DS92LV222ATMX/NOPB

DS92LV222A DS92LV222A Two Channel Bus LVDS MUXed Repeater Literature Number: SNLS009A DS92LV222A Two Channel Bus LVDS MUXed Repeater General Description Features The DS92LV222A is a repeater designed specifically for the bridging of multiple backplanes in a rack. The DS92LV222A utilizes low voltage differential signaling to deliver high speed while consuming minimal power with reduced EMI. The RSEL pin and DE pins allow maximum flexibility as to which receiver/driver are used. The DS92LV222A repeats signals between backplanes and accepts or drives signals onto the local bus. It also features a flow through pin out which allows easy PCB routing for short stubs between its pins and the connector. The driver is selectable between 3.5 mA (100Ω load) and 8.5 mA (27Ω load) output loop currents depending upon the level applied to the ISEL pin. This allows for single termination (point-to-point) and also double termination (multipoint) applications while maintain similar differential levels. The receiver threshold is ± 100 mV, while providing ± 1V common mode range. n n n n n n n n n n n n Bus LVDS Signaling (BLVDS) Designed for Double Termination Applications Low power CMOS design High Signaling Rate Capability (above 100 Mbps) Ultra Low Power Dissipation (13.2 mW quiescent) Balanced Output Impedance Lite Bus Loading 5 pF typical Selectable Drive Capability (3.5 mA or 8.5 mA) 3.3V operation ± 1V Common Mode Range ± 100 mV Receiver Sensitivity Available in 16 pin SOIC package. Connection Diagram DS100055-1 Order Number DS92LV222ATM See NS Package Number M16A Block Diagram DS100055-2 TRI-STATE ® is a registered trademark of National Semiconductor Corporation. © 2000 National Semiconductor Corporation DS100055 www.national.com DS92LV222A Two Channel Bus LVDS MUXed Repeater May 1998 DS92LV222A Absolute Maximum Ratings (Notes 1, 2) Derate SOIC Package above 25˚C If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) −0.3V to (VCC + 0.3V) Current Select Voltage (ISEL) −0.3V to (VCC + 0.3V) Receiver Select Voltage (RSEL) −0.3V to (VCC + 0.3V) Bus Pin Voltage (DO/RI ± ) (Soldering, 4 sec.) Continuous ESD (HBM 1.5 kΩ, 100 pF) > 2 kV 260˚C Recommended Operating Conditions Min −0.3V to +3.9V Driver Short Circuit Current −65˚C to +150˚C Lead Temperature 6.0V Enable Input Voltage (DE) 8mW/˚C Storage Temperature Range Max Units Supply Voltage (VCC) 3.0 3.6 V Receiver Input Voltage 0.0 2.9 V Operating Free Air Temperature −40 +85 ˚C Maximum Package Power Dissipation at 25˚C SOIC 970 mW DC Electrical Characteristics TA = −40˚C to +85˚C unless otherwise noted, VCC = 3.3V ± 0.3V (Notes 2, 3) Symbol Parameter Conditions Pin Min Typ Max Units 170 220 280 mV 2 10 mV 1.25 1.6 V 10 20 mV 360 480 mV 2 10 mV 1.25 1.6 V 10 20 mV VO = VCC or GND, DE = 0 ±1 ± 10 µA DIFFERENTIAL DRIVER CHARACTERISTICS RL = 27Ω Figure 1 Isel = 0V VOD Output Differential Voltage ∆VOD VOD Magnitude Change VOS Offset Voltage ∆VOS Offset Magnitude Change VOD Output Differential Voltage ∆VOD VOD Magnitude Change VOS Offset Voltage ∆VOS Offset Magnitude Change IOZD TRI-STATE IOXD Power-Off Leakage VO = 2.9V or GND, VCC = 0V ±1 ± 10 µA IOSD Output Short Circuit Current ISEL = VCC VO = 0V −11 −13 mA +100 mV ® DO+, DO− 1.0 RL = 100Ω Figure 1 Isel = 3.3V 250 0.9 Leakage DIFFERENTIAL RECEIVER CHARACTERISTICS VTH Input Threshold High VTL Input Threshold Low IIN Input Current RI+, RI− −100 −10 VIN = +2.9V, or 0V, VCC = 3.6 V or 0 V mV ±1 +10 µA 2.0 VCC V GND 0.8 V ± 10 ± 10 µA DEVICE CHARACTERISTICS VIH Minimum Input High Voltage VIL Maximum Input Low Voltage IIH Input High Current IIL Input Low Current VIN = GND or 0.4V VCL Input Diode Clamp Voltage ICLAMP = −18 mA www.national.com DE0, DE1, RSEL, ISEL0, ISEL1 VIN = VCC or 2.4V ±1 ±1 −1.5 2 −0.8 µA V (Continued) TA = −40˚C to +85˚C unless otherwise noted, VCC = 3.3V ± 0.3V (Notes 2, 3) Symbol Parameter Conditions Pin Min Typ Max Units 25 45 mA 24 40 mA 4 8 mA DEVICE CHARACTERISTICS ICCD Power Supply Current No Load; DE = RSEL = VCC Isel = 0 V VCC RL = 27Ω; DE = RSEL = VCC Isel = 0 V ICCZ DE = 0V; RSEL = VCC Cinput Capacitance at RO+/RO- 5 pF Coutput Capacitance at DO+/DO- 5 pF Note 1: “Absolute Maximum Ratings” are these beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. The table of “Electrical Characteristics” provides conditions for actual device operation. Note 2: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. Note 3: All typicals are given for VCC = +3.3V and T A = +25˚C, unless otherwise stated. Note 4: ESD Rating: HBM (1.5 kΩ, 100 pF) > 2 kV EIAJ (0Ω, 200 pF) > 200V Note 5: CL includes probe and fixture capacitance. Note 6: Generator waveforms for all tests unless otherwise specified: f = 1MHz, ZO = 50Ω, tf = < 6.0 ns (0%–100%). Note 7: The DS92LV222A is a current mode device and only functions datasheet specifications when a resistive load is applied to the drivers outputs. Note 8: During receiver select transition(s), data must be held in a steady state 15 ns before and 15 ns after the RSEL pin changes state. Note 9: Channel-to-channel skew is the measurement between outputs of D0 and D1. AC Electrical Characteristics TA = −40˚C to +85˚C, VCC = 3.3V ± 0.3V (Note 6) Symbol Parameter tTLH Transition Time Low to High tTHL Transition Time High to Low tPHZ Disable Time High to Z tPLZ Disable Time Low to Z tPZH tPZL Conditions RL = 27Ω Figures 2, 3 CL = 10 pF Figures 2, 3 RL = 27Ω Figures 4, 5 CL = 10 pF Figures 4, 5 Min Typ Max Units 0.15 0.4 2.0 ns 0.15 0.4 2.0 ns 2.0 6.0 9.0 ns 2.0 6.0 9.0 ns Enable Time Z to High 2.0 6.0 9.0 ns Enable Time Z to Low 2.0 6.0 9.0 ns RL = 27Ω Figures 2, 3 CL = 10 pF Figures 2, 3 3.0 7.7 13 ns 3.0 8.0 13 ns 0 0.3 2.0 ns RSEL to Driver Outputs RL = 27Ω Figures 6, 7 CL = 10 pF (Note 8) 2.0 7.5 13 ns 2.0 8.0 13 ns 0.3 0.8 ns 0.3 0.8 ns 0.3 0.8 ns 0.3 0.8 ns DIFFERENTIAL RECEIVER TO DRIVER TIMING REQUIREMENTS tPHL_RD Differential Prop. Delay High to Low tPLH_RD Differential Prop. Delay Low to High tSK_RD Pulse SKEW |t PHL –tPLH| tPHL_RS0 Prop. Delay High to Low tPLH_RS1 Prop. Delay Low to High tPHL_R0 Dx Channel-to-Channel Skew R tPLH_R0 Dx Channel-to-Channel Skew R tPHL_R1 Dx Channel-to-Channel Skew R tPLH_R1 Dx Channel-to-Channel Skew R 0 to Dx 0 to Dx 1 to Dx 1 to Dx RL = 27Ω CL = 10 pF (Note 9) 3 www.national.com DS92LV222A DC Electrical Characteristics DS92LV222A Test Circuits and Timing Waveforms DS100055-3 FIGURE 1. Differential Driver DC Test Circuit DS100055-4 FIGURE 2. Differential Receiver to Driver Propagation Delay and Driver Transition Time Test Circuit DS100055-5 FIGURE 3. Differential Receiver to Driver Propagation Delay and Driver Transition Time Waveforms DS100055-6 FIGURE 4. Driver TRI-STATE Delay Test Circuit www.national.com 4 DS92LV222A Test Circuits and Timing Waveforms (Continued) DS100055-7 FIGURE 5. Driver TRI-STATE Delay Waveforms DS100055-8 FIGURE 6. Receiver Select to Driver Propagation Delay Test Circuit DS100055-9 FIGURE 7. Receiver Select to Driver Propagation Delay Waveforms Pin Description Pin Name Number of Pins Input/ Output Description RI ± 4 I Bus LVDS Receiver Inputs Bus LVDS Driver Outputs DO ± 4 O RSEL 1 I Receiver Select TTL Input, (see Truth Tables) DE 2 I Driver Enable TTL Input, Active High ISEL 2 I IOL Control Pin (Select High = 3.5 mA (100Ω Load), Select Low = 8.5mA (27Ω Load)) GND 1 NA Ground Reference VCC 1 NA Power Supply Reserved 1 NA Reserved Pin 5 www.national.com DS92LV222A Function Select Table DE0 DE1 Receiver Zero ON, Driver Zero ON, Driver One OFF MODE SELECTED H L L Receiver Zero ON, Driver Zero OFF, Driver One ON L H L Receiver One ON, Driver Zero ON, Driver One OFF H L H Receiver One ON, Driver Zero OFF, Driver One ON L H H Receiver Zero ON, Driver Zero ON, Driver One ON H H L Receiver One ON, Driver Zero ON, Driver One ON H H H Driver Zero and Driver One TRI-STATE L L X Truth Table for Receiver Zero INPUTS DE0 RSEL H L H L H L L X Truth Table for Receiver One OUTPUTS (RI0+)–(RI0−) RSEL INPUTS DO+ DO− DE1 RSEL L L H H H H H L H H 100 mV > & > −100 mV X X H H X Z Z L X X = High or low logic state Z = High impedance state L = Low state OUTPUTS (RI1+)–(RI1−) DO+ DO− L L H H H L 100 mV > & > −100 mV X X X Z Z X = High or low logic state Z = High impedance state L = Low state Truth Table for Current Drive Driver Current Drive ISEL0 ISEL1 Driver 0 3.5 mA H X Driver 0 8.5 mA L X Driver 1 3.5 mA X H Driver 1 8.5 mA X L • Applications Information There are few common practices which should be employed when designing PCB for Bus LVDS signaling. Recommended practices are: • Use at least 4 PCB board layer (Bus LVDS signals, ground, power and TTL signals). • Keep drivers and receivers as close to the (Bus LVDS port side) connector as possible. • Bypass each Bus LVDS device and also use distributed bulk capacitance. Surface mount capacitors placed close to power and ground pins work best. Two or three multilayer ceramic (MLC) surface mount capacitors (0.1µ and 0.01 µF in parallel should be used between each VCC and ground. The capacitors should be as close as possible to the VCC pin. • Use controlled impedance traces which match the differential impedance of your transmission medium (i.e., Cable) and termination resistor. • Use the termination resistor which best matches the differential impedance of your transmission line. • • Leave unused Bus LVDS receiver inputs open (floating). • • Isolate TTL signals from Bus LVDS signals. MEDIA (CABLE, CONNECTOR OR BACKPLANE) SELECTION: • Use controlled impedance media. The cables and connectors should have a matched differential impedance. www.national.com 6 Balanced cables (e.g., twisted pair) are usually better than unbalanced cables (ribbon cable, simple coax) for noise reduction and signal quality. There are different types of failsafe situations to consider, these are Open Input, Terminated Input, and other special cases. The first, Open input failsafe occurs when only one receiver is being used (R0 for example). The unused receiver (R1) inputs should be left open for noise minimization. The second case is for terminated inputs. This occurs when the inputs have a low impedance (typically 100 Ohm) termination (R T) across them, and the cable is unplugged. For this case, and if the output state needs to maintain a known state, two external bias resistors may be used to provide a strong common mode bias point. For this a 10K Ohm pull up and pull down resistor may be used to set the output high. Note that R1 and R2 should be much larger ( 2 orders of magnitude) compared to R T to minimize loading effects to the Bus LVDS driver when it is active. DS92LV222A Applications Information (Continued) DS100055-10 FIGURE 8. Terminated Input Failsafe Circuit 7 www.national.com DS92LV222A Two Channel Bus LVDS MUXed Repeater Physical Dimensions inches (millimeters) unless otherwise noted Order Number DS92LV222ATM NS Package Number M16A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com www.national.com National Semiconductor Europe Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: ap.support@nsc.com National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated