LM3248EVM

Using the LM3248 Evaluation Module User's Guide Literature Number: SNAA196 September 2013 All trademarks are the property of their respective owners. User's Guide SNAA196 – September 2013 LM3248 2.7MHz, 2.5A Boost-Buck DC/DC Converter Evaluation Module 1 Introduction The LM3248 evaluation module is a working demonstration of a PWM/PFM Boost-Buck DC/DC converter designed to provide efficient utilization of battery power for 2G/3G/4G and 3GPP/LTE RF subsystems. The LM3248 incorporates a step-up (Boost) and a variable output step-down (Buck) DC-DC converter. The Boost converter provides the RF power subsystem the capability to operate at lower battery voltages as well as increased PA linearity and transmit power margins over a wider battery voltage supply range. This application note contains information specific to the evaluation board. For device details and electrical characteristics, please refer to the LM3248 data sheet. If you are considering using the LM3248 in a system design, please see the "PCB Layout Considerations" section of the device data sheet. 2 Operating Conditions The device will operate under the following conditions: • VIN range: 2.7V to 5.5V • VOUT Range: 0.4V to 4.0V • IOUT range: 0A to 2.5A 3 Package The LM3248 is available in a 30-bump (0.4 mm pitch) lead-free DSBGA package. 4 Typical LM3248 Boost-Buck Application Diagram 1 F Low ESL 1.0 H 10 F VBATT 2.7V to 5.5V SW_ BOOST OUT_ BOOST PVIN_ BUCK VDD1_ BUCK VDD2_ BUCK FB_ BUCK PVIN_ BOOST ACB 10 F SW_ BUCK ACB BYPASS BUCK BOOST VDD_ BOOST 1.5 H VCC_PA 10 F CONTROL BOOST_ SGND_ ENABLE GATE MODE BUCK VCON PGND DGND 1 nF BGND SGND_ BOOST FB 1.8V Logic Apps Processor 2 LM3248 2.7MHz, 2.5A Boost-Buck DC/DC Converter Evaluation Module Copyright © 2013, Texas Instruments Incorporated SNAA196 – September 2013 Submit Documentation Feedback LM3248 Bill of Materials www.ti.com 5 LM3248 Bill of Materials Designator Manufacturer Mfr Part Number Supplier 1 3 Standard Banana Jack, Insulated, Red Keystone 6091 Digi-Key C1, C7, C8 3 CAP, CERM, 10µF, 6.3V, ±20%, X5R, 0402 Samsung CL05A106MQ5NUNC Digi-Key C10 1 CAP, CERM, 4.7µF, 10V, ±20%, X5R, 0402 MuRata GRM155R61A475M See Mfr. C14 1 CAP, CERM, 0.22µF, 6.3V, TDK ±20%, X5R, 0201 C0603X5R0J224M Digi-Key C16, C19 2 CAP, CERM, 3300pF, 6.3V, ±10%, X5R, 01005 TDK C0402X5R0J332K020BC Digi-Key C18 1 CAP, CERM, 1µF, 10V, ±20%, X5R, 0201 Samsung CL03A105MP3NSNC Digi-Key C2 1 CAP, CERM, 1µF, 10V, ±20%, X5R, 0306 Taiyo Yuden LWK107BJ105MV See Mfr. C20 1 CAP, CERM, 0.01µF, 6.3V, TDK ±10%, X5R, 0201 C0603X5R0J103K Digi-Key Mouser C3 1 CAP, CERM, 100pF, 25V, ±10%, X5R, 0201 MuRata GRM033R71E102KA01D Digi-Key Arrow C5, C6 2 CAP, TANT, 470µF, 10V, ±10%, 0.04Ω, 7260-38 SMD Kemet T495E477K010ATE040 Digi-Key C9, C34 2 CAP, CERM, 1000pF, 25V, MuRata ±10%, X7R, 0201 GMR022R71E102KA01D Digi-Key GND, GND_BST, GND_BUCK 3 Standard Banaka Jack, Insulated, Black Keystone 6092 Digi-Key H1, H2, H3, H4 4 Machine Screw, Roun, #440 x 1/4, Nylon, Philips panhead B&F Fastener NY PMS 440 0025 PH Supply Digi-Key H5, H6, H7, H8 4 Standoff, Hex, 0.5"L #4-40 x 1/4, Nylon Keystone 1902C Digi-Key L1 1 Inductor, Shielded, Metal Composite, 1µH, 2.6A, 0.062Ω, 3225 Toko 1276AS-H-1R0N See Mfr. L3 1 Inductor, Shielded, Metal Composite, 1.5µH, 1.6A, 0.144Ω, 2016 Toko 1285AS-H-1R5M See Mfr. P1 1 Header (shrouded) 100 mil, TE 10x2, TH Connectivity 5103309-5 Digi-Key Mouser R1, R5 2 RES 0Ω, 5%, 0.1W, 0603 Vishay-Dale CRCW06030000Z0EA Digi-Key Farnell R3, R4, R6, R7 4 RES, 499Ω, 1%, 0.05W, 0201 Vishay-Dale CRCW0201499RFKED Digi-Key Mouser U1 1 LM3248 Boost-Buck DCDC Converter Texas Instrument LM3248TME T.I. VOUT 1 Emerson Connector, RF Co-ax, 50Ω, Network 6GHz, Vertical, TH Power 135-3701-201 Digi-Key ACB, ATB0, ATB1, ATB2, BG, BK UT, BST_OUT, EN, lBST, L BUCK, MOD, OUT_BST, PVIN BST, SW BST, SW BUCK, VCON, VCON_S 17 Header, TH, 100mil, 2x1, Gold-plated, 230mil above insulator Samtec, Inc. TSW-102-07-G-S Digi-Key C11 1 CAP, CERM, 2.2µF, 6.3V ±20%, X5R, 0402 MuRata DNI Digi-Key C17 1 CAP, CERM, 4.7µF, 10V ±20%, X5R, 0402 MuRata DNI Digi-Key BOOST_OUT, BUCK_OUT, VBATT SNAA196 – September 2013 Submit Documentation Feedback Qty. Description Supplier 2 Mouser Farnell Mouser Mouser LM3248 2.7MHz, 2.5A Boost-Buck DC/DC Converter Evaluation Module Copyright © 2013, Texas Instruments Incorporated 3 LM3248 Evaluation Module Photo 6 www.ti.com C21 1 CAP, CERM, 2.2µF, 6.3V ±20%, X5R, 0402 MuRata DNI Digi-Key R2 1 RES, 0Ω, 5%, 0.063W, 0402 Dale DNI Digi-Key FB1, FB2 2 (Not installed) 3.5A Ferrite Bead, 60Ω @ 100MHz, SMD TDK MPZ1608S600A Digi-Key Mouser LM3248 Evaluation Module Photo Figure 1. LM3248 Evaluation Board 4 LM3248 2.7MHz, 2.5A Boost-Buck DC/DC Converter Evaluation Module Copyright © 2013, Texas Instruments Incorporated SNAA196 – September 2013 Submit Documentation Feedback Connecting to the LM3248 Evaluation Module www.ti.com 7 Connecting to the LM3248 Evaluation Module NOTE: All of the control signals (BOOST_GATE (“BG”), MODE, ENABLE (“EN”) and VCON) can be accessed on the bank of test access points just above connector P1, as shown in Figure 1. The pins next to each of the silkscreened signal names are all grounded, with the exception of the one labeled “VCON_S.” The pins with silkscreened dots indicate the active signal pins. 1. LM3248 EVM Jumper Settings • The LBST, L BUCK & ACB 0.1” center slide-on jumpers located on the back side of the LM3248 Evaluation Board must be installed for proper operation. See Figure 8 for locations on back side of EVM. • The OUT_BST shunt on the top side of the LM3248 Evaluation Board adjacent to the BOOST_OUT banana jack is not required for normal operation, but must be in place if this banana jack is used for monitoring the Boost Output voltage. 2. Connect the EN pin signal source with the signal source set to 0V. 3. Connect the VBATT supply to the red (+) and black (ground) banana connector pins on the left side of the module. 4. Connect the other control signals (BOOST_GATE, MODE, and VCON) to the evaluation module, making sure the signal sources are first set to 0V. NOTE: BOOST_GATE is a logic level signal (see the LM3248 data sheet) which represents the TTI frame interval. A pulse or function generator should be used to drive this pin, but should be configured to drive a high impedance load so that the level seen on the instrument panel is the same as that measured into a high-Z load (50Ω mode will put out 2X the indicated voltage when driving a high-Z load). Set the period to 2G=4.616 ms, 3G=10 ms or 4G=1 ms, and the pulse width to 45 µs, to emulate the corresponding intervals that the boost "bias" circuits need to run in these respective modes. 5. Connect the load (resistor, electronic load , or PA module) to the BUCK_OUT red (+) and GND_BUCK black (ground) banana jacks. 8 Turn-on Sequencing 1. After insuring that ENABLE, BOOST_GATE and MODE pins are all at 0V, turn VBATT ON, and then turn ON the ENABLE, BOOST_GATE and MODE signals (MODE=LOW for 3G/4G, HIGH for 2G). For best accuracy, measure VBATT across the "PVIN BST" test points on the bottom of the EVM. 2. Turn on and adjust VCON to obtain the desired BUCK OUT voltage level (VCON = VOUT/2.5), which, for best accuracy, is measured across the "BK OUT" test points on the bottom side of the EVM. SNAA196 – September 2013 Submit Documentation Feedback LM3248 2.7MHz, 2.5A Boost-Buck DC/DC Converter Evaluation Module Copyright © 2013, Texas Instruments Incorporated 5 Turn-off Sequencing 9 www.ti.com Turn-off Sequencing 1. Switch ENABLE, BOOST_GATE and VCON to 0V. 2. Turn off VBATT supply. 10 Bottom Layer Test and Jumper Pairs The signals below may be monitored by attaching scope probes or clip leads to the corresponding pins. The dotted pin is the signal. The adjacent (undotted) is the ground pin. Test Points: • PVIN BST - Boost input node (VBATT connection) • SW BST - Boost switch node • BST_OUT - Boost output node • SW BUCK - Buck switch node • BK OUT - Buck output note Jumpers (see Figure 8 for locations): • LBST - Boost inductor jumper • L BUCK - Buck inductor jumper • ACB - ACB jumper 6 LM3248 2.7MHz, 2.5A Boost-Buck DC/DC Converter Evaluation Module Copyright © 2013, Texas Instruments Incorporated SNAA196 – September 2013 Submit Documentation Feedback LM3248 Evaluation Board Layout www.ti.com 11 LM3248 Evaluation Board Layout Figure 2. Top Layer Figure 3. Bottom Layer Figure 4. Mid Layer 1 Figure 5. Mid Layer 2 SNAA196 – September 2013 Submit Documentation Feedback LM3248 2.7MHz, 2.5A Boost-Buck DC/DC Converter Evaluation Module Copyright © 2013, Texas Instruments Incorporated 7 LM3248 Evaluation Board Layout www.ti.com Figure 6. Mid-Layer 3 Figure 7. Mid Layer 4 0.1 inch jumpers are installed here Figure 8. Bottom Layer (Mirrored) 8 LM3248 2.7MHz, 2.5A Boost-Buck DC/DC Converter Evaluation Module Copyright © 2013, Texas Instruments Incorporated SNAA196 – September 2013 Submit Documentation Feedback LM3248 Evaluation Board Layout www.ti.com Figure 9. Stackup SNAA196 – September 2013 Submit Documentation Feedback LM3248 2.7MHz, 2.5A Boost-Buck DC/DC Converter Evaluation Module Copyright © 2013, Texas Instruments Incorporated 9 LM3248 Evaluation Module Schematic 12 www.ti.com LM3248 Evaluation Module Schematic BOOST_OUT GND_BST 1 2 GND C1 OUT_BST PGND 10µF 0402 C2 PGND 1µF 0306 GND L1 1µH 1 2 F2 E4 E5 C2 VDD2_BUCK FB_BUCK E2 ACB F4 F5 VDD_BOOST PGND ATB0 SW_BUCK SW_BUCK BOOST_GATE M ODE PGND N/C PGND D3 SGND_BUCK A1 ATB0 1 2 C4 C5 F3 C3 E1 F1 D1 E3 B2 D2 GND D4 D5 1 1.6x2mm 1 2 SW BUCK R7 499 0201 1 2 GND VCON GND PGND GND BK OUT C9 1000pF 0201 2 VOUT 1 C16 3300pF 01005 C10 4.7µF 0402 GND GND GND DNI C17 4.7µF 0402 DNI C21 2.2µF 0402 C18 1µF 0201 C19 3300pF 01005 DNI C11 2.2µF DNI R2 0 0402 GND_BUCK GND BG 499 MODE 0201 GND GND C8 10µF 0402 FB2 DNI (De fa u l t: Cutta bl e s h ort c i rc ui t) 1 2 GND R6 C3 100pF 0201 VOUT SW_BUCK B1 C1 R3 499 0201 BUCK_OUT L BUCK L3 1.5µH AT B1 GND ACB ACB AT B2 GND PVIN_BOOST PVIN_BOOST ENABL E GND C7 10µF 0402 DGND GND C34 1000pF 0201 R5 0 0603 FB_BUCK VCON C20 0.01µF 0201 U1 LM3248 2 3 4 5 A2 A3 1 2 VDD1_BUCK GND PGND PVIN_BUCK PVIN_BUCK GND OUT_BOOST OUT_BOOST SW BST PVIN BST A4 A5 B3 B4 B5 1 2 SW_BOOST SW_BOOST SW_BOOST GND R1 0 0603 C14 0.22µF 0201 SGND_BOOST C5 470µF BST_OUT 3.2x1.0x2.5mm SW_BOOST 1 2 2 DNI 4 amp m ax (Default: Cuttable C6 short circuit) 470µF VBATT 1 2 FB1 1 2 1 LBST DNI VBATT 1 2 PGND 1 2 GND GND 1 2 1 2 VCON_S M ODE R4 ENABLE 499 0201 ATB2 GND BG GND P1 ATB2 ATB1 1 2 ENABLE ATB0 M ODE BG 1 2 ATB2 1 3 5 7 9 11 13 15 17 19 2 4 6 8 10 12 14 16 18 20 EN ATB1 GND GND ATB1 5103309-5 GND GND 10 LM3248 2.7MHz, 2.5A Boost-Buck DC/DC Converter Evaluation Module Copyright © 2013, Texas Instruments Incorporated SNAA196 – September 2013 Submit Documentation Feedback Connection Diagram www.ti.com 13 Connection Diagram A VDD_ BOOST PVIN_ BOOST PVIN_ BOOST OUT_ BOOST OUT_ BOOST OUT_ BOOST OUT_ BOOST PVIN_ BOOST PVIN_ BOOST VDD_ BOOST A B BOOST_ GATE SGND_ BOOST SW_ BOOST SW_ BOOST SW_ BOOST SW_ BOOST SW_ BOOST SW_ BOOST SGND_ BOOST BOOST_ GATE B C MODE VDD1_ BUCK SGND_ BUCK PGND PGND PGND PGND SGND_ BUCK VDD1_ BUCK MODE C D ENABLE VCON NC SW_ BUCK SW_ BUCK SW_ BUCK SW_ BUCK NC VCON ENABLE D E ATB1 FB_ BUCK DGND PVIN_ BUCK PVIN_ BUCK PVIN_ BUCK PVIN_ BUCK DGND FB_ BUCK ATB1 E F ATB2 VDD2_ BUCK PGND ACB ACB ACB ACB PGND VDD2_ BUCK ATB2 F 2 3 4 5 5 4 3 2 1 1 Figure 10. Top View (Bumps Down) SNAA196 – September 2013 Submit Documentation Feedback Figure 11. Bottom View (Bumps Up) LM3248 2.7MHz, 2.5A Boost-Buck DC/DC Converter Evaluation Module Copyright © 2013, Texas Instruments Incorporated 11 Pin Descriptions 14 www.ti.com Pin Descriptions Pin # Name I/O A1 VDD_BOOST - Power supply voltage input for Boost Analog blocks. Connected to VBATT supply. PVIN_BOOST - Power supply voltage input for Boost Bypass FET. OUT_BOOST 0 Boost converter output. When Boost and Buck are active, OUT_BOOST must be externally connected to PVIN_BUCK. A 10 µF capacitor must be placed between this node and GND. Internally connected to BUCK voltage input and feedback to inverting input of Boost error amplifier. B1 BOOST_GATE I Digital input. A Low to High transition wakes up the boost converter and positions it to a high level in preparation for a possible VCON change. B2 SGND_BOOST - Analog Ground for the Boost Analog blocks. SW_BOOST I/O C1 MODE I Digital input. Low = 3G/4G operation; High = 2G operation. C2 VDD1_BUCK - Power supply voltage input for Buck Analog PWM blocks. Internally connected to PVIN_BUCK when used with Boost. C3 SGND_BUCK - Analog Ground for the Buck Analog Blocks. PGND - Power Ground for output FETs. D1 ENABLE I Input. Chip enable. Setting ENABLE = High biases up the Buck and initiates VCON regulation by the Buck. D2 VCON I Analog voltage control input which controls Buck output voltage. D3 NC - No Connect; leave this pin floating. SW_BUCK 0 Buck converter switch node for external filter inductor connection E1 ATB1 - Test pin. Connect to SGND or System Ground. E2 FB_BUCK - Feedback input to inverting input of error amplifier. Connect Buck output voltage directly to this node. E3 DGND - Ground for Boost, Buck and digital blocks. PVIN_BUCK - Power supply input for Buck PFET and ACB FET. A 10 µF capacitor must be placed between this node and PGND. Must be externally connected to OUT_BOOST. F1 ATB2 - Test pin. Connect to SGND or System Ground. F2 VDD2_BUCK - Power supply voltage input for Buck Analog PWM blocks. Internally connected to PVIN_BUCK when used with Boost. ACB - Active Current Assist and Bypass output. Connected to the Buck converter output filter capacitor. A2 A3 A4 A5 Description B3 B4 Boost converter switch node. When Boost and Buck are active, SW_BOOST is typically connected to VBATT supply through external power inductor. B5 C4 C5 F3 D4 D5 E4 E5 F4 F5 12 LM3248 2.7MHz, 2.5A Boost-Buck DC/DC Converter Evaluation Module Copyright © 2013, Texas Instruments Incorporated SNAA196 – September 2013 Submit Documentation Feedback STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. 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