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LM36011
SNVSAN5A – JULY 2017 – REVISED OCTOBER 2017
LM36011 Inductorless, Single-LED Flash Driver
With 1.5-A High-Side Current Source
1 Features
3 Description
•
The LM36011 is an ultra-small LED flash driver that
provides a high level of adjustability. With a total
solution size of 4 mm2, it can produce up to 1.5 A of
LED flash current or up to 376 mA of torch current.
This is all done from a accurately programmable
current source without the need of a pre-regulated
voltage, which saves on solution size and cost.
1
•
•
•
•
•
•
•
Accurate and Programmable LED Currents
– Flash / IR Currents Ranging from 11 mA up to
1.5 A (128 Levels)
– Torch Currents Ranging from 2.4 mA up to
376 mA (128 Levels)
Flash Time-Out up to 1.6 Seconds
Optimized Flash LED Current During Low Battery
Conditions (IVFM)
Grounded Cathode LED Operation for Improved
Thermal Management
Small Total Solution Size: < 4 mm2
Hardware Strobe Enable (STROBE)
Input Voltage Range from 2.5 V to 5.5 V
400-kHz I2C-Compatible Interface
– I2C Address = 0x64
Device Information(1)
PART NUMBER
LM36011
PACKAGE
DSBGA (8)
BODY SIZE (NOM)
1.512 mm × 0.800 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
•
•
•
•
•
Features of the LM36011 are controlled via an I2Ccompatible interface. These features include:
hardware flash (STROBE), flash time-out, UVLO,
thermal scale-back, LED fault detection, and 128
programmable currents for both flash and movie
mode (torch). The device operates over a –40°C to
+85°C ambient temperature range.
Mobile Phones
Tablets
IR LED Driver
Video Surveillance: IP Camera
Barcode Scanner
Portable Data Terminal
Simplified Schematic
VIN
2.5 V ± 5.5 V
IN
C1
LED
D1
SDA
GND
µP/µC
SCL
STROBE
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM36011
SNVSAN5A – JULY 2017 – REVISED OCTOBER 2017
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Timing Requirements ................................................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ........................................ 9
7.3 Feature Description ................................................ 10
7.4 Device Functioning Modes...................................... 11
7.5 Programming........................................................... 13
7.6 Register Descriptions .............................................. 15
8
Applications and Implementation ...................... 17
8.1 Application Information............................................ 17
8.2 Typical Application ................................................. 17
9 Power Supply Recommendations...................... 23
10 Layout................................................................... 23
10.1 Layout Guidelines ................................................. 23
10.2 Layout Example ................................................... 23
11 Device and Documentation Support ................. 24
11.1
11.2
11.3
11.4
11.5
Device Support......................................................
Documentation Support ........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
24
24
24
24
24
12 Mechanical, Packaging, and Orderable
Information ........................................................... 24
4 Revision History
Changes from Original (July 2017) to Revision A
•
2
Page
Corrected package dimensions ........................................................................................................................................... 24
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5 Pin Configuration and Functions
YKB Package
8-Pin DSBGA
Top View
A1
A2
Pin A1
B1
B2
C1
C2
D1
D2
Pin Functions
PIN
TYPE (1)
DESCRIPTION
NAME
NO.
A1
GND
G
Ground
IN
P
Input voltage connection. Connect IN to the input supply and bypass to GND with a 10-µF or
larger ceramic capacitor.
B2
STROBE
I
Active high hardware flash enable. Drive STROBE high to turn on flash pulse. An internal
pulldown resistor of 300 kΩ is between STROBE and GND.
C2
SDA
I/O
D1
LED
P
High-side current source output for flash LED.
D2
SCL
I
I2C serial clock input.
B1
No Connect
—
A2,C1
(1)
I2C serial data input/output.
No connect
G = Ground; P = Power; I = Input; O = Output
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN
MAX
IN, OUT, LED
−0.3
6
SDA, SCL, STROBE
−0.3
(VIN+ 0.3) w/ 6 V maximum
Continuous power dissipation (3)
−65
Storage temperature, Tstg
(2)
(3)
V
Internally limited
Junction temperature, TJ-MAX
(1)
UNIT
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the potential at the GND pin.
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and
disengages at TJ = 135°C (typical). Thermal shutdown is ensured by design.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±1000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1) (2)
VIN
Junction temperature, TJ
Ambient temperature, TA
(1)
(2)
(3)
(3)
MIN
MAX
2.5
5.5
UNIT
V
−40
125
°C
−40
85
°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the potential at the GND pin.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
6.4 Thermal Information
LM36011
THERMAL METRIC (1)
YKB (DSBGA)
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
117.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
1.3
°C/W
RθJB
Junction-to-board thermal resistance
34.3
°C/W
ΨJT
Junction-to-top characterization parameter
0.5
°C/W
ΨJB
Junction-to-board characterization parameter
34.6
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
TA = 25°C and VIN = 3.6 V, unless otherwise specified. Minimum and maximum limits apply over the full operating ambient
temperature range (–40°C ≤ TA ≤ 85°C). (1) (2)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
CURRENT SOURCE SPECIFICATIONS
(3)
–10%
1.5
10%
A
VIN = 4 V, torch code = 0x7F = 376 mA
–10%
376
10%
mA
VIN = 4 V, flash code = 0x7F = 1.5 A
ILED
Current source accuracy
VHR
LED current source regulation
voltage
ILED = 1.5 A
Flash
550
ILED = 376 mA
Torch
350
mV
STEP-UP DC-DC CONVERTER SPECIFICATIONS
VUVLO
Undervoltage lockout threshold
Falling VIN
VIVFM
Input voltage flash monitor trip
threshold
Reg 0x02, bits [7:5] = 000
IQ
Quiescent supply current
ISB
2.5
–3%
2.9
V
3%
V
0.3
Device disabled
2.5 V ≤ VIN ≤ 5.5 V
Standby supply current
mA
0.8
4
µA
0
0.4
V
1.2
VIN
V
0
0.4
1.2
VIN
STROBE VOLTAGE SPECIFICATIONS
VIL
Input logic low
VIH
Input logic high
2.5 V ≤ VIN ≤ 5.5 V
I2C-COMPATIBLE INTERFACE SPECIFICATIONS (SCL, SDA)
VIL
Input logic low
VIH
Input logic high
VOL
Output logic low
(1)
(2)
(3)
2.5 V ≤ VIN ≤ 4.2 V
ILOAD = 3 mA
V
400
mV
Minimum (MIN) and Maximum (MAX) limits are specified by design, test, or statistical analysis. Typical (TYP) numbers are not verified,
but do represent the most likely norm. Unless otherwise specified, conditions for typical specifications are: VIN = 3.6 V and TA = 25°C.
All voltages are with respect to the potential at the GND pin.
The ability to deliver 1.5 A of LED current is highly dependent upon the input voltage, LED voltage, ambient temperature and PCB
layout. Depending upon the system conditions, it is possible that the device could hit the internal thermal shutdown or thermal scaleback value before the desired flash duration is reached. See Thermal Performance for more details.
6.6 Timing Requirements
MIN
NOM
MAX
UNIT
t1
SCL clock period
2.4
µs
t2
Data in set-up time to SCL high
100
ns
t3
Data out stable after SCL low
0
ns
t4
SDA low set-up time to SCL low (start)
100
ns
t5
SDA high hold time after SCL high (stop)
100
ns
t1
SCL
t5
t4
SDA_IN
t2
SDA_OUT
t3
2
Figure 1. I C-Compatible Interface Specifications
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6.7 Typical Characteristics
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
1.6
1.6
85qC
25qC
-40qC
1.4
1.2
1.2
1
1
IFLASH (A)
IFLASH (A)
1.4
0.8
0.6
0.8
0.6
0.4
0.4
0.2
0.2
0
0x00
0x0F
0x1F
0x2F 0x3F 0x4F 0x5F
Brightness Code (hex)
0x6F
85qC
25qC
-40qC
0
2.5
0x7F
3
3.5
D001
VIN = 4 V
4
VIN (V)
4.5
5
5.5
D002
IFLASH = 1.5 A
Figure 2. LED Flash Current vs Brightness Code
Figure 3. LED Flash Current vs Input Voltage
0.8
1.2
0.7
1
0.6
IFLASH (A)
IFLASH (A)
0.8
0.6
0.4
0.5
0.4
0.3
0.2
0
2.5
3
3.5
4
VIN (V)
4.5
5
0
2.5
D003
4
VIN (V)
4.5
5
5.5
D004
IFLASH = 0.75 A
Figure 5. LED Flash Current vs Input Voltage
Figure 4. LED Flash Current vs Input Voltage
1.6
Code 0x00
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
0.6
0.5
0.4
1.4
1.2
IFLASH (A)
0.7
IFLASH (A)
3.5
.
0.8
0.3
1
0.8
0.4
0.1
0.2
3
3.5
4
VIN (V)
4.5
5
5.5
Code 0x47
Code 0x4F
Code 0x57
Code 0x5F
Code 0x67
Code 0x6F
Code 0x77
Code 0x7F
0.6
0.2
0
2.5
3
D005
Figure 6. LED Flash Current vs Input Voltage
6
3
5.5
IFLASH = 1.03 A
0
2.5
85qC
25qC
-40qC
0.1
85qC
25qC
-40qC
0.2
3.5
4
VIN (V)
4.5
5
5.5
D006
Figure 7. LED Flash Current vs Input Voltage
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Typical Characteristics (continued)
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
0.4
0.4
85qC
25qC
-40qC
0.36
0.32
0.28
0.28
0.24
0.24
ITORCH (A)
ITORCH (A)
0.32
0.36
0.2
0.16
0.2
0.16
0.12
0.12
0.08
0.08
0.04
0.04
0
0x00
0x0F
0x1F
0x2F 0x3F 0x4F 0x5F
Brightness Code (hex)
0x6F
85qC
25qC
-40qC
0
2.5
0x7F
3
3.5
D007
4
VIN (V)
4.5
5
5.5
D008
ITORCH = 376 mA
Figure 8. LED Torch Current vs Brightness Code
Figure 9. LED Torch Current vs Input Voltage
0.28
0.2
0.18
0.24
0.16
0.14
ITORCH (A)
ITORCH (A)
0.2
0.16
0.12
0.1
0.08
0.06
0.08
0.04
85qC
25qC
-40qC
0.04
0
2.5
0.12
3
3.5
4
VIN (V)
4.5
5
0
2.5
5.5
3
3.5
D009
ITORCH = 258 mA
4
VIN (V)
4.5
Figure 10. LED Torch Current vs Input Voltage
5.5
D010
Figure 11. LED Torch Current vs Input Voltage
0.4
Code 0x00
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
0.16
0.14
0.12
0.1
0.3
ITORCH (A)
0.18
0.08
0.2
Code 0x47
Code 0x4F
Code 0x57
Code 0x5F
Code 0x67
Code 0x6F
Code 0x77
Code 0x7F
0.06
0.1
0.04
0.02
0
2.5
5
ITORCH = 188 mA
0.2
ITORCH (A)
85qC
25qC
-40qC
0.02
3
3.5
4
VIN (V)
4.5
5
5.5
0
2.5
3
D011
Figure 12. LED Torch Current vs Input Voltage
3.5
4
VIN (V)
4.5
5
5.5
D012
Figure 13. LED Torch Current vs Input Voltage
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Typical Characteristics (continued)
380
380
360
360
340
340
320
320
IQ_LED-ON (PA)
IQ_LED-OFF (PA)
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
300
280
260
240
280
260
240
220
220
85qC
25qC
-40qC
200
180
2.5
300
3
3.5
4
VIN (V)
4.5
5
85qC
25qC
-40qC
200
180
2.5
5.5
3
3.5
D013
Mode (Reg 0x01 bits[1:0]) = 01 (IR Mode)
4
VIN (V)
4.5
5
5.5
D014
Mode (Reg 0x01 bits[1:0]) = 10 (Torch Mode)
Figure 14. LED Off Current vs Input Voltage
Figure 15. LED On Current vs Input Voltage
2
1.8
1.6
ISB (PA)
1.4
1.2
1
0.8
0.6
0.4
85qC
25qC
-40qC
0.2
0
2.5
3
3.5
4
VIN (V)
4.5
5
5.5
D015
Figure 16. Standby Current vs Input Voltage
8
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7 Detailed Description
7.1 Overview
The LM36011 is a high-power white LED flash driver capable of delivering up to 1.5 A to the LED over the 2.5-V
to 5.5-V input voltage range.
The device has one logic input for a hardware flash enable (STROBE). This logic input has an internal 300-kΩ
(typical) pulldown resistor to GND.
Additional features of the device include an input voltage monitor that can reduce the flash current during low VIN
conditions and a temperature based current scale-back feature that forces the flash current to the set torch level
if the on-chip junction temperature reaches 125°C.
Control is done via an I2C-compatible interface. This includes adjustment of the flash and torch current levels,
and changing the flash time-out duration. Additionally, there are flag and status bits that indicate flash current
time-out, LED over-temperature condition, LED failure (open/short), device thermal shutdown, thermal current
scale-back, and VIN undervoltage conditions.
7.2 Functional Block Diagram
IN
IN
UVLO
Input Voltage
Flash Monitor
Thermal Current
Scale Back
+125oC
Thermal Shutdown
+150oC
+
-
+
-
LED
SDA
I2C
Interface
Control
Logic/
Registers
SCL
GND
STROBE
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7.3 Feature Description
7.3.1 Flash Mode
In flash mode, the LED current source provides 128 target current levels from 11 mA to 1.5 A, set by the LED
Flash Brightness Register (0x03 bits [6:0]). Flash mode is activated by the Enable Register (0x01), setting mode
M1, M0 (bits [1:0]) to 11. Once the flash sequence is activated, the LED current source ramps up to the
programmed flash current by stepping through all current steps until the programmed current is reached.
When flash mode is enabled using the mode M1, M0 (bits [1:0]) of the Enable Register (0x01), the mode bits in
the Enable Register are cleared after a flash time-out event.
7.3.2 Torch Mode
In torch mode, the LED current source provides 128 target current levels from 2.4 mA to 376 mA, set by the LED
Torch Brightness Register (0x04 bits [6:0]). Torch mode is activated by the Enable Register (0x01), setting mode
M1, M0 (bits [1:0]) to 10. Once the TORCH sequence is activated, the LED current source ramps up to the
programmed torch current by stepping through all current steps until the programmed current is reached. The
rate at which the current ramps is determined by the value chosen in the Torch Ramp bit [0] in Timing Register
(0x02).
7.3.3 IR Mode
In IR mode, the target LED current is equal to the value stored in the LED Flash Brightness Register (0x03 bits
[7:0]). IR mode is enabled by the Enable Register (0x01) setting mode M1, M0 (bits [1:0]) to 01. In IR mode,
toggling the STROBE pin enables and disables the LED current source. The STROBE pin can only be set to be
Level sensitive, as all timing of the IR pulse is externally controlled. In IR mode, the current source does not
control the ramp rate of the LED output. The current transitions immediately from off to on and then on to off.
STROBE
M1,M0 = µ00¶
EN = µ1¶
M1,M0 = µ01¶
STROBE EN = µ1¶
ILED
Figure 17. IR Mode
STROBE
(1)
TIME-OUT
RESET
TIME-OUT
Start
TIME-OUT
RESET
TIME-OUT
Start
M1,M0 = µ01¶
STROBE EN = µ1¶
ILED
TIME-OUT
Start
TIME-OUT
Reached
VOUT goes low,
LED turn off
When the flash timer elapses, the device goes into stand-by regardless of strobe state
Figure 18. IR Mode Time-out
10
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7.4 Device Functioning Modes
7.4.1 Start-Up (Enabling The Device)
At turnon the LED current source steps through each FLASH or TORCH level until the target LED current is
reached. This gives the device a controlled turnon and limits inrush current from the VIN supply. The target LED
flash and the target LED torch currents are set by the LED Flash Brightness Register (0x03 bits [6:0]) and LED
Torch Brightness Register (0x04 bits [6:0]) respectively.
7.4.2 Input Voltage Flash Monitor (IVFM)
The LM36011 has the ability to adjust the flash current based upon the voltage level present at the IN pin
utilizing the input voltage flash monitor (IVFM). The adjustable threshold IVFM-D ranges from 2.9 V to 3.6 V in
100-mV steps and is set by Configuration Register (0x02) bits [7:5]. Additionally, the IVFM-D threshold sets the
input voltage boundary that forces the LM36011 to stop ramping the flash current during start-up.
IVFM ENABLE
LEVEL STROBE
VIN PROFILE for Stop and Hold Mode
IVFM-D
Set Target Flash Current
T-Filter = 4 ms
O/P Current Profile in
Stop and Hold Mode
Dotted line shows O/P Current Profile with
IVFM Disabled
SET RAMP FROM
THE RAMP
REGISTER USED
Figure 19. IVFM Mode
7.4.3 Fault/Protections
Upon a fault condition, the LM36011 sets the appropriate flag(s) in the Flags Register (0x05) and switches into
stand-by mode obtained by clearing the mode M1, M0 (bits [1:0]) of the Enable Register (0x01). The LM36011
remains in standby until an I2C read of the Flags Register. I2C read of the Flags Register clears the flags and the
fault status can be re-checked. If the fault(s) is still present, the LM36011 re-sets the appropriate flag bits and
enters stand-by again.
7.4.3.1 Input Voltage Flash Monitor (IVFM)
When the input voltage crosses the IVFM-D value, programmed by Configuration Register (0x02) bits [7:5], the
LM36011 sets the IVFM flag (bit [6]) of Flags Register (0x05).
7.4.3.2 LED Short Fault
LM36011 enters stand-by mode from flash or torch mode and VLED Short Fault flag (bit [5]) of Flags Register
(0x05) is set, if the LED output experiences a short condition. An LED short condition occurs if the voltage at the
LED pin goes below 500 mV (typical). There is a deglitch time of 256 µs before the LED short flag is valid The
LED short fault can be reset to 0 by removing power to the LM36011, or setting the software reset field (Register
0x06 bit [7]) to a 1, or by reading back the Flags Register.
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Device Functioning Modes (continued)
7.4.3.3 Thermal Scale-Back (TSB)
When the LM36011 die temperature reaches 125°C, the thermal scale-back (TSB) circuit trips and TSB flag (bit
[2]) of Flags Register (0x05) is set. The LED current then shifts to torch current level, set by the LED Torch
Brightness Register (0x04 bits [6:0]) for the duration of the flash pulse, set by the flash time-out in the
Configuration Register (0x02 bits [4:1]) After I2C read of the Flags Register and upon re-flash, if the die
temperature is still above 125°C, the LM36011 re-enters into torch current level and sets the TSB flag bit again.
7.4.3.4 Thermal Shutdown (TSD)
When the LM36011 die temperature reaches 150°C, the thermal shutdown (TSD) circuit trips, forcing the
LM36011 into standby and writing a 1 to the TSD flag (bit [2]) of the Flags Register (0x05). The LM36011 restarts
only after the Flags Register is read, which clears the fault flag. Upon restart, if the die temperature is still above
150°C, the LM36011 resets the TSD flag and re-enters standby.
7.4.3.5 Undervoltage Lockout (UVLO)
The LM36011 has an internal comparator that monitors the voltage at IN pin. If the input voltage drops to 2.5 V,
the UVLO flag (bit [1]) of Flags Register (0x05) is set and the LM36011 switches to stand-by mode. After the
UVLO flag is set, even if the input voltage rises above 2.5 V, the LM36011 is not available for operation until
there is an I2C read of the Flags Register. Upon an I2C read of the Flags Register, the UVLO fault is cleared and
normal operation can resume.
7.4.3.6 Flash Time-out (FTO)
The LM36011 sources the flash current for the time period set by Flash Time-out (0x02 bits [4:1]). The LED
current source has 16 time-out levels ranging from 40 ms to 1600 ms.
12
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7.5 Programming
7.5.1 Control Truth Table
M1 (Register 0x01
bit[1])
M0 (Register 0x01 bit[0])
STROBE EN (Register
0x01 bit[2])
STROBE PIN
ACTION
0
0
0
X
Standby
0
0
1
pos edge
Ext flash
1
0
X
X
Int torch
1
1
X
X
Int flash
0
1
0
X
IR LED standby
0
1
1
0
IR LED standby
0
1
1
pos edge
IR LED enabled
7.5.2 I2C-Compatible Interface
7.5.2.1 Data Validity
The data on SDA must be stable during the HIGH period of the clock signal (SCL). In other words, the state of
the data line can only be changed when SCL is LOW.
SCL
SDA
data
change
allowed
data
valid
data
change
allowed
data
valid
data
change
allowed
Figure 20. Data Validity Data
A pullup resistor between the VIO line of the controller and SDA must be greater than [(VIO – VOL) / 3 mA] to
meet the VOL requirement on SDA. Using a larger pullup resistor results in lower switching current with slower
edges, while using a smaller pullup resistor results in higher switching currents with faster edges.
7.5.2.2 Start and Stop Conditions
START and STOP conditions classify the beginning and the end of the I2C session. A START condition is
defined as the SDA signal transitioning from HIGH to LOW while SCL line is HIGH. A STOP condition is defined
as the SDA transitioning from LOW to HIGH while SCL is HIGH. The I2C master always generates START and
STOP conditions. The I2C bus is considered busy after a START condition and free after a STOP condition.
During data transmission, the I2C master can generate repeated START conditions. First START and repeated
START conditions are equivalent, function-wise.
SDA
SCL
S
P
Start Condition
Stop Condition
Figure 21. Start and Stop Conditions
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7.5.2.3 Transferring Data
Every byte put on the SDA line must be eight bits long, with the most significant bit (MSB) transferred first. Each
byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated by the
master. The master releases the SDA line (HIGH) during the acknowledge clock pulse. The LM36011 pulls down
the SDA line during the 9th clock pulse, signifying an acknowledge. The LM36011 generates an acknowledge
after each byte is received. There is no acknowledge created after data is read from the device.
After the START condition, the I2C master sends a chip address. This address is seven bits long followed by an
eighth bit which is a data direction bit (R/W). The LM36011 7-bit address is 0x64. For the eighth bit, a 0 indicates
a WRITE, and a 1 indicates a READ. The second byte selects the register to which the data is written. The third
byte contains data to write to the selected register.
ack from
slave
start
msb Chip
Address lsb
start
Id = 64h
ack from
slave
w ack msb Register Add lsb
ack
w ack
ack
ack from
slave
msb
DATA
lsb
ack
stop
SCL
SDA
addr = 01h
Data = 03h
ack
stop
Figure 22. Write Cycle W = Write (SDA = 0) R = Read (SDA = 1) Ack = Acknowledge
(SDA Pulled Down by Either Master or Slave) ID = Chip Address, 64h for LM36011
7.5.2.4 I2C-Compatible Chip Address
The device address for the LM36011 is 1100100 (0x64). After the START condition, the I2C-compatible master
sends the 7-bit address followed by an eighth read or write bit (R/W). R/W = 0 indicates a WRITE and R/W = 1
indicates a READ. The second byte following the device address selects the register address to which the data is
written. The third byte contains the data for the selected register.
MSB
1
Bit 7
LSB
1
Bit 6
0
Bit 5
0
Bit 4
1
Bit 3
0
Bit 2
0
Bit 1
R/W
Bit 0
I2C Slave Address (chip address)
Figure 23. I2C-Compatible Chip Address
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7.6 Register Descriptions
REGISTER NAME
POWER ON/RESET VALUE
INTERNAL HEX ADDRESS
LM36011
Enable Register
0x01
0x20
Configuration Register
0x02
0x15
LED Flash Brightness Register
0x03
0x00
LED Torch Brightness Register
0x04
0x00
Flags Register
0x05
0x00
Device ID Register
0x06
0x01
7.6.1 Enable Register (0x01)
Bit 7
RFU
Bit 6
RFU
Bit 5
RFU
Bit 4
IVFM Enable
0 = Disabled
(Default)
1 = Enabled
Bit 3
Strobe Type
0 = Level
Triggered
(Default)
1 = Edge
Triggered
Bit 2
Bit 1
Strobe Enable
0 = Disabled
(Default )
1 = Enabled
Bit 0
Mode Bits: M1, M0
00 = Standby (Default)
01 = IR Drive
10 = Torch
11 = Flash
NOTE
Edge strobe mode is not valid in IR MODE. Switching between level and edge strobe
types while the device is enabled is not recommended.
In edge or level strobe mode, TI recommends that the trigger pulse width be set greater
than 1 ms to ensure proper turn-on of the device.
7.6.2 Configuration Register (0x02)
Bit 7
Bit 6
Bit 5
IVFM Levels (IVFM-D)
000 = 2.9 V (Default)
001 = 3 V
010 = 3.1 V
011 = 3.2 V
100 = 3.3 V
101 = 3.4 V
110 = 3.5 V
111 = 3.6 V
Bit 4
Bit 3
Flash Time-out Duration
0000 = 40 ms
0001 = 80 ms
0010 = 120 ms
0011 = 160 ms
0100 = 200 ms
0101 = 240 ms
0110 = 280 ms
0111 = 320 ms
1000 = 360 ms
1001 = 400 ms
1010 = 600 ms (Default)
1011 = 800 ms
1100 = 1000 ms
1101 = 1200 ms
1110 = 1400 ms
1111 = 1600 ms
Bit 2
Bit 1
Bit 0
Torch Ramp
0 = No Ramp
1 = 1 ms
(default)
NOTE
On the LM36011, special care must be taken with regards to thermal management when
using time-out values greater than 500 ms. Depending on the PCB layout, input voltage,
and output current, it is possible to have the internal thermal shutdown circuit trip prior to
reaching the desired flash time-out value.
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7.6.3 LED Flash Brightness Register (0x03)
Bit 7
Thermal
Current
Scale-Back
0 = Disabled
1 = Enabled
(default)
If enabled, the
LED current
shifts to torch
current level if
TJ reaches
125 °C
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 3
Bit 2
Bit 1
Bit 0
LED Flash Brightness Level
0000000 = 11 mA (Default)
.......................
00010101 (0x15) = 0.257 A
.......................
0111111 (0x3F) = 0.75 A
.......................
0101111 (0x5F) = 1.03 A
.......................
01100110 (0x66) = 1.2 A
.......................
1111111 (0x7F) = 1.5 A
7.6.4 LED Torch Brightness Register (0x04)
Bit 7
Bit 6
Bit 5
Bit 4
LED Torch Brightness Levels
0000000 = 2.4 mA (Default)
.......................
00010101 (0x15) = 64 mA
.......................
0111111 (0x3F) = 188 mA
.......................
0101111 (0x5F) = 258 mA
.......................
01100110 (0x66) = 302 mA
.......................
1111111 (0x7F) = 376 mA
RFU
7.6.5 Flags Register (0x05)
Bit 7
RFU
Bit 6
IVFM Trip
Flag
Bit 5
VLED Short
Fault
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RFU
Thermal Current
Scale-back
(TSB) Flag
Thermal
Shutdown
(TSD) Fault
UVLO Fault
Flash Time-Out
Flag
Bit 2
Bit 1
Bit 0
7.6.6 Device ID and RESET Register (0x06)
Bit 7
Software
RESET
0 = Normal
(default)
1 = Force
device RESET
16
Bit 6
Bit 5
Bit 4
Bit 3
Device ID
000
Silicon Revision Bits
001
RFU
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8 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM36011 can drive a flash LED at currents up to 1.5 A. .
8.2 Typical Application
VIN
2.5 V ± 5.5 V
IN
C1
LED
D1
SDA
GND
µP/µC
SCL
STROBE
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Figure 24. LM36011 Typical Application
8.2.1 Design Requirements
Example requirements based on default register values:
Table 1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input voltage range
2.5 V to 5.5 V
Brightness control
I2C Register
LED configuration
1 flash LED
Flash brightness
1.5-A maximum current
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8.2.2 Detailed Design Procedure
8.2.2.1 Thermal Performance
Output power is limited by two things: the ambient temperature, and the maximum power dissipation in the
package. If the die temperature of the device is below the absolute maximum rating of 125°C, the maximum
output power can be over 6 W. However, any appreciable output current causes the internal power dissipation to
increase and therefore increase the die temperature. Any circuit configuration must ensure that the die
temperature remains below 125°C taking into account the ambient temperature derating. The thermal scale-back
protection (TSB) helps ensure that temperature requirement is held valid. If the TSB feature is disabled, thermal
shutdown (TSD) is the next level of protection for the device, which is set to 150°C. This mechanism cannot be
disabled, and operation of the device above 125°C is not ensured by the electrical specification.
The device power dissipation equals:
PDISS
VIN VLED u ILED
(1)
Use Equation 2 to calculate the junction temperature (TJ) of the device:
TJ R TJA u PDISS
(2)
Note that these equations only provide approximation of the junction temperature and do not take into account
thermal time constants, which play a large role in determining maximum deliverable output power and flash
durations.
8.2.2.2 Input Capacitor Selection
Choosing the correct size and type of input capacitor helps minimize noise on the input pin of the boost converter
that can feed through and disrupt internal analog signals. In the typical application circuit a 10-µF ceramic input
capacitor works well. It is important to place the input capacitor as close as possible to the LM36011 input (IN)
pin. This reduces the series resistance and inductance that can inject noise into the device. Table 2 lists various
input capacitors recommended for use with the LM36011.
Table 2. Recommended InputCapacitors (X5R/X7R Dielectric)
PART NUMBER
VALUE
CASE SIZE
VOLTAGE RATING
TDK Corporation
MANUFACTURER
C1608JB0J106M
10 µF
0603 (1.6 mm × 0.8 mm × 0.8 mm)
6.3 V
TDK Corporation
C2012JB1A106M
10 µF
0805 (2 mm × 1.25 mm × 1.25 mm)
10 V
Murata
GRM188R60J106M
10 µF
0603 (1.6 mm × 0.8 mm × 0.8 mm)
6.3 V
Murata
GRM21BR61A106KE19
10 µF
0805 (2 mm × 1.25 mm × 1.25 mm)
10 V
18
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8.2.3 Application Curves
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
100
100
95
95
90
90
85
KFLASH ( )
85
KFLASH (%)
85qC
25qC
-40qC
80
75
70
65
80
75
70
65
60
60
55
85qC
25qC
-40qC
55
50
0x00
0x0F
0x1F
0x2F 0x3F 0x4F 0x5F
Brightness Code (hex)
0x6F
50
45
2.5
0x7F
3
3.5
D016
VIN = 4.0 V
5
5.5
D017
Figure 26. LED Flash Efficiency vs Input Voltage
100
100
85qC
25qC
-40qC
95
90
90
85
85
80
80
75
70
65
75
70
65
60
60
55
55
50
50
45
2.5
3
3.5
4
VIN (V)
4.5
5
85qC
25qC
-40qC
95
KFLASH ( )
KFLASH ( )
4.5
IFLASH = 1.5 A
Figure 25. LED Flash Efficiency vs Brightness Code
45
2.5
5.5
3
3.5
D018
IFLASH = 1.03 A
4
VIN (V)
4.5
5
5.5
D019
IFLASH = 0.75 A
Figure 27. LED Flash Efficiency vs Input Voltage
Figure 28. LED Flash Efficiency vs Input Voltage
100
100
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
90
85
80
75
95
90
85
KFLASH ( )
95
KFLASH ( )
4
VIN (V)
70
65
80
75
65
60
60
55
55
50
50
45
2.5
3
3.5
4
VIN (V)
4.5
5
5.5
Code 0x47
Code 0x4F
Code 0x57
Code 0x5F
Code 0x67
Code 0x6F
Code 0x77
Code 0x7F
70
45
2.5
D020
Figure 29. LED Flash Efficiency vs Input Voltage
3
3.5
4
VIN (V)
4.5
5
5.5
D021
Figure 30. LED Flash Efficiency vs Input Voltage
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100
100
95
95
90
90
85
85
80
80
KTORCH ( )
KTORCH (%)
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
75
70
65
85qC
25qC
-40qC
75
70
65
60
60
85qC
25qC
-40qC
55
50
0x00
0x0F
0x1F
0x2F 0x3F 0x4F 0x5F
Brightness Code (hex)
0x6F
55
50
45
2.5
0x7F
3
3.5
D022
4
VIN (V)
4.5
5
5.5
D023
ITORCH = 376 mA
Figure 31. LED Torch Efficiency vs Brightness Code
Figure 32. LED Torch Efficiency vs Input Voltage
100
100
85qC
25qC
-40qC
95
90
85
85
80
80
KTORCH ( )
KTORCH ( )
90
75
70
65
75
70
65
60
60
55
55
50
50
45
2.5
3
3.5
4
VIN (V)
4.5
5
85qC
25qC
-40qC
95
45
2.5
5.5
3
3.5
D024
ITORCH = 258 mA
5.5
D025
100
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
90
85
80
75
Code 0x47
Code 0x4F
Code 0x57
Code 0x5F
Code 0x67
Code 0x6F
Code 0x77
Code 0x7F
95
90
85
KTORCH ( )
95
KTORCH ( )
5
Figure 34. LED Torch Efficiency vs Input Voltage
100
70
65
80
75
70
65
60
60
55
55
50
50
3
3.5
4
VIN (V)
4.5
5
5.5
45
2.5
3
3.5
4
VIN (V)
4.5
5
5.5
D027
D026
Figure 35. LED Torch Efficiency vs Input Voltage
20
4.5
ITORCH = 188 mA
Figure 33. LED Torch Efficiency vs Input Voltage
45
2.5
4
VIN (V)
Figure 36. LED Torch Efficiency vs Input Voltage
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TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
Time (200 µs/DIV)
Mode bits (Reg 0x01 bit[1:0]) = 11 (Flash mode)
Time (100 ms/DIV)
Flash Time-out (Reg 0x02 bits[4:1]) = 0111 (320 ms)
Figure 37. Flash Start-up with I2C
Time (2 ms/DIV)
Figure 39. Flash Turn-off with I2C
Figure 38. Flash Time-out
Time (200 µs/DIV)
Mode bits (Reg 0x01 bit[1:0]) = 10 (Torch mode)
Figure 40. Torch Start-up with I2C
Time (1 ms/DIV)
Mode bits (Reg 0x01 bit[1:0]) = 00 (Standby mode)
Figure 41. Torch Turn-off with I2C
Time (400 µs/DIV)
STROBE Enabled (Reg 0x01 bit[2] = 1)
Figure 42. Flash Start-up with STROBE
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TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
22
Time (100 ms/DIV)
STROBE Enabled (Reg 0x01 bit[2] = 1)
Level Triggered (Reg 0x01 bit[3] = 0)
Strobe pulse = 100 ms
Time (100 ms/DIV)
STROBE Enabled (Reg 0x01 bit[2] = 1)
Edge Triggered (Reg 0x01 bit[3] = 1)
Flash Time-out = 320 ms
Figure 43. Flash Turn-off with Level Triggered STROBE
Figure 44. Flash Turn-off with Edge Triggered STROBE
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9 Power Supply Recommendations
The LM36011 is designed to operate from an input voltage supply range between 2.5 V and 5.5 V. This input
supply must be well regulated and capable to supply the required input current. If the input supply is located far
from the LM36011 additional bulk capacitance may be required in addition to the ceramic bypass capacitors.
10 Layout
10.1 Layout Guidelines
The following steps are to be used as a reference to ensure the device is stable and maintains proper LED
current regulation across its intended operating voltage and current range.
1. Place CIN on the top layer (same layer as the LM36011) and as close as possible to the device. Connecting
the input capacitor through short, wide traces to both the IN and GND pins reduces the inductive voltage
spikes that occur during switching which can corrupt the VIN line.
2. Terminate the flash LED cathode directly to the GND pin of the LM36011. If possible, route the LED return
with a dedicated path so as to keep the high amplitude LED current out of the GND plane. For a flash LED
that is routed relatively far away from the LM36011, a good approach is to sandwich the forward and return
current paths over the top of each other on two layers. This helps reduce the inductance of the LED current
path.
10.2 Layout Example
IN
10 PF
VIAs to GND
Plane
GND
IN
NC
STROBE
STROBE
IN
SDA
SDA
LED
SCL
SCL
LED
Figure 45. LM36011 Layout Example
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation, see the following:
AN-1112 DSBGA Wafer Level Chip Scale Package
11.3 Trademarks
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
24
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LM36011YKBR
ACTIVE
DSBGA
YKB
8
3000
RoHS & Green
SAC396
Level-1-260C-UNLIM
-40 to 85
6011
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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