GD75323DW

GD75323 MULTIPLE RS-232 DRIVERS AND RECEIVERS SLLS213A – JANUARY 1996 – REVISED JUNE 1999 D D D D D D D Single Chip With Easy Interface Between UART and Serial-Port Connector of an External Modem or Other Computer Peripheral Five Drivers and Three Receivers Meet or Exceed the Requirements of ANSI Standard TIA/EIA-232-F and ITU Recommendation V.28 Standards Supports Data Rates up to 120 kbit/s Complement to the GD75232 Provides Pin-to-Pin Replacement for the Goldstar GD75323 Pin-Out Compatible With SN75196 Functional Replacement for the MC145405 DW OR N PACKAGE (TOP VIEW) VCC 1DA 2DA 3DA 1RY 2RY 4DA 3RY 5DA GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VDD 1DY 2DY 3DY 1RA 2RA 4DY 3RA 5DY VSS description The GD75323 combines five drivers and three receivers from the trade-standard SN75188 and SN75189 bipolar quadruple drivers and receivers, respectively. The flow-through design of the GD75323 decreases the part count, reduces the board space required, and allows easy interconnection of the UART and serial-port connector. The all-bipolar circuits and processing of the GD75323 provide a rugged, low-cost solution for this function. The GD75323 complies with the requirements of the ANSI TIA/EIA-232-F and ITU (formerly CCITT) V.28 standards. These standards are for data interchange between a host computer and a peripheral at signal rates up to 20 kbit/s. The switching speeds of the GD75323 are fast enough to support rates up to 120 kbit/s with lower capacitive loads (shorter cables). Interoperability at the higher signaling rates cannot be assured unless the designer has design control of the cable and the interface circuits at both ends. For interoperability at signaling rates up to 120 kbit/s, use of ANSI Standard TIA/EIA-423-B and TIA/EIA-422-B and ITU Recommendations V.10 and V.11 are recommended. The GD75323 is characterized for operation over a temperature range of 0°C to 70°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 GD75323 MULTIPLE RS-232 DRIVERS AND RECEIVERS SLLS213A – JANUARY 1996 – REVISED JUNE 1999 logic symbol† 1DA 2DA 3DA 1RY 2RY 4DA 3RY 5DA 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 1DY 2DY 3DY 1RA 2RA 4DY 3RA 5DY † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 1DA 2DA 3DA 1RY 2RY 4DA 3RY 5DA 2 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 POST OFFICE BOX 655303 1DY 2DY 3DY 1RA 2RA 4DY 3RA 5DY • DALLAS, TEXAS 75265 GD75323 MULTIPLE RS-232 DRIVERS AND RECEIVERS SLLS213A – JANUARY 1996 – REVISED JUNE 1999 schematic (each driver) To Other Drivers VDD 11.6 kΩ 9.4 kΩ Input DAx 75.8 Ω 320 Ω DYx Output 4.2 kΩ GND To Other Drivers 10.4 kΩ 3.3 kΩ 68.5 Ω VSS To Other Drivers Resistor values shown are nominal. schematic (each receiver) To Other Receivers VCC 9 kΩ 5 kΩ 1.66 kΩ RYx Output 2 kΩ 3.8 kΩ Input RAx 10 kΩ GND To Other Receivers Resistor values shown are nominal. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 GD75323 MULTIPLE RS-232 DRIVERS AND RECEIVERS SLLS213A – JANUARY 1996 – REVISED JUNE 1999 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 V Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V Supply voltage, VSS (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 15 V Input voltage range, VI: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –15 V to 7 V Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30 V to 30 V Output voltage range, VO (Driver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 15 V to 15 V Low-level output current, IOL (Receiver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to the network ground terminal. 2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero. recommended operating conditions Supply voltage VDD VSS High-level input voltage, VIH VCC Driver Low-level input voltage, VIL Driver MIN NOM MAX 7.5 9 13.5 – 7.5 –9 – 13.5 4.5 5 5.5 1.9 –6 Receiver – 0.5 Driver High level output current, High-level current IOL 6 Receiver Operating free-air temperature,TA V V 0.8 Driver High level output current, High-level current IOH UNIT 16 0 70 V mA mA °C supply currents over operating free-air temperature range PARAMETER IDD ISS ICC 4 TEST CONDITIONS MAX All inputs at 1.9 1 9 V, V No load VDD = 9 V, VDD = 12 V, VSS = – 9 V VSS = – 12 V 25 All inputs at 0.8 0 8 V, V No load VDD = 9 V, VDD = 12 V, VSS = – 9 V VSS = – 12 V 7.5 1 9 V, V All inputs at 1.9 No load VDD = 9 V, VDD = 12 V, VSS = – 9 V VSS = – 12 V – 25 All inputs at 0.8 0 8 V, V No load VDD = 9 V, VDD = 12 V, VSS = – 9 V VSS = – 12 V – 5.3 VCC= 5 V, All inputs at 5 V, No load Supply current from VDD Supply current from VSS Supply current from VCC MIN POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 32 9.5 – 32 – 5.3 20 UNIT mA mA mA mA mA GD75323 MULTIPLE RS-232 DRIVERS AND RECEIVERS SLLS213A – JANUARY 1996 – REVISED JUNE 1999 DRIVER SECTION electrical characteristics over operating free-air temperature range, VDD = 9 V, VSS = –9 V, VCC = 5 V (unless otherwise noted) PARAMETER VOH VOL High-level output voltage IIH IIL High-level input current IOS(H) IOS(L) ro TEST CONDITIONS MIN TYP 6 7.5 MAX UNIT VIL = 0.8 V, VIH = 1.9 V, RL = 3 kΩ, See Figure 1 RL = 3 kΩ, See Figure 1 –6 V See Figure 2 10 µA Low-level input current VI = 5 V, VI = 0, See Figure 2 – 1.6 mA High-level short-circuit output current (see Note 4) VIL = 0.8 V, VO = 0, See Figure 1 – 4.5 –9 – 19.5 mA VIH = 2 V, VO = 0, VCC = VDD = VSS = 0, See Figure 1 4.5 9 19 mA Low-level output voltage (see Note 3) Low-level short-circuit output current – 7.5 V VO = – 2 V to 2 V 300 Ω NOTES: 3. The algebraic convention, where the more positive (less negative) limit is designated as maximum, is used in this data sheet for logic levels only, e.g., if – 10 V is maximum, the typical value is a more negative voltage. 4. Output short-circuit conditions must maintain the total power dissipation below absolute maximum ratings. 5. Test conditions are those specified by TIA/EIA-232-F and as listed above. Output resistance (see Note 5) switching characteristics, VDD = 12 V, VSS = –12 V, VCC = 5 V ± 10%, TA = 25°C PARAMETER tPLH tPHL tTLH tTHL TEST CONDITIONS Propagation delay time, low- to high-level output Propagation delay time, high- to low-level output time lowlow to high-level high level output Transition time, Transition time, highg to low-level output (see ( Note 5) TYP MAX UNIT 315 500 ns 75 175 ns CL = 15 pF, 60 100 ns RL = 3 kΩ to 7 kΩ, See Figure 3 and Note 6 CL = 2500 pF, 1.7 2.5 µs RL = 3 kΩ to 7 kΩ, See Figure 3 CL = 15 pF, 40 75 ns RL = 3 kΩ to 7 kΩ, See Figure 3 and Note 7 CL = 2500 pF, 1.5 2.5 µs RL = 3 kΩ to 7 kΩ,, See Figure 3 CL = 15 pF,, RL = 3 kΩ to 7 kΩ, See Figure 3 MIN NOTES: 6. Measured between – 3-V and 3-V points of the output waveform (TIA/EIA-232-F conditions), all unused inputs are tied either high or low. 7. Measured between 3-V and – 3-V points of the output waveform (TIA/EIA-232-F conditions), all unused inputs are tied either high or low. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 GD75323 MULTIPLE RS-232 DRIVERS AND RECEIVERS SLLS213A – JANUARY 1996 – REVISED JUNE 1999 RECEIVER SECTION electrical characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS TA = 25°C TA = 0°C to 70 °C TYPĔ MAX 1.75 1.9 2.3 VIT IT+ Positive going input threshold voltage Positive-going VIT– Vhys Negative-going input threshold voltage VOH High level output voltage High-level IOH = – 0.5 0 5 mA VIH = 0.75 V Inputs open VOL Low-level output voltage IIH High level input current High-level IOL = 10 mA, VI = 25 V, VI = 3 V See Figure 5 3.6 See Figure 5 0.43 IIL Low level input current Low-level VI = 3 V, VI = – 25 V, See Figure 5 – 3.6 VI = – 3 V, See Figure 5 – 0.43 Input hysteresis voltage (VIT+ – VIT–) See Figure 5 MIN 1.55 0.75 See Figure 5 2.3 0.97 1.25 4 5 0.2 0.45 UNIT V 0.5 2.6 2.6 IOS Short-circuit output current See Figure 4 † All typical values are at TA = 25°C, VCC = 5 V, VDD = 9 V, and VSS = – 9 V. 8.3 – 8.3 V V mA mA – 3.4 –12 mA TYP MAX UNIT 107 500 ns switching characteristics, VCC = 5 V, VDD = 12 V, VSS = –12 V, TA = 25°C PARAMETER TEST CONDITIONS tPLH tPHL Propagation delay time, low- to high-level output tTLH tTHL Transition time, low- to high-level output Propagation delay time, high- to low-level output CL = 50 pF, See Figure 6 MIN RL = 5 kΩ, Transition time, high- to low-level output 42 150 ns 175 525 ns 16 60 ns PARAMETER MEASUREMENT INFORMATION IOS(L) VDD VCC VDD VDD or GND – IOS(H) IIH VSS or GND VI VCC VI – IIL VO RL = 3 kΩ VI VSS VSS Figure 1. Driver Test Circuit for VOH, VOL, IOS(H), and IOS(L 6 POST OFFICE BOX 655303 Figure 2. Driver Test Circuit for IIH and IIL • DALLAS, TEXAS 75265 GD75323 MULTIPLE RS-232 DRIVERS AND RECEIVERS SLLS213A – JANUARY 1996 – REVISED JUNE 1999 PARAMETER MEASUREMENT INFORMATION 3V 1.5 V Input VDD Input V CC 1.5 V 0V t PHL Pulse Generator VO CL (see Note A) RL See Note B 90% Output VSS t PLH 50% 10% 50% 10% 90% VOL t THL TEST CIRCUIT VOH t TLH VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns. Figure 3. Driver Test Circuit and Voltage Waveforms VDD VCC VDD VCC – IOS – IOH VIT, VI VOH VI VOL IOL VSS VSS Figure 4. Receiver Test Circuit for IOS Figure 5. Receiver Test Circuit for VIT, VOH, and VOL 5V VDD Input 50% Input 50% –5 V VCC t PHL Pulse Generator VO CL (see Note A) RL See Note B 90% Output 50% 10% t PLH 50% 10% 90% VOL VSS t THL TEST CIRCUIT VOH t TLH VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns. Figure 6. Receiver Propagation and Transition Times POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 GD75323 MULTIPLE RS-232 DRIVERS AND RECEIVERS SLLS213A – JANUARY 1996 – REVISED JUNE 1999 TYPICAL CHARACTERISTICS DRIVER SECTION OUTPUT CURRENT vs OUTPUT VOLTAGE VOLTAGE-TRANSFER CHARACTERISTICS VO VO – Output Voltage – V 9 6 3 ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ 20 VDD = 12 V, VSS = – 12 V 16 VDD = 9 V, VSS = – 9 V 12 IO I O – Output Current – mA 12 VDD = 6 V, VSS = – 6 V 0 –3 –6 –9 – 12 ÎÎÎÎ ÎÎÎÎ VDD = 9 V VSS = – 9 V TA = 25°C 4 0 –4 ÎÎÎ 3-kΩ Load Line –8 VOH(VI = 0.8 V) – 16 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 VI – Input Voltage – V – 20 – 16 2 – 12 SHORT-CIRCUIT OUTPUT CURRENT vs FREE-AIR TEMPERATURE VDD = 9 V VSS = – 9 V RL = 3 kΩ TA = 25°C IOS(L) (VI = 1.9 V) SR – Slew Rate – V/ µs 6 3 ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÁÁ ÎÎÎÎÎÎ ÁÁ 0 VDD = 9 V VSS = – 9 V VO = 0 –3 16 ÁÁÁÁÁ ÁÁÁÁÁ ÎÎÎÎÎ ÁÁÁÁÁ 1000 9 12 SLEW RATE vs LOAD CAPACITANCE 12 IIOS OS – Short-Circuit Output Current – mA –8 –4 0 4 8 VO – Output Voltage – V Figure 8 Figure 7 100 10 –6 IOS(H) (VI = 0.8 V) –9 1 – 12 0 10 20 30 40 50 60 70 10 TA – Free-Air Temperature – °C 100 Figure 10 POST OFFICE BOX 655303 1000 CL – Load Capacitance – pF Figure 9 8 VOL(VI = 1.9 V) – 12 RL = 3 kΩ TA = 25°C 0 8 ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎ • DALLAS, TEXAS 75265 10000 GD75323 MULTIPLE RS-232 DRIVERS AND RECEIVERS SLLS213A – JANUARY 1996 – REVISED JUNE 1999 TYPICAL CHARACTERISTICS RECEIVER SECTION INPUT THRESHOLD VOLTAGE vs SUPPLY VOLTAGE 2.4 2 2.2 1.8 V – Input Threshold Voltage – V IT V – Input Threshold Voltage – V IT INPUT THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE VIT + 2 1.8 1.6 1.4 1.2 VIT– 0.8 0.6 0.4 VIT+ 1.6 1.4 1.2 1 VIT– 0.8 0.6 0.4 0.2 0 10 20 30 40 50 60 0 2 70 TA – Free-Air Temperature – °C 3 ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÁÁÁÁ ÎÎÎÎÎ ÁÁÁÁ ÎÎÎÎÎ NOISE REJECTION ÁÁÁÁ ÁÁÁÁ ÎÎÎÎ ÁÁÁ ÎÎÎÎ ÁÁÁ CC = 500 pF CC = 12 pF 2 CC = 100 pF 1 0 10 40 100 400 1000 4000 tw – Pulse Duration – ns 10000 NOTE A: This figure shows the maximum amplitude of a positive-going pulse that, starting from 0 V, does not cause a change of the output level. 20 30 40 50 60 TA – Free-Air Temperature – °C 70 14 VDD – Maximum Supply Voltage – V Amplitude – V 3 10 16 CC = 300 pF 4 9 MAXIMUM SUPPLY VOLTAGE vs FREE-AIR TEMPERATURE VCC = 5 V TA = 25°C See Note A 5 5 6 7 8 VCC – Supply Voltage – V Figure 12 Figure 11 6 4 12 10 8 6 4 2 RL ≥ 3 kΩ (from each output to GND) 0 0 10 Figure 13 Figure 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 GD75323 MULTIPLE RS-232 DRIVERS AND RECEIVERS SLLS213A – JANUARY 1996 – REVISED JUNE 1999 APPLICATION INFORMATION Diodes placed in series with the VDD and VSS leads protect the GD75323 in the fault condition in which the device outputs are shorted to VDD or VSS, and the power supplies are at low and provide low-impedance paths to ground (see Figure 15). VDD ± 15 V VDD Output GD75323 GD75323 VSS VSS Figure 15. Power-Supply Protection to Meet Power-Off Fault Conditions of TIA / EIA-232-F TIA/EIA-232-F DB9S Connector – 12 V TL16C450 ACE 10 RI 43 9 DTR 37 8 CTS 40 7 SO 13 6 RTS 36 5 SI 11 4 DSR 41 3 DCD 42 2 1 GND VSS 5DA 5DY 3RY 3RA 4DA 4DY 2RY 2RA GD75323 1RY 1RA 3DA 3DY 2DA 2DY 1DA 1DY VCC VDD 11 12 5 9 RI 13 DTR 14 CTS 15 TX 16 RTS 17 RX 18 DSR 19 20 C5† C4† DCD C3† 6 C2† C1† 1 12 V 5V † See Figure 10 to select the correct values for the loading capacitors (C1, C2, C3, C4, and C5), which may be required to meet the RS-232 maximum slew-rate requirement of 30 V/µs. The value of the loading capacitors required depends upon the line length and desired slew rate, but is typically 330 pF. NOTE C: To use the receivers only, VDD and VSS both must be powered or tied to ground. Figure 16. Typical Connection 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) GD75323DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 GD75323 GD75323DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 GD75323 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of