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LM2623EV

LM2623EV

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    BOARD EVALUATION LM2623

  • 数据手册
  • 价格&库存
LM2623EV 数据手册
User's Guide SNVA063H – April 2003 – Revised April 2013 AN-1274 LM2623 Evaluation Board 1 Introduction The LM2623 is a general purpose, gated oscillator based, DC/DC boost converter that can run from low input voltage and produce a regulated output voltage with low ripple. The LM2623 evaluation board is programmed for a 5V output running off a two-cell power supply. For more information regarding the LM2623, please refer to LM2623 General Purpose, Gated Oscillator Based, DC/DC Boost Converter (SNVS188), AN-1258 LM2623 Boost Converter - A Simple Supply (SNVA061), and AN-1221 LM2623 General Purpose, Boost Converter Circuit (SNVA050) for more application configurations. 2 Bill of Materials Table 1. Bill of Materials Designator Description Manufacturer Model Number U1 LM2623 DC-DC Converter VSSOP-8 Texas Instruments LM2623 L1 Inductor (4.7µH 20% 2A) Coilcraft DO1813P-472HC C1 Input Capacitor (220µF Tantalum Capacitor ( 20% 6.3V )) Vishay - Sprague 595D227X06R3C2 C2 Output Capacitor (100µF Tantalum Capacitor (10%, 6.3V)) Vishay - Sprague 293D107X96R3C2T D1 Output Diode (40V 3A Schottky) OnSemi MBRS340T3 RF2 100 kΩ Feedback Resistor Vishay - Dale CRCW06031003F RF1 300 kΩ Feedback Resistor Vishay - Dale CRCW06033003F R3 150 kΩ Frequency Set Resistor Vishay - Dale CRCW06031503F R5 0Ω Resistor Vishay - Dale CRCW0603000F C3 4.7pF Ceramic Capacitor TDK C1608C0G1H4R7C All trademarks are the property of their respective owners. SNVA063H – April 2003 – Revised April 2013 Submit Documentation Feedback AN-1274 LM2623 Evaluation Board Copyright © 2003–2013, Texas Instruments Incorporated 1 Application Circuit 3 www.ti.com Application Circuit Within the Application Board Circuit Diagram, Figure 1, there are many components shown that are not populated on the 5V output evaluation board. These component footprints are used in numerous other applications found in application note AN-1221. In addition, jumpers J1, J2, and J4 are closed on the twocell input to 5V output application board. D1 L1 V IN 2.3V to 5.5V 4.7PH R3 150k 3A C3 C1 + 220PF tant. 4.7pF 8 SW 3 BOOT FREQ LM2623 1 EN V DD PGND FB 7 5V 2 6 C2 100PF tant RF1 300k 4 SGND 5 RF2 100k Figure 1. Evaluation Board Application Circuit 2 AN-1274 LM2623 Evaluation Board SNVA063H – April 2003 – Revised April 2013 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Board Layers www.ti.com 4 Board Layers Figure 2. Typical Layout, Top View Figure 3. Bottom View Unmirrored SNVA063H – April 2003 – Revised April 2013 Submit Documentation Feedback AN-1274 LM2623 Evaluation Board Copyright © 2003–2013, Texas Instruments Incorporated 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated
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