LM2937ESX-8.0

LM2937 www.ti.com SNVS100E – MARCH 2000 – REVISED APRIL 2013 LM2937 500 mA Low Dropout Regulator Check for Samples: LM2937 FEATURES DESCRIPTION 1 • 2 • • • • • • • • Fully Specified for Operation Over −40°C to +125°C Output Current in Excess of 500 mA Output Trimmed for 5% Tolerance Under all Operating Conditions Typical Dropout Voltage of 0.5V at Full Rated Load Current Wide Output Capacitor ESR Range, up to 3Ω Internal Short Circuit and Thermal Overload Protection Reverse Battery Protection 60V Input Transient Protection Mirror Image Insertion Protection The LM2937 is a positive voltage regulator capable of supplying up to 500 mA of load current. The use of a PNP power transistor provides a low dropout voltage characteristic. With a load current of 500 mA the minimum input to output voltage differential required for the output to remain in regulation is typically 0.5V (1V ensured maximum over the full operating temperature range). Special circuitry has been incorporated to minimize the quiescent current to typically only 10 mA with a full 500 mA load current when the input to output voltage differential is greater than 3V. The LM2937 requires an output bypass capacitor for stability. As with most low dropout regulators, the ESR of this capacitor remains a critical design parameter, but the LM2937 includes special compensation circuitry that relaxes ESR requirements. The LM2937 is stable for all ESR below 3Ω. This allows the use of low ESR chip capacitors. Ideally suited for automotive applications, the LM2937 will protect itself and any load circuitry from reverse battery connections, two-battery jumps and up to +60V/−50V load dump transients. Familiar regulator features such as short circuit and thermal shutdown protection are also built in. Connection Diagrams Front View Figure 1. TO-220 Plastic Package See Package Number NDE0003B Top View Figure 3. DDPAK/TO-263 Surface-Mount Package See Package Number KTT0003B Front View Figure 2. SOT-223 Plastic Package See Package Number DCY0004A Side View Figure 4. DDPAK/TO-263 Surface-Mount Package See Package Number KTT0003B 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM2937 SNVS100E – MARCH 2000 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Continuous Input Voltage Transient (t ≤ 100 ms) Internal Power Dissipation (3) 26V 60V Internally Limited Maximum Junction Temperature 150°C −65°C to +150°C Storage Temperature Range TO-220 (10 seconds) 260°C DDPAK/TO-263 (10 seconds) 230°C SOT-223 (Vapor Phase, 60 seconds) 215°C SOT-223 (Infared, 15 seconds) 220°C ESD Susceptibility (1) (2) (3) (4) (4) 2 kV Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device outside of its rated Operating Conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above 150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θJA is 65°C/W, for the TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is the sum of the LM2937 junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package (see Application Hints for more information on heatsinking). ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ. Operating Conditions (1) Temperature Range (2) LM2937ET, LM2937ES LM2937IMP Maximum Input Voltage (1) (2) 2 −40°C ≤ TJ ≤125°C −40°C ≤ TJ ≤85°C 26V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device outside of its rated Operating Conditions. The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above 150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θJA is 65°C/W, for the TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is the sum of the LM2937 junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package (see Application Hints for more information on heatsinking). Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100E – MARCH 2000 – REVISED APRIL 2013 Electrical Characteristics VIN = VNOM + 5V (1) IOUTmax = 500 mA for the TO-220 and DDPAK/TO-263 packages, IOUTmax=400mA for the SOT-223 package, COUT = 10 μF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the indicated device., all other specifications are for TA = TJ = 25°C. Output Voltage (VOUT) Parameter 5V Conditions Typ Output Voltage 8V Limit Typ 4.85 5.00 5 mA ≤ IOUT ≤ IOUTmax 4.75 10V Limit Typ 7.76 8.00 7.60 Limit 9.70 10.00 Units V(Min) 9.50 V(Min) 5.15 8.24 10.30 V(Max) 5.25 8.40 10.50 V(Max) Line Regulation (VOUT + 2V) ≤ VIN ≤ 26V, IOUT = 5 mA 15 50 24 80 30 100 mV(Max) Load Regulation 5 mA ≤ IOUT ≤ IOUTmax 5 50 8 80 10 100 mV(Max) Quiescent Current (VOUT + 2V) ≤ VIN ≤ 26V, IOUT = 5 mA 2 10 2 10 2 10 mA(Max) VIN = (VOUT + 5V), IOUT = IOUTmax 10 20 10 20 10 20 mA(Max) Output Noise Voltage 10 Hz–100 kHz, IOUT = 5 mA 150 Long Term Stability 1000 Hrs. 20 Dropout Voltage IOUT = IOUTmax 0.5 1.0 0.5 1.0 0.5 1.0 V(Max) IOUT = 50 mA 110 250 110 250 110 250 mV(Max) Short-Circuit Current 1.0 0.6 1.0 0.6 1.0 0.6 A(Min) Peak Line Transient Voltage tf < 100 ms, RL = 100Ω 75 60 75 60 75 60 V(Min) 26 V(Min) Maximum Operational Input Voltage 240 32 26 μVrms 300 40 26 mV Reverse DC Input Voltage VOUT ≥ −0.6V, RL = 100Ω −30 −15 −30 −15 −30 −15 V(Min) Reverse Transient Input Voltage tr < 1 ms, RL = 100Ω −75 −50 −75 −50 −75 −50 V(Min) (1) Typicals are at TJ = 25°C and represent the most likely parametric norm. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2937 3 LM2937 SNVS100E – MARCH 2000 – REVISED APRIL 2013 www.ti.com Electrical Characteristics VIN = VNOM + 5V (1) IOUTmax = 500 mA for the TO-220 and DDPAK/TO-263 packages, IOUTmax=400mA for the SOT-223 package, COUT = 10 μF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the indicted device., all other specifications are for TA = TJ = 25°C. Output Voltage (VOUT) Parameter 12V Conditions Typ Output Voltage 15V Limit Typ 11.64 5 mA ≤ IOUT ≤ IOUTmax 12.00 11.40 Limit 14.55 15.00 Units V (Min) 14.25 V(Min) 12.36 15.45 V(Max) 12.60 15.75 V(Max) Line Regulation (VOUT + 2V) ≤ VIN ≤ 26V, IOUT = 5 mA 36 120 45 150 mV(Max) Load Regulation 5 mA ≤ IOUT ≤ IOUTmax 12 120 15 150 mV(Max) Quiescent Current (VOUT + 2V) ≤ VIN ≤ 26V, IOUT = 5 mA 2 10 2 10 mA(Max) VIN = (VOUT + 5V), IOUT = IOUTmax 10 20 10 20 mA(Max) Output Noise Voltage 10 Hz–100 kHz, IOUT = 5 mA 360 Long Term Stability 1000 Hrs 44 Dropout Voltage IOUT = IOUTmax 0.5 1.0 0.5 1.0 V(Max) IOUT = 50 mA 110 250 110 250 mV(Max) 1.0 0.6 1.0 0.6 A(Min) 75 60 75 60 V(Min) 26 V(Min) Short-Circuit Current Peak Line Transient Voltage tf < 100 ms, RL = 100Ω Maximum Operational Input Voltage μVrms 450 56 26 mV Reverse DC Input Voltage VOUT ≥ −0.6V, RL = 100Ω −30 −15 −30 −15 V(Min) Reverse Transient Input Voltage tr < 1 ms, RL = 100Ω −75 −50 −75 −50 V(Min) (1) 4 Typicals are at TJ = 25°C and represent the most likely parametric norm. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100E – MARCH 2000 – REVISED APRIL 2013 Typical Performance Characteristics Dropout Voltage vs. Output Current Dropout Voltage vs. Temperature Figure 5. Figure 6. Output Voltage vs. Temperature Quiescent Current vs. Temperature Figure 7. Figure 8. Quiescent Current vs. Input Voltage Quiescent Current vs. Output Current Figure 9. Figure 10. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2937 5 LM2937 SNVS100E – MARCH 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) (1) 6 Line Transient Response Load Transient Response Figure 11. Figure 12. Ripple Rejection Output Impedance Figure 13. Figure 14. Maximum Power Dissipation (TO-220) Maximum Power Dissipation (DDPAK/TO-263) (1) Figure 15. Figure 16. The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above 150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θJA is 65°C/W, for the TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is the sum of the LM2937 junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package (see Application Hints for more information on heatsinking). Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100E – MARCH 2000 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Low Voltage Behavior Low Voltage Behavior Figure 17. Figure 18. Low Voltage Behavior Output at Voltage Extremes Figure 19. Figure 20. Output at Voltage Extremes Figure 21. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2937 7 LM2937 SNVS100E – MARCH 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 8 Output Capacitor ESR Peak Output Current Figure 22. Figure 23. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100E – MARCH 2000 – REVISED APRIL 2013 Typical Application * Required if the regulator is located more than 3 inches from the power supply filter capacitors. ** Required for stability. Cout must be at least 10 μF (over the full expected operating temperature range) and located as close as possible to the regulator. The equivalent series resistance, ESR, of this capacitor may be as high as 3Ω. APPLICATION HINTS EXTERNAL CAPACITORS The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both ESR (Equivalent Series Resistance) and minimum amount of capacitance. MINIMUM CAPACITANCE: The minimum output capacitance required to maintain stability is 10 μF (this value may be increased without limit). Larger values of output capacitance will give improved transient response. ESR LIMITS: The ESR of the output capacitor will cause loop instability if it is too high or too low. The acceptable range of ESR plotted versus load current is shown in the graph below. It is essential that the output capacitor meet these requirements, or oscillations can result. Output Capacitor ESR Figure 24. ESR Limits It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the design. For aluminum electrolytic capacitors, ESR will increase by about 30X as the temperature is reduced from 25°C to −40°C. This type of capacitor is not well-suited for low temperature operation. Solid tantalum capacitors have a more stable ESR over temperature, but are more expensive than aluminum electrolytics. A cost-effective approach sometimes used is to parallel an aluminum electrolytic with a solid Tantalum, with the total capacitance split about 75/25% with the Aluminum being the larger value. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2937 9 LM2937 SNVS100E – MARCH 2000 – REVISED APRIL 2013 www.ti.com If two capacitors are paralleled, the effective ESR is the parallel of the two individual values. The “flatter” ESR of the Tantalum will keep the effective ESR from rising as quickly at low temperatures. HEATSINKING A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. Under all possible operating conditions, the junction temperature must be within the range specified under Absolute Maximum Ratings. To determine if a heatsink is required, the power dissipated by the regulator, PD, must be calculated. The figure below shows the voltages and currents which are present in the circuit, as well as the formula for calculating the power dissipated in the regulator: IIN = IL + IG PD = (VIN − VOUT) IL + (VIN) IG Figure 25. Power Dissipation Diagram The next parameter which must be calculated is the maximum allowable temperature rise, TR (max). This is calculated by using the formula: TR (max) = TJ(max) − TA (max) where • • TJ (max) is the maximum allowable junction temperature, which is 125°C for commercial grade parts TA (max) is the maximum ambient temperature which will be encountered in the application (1) Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient thermal resistance, θ(J−A), can now be found: θ(J−A) = TR (max)/PD (2) IMPORTANT: If the maximum allowable value for θ(J−A) is found to be ≥ 53°C/W for the TO-220 package, ≥ 80°C/W for the DDPAK/TO-263 package, or ≥174°C/W for the SOT-223 package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the calculated value for θ(J−A) falls below these limits, a heatsink is required. 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100E – MARCH 2000 – REVISED APRIL 2013 HEATSINKING TO-220 PACKAGE PARTS The TO-220 can be attached to a typical heatsink, or secured to a copper plane on a PC board. If a copper plane is to be used, the values of θ(J−A) will be the same as shown in the next section for the DDPAK/TO-263. If a manufactured heatsink is to be selected, the value of heatsink-to-ambient thermal resistance, θ(H−A), must first be calculated: θ(H−A) = θ(J−A) − θ(C−H) − θ(J−C) where • • θ(J−C) is defined as the thermal resistance from the junction to the surface of the case. A value of 3°C/W can be assumed for θ(J−C) for this calculation θ(C−H) is defined as the thermal resistance between the case and the surface of the heatsink. The value of θ(C−H) will vary from about 1.5°C/W to about 2.5°C/W (depending on method of attachment, insulator, etc.). If the exact value is unknown, 2°C/W should be assumed for θ(C−H) (3) When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is less than or equal to this number. θ(H−A) is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots temperature rise vs power dissipation for the heatsink. HEATSINKING DDPAK/TO-263 AND SOT-223 PACKAGE PARTS Both the DDPAK/TO-263 (“S”) and SOT-223 (“MP”) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane. Figure 26 shows for the DDPAK/TO-263 the measured values of θ(J−A) for different copper area sizes using a typical PCB with 1 ounce copper and no solder mask over the copper area used for heatsinking. Figure 26. θ(J−A) vs. Copper (1 ounce) Area for the DDPAK/TO-263 Package As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. It should also be observed that the minimum value of θ(J−A) for the DDPAK/TO-263 package mounted to a PCB is 32°C/W. As a design aid, Figure 27 shows the maximum allowable power dissipation compared to ambient temperature for the DDPAK/TO-263 device (assuming θ(J−A) is 35°C/W and the maximum junction temperature is 125°C). Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2937 11 LM2937 SNVS100E – MARCH 2000 – REVISED APRIL 2013 www.ti.com Figure 27. Maximum Power Dissipation vs. TAMB for the DDPAK/TO-263 Package Figure 28 and Figure 29 show the information for the SOT-223 package. Figure 29 assumes a θ(J−A) of 74°C/W for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of +85°C. Figure 28. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package Figure 29. Maximum Power Dissipation vs TAMB for the SOT-223 Package SOT-223 SOLDERING RECOMMENDATIONS It is not recommended to use hand soldering or wave soldering to attach the small SOT-223 package to a printed circuit board. The excessive temperatures involved may cause package cracking. Either vapor phase or infrared reflow techniques are preferred soldering attachment methods for the SOT-223 package. 12 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2937 LM2937 www.ti.com SNVS100E – MARCH 2000 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision D (April 2013) to Revision E • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 12 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2937 13 PACKAGE OPTION ADDENDUM www.ti.com 23-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM2937ES-10 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES -10 LM2937ES-10/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES -10 LM2937ES-12 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES -12 LM2937ES-12/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES -12 LM2937ES-15 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES -15 LM2937ES-15/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES -15 LM2937ES-5.0 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES -5.0 LM2937ES-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES -5.0 LM2937ES-8.0 ACTIVE DDPAK/ TO-263 KTT 3 TBD Call TI Call TI -40 to 125 LM2937ES -8.0 LM2937ES-8.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES -8.0 LM2937ESX-12 ACTIVE DDPAK/ TO-263 KTT 3 TBD Call TI Call TI -40 to 125 LM2937ES -12 LM2937ESX-12/NOPB ACTIVE DDPAK/ TO-263 KTT 3 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES -12 LM2937ESX-15 ACTIVE DDPAK/ TO-263 KTT 3 TBD Call TI Call TI -40 to 125 LM2937ES -15 LM2937ESX-15/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES -15 LM2937ESX-5.0 ACTIVE DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LM2937ES -5.0 LM2937ESX-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES -5.0 LM2937ESX-8.0 ACTIVE DDPAK/ TO-263 KTT 3 TBD Call TI Call TI -40 to 125 LM2937ES -8.0 45 500 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 23-Sep-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM2937ESX-8.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES -8.0 LM2937ET-10 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET -10 LM2937ET-10/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2937ET -10 LM2937ET-12 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET -12 LM2937ET-12/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2937ET -12 LM2937ET-15 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET -15 LM2937ET-15/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2937ET -15 LM2937ET-5.0 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET -5.0 LM2937ET-5.0/NOPB ACTIVE TO-220 NDE 3 45 Pb-Free (RoHS Exempt) CU SN Level-1-NA-UNLIM -40 to 125 LM2937ET -5.0 LM2937ET-8.0 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET -8.0 LM2937ET-8.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2937ET -8.0 LM2937IMP-10 ACTIVE SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 L73B LM2937IMP-10/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L73B LM2937IMP-12 ACTIVE SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 L74B LM2937IMP-12/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L74B LM2937IMP-5.0 ACTIVE SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 L71B LM2937IMP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L71B LM2937IMP-8.0 ACTIVE SOT-223 DCY 4 TBD Call TI Call TI -40 to 125 L72B Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 23-Sep-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM2937IMP-8.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L72B LM2937IMPX-10 ACTIVE SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 125 L73B LM2937IMPX-10/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L73B LM2937IMPX-12 ACTIVE SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 125 L74B LM2937IMPX-12/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L74B LM2937IMPX-15 ACTIVE SOT-223 DCY 4 TBD Call TI Call TI -40 to 125 L75B LM2937IMPX-15/NOPB ACTIVE SOT-223 DCY 4 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L75B LM2937IMPX-5.0 ACTIVE SOT-223 DCY 4 TBD Call TI Call TI -40 to 125 L71B LM2937IMPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L71B LM2937IMPX-8.0 ACTIVE SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 125 L72B LM2937IMPX-8.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L72B 2000 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Sep-2013 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2937ESX-12/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2937ESX-15/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2937ESX-5.0 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2937ESX-5.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2937ESX-8.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2937IMP-10 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMP-10/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMP-12 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMP-12/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMP-5.0 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMP-8.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMPX-10 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMPX-10/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Device LM2937IMPX-12 Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMPX-12/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMPX-15/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMPX-8.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2937IMPX-8.0 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2937ESX-12/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2937ESX-15/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2937ESX-5.0 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2937ESX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2937ESX-8.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2937IMP-10 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-10/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-12 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-12/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-5.0 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2937IMP-8.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2937IMPX-10 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-10/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-12 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-12/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-15/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-8.0 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2937IMPX-8.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 Pack Materials-Page 3 MECHANICAL DATA NDE0003B www.ti.com MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0°–10° 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA KTT0003B TS3B (Rev F) BOTTOM SIDE OF PACKAGE www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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