LM1117
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
LM1117 800-mA, Low-Dropout Linear Regulator
1 Features
3 Description
•
•
The LM1117 is a low dropout voltage regulator with a
dropout of 1.2 V at 800 mA of load current.
•
•
•
•
•
•
For a newer drop-in alternative, see the TLV1117
Available in 1.8 V, 2.5 V, 3.3 V, 5 V, and adjustable
versions
Space-saving SOT-223 and WSON packages
Current limiting and thermal protection
Output current: 800 mA
Line regulation: 0.2% (maximum)
Load regulation: 0.4% (maximum)
Temperature range:
– LM1117: 0°C to 125°C
– LM1117I: −40°C to 125°C
2 Applications
•
•
•
•
•
AC drive power stage modules
Merchant network and server PSU
Industrial AC/DC
Ultrasound scanners
Servo drive control modules
The LM1117 is available in an adjustable version,
which can set the output voltage from 1.25 to 13.8
V with only two external resistors. In addition, it is
available in five fixed voltages, 1.8 V, 2.5 V, 3.3 V, and
5 V.
The LM1117 offers current limiting and thermal
shutdown. Its circuit includes a Zener trimmed
bandgap reference to assure output voltage accuracy
to within ±1%.
A minimum of 10-µF tantalum capacitor is required
at the output to improve the transient response and
stability.
Device Information(1)
PART NUMBER
LM1117,
LM1117I
(1)
PACKAGE
BODY SIZE (NOM)
SOT-223 (4)
6.50 mm × 3.50 mm
TO-220 (3)
14.986 mm × 10.16 mm
TO-252 (3)
6.58 mm × 6.10 mm
WSON (8)
4.00 mm × 4.00 mm
TO-263 (3)
10.18 mm × 8.41 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
Adjustable Output Regulator
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings........................................ 4
7.2 ESD Ratings............................................................... 4
7.3 Recommended Operating Conditions.........................4
7.4 Thermal Information....................................................4
7.5 LM1117 Electrical Characteristics............................... 5
7.6 LM1117I Electrical Characteristics.............................. 7
7.7 Typical Characteristics................................................ 9
8 Detailed Description...................................................... 11
8.1 Overview................................................................... 11
8.2 Functional Block Diagram......................................... 11
8.3 Feature Description...................................................11
8.4 Device Functional Modes..........................................13
9 Application and Implementation.................................. 14
9.1 Application Information............................................. 14
9.2 Typical Application.................................................... 14
9.3 System Examples..................................................... 16
10 Power Supply Recommendations..............................17
11 Layout........................................................................... 18
11.1 Layout Guidelines................................................... 18
11.2 Layout Example...................................................... 22
12 Device and Documentation Support..........................23
12.1 Documentation Support.......................................... 23
12.2 Receiving Notification of Documentation Updates..23
12.3 Support Resources................................................. 23
12.4 Trademarks............................................................. 23
12.5 Electrostatic Discharge Caution..............................23
12.6 Glossary..................................................................23
13 Mechanical, Packaging, and Orderable
Information.................................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision O (June 2020) to Revision P (July 2022)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
Changes from Revision N (January 2016) to Revision O (June 2020)
Page
• Added alternative device Features bullet ...........................................................................................................1
• Changed Applications section ........................................................................................................................... 1
• Added Device Comparison Table ...................................................................................................................... 3
• Added Related Documentation section............................................................................................................ 23
2
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
5 Device Comparison Table
IOUT
PARAMETER
LM1117
TLV1117
UNIT
Input voltage range (max)
15
15
V
Load regulation accuracy
1.6
1.6
%
PSRR (120 Hz)
75
75
dB
Recommended operating temperature
0 – 125
-40 – 125
°C
SOT-223 TJA
61.6
104.3
°C/W
TO-220 TJA
23.8
30.1
°C/W
TO-252 TJA
45.1
50.9
°C/W
TO-263 TJA
41.3
27.5
°C/W
WSON-8 TJA
39.3
38.3
°C/W
800 mA
6 Pin Configuration and Functions
Figure 6-1. 4-Pin SOT DCY Package (Top View)
Figure 6-3. 3-Pin TO-263 KTT Package (Top View)
ADJ/GND
1
VIN
2
Figure 6-2. 3-Pin TO-220 NDE Package (Top View)
Figure 6-4. 3-Pin TO-252 NDP Package (Top View)
8
NOT CONNECTED
7
VOUT
VOUT
VIN
3
6
VOUT
VIN
4
5
VOUT
When using the WSON package pins 2, 3, and 4 must be connected together and pins 5, 6, and 7 must be connected together.
Figure 6-5. 8-Pin WSON NGN Package (Top View)
Table 6-1. Pin Functions
PIN
NAME
I/O
DESCRIPTION
TO-252
WSON
SOT-223
TO-263
TO-220
ADJ/GND
1
1
1
1
1
—
VIN
3
2, 3, 4
3
3
3
I
Input voltage pin for the regulator
2 , TAB
5, 6, 7,
TAB
2, 4
2, TAB
2, TAB
O
Output voltage pin for the regulator
VOUT
Adjust pin for adjustable output option. Ground pin for fixed
output option.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
3
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
Maximum input voltage (VIN to GND)
Power
dissipation(2)
Storage temperature, Tstg
(2)
UNIT
20
V
Internally Limited
Junction temperature (TJ)(2)
(1)
MAX
–65
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.
7.2 ESD Ratings
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
VALUE
UNIT
±2000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as
±2000 V may actually have higher performance.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
15
V
LM1117
0
125
°C
LM1117I
−40
125
Input voltage (VIN to GND)
Junction temperature (TJ)(1)
(1)
UNIT
The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.
7.4 Thermal Information
LM1117, LM1117I
THERMAL METRIC(1)
NDE
(TO-220)
NDP
(TO-252)
NGN
(WSON)
KTT
(TO-263)
UNIT
4 PINS
3 PINS
3 PINS
8 PINS
3 PINS
RθJA
Junction-to-ambient thermal resistance
61.6
23.8
45.1
39.3
41.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
42.5
16.6
52.1
31.4
44.1
°C/W
RθJB
Junction-to-board thermal resistance
10.4
5.3
29.8
16.5
24.2
°C/W
ψJT
Junction-to-top characterization parameter
2.9
3.1
4.5
0.3
10.9
°C/W
ψJB
Junction-to-board characterization parameter
10.3
5.3
29.4
16.7
23.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
1.5
1.3
5.6
1.3
°C/W
(1)
4
DCY
(SOT-223)
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
7.5 LM1117 Electrical Characteristics
unless otherwise specified, TJ = 25°C
PARAMETER
TEST CONDITIONS
LM1117-ADJ
IOUT = 10 mA, VIN – VOUT = 2 V, TJ = 25°C
VREF
Reference voltage
LM1117-ADJ
10 mA ≤ IOUT ≤ 800 mA, 1.4 V ≤
VIN – VOUT ≤ 10 V
over the junction temperature range
0°C to 125°C
VOUT
Output voltage
over the junction temperature range
0°C to 125°C
over the junction temperature range
0°C to 125°C
ΔVOUT
Line regulation(3)
over the junction temperature range
0°C to 125°C
LM1117-ADJ
IOUT = 10mA, 1.5V ≤ VIN-VOUT ≤
13.75V
TJ = 25°C
over the junction temperature range
0°C to 125°C
TJ = 25°C
Load regulation(3)
LM1117-2.5
VIN = 3.9 V, 0 ≤ IOUT ≤ 800 mA
LM1117-3.3
VIN = 4.75 V, 0 ≤ IOUT ≤ 800 mA
LM1117-5.0
VIN = 6.5 V, 0 ≤ IOUT ≤ 800 mA
1.782
TJ = 25°C
1.8
1.746
2.5
2.45
3.3
3.235
over the junction temperature range
0°C to 125°C
3.333
V
3.365
5
5.05
5
4.9
V
5.1
0.035%
0.2%
1
6
mV
1
6
mV
1
6
mV
1
10
mV
0.2%
0.4%
1
10
mV
1
10
mV
1
over the junction temperature range
0°C to 125°C
TJ = 25°C
V
3.3
over the junction temperature range
0°C to 125°C
TJ = 25°C
2.525
2.55
over the junction temperature range
0°C to 125°C
TJ = 25°C
V
2.5
over the junction temperature range
0°C to 125°C
TJ = 25°C
1.818
1.854
over the junction temperature range
0°C to 125°C
TJ = 25°C
V
1.8
2.475
UNIT
1.27
over the junction temperature range
0°C to 125°C
TJ = 25°C
LM1117-ADJ
VIN – VOUT = 3 V, 10 ≤ IOUT ≤ 800 over the junction temperature range
mA
0°C to 125°C
ΔVOUT
1.225
over the junction temperature range
0°C to 125°C
TJ = 25°C
LM1117-3.3
IOUT = 0 mA, 4.75 V ≤ VIN ≤ 15 V over the junction temperature range
0°C to 125°C
LM1117-1.8
VIN = 3.2 V, 0 ≤ IOUT ≤ 800 mA
1.25
4.95
TJ = 25°C
LM1117-5.0
IOUT = 0 mA, 6.5 V ≤ VIN ≤ 15 V
1.262
TJ = 25°C
LM1117-5.0
0 ≤ IOUT ≤ 800 mA, 6.5 V ≤ VIN ≤
12 V
LM1117-2.5
IOUT = 0 mA, 3.9 V ≤ VIN ≤ 10 V
1.25
3.267
LM1117-5.0
IOUT = 10 mA, VIN = 7 V, TJ = 25°C
LM1117-1.8
IOUT = 0 mA, 3.2 V ≤ VIN ≤ 10 V
1.238
TJ = 25°C
LM1117-3.3
IOUT = 10 mA, VIN = 5 V TJ = 25°C
LM1117-3.3
0 ≤ IOUT ≤ 800 mA, 4.75 V ≤ VIN
≤ 10 V
MAX(1)
TJ = 25°C
LM1117-2.5
IOUT = 10 mA, VIN = 4.5 V, TJ = 25°C
LM1117-2.5
0 ≤ IOUT ≤ 800 mA, 3.9 V ≤ VIN ≤
10 V
TYP(2)
TJ = 25°C
LM1117-1.8
IOUT = 10 mA, VIN = 3.8 V, TJ = 25°C
LM1117-1.8
0 ≤ IOUT ≤ 800 mA, 3.2 V ≤ VIN ≤
10 V
MIN(1)
10
mV
1
15
mV
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
5
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
unless otherwise specified, TJ = 25°C
PARAMETER
TEST CONDITIONS
MIN(1)
TJ = 25°C
IOUT = 100 mA
VIN –
V OUT
IOUT = 500 mA
1.2
1.25
TJ = 25°C
ILIMIT
Current limit
Minimum load
current(5)
800
10
10
TJ = 25°C
10
TJ = 25°C
10
TA = 25°C, 30-ms pulse
0.01
Adjust pin current
change
TJ = 25°C
(5)
6
mA
mA
%/W
dB
60
120
μA
0.2
over the junction temperature range
0°C to 125°C
Temperature stability
(1)
(2)
(3)
(4)
0.1
60
TJ = 25°C
mA
75
over the junction temperature range 0°C to 125°C
10 ≤ IOUT ≤ 80 0mA,
1.4 V ≤ VIN – VOUT ≤ 10 V
mA
5
over the junction temperature range
0°C to 125°C
TJ = 25°C
Adjust pin current
mA
5
over the junction temperature range
0°C to 125°C
fRIPPLE = 1 20 Hz, VIN – VOUT = 3
over the junction temperature range
V VRIPPLE = 1 VPP
0°C to 125°C
mA
5
over the junction temperature range
0°C to 125°C
LM1117-5.0
VIN ≤ 15 V
V
5
TJ = 25°C
LM1117-3.3
VIN ≤ 15 V
1500
5
over the junction temperature range
0°C to 125°C
Quiescent current
V
1.7
TJ = 25°C
LM1117-2.5
VIN ≤ 15 V
Ripple regulation
1200
over the junction temperature range
0°C to 125°C
LM1117-1.8
VIN ≤ 15 V
Thermal regulation
1.3
TJ = 25°C
LM1117-ADJ
VIN = 15 V
V
1.2
over the junction temperature range
0°C to 125°C
VIN – VOUT = 5 V, TJ = 25°C
UNIT
1.15
over the junction temperature range
0°C to 125°C
IOUT = 800 mA
MAX(1)
1.1
over the junction temperature range
0°C to 125°C
TJ = 25°C
Dropout voltage(4)
TYP(2)
5
µA
0.5%
Long term stability
TA = 125°C, 1000 hours
RMS output noise
(% of VOUT), 10 Hz ≤ f ≤ 10 kHz
0.3%
0.003%
All limits are ensured by testing or statistical analysis.
Typical Values represent the most likely parametric normal.
Load and line regulation are measured at constant junction room temperature.
The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is
measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V.
The minimum output current required to maintain regulation.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
7.6 LM1117I Electrical Characteristics
unless otherwise specified, TJ = 25°C
TEST CONDITIONS
MIN(1)
TYP(2)
MAX(1)
LM1117I-ADJ
IOUT = 10 mA, VIN – VOUT = 2 V, TJ = 25°C
1.238
1.25
1.262
PARAMETER
VREF
Reference voltage
LM1117I-ADJ
10 mA ≤ IOUT ≤ 800 mA, 1.4 V ≤ VIN
– VOUT ≤ 10 V
TJ = 25°C
over the junction
temperature range –
40°C to 125°C
LM1117I-3.3
IOUT = 10 mA, VIN = 5 V, TJ = 25°C
VOUT
Output voltage
LM1117I-5.0
IOUT = 10 mA, VIN = 7 V, TJ = 25°C
LM1117I-ADJ
IOUT = 10 mA, 1.5 V ≤ VIN – VOUT ≤
13.75 V
TJ = 25°C
ΔVOUT
Line regulation(3)
LM1117I-ADJ
VIN – VOUT = 3 V, 10 ≤ IOUT ≤ 800
mA
ΔVOUT
Load
LM1117I-3.3
VIN = 4.75 V, 0 ≤ IOUT ≤ 800 mA
4.8
5.05
V
5.2
0.035%
0.3%
1
10
mV
1
15
mV
0.2%
0.5%
1
over the junction
temperature range –
40°C to 125°C
over the junction
temperature range –
40°C to 125°C
V
5
over the junction
temperature range –
40°C to 125°C
TJ = 25°C
LM1117I-5.0
VIN = 6.5 V, 0 ≤ IOUT ≤ 800 mA
5
over the junction
temperature range –
40°C to 125°C
TJ = 25°C
3.333
3.432
over the junction
temperature range –
40°C to 125°C
TJ = 25°C
regulation(3)
3.3
over the junction
temperature range –
40°C to 125°C
TJ = 25°C
LM1117I-5.0
IOUT = 0 mA, 6.5 V ≤ VIN ≤ 15 V
1.29
3.168
TJ = 25°C
over the junction
temperature range –
40°C to 125°C
V
3.3
4.95
TJ = 25°C
LM1117I-3.3
IOUT = 0 mA, 4.75 V ≤ VIN ≤ 15 V
1.2
3.267
TJ = 25°C
LM1117I-3.3
0 ≤ IOUT ≤ 800 mA, 4.75 V ≤ VIN ≤ 10 over the junction
temperature range –
V
40°C to 125°C
LM1117I-5.0
0 ≤ IOUT ≤ 800 mA, 6.5 V ≤ VIN ≤ 12
V
1.25
UNIT
15
mV
1
20
mV
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
7
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
unless otherwise specified, TJ = 25°C
PARAMETER
TEST CONDITIONS
MIN(1)
TJ = 25°C
1.3
TJ = 25°C
VIN-V OUT Dropout
1.35
TJ = 25°C
ILIMIT
Current limit
VIN – VOUT = 5 V, TJ = 25°C
Minimum load
current(5)
LM1117I-ADJ
VIN = 15 V
1.4
800
TJ = 25°C
15
TA = 25°C, 30-ms pulse
Ripple regulation
fRIPPLE = 120 Hz, VIN – VOUT = 3 V
VRIPPLE = 1 VPP
15
0.01
TJ = 25°C
over the junction
temperature range –
40°C to 125°C
TJ = 25°C
10 ≤ IOUT ≤ 800 mA,
1.4 V ≤ VIN – VOUT ≤ 10 V
(5)
8
mA
mA
mA
%/W
75
dB
60
over the junction temperature range –40°C to 125°C
120
μA
0.2
over the junction
temperature range –
40°C to 125°C
Temperature
stability
(1)
(2)
(3)
(4)
0.1
60
TJ = 25°C
Adjust pin current
change
mA
5
over the junction
temperature range –
40°C to 125°C
Thermal regulation
V
5
TJ = 25°C
LM1117I-5.0
VIN ≤ 15 V
1500
5
over the junction
temperature range –
40°C to 125°C
Quiescent current
V
1.7
TJ = 25°C
Adjust pin current
1200
over the junction
temperature range –
40°C to 125°C
LM1117I-3.3
VIN ≤ 15 V
V
1.2
over the junction
temperature range –
40°C to 125°C
IOUT = 800 mA
UNIT
1.15
over the junction
temperature range –
40°C to 125°C
IOUT = 500 mA
MAX(1)
1.1
over the junction
temperature range –
40°C to 125°C
IOUT = 100 mA
voltage(4)
TYP(2)
10
µA
0.5%
Long term stability
TA = 125°C, 1000 hours
RMS output noise
(% of VOUT), 10 Hz ≤ f ≤ 10 kHz
0.3%
0.003%
All limits are ensured by testing or statistical analysis.
Typical Values represent the most likely parametric normal.
Load and line regulation are measured at constant junction room temperature.
The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is
measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V.
The minimum output current required to maintain regulation.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
7.7 Typical Characteristics
Figure 7-1. Dropout Voltage (VIN – VOUT)
Figure 7-2. Short-Circuit Current
Figure 7-3. Load Regulation
Figure 7-4. LM1117-ADJ Ripple Rejection
Figure 7-5. LM1117-ADJ Ripple Rejection vs
Current
Figure 7-6. Temperature Stability
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
9
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
Figure 7-7. Adjust Pin Current
Figure 7-8. LM1117-5.0 Load Transient Response
Figure 7-9. LM1117-5.0 Line Transient Response
10
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
8 Detailed Description
8.1 Overview
The LM1117 adjustable version develops a 1.25-V reference voltage, VREF, between the output and the adjust
pin. As shown in Figure 8-1, this voltage is applied across resistor R1 to generate a constant current I1. The
current IADJ from the adjust pin can introduce error to the output, but since it is very small (60 µA) compared to
the I1 and very constant with line and load changes, the error can be ignored. The constant current I1 then flows
through the output set resistor R2 and sets the output voltage to the desired level.
For fixed voltage devices, R1 and R2 are integrated inside the devices.
Figure 8-1. Basic Adjustable Regulator
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Load Regulation
The LM1117 regulates the voltage that appears between its output and ground pins, or between its output and
adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the
best load regulation, a few precautions are needed.
Figure 8-2 shows a typical application using a fixed output regulator. The Rt1 and Rt2 are the line resistances. It
is obvious that the VLOAD is less than the VOUT by the sum of the voltage drops along the line resistances. In this
case, the load regulation seen at the RLOAD would be degraded from the data sheet specification. To improve
this, the load should be tied directly to the output terminal on the positive side and directly tied to the ground
terminal on the negative side.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
11
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
Figure 8-2. Typical Application Using Fixed Output Regulator
When the adjustable regulator is used (Figure 8-3), the best performance is obtained with the positive side of
the resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates
line drops from appearing effectively in series with the reference and degrading regulation. For example, a 5V
regulator with 0.05Ω resistance between the regulator and load will have a load regulation due to line resistance
of 0.05Ω x IL. If R1 (=125Ω) is connected near the load, the effective line resistance will be 0.05Ω (1+R2/R1) or
in this case, it is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of
the load to provide remote ground sensing and improve load regulation.
Figure 8-3. Best Load Regulation Using Adjustable Output Regulator
12
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
8.4 Device Functional Modes
8.4.1 Protection Diodes
Under normal operation, the LM1117 regulators do not need any protection diode. With the adjustable device,
the internal resistance between the adjust and output terminals limits the current. No diode is needed to divert
the current around the regulator even with capacitor on the adjust terminal. The adjust pin can take a transient
signal of ±25V with respect to the output voltage without damaging the device.
When a output capacitor is connected to a regulator and the input is shorted to ground, the output capacitor
will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the
output voltage of the regulator, and rate of decrease of VIN. In the LM1117 regulators, the internal diode between
the output and input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large
output capacitor (≥1000 µF), and with input instantaneously shorted to ground, the regulator could be damaged.
In this case, an external diode is recommended between the output and input pins to protect the regulator, as
shown in Figure 8-4.
Figure 8-4. Regulator With Protection Diode
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
13
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The LM1117 is a versatile and high performance linear regulator with a wide temperature range and tight line/
load regulation operation. An output capacitor is required to further improve transient response and stability. For
the adjustable option, the ADJ pin can also be bypassed to achieve very high ripple-rejection ratios. The LM1117
is versatile in its applications, including its uses as a post regulator for DC/DC converters, battery chargers, and
microprocessor supplies.
9.2 Typical Application
Figure 9-1. 1.25-V to 10-V Adjustable Regulator With Improved Ripple Rejection
9.2.1 Design Requirements
The device component count is very minimal, employing two resistors as part of a voltage divider circuit and
an output capacitor for load regulation. A 10-μF tantalum on the input is a suitable input capacitor for almost all
applications. An optional bypass capacitor across R2 can also be used to improve PSRR. See Section 7.3 for
more information.
9.2.2 Detailed Design Procedure
The output voltage is set based on the selection of the two resistors, R1 and R2, as shown in Figure 9-1. For
details on capacitor selection, refer to Section 9.2.2.1.
9.2.2.1 External Capacitors
9.2.2.1.1 Input Bypass Capacitor
An input capacitor is recommended. A 10-µF tantalum on the input is a suitable input capacitor for almost all
applications.
9.2.2.1.2 Adjust Terminal Bypass Capacitor
The adjust terminal can be bypassed to ground with a bypass capacitor (CADJ) to improve ripple rejection. This
bypass capacitor prevents ripple from being amplified as the output voltage is increased. At any ripple frequency,
the impedance of the CADJ should be less than R1 to prevent the ripple from being amplified:
14
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
1/(2π × fRIPPLE × CADJ) < R1
(1)
The R1 is the resistor between the output and the adjust pin. Its value is normally in the range of 100-200Ω. For
example, with R1 = 124Ω and fRIPPLE = 120Hz, the CADJ should be > 11µF.
9.2.2.1.3 Output Capacitor
The output capacitor is critical in maintaining regulator stability, and must meet the required conditions for both
minimum amount of capacitance and equivalent series resistance (ESR). The minimum output capacitance
required by the LM1117 is 10 µF, if a tantalum capacitor is used. Any increase of the output capacitance will
merely improve the loop stability and transient response. The ESR of the output capacitor should range between
0.3 Ω to 22 Ω. In the case of the adjustable regulator, when the CADJ is used, a larger output capacitance (22-µF
tantalum) is required.
9.2.3 Application Curve
As shown in Figure 9-2, the dropout voltage will vary with output current and temperature. Care should be taken
during design to ensure the dropout voltage requirement is met across the entire operating temperature and
output current range.
Figure 9-2. Dropout Voltage (VIN – VOUT)
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
15
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
9.3 System Examples
Several circuits can be realized with the LM1117. The circuit diagrams in this section demonstrate multiple
system examples that can be utilized in many applications.
Figure 9-3. Fixed Output Regulator
Figure 9-4. Adjusting Output of Fixed Regulators
Figure 9-5. Regulator With Reference
Figure 9-6. 5-V Logic Regulator With Electronic
Shutdown*
Figure 9-7. Battery Backed-Up Regulated Supply
Figure 9-8. Low Dropout Negative Supply
16
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
10 Power Supply Recommendations
The input supply to the LM1117 must be kept at a voltage level such that its maximum rating is not exceeded.
The minimum dropout voltage must also be met with extra headroom when possible to keep the LM1117 in
regulation. An input capacitor is recommended. For more information regarding capacitor selection, refer to
Section 9.2.2.1.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
17
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
11 Layout
11.1 Layout Guidelines
Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise.
Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the
feedback loop from VOUT to ADJ must be kept as short as possible. To improve PSRR, a bypass capacitor can
be placed at the ADJ pin and must be located as close as possible to the IC. In cases when VIN shorts to
ground, an external diode must be placed from VOUT to VIN to divert the surge current from the output capacitor
and protect the IC. The diode must be placed close to the corresponding IC pins to increase their effectiveness.
11.1.1 Heatsink Requirements
When an integrated circuit operates with an appreciable current, its junction temperature is elevated. It is
important to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is
determined by summing the individual parts consisting of a series of temperature rises from the semiconductor
junction to the operating environment. A one-dimensional steady-state model of conduction heat transfer is
demonstrated in Figure 11-1. The heat generated at the device junction flows through the die to the die attach
pad, through the lead frame to the surrounding case material, to the printed circuit board, and eventually to the
ambient environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a
heatsink.
Table 11-1. Component and Application Variables
RθJC (COMPONENT VARIABLES)
RθJA (APPLICATION VARIABLES)
Leadframe Size and Material
Mounting Pad Size, Material, and Location
No. of Conduction Pins
Placement of Mounting Pad
Die Size
PCB Size and Material
Die Attach Material
Traces Length and Width
Molding Compound Size and Material
Adjacent Heat Sources
Volume of Air
Ambient Temperatue
Shape of Mounting Pad
The case temperature is measured at the point where the leads contact with the mounting pad surface
Figure 11-1. Cross-Sectional View of Integrated Circuit Mounted on a Printed Circuit Board
18
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
The LM1117 regulators have internal thermal shutdown to protect the device from over-heating. Under all
possible operating conditions, the junction temperature of the LM1117 must be within the range of 0°C to 125°C.
A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature
of the application. To determine if a heatsink is needed, the power dissipated by the regulator, PD , must be
calculated:
IIN = IL + IG
(2)
PD = (VIN-VOUT)I L + VINIG
(3)
Figure 11-2 shows the voltages and currents which are present in the circuit.
Figure 11-2. Power Dissipation Diagram
The next parameter which must be calculated is the maximum allowable temperature rise, TR(max):
TR(max) = TJ(max)-TA(max)
(4)
where
•
•
TJ(max) is the maximum allowable junction temperature (125°C) which will be encountered in the application
TA(max) is the maximum ambient temperature which will be encountered in the application
Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient
thermal resistance (RθJA) can be calculated:
RθJA = TR(max)/PD
(5)
For the maximum allowable value for θJA, refer to the Section 7.4 table.
As a design aid, Table 11-2 shows the value of the θJA of SOT-223 and TO-252 for different heatsink area.
Figure 11-3 and Figure 11-4 reflects the same test results as what are in the Table 11-2
Figure 11-5 and Figure 11-6 shows the maximum allowable power dissipation vs. ambient temperature for the
SOT-223 and TO-252 device. Figure 11-7 and Figure 11-8 shows the maximum allowable power dissipation vs.
copper area (in2) for the SOT-223 and TO-252 devices. Please see AN1028 for power enhancement techniques
to be used with SOT-223 and TO-252 packages.
The AN-1187 Leadless Leadframe Package (LLP) application note discusses improved thermal performance
and power dissipation for the WSON.
Table 11-2. RθJA Different Heatsink Area
LAYOUT
COPPER AREA
Top Side
(in2)(1)
THERMAL RESISTANCE
Bottom Side
(in2)
(θJA,°C/W) SOT-223
(θJA,°C/W) TO-252
1
0.0123
0
136
103
2
0.066
0
123
87
3
0.3
0
84
60
4
0.53
0
75
54
5
0.76
0
69
52
6
1
0
66
47
7
0
0.2
115
84
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
19
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
Table 11-2. RθJA Different Heatsink Area (continued)
LAYOUT
(1)
COPPER AREA
THERMAL RESISTANCE
8
0
0.4
98
70
9
0
0.6
89
63
10
0
0.8
82
57
11
0
1
79
57
12
0.066
0.066
125
89
13
0.175
0.175
93
72
14
0.284
0.284
83
61
15
0.392
0.392
75
55
16
0.5
0.5
70
53
Tab of device attached to topside copper
Figure 11-3. RθJA vs 1-oz Copper Area for SOT-223
Figure 11-4. RθJA vs 2-oz Copper Area for TO-252
Figure 11-5. Maximum Allowable Power
Dissipation vs Ambient Temperature for SOT-223
Figure 11-6. Maximum Allowable Power
Dissipation vs Ambient Temperature for TO-252
20
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
Figure 11-7. Maximum Allowable Power
Dissipation vs 1-oz Copper Area for SOT-223
Figure 11-8. Maximum Allowable Power
Dissipation vs 2-oz Copper Area for TO-252
Figure 11-9. Top View of the Thermal Test Pattern in Actual Scale
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
21
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
Figure 11-10. Bottom View of the Thermal Test Pattern in Actual Scale
11.2 Layout Example
Figure 11-11. Layout Example (SOT-223)
22
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
LM1117
www.ti.com
SNOS412P – FEBRUARY 2000 – REVISED JULY 2022
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
Texas Instruments, AN-1187 Leadless Leadframe Package (LLP) application note
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LM1117
23
PACKAGE OPTION ADDENDUM
www.ti.com
13-Jul-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
LM1117DT-1.8/NOPB
ACTIVE
TO-252
NDP
3
75
RoHS & Green
SN
Level-2-260C-1 YEAR
0 to 125
LM1117
DT-1.8
Samples
LM1117DT-2.5/NOPB
ACTIVE
TO-252
NDP
3
75
RoHS & Green
SN
Level-2-260C-1 YEAR
0 to 125
LM1117
DT-2.5
Samples
LM1117DT-3.3/NOPB
ACTIVE
TO-252
NDP
3
75
RoHS & Green
SN
Level-2-260C-1 YEAR
0 to 125
LM1117
DT-3.3
Samples
LM1117DT-5.0/NOPB
ACTIVE
TO-252
NDP
3
75
RoHS & Green
SN
Level-2-260C-1 YEAR
0 to 125
LM1117
DT-5.0
Samples
LM1117DT-ADJ/NOPB
ACTIVE
TO-252
NDP
3
75
RoHS & Green
SN
Level-2-260C-1 YEAR
0 to 125
LM1117
DT-ADJ
Samples
LM1117DTX-1.8/NOPB
ACTIVE
TO-252
NDP
3
2500
RoHS & Green
SN
Level-2-260C-1 YEAR
0 to 125
LM1117
DT-1.8
Samples
LM1117DTX-2.5/NOPB
ACTIVE
TO-252
NDP
3
2500
RoHS & Green
SN
Level-2-260C-1 YEAR
0 to 125
LM1117
DT-2.5
Samples
LM1117DTX-3.3/NOPB
ACTIVE
TO-252
NDP
3
2500
RoHS & Green
SN
Level-2-260C-1 YEAR
0 to 125
LM1117
DT-3.3
Samples
LM1117DTX-5.0/NOPB
ACTIVE
TO-252
NDP
3
2500
RoHS & Green
SN
Level-2-260C-1 YEAR
0 to 125
LM1117
DT-5.0
Samples
LM1117DTX-ADJ/NOPB
ACTIVE
TO-252
NDP
3
2500
RoHS & Green
SN
Level-2-260C-1 YEAR
0 to 125
LM1117
DT-ADJ
Samples
LM1117IDT-3.3/NOPB
ACTIVE
TO-252
NDP
3
75
RoHS & Green
SN
Level-2-260C-1 YEAR
-40 to 125
LM1117
IDT-3.3
Samples
LM1117IDT-5.0/NOPB
ACTIVE
TO-252
NDP
3
75
RoHS & Green
SN
Level-2-260C-1 YEAR
-40 to 125
LM1117
IDT-5.0
Samples
LM1117IDT-ADJ/NOPB
ACTIVE
TO-252
NDP
3
75
RoHS & Green
SN
Level-2-260C-1 YEAR
-40 to 125
LM1117
IDT-ADJ
Samples
LM1117IDTX-3.3/NOPB
ACTIVE
TO-252
NDP
3
2500
RoHS & Green
SN
Level-2-260C-1 YEAR
-40 to 125
LM1117
IDT-3.3
Samples
LM1117IDTX-5.0/NOPB
ACTIVE
TO-252
NDP
3
2500
RoHS & Green
SN
Level-2-260C-1 YEAR
-40 to 125
LM1117
IDT-5.0
Samples
LM1117IDTX-ADJ/NOPB
ACTIVE
TO-252
NDP
3
2500
RoHS & Green
SN
Level-2-260C-1 YEAR
-40 to 125
LM1117
IDT-ADJ
Samples
LM1117ILD-ADJ/NOPB
ACTIVE
WSON
NGN
8
1000
RoHS & Green
SN
Level-3-260C-168 HR
-40 to 125
1117IAD
Samples
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
13-Jul-2022
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
LM1117IMP-3.3/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
N05B
Samples
LM1117IMP-5.0/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
N06B
Samples
LM1117IMP-ADJ/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
N03B
Samples
LM1117IMPX-3.3/NOPB
ACTIVE
SOT-223
DCY
4
2000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
N05B
Samples
LM1117IMPX-5.0/NOPB
ACTIVE
SOT-223
DCY
4
2000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
N06B
Samples
LM1117IMPX-ADJ/NOPB
ACTIVE
SOT-223
DCY
4
2000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
N03B
Samples
LM1117LD-1.8/NOPB
ACTIVE
WSON
NGN
8
1000
RoHS & Green
SN
Level-3-260C-168 HR
0 to 125
1117-18
Samples
LM1117LD-2.5/NOPB
ACTIVE
WSON
NGN
8
1000
RoHS & Green
SN
Level-3-260C-168 HR
0 to 125
1117-25
Samples
LM1117LD-3.3/NOPB
ACTIVE
WSON
NGN
8
1000
RoHS & Green
SN
Level-3-260C-168 HR
0 to 125
1117-33
Samples
LM1117LD-ADJ/NOPB
ACTIVE
WSON
NGN
8
1000
RoHS & Green
SN
Level-3-260C-168 HR
0 to 125
1117ADJ
Samples
LM1117LDX-1.8/NOPB
ACTIVE
WSON
NGN
8
4500
RoHS & Green
SN
Level-3-260C-168 HR
0 to 125
1117-18
Samples
LM1117LDX-ADJ/NOPB
ACTIVE
WSON
NGN
8
4500
RoHS & Green
SN
Level-3-260C-168 HR
0 to 125
1117ADJ
Samples
LM1117MP-1.8/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
0 to 125
N12A
Samples
LM1117MP-2.5/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
0 to 125
N13A
Samples
LM1117MP-3.3/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
0 to 125
N05A
Samples
LM1117MP-5.0/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
0 to 125
N06A
Samples
LM1117MP-ADJ/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
0 to 125
N03A
Samples
LM1117MPX-1.8/NOPB
ACTIVE
SOT-223
DCY
4
2000
RoHS & Green
SN
Level-1-260C-UNLIM
0 to 125
N12A
Samples
LM1117MPX-2.5/NOPB
ACTIVE
SOT-223
DCY
4
2000
RoHS & Green
SN
Level-1-260C-UNLIM
0 to 125
N13A
Samples
LM1117MPX-3.3
ACTIVE
SOT-223
DCY
4
2000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
N05A
Samples
LM1117MPX-3.3/NOPB
ACTIVE
SOT-223
DCY
4
2000
RoHS & Green
SN
Level-1-260C-UNLIM
N05A
Samples
Addendum-Page 2
0 to 125
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
13-Jul-2022
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
LM1117MPX-5.0/NOPB
ACTIVE
SOT-223
DCY
4
2000
RoHS & Green
SN
Level-1-260C-UNLIM
0 to 125
N06A
Samples
LM1117MPX-ADJ/NOPB
ACTIVE
SOT-223
DCY
4
2000
RoHS & Green
SN
Level-1-260C-UNLIM
0 to 125
N03A
Samples
LM1117S-ADJ/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
0 to 125
LM1117S
ADJ
Samples
LM1117SX-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
0 to 125
LM1117S
3.3
Samples
LM1117SX-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
0 to 125
LM1117S
5.0
Samples
LM1117SX-ADJ/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
0 to 125
LM1117S
ADJ
Samples
LM1117T-2.5/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
0 to 125
LM1117T
2.5
Samples
LM1117T-3.3/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
0 to 125
LM1117T
3.3
Samples
LM1117T-5.0/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
0 to 125
LM1117T
5.0
Samples
LM1117T-ADJ/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
0 to 125
LM1117T
ADJ
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
工商网监
湘ICP备2023018690号
