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LM4120
SNVS049F – FEBRUARY 2000 – REVISED MARCH 2016
LM4120 Precision Micropower Low Dropout Voltage Reference
1 Features
3 Description
•
•
•
•
•
•
•
•
The LM4120 device is a precision low-power, low
dropout bandgap voltage reference with up to 5-mA
output current source and sink capability.
1
•
•
Small SOT23-5 Package
Low Dropout Voltage: 120 mV Typical at 1 mA
High Output Voltage Accuracy: 0.2%
Source and Sink Current Output: ±5 mA
Supply Current: 160 μA Typical
Low Temperature Coefficient: 50 ppm/°C
Enable Pin
Fixed Output Voltages: 1.8, 2.048, 2.5, 3, 3.3,
4.096, and 5 V
Industrial Temperature Range: −40°C to 85°C
(For Extended Temperature Range, −40°C to
125°C, Contact TI)
2 Applications
•
•
•
•
•
•
•
•
•
•
Portable, Battery-Powered Equipment
Instrumentation and Process Control
Automotive and Industrial
Test Equipment
Data Acquisition Systems
Precision Regulators
Battery Chargers
Base Stations
Communications
Medical Equipment
This series reference operates with input voltages as
low as 2 V and up to 12 V, consuming 160-µA
(typical) supply current. In power-down mode, device
current drops to less than 2 μA.
The LM4120 comes in two grades (A and Standard)
and seven voltage options for greater flexibility. The
best grade devices (A) have an initial accuracy of
0.2%, while the standard have an initial accuracy of
0.5%, both with a temperature coefficient of
50 ppm/°C ensured from −40°C to 125°C.
The very low dropout voltage, low supply current, and
power-down capability of the LM4120 make this
product an ideal choice for battery-powered and
portable applications.
The device performance is ensured over the industrial
temperature range (−40°C to 85°C), while certain
specifications are ensured over the extended
temperature range (−40°C to 125°C). Contact TI for
full specifications over the extended temperature
range. The LM4120 is available in a standard 5-pin
SOT-23 package.
Device Information(1)
PART NUMBER
LM4120
PACKAGE
SOT-23 (5)
BODY SIZE (NOM)
1.60 mm × 2.90 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Functional Block Diagram
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM4120
SNVS049F – FEBRUARY 2000 – REVISED MARCH 2016
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
6.1
6.2
6.3
6.4
6.5
6.6
3
3
4
4
4
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions ......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 10
8
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application .................................................. 14
9 Power Supply Recommendations...................... 15
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Example ................................................... 16
11 Device and Documentation Support ................. 17
11.1
11.2
11.3
11.4
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
17
17
17
17
12 Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (February 2016) to Revision F
•
Added updated Layout Example ......................................................................................................................................... 16
Changes from Revision D (July 2015) to Revision E
•
2
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
Changes from Revision B (April 2013) to Revision C
•
Page
Added updated Layout Example .......................................................................................................................................... 16
Changes from Revision C (April 2013) to Revision D
•
Page
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 14
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5 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
Enable
3
I
GND
2
—
Negative supply or ground connection
REF
1
—
REF pin. This pin must be left unconnected.
VIN
4
I
Positive supply
VOUT
5
O
Reference output
Pulled to input for normal operation. Forcing this pin to ground will turn off the output.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
Maximum voltage on input or enable pins
MIN
MAX
UNIT
–0.3
14
V
Output short-circuit duraion
Power dissipation (TA = 25°C)
Lead temperature
Indefinite
(2)
350
mW
Soldering, (10 sec.)
260
°C
Vapor Phase (60 sec.)
215
°C
Infrared (15 sec.)
220
°C
150
°C
Storage temperature, Tstg
(1)
(2)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Without PCB copper enhancements. The maximum power dissipation must be derated at elevated temperatures and is limited by TJMAX
(maximum junction temperature), RθJA (junction-to-ambient thermal resistance) and TA (ambient temperature). The maximum power
dissipation at any temperature is: PDissMAX = (TJMAX – TA) / RθJA up to the value listed in the Absolute Maximum Ratings.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged device model (CDM), per JEDEC specification JESD22C101 (2)
±750
Machine Model
±200
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Ambient temperature
–40
85
°C
Junction temperature
–40
125
°C
6.4 Thermal Information
LM4120
THERMAL METRIC (1)
DBV [SOT-23]
UNIT
5 PINS
RθJA
Junction-to-ambient thermal resistance
170.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
123.9
°C/W
RθJB
Junction-to-board thermal resistance
30.4
°C/W
ψJT
Junction-to-top characterization parameter
17.2
°C/W
ψJB
Junction-to-board characterization parameter
29.9
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
unless otherwise specified, VIN = 3.3 V, ILOAD = 0, COUT = 0.01 µF, TA = Tj = 25°C.
PARAMETER
TEST CONDITIONS
MIN
(1)
TYP
(2)
MAX
(1)
UNIT
1.8 V, 2.048 V, AND 2.5 V
VOUT
TCVOUT/°C
ΔVOUT/ΔVIN
Output voltage initial
accuracy
LM4120A-1.800
LM4120A-2.048
LM4120A-2.500
±0.2%
LM4120-1.800
LM4120-2.048
LM4120-2.500
±0.5%
Temperature coefficient
–40°C ≤ TA ≤ +125°C
3.3 V ≤ VIN ≤ 12 V
Line regulation
0 mA ≤ ILOAD ≤ 1 mA
ΔVOUT/ΔILOAD
1 mA ≤ ILOAD ≤ 5 mA
Load regulation
Dropout voltage
(3)
(2)
(3)
4
–40°C ≤ TA ≤ 85°C
0.01
0.03
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
0.01
0.04
%/mA
0.12
45
65
120
150
–40°C ≤ TA ≤ 85°C
80
–40°C ≤ TA ≤ 85°C
180
180
–40°C ≤ TA ≤ 85°C
%/V
0.08
0.1
0.04
ILOAD = 1 mA
ppm/°c
0.17
0.01
–5 mA ≤ ILOAD ≤ −1 mA
ILOAD = 5 mA
(1)
50
0.008
–1 mA ≤ ILOAD ≤ 0 mA
ILOAD = 0 mA
VIN−VOUT
14
0.0007
mV
210
250
Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical
Quality Control (SQC) methods. The limits are used to calculate TI's Averaging Outgoing Quality Level (AOQL).
Typical numbers are at 25°C and represent the most likely parametric norm.
Dropout voltage is the differential voltage between VOUT and VIN at which VOUT changes ≤ 1% from VOUT at VIN = 3.3 V for 1.8 V, 2 V,
2.5 V, and VOUT + 1 V for others. For 1.8-V option, dropout voltage is not ensured over temperature. A parasitic diode exists between
input and output pins; it will conduct if VOUT is pulled to a higher voltage than VIN.
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Electrical Characteristics (continued)
unless otherwise specified, VIN = 3.3 V, ILOAD = 0, COUT = 0.01 µF, TA = Tj = 25°C.
PARAMETER
TEST CONDITIONS
VN
Output (4)
IS
Supply current
ISS
Power-down supply
current
VH
Logic high input voltage
VL
Logic low input voltage
IH
Logic high input current
IL
Logic low input current
(1)
TYP
(2)
0.1 Hz to 10 Hz
20
10 Hz to 10 kHz
36
160
–40°C ≤ TA ≤ 85°C
Enable = 0.4 V
–40°C ≤ TJ ≤ 85°C
Enable = 0.2 V
ΔVOUT
Long term stability
(5)
(6)
UNIT
µVPP
250
µA
1
µA
2
V
2.4
0.4
–40°C ≤ TA ≤ 85°C
V
0.2
7
–40°C ≤ TA ≤ 85°C
µA
15
0.1
VIN = 12 V, VOUT = 0
Thermal hysteresis
(1)
2.4
Short circuit current
Hyst
MAX
275
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
VIN = 3.3 V, VOUT = 0
ISC
MIN
µA
15
–40°C ≤ TA ≤ 85°C
6
30
mA
17
–40°C ≤ TA ≤ 85°C
6
30
–40°C ≤ TA ≤ 125°C
0.5
mV/V
1000 hrs @ 25°C
100
ppm
3 V, 3.3 V, 4.096 V, AND 5 V
VOUT
Output voltage initial
accuracy
LM4120A-3.000
LM4120A-3.300
LM4120A-4.096
LM4120A-5.000
±0.2%
LM4120-3.000
LM4120-3.300
LM4120-4.096
LM4120-5.000
±0.5%
TCVOUT/°C
Temperature coefficient
–40°C ≤ TA ≤ 125°C
ΔVOUT/ΔVIN
Line regulation
(VOUT + 1 V) ≤ VIN ≤ 12 V
0 mA ≤ ILOAD ≤ 1 mA
ΔVOUT/ΔILOAD
1 mA ≤ ILOAD ≤ 5 mA
Load regulation
Dropout voltage
(3)
(5)
(6)
0.0007
0.008
–40°C ≤ TA ≤ 85°C
0.03
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
0.08
0.04
0.1
0.01
45
–40°C ≤ TA ≤ 85°C
%/mA
0.12
65
80
120
–40°C ≤ TA ≤ 85°C
150
180
180
–40°C ≤ TA ≤ 85°C
%/V
0.17
0.01
0.04
ILOAD = 1 mA
ppm/°c
0.01
–5 mA ≤ ILOAD ≤ –1 mA
ILOAD = 5 mA
(4)
50
–1 mA ≤ ILOAD ≤ 0 mA
ILOAD = 0 mA
VIN−VOUT
14
mV
210
250
Output noise voltage is proportional to VOUT. VN for other voltage option is calculated using (VN(1.8 V) / 1.8) × VOUT.
VN (2.5 V) = (36 μVPP / 1.8) × 2.5 = 46 μVPP.
Thermal hysteresis is defined as the change in 25°C output voltage before and after exposing the device to temperature extremes.
Long term stability is change in VREF at 25°C measured continuously during 1000 hours.
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Electrical Characteristics (continued)
unless otherwise specified, VIN = 3.3 V, ILOAD = 0, COUT = 0.01 µF, TA = Tj = 25°C.
PARAMETER
TEST CONDITIONS
MIN
(1)
TYP
(2)
MAX
(1)
UNIT
3 V, 3.3 V, 4.096 V, AND 5 V (continued)
VN
Output noise voltage (4)
IS
Supply current
ISS
Power-down supply
current
VH
Logic high input voltage
VL
Logic low input voltage
IH
Logic high input current
IL
Logic low input current
0.1 Hz to 10 Hz
20
10 Hz to 10 kHz
36
160
–40°C ≤ TA ≤ 85°C
Enable = 0.4 V
–40°C ≤ TJ ≤ 85°C
Enable = 0.2 V
ΔVOUT
6
Long term stability
(5)
(6)
2
0.4
0.2
7
–40°C ≤ TA ≤ 85°C
µA
V
2.4
–40°C ≤ TA ≤ 85°C
15
0.1
V
µA
µA
15
–40°C ≤ TA ≤ 85°C
Short circuit current
Thermal hysteresis
µA
1
–40°C ≤ TA ≤ 85°C
2.4
VIN = 12 V, VOUT = 0
Hyst
250
275
–40°C ≤ TA ≤ 85°C
VOUT = 0
ISC
µVPP
6
30
17
–40°C ≤ TA ≤ 85°C
6
mA
30
–40°C ≤ TA ≤ 125°C
0.5
mV/V
1000 hours @ 25°C
100
ppm
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6.6 Typical Characteristics
unless otherwise specified, VIN = 3.3 V, VOUT = 2.5 V, ILOAD = 0, COUT = 0.022 µF, TA = 25°C, and VEN = VIN
Figure 1. Long Term Drift
Figure 2. Typical Temperature Drift
Figure 3. Short Circuit Current vs Temperature
Figure 4. Dropout Voltage vs Output Error
Figure 5. Dropout Voltage vs Load Current
Figure 6. Line Regulation
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Typical Characteristics (continued)
unless otherwise specified, VIN = 3.3 V, VOUT = 2.5 V, ILOAD = 0, COUT = 0.022 µF, TA = 25°C, and VEN = VIN
8
Figure 7. Load Regulation
Figure 8. GND Pin Current
Figure 9. GND Pin Current at No Load vs Temperature
Figure 10. GND Pin Current vs Load
Figure 11. 0.1-Hz to 10-Hz Output Noise
Figure 12. Output Impedance vs Frequency
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Typical Characteristics (continued)
unless otherwise specified, VIN = 3.3 V, VOUT = 2.5 V, ILOAD = 0, COUT = 0.022 µF, TA = 25°C, and VEN = VIN
Figure 13. PSRR vs Frequency
Figure 14. Enable Response
Figure 15. Load Step Response
Figure 16. Line Step Response
Figure 17. Thermal Hysteresis
Figure 18. Enable Pin Current
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7 Detailed Description
7.1 Overview
The LM4120 device is a precision bandgap voltage reference available in seven different voltage options with up
to 5-mA current source and sink capability. This series reference can operate with input voltages from 2 V to
12 V while consuming 160-µA (typical) supply current. In power-down mode, device current drops to less than
2 μA. The LM4120 is available in two grades, A and Standard.
The best grade devices (A) have an initial accuracy of 0.2% with a TEMPCO of 50 ppm/°C ensured from −40°C
to 125°C.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Enable
The ENABLE analog input pin with limited hysteresis generally requires 6 µA (typical) of current to start up the
part. During normal operation, the Enable pin must be connected to the VIN pin. There is a minimum slew rate
on this pin of about 0.003 V/μs to prevent glitches on the output. All of these conditions can easily be met with
ordinary CMOS or TTL logic. The Enable pin can also be used to remotely operate the LM4120 by pulling up the
Enable pin voltage to the input voltage level.
When remotely shutting down the LM4120, the Enable pin must be pulled down to the ground. Floating this pin is
not recommended.
7.3.2 Reference
The REF pin must remain unconnected in all cases. The reference pin is sensitive to noise, and capacitive
loading. Therefore, during the PCB layout care must be taken to keep this pin isolated as much as possible.
7.4 Device Functional Modes
Table 1 describes the functional modes of the LM4120.
Table 1. Enable Pin Mode Summary
10
ENABLE PIN CONNECTION
LOGIC STATE
DESCRIPTION
EN = VIN
1
Normal Operation. LM4120 starts up.
EN = GND
0
LM4120 in shutdown mode
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The standard application circuit for the LM4120 is shown in Figure 29. The device is designed to be stable with
ceramic output capacitors in the range of 0.022 µF to 0.047 µF. The minimum required output capacitor is
0.022 µF. These capacitors typically have an ESR of about 0.1 Ω to 0.5 Ω. Smaller ESR can be tolerated, but
larger ESR cannot be tolerated. The output capacitor can be increased to improve load transient response, up to
about 1 µF. However, values above 0.047 µF must be tantalum. With tantalum capacitors in the 1-µF range, a
small capacitor between the output and the reference pin is required. This capacitor will typically be in the 50-pF
range. Care must be taken when using output capacitors of 1 µF or larger. These applications must be
thoroughly tested over temperature, line, and load.
An input capacitor is typically not required. However, a 0.1-µF ceramic can be used to help prevent line
transients from entering the LM4120. Larger input capacitors must be tantalum or aluminum.
The reference pin is sensitive to noise, and capacitive loading. Therefore, the PCB layout must isolate this pin as
much as possible.
The enable pin is an analog input with very little hysteresis. About 6 µA into this pin is required to turn the part
on, and it must be taken close to GND to turn the part off (see Electrical Characteristics for thresholds). If the
shutdown feature is not required, then this pin can safely be connected directly to the input supply.
Figure 19. Voltage Reference With Negative Output Circuit
Figure 20. Precision High-Current Low-Dropout Regulator Circuit
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Application Information (continued)
Figure 21. Precision High-Current Negative Voltage Regulator Circuit
Figure 22. Voltage Reference With Complimentary Output Circuit
Figure 23. Precision High-Current Low-Dropout Regulator Circuit
12
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Application Information (continued)
Figure 24. Stacking Voltage References Circuit
Figure 25. Precision Voltage Reference With Force and Sense Output Circuit
Figure 26. Programmable Current Source Circuit
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Application Information (continued)
Figure 27. Precision Regulator With Current Limiting Circuit
Figure 28. Power Supply Splitter Circuit
8.2 Typical Application
Figure 29. Standard Application Circuit
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 2 as the input parameters.
Table 2. Design Parameters
14
PARAMETER
EXAMPLE VALUE
Output Voltage VOUT
1.8 V, 2.048 V, 2.5 V, 3 V, 3.3 V, 4.096 V, 5 V
Input Voltage Range VIN
VOUT 120 mV to 12 V
Load Current
1 mA (typical)
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8.2.2 Detailed Design Procedure
8.2.2.1 Input Capacitors
Although not always required, an input capacitor is recommended. A supply bypass capacitor on the input
assures that the reference is working from a source with low impedance, which improves stability. A bypass
capacitor can also improve transient response by providing a reservoir of stored energy that the reference can
utilize in case where the load current demand suddenly increases. The value used for CIN may be used without
limit.
8.2.2.2 Output Capacitors
The LM4120 may require a 0.022-μF to 1-μF output capacitor for loop stability (compensation) as well as
transient response. During the sudden changes in load current demand, the output capacitor must source or sink
current during the time it takes the control loop of the LM4120 to respond.
8.2.3 Application Curves
Figure 30. Start-Up Response
Figure 31. Load Step Response
9 Power Supply Recommendations
Noise on the power-supply input can effect the output noise, but can be reduced by using an optional bypass
capacitor between the input pin and the ground. A ceramic input capacitor more than 0.1 µF or higher can be
used for that purpose.
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10 Layout
10.1 Layout Guidelines
The mechanical stress due to PC board mounting can cause the output voltage to shift from its initial value. The
center of a PC board generally has the highest mechanical and thermal expansion stress. Mounting the device
near the edges or the corners of the board where mechanical stress is at its minimum. References in SOT
packages are generally less prone to assembly stress than devices in Small Outline (SOIC) package.
A mechanical isolation of the device by creating an island by cutting a U shape slot (U - SLOT) on the PCB while
mounting the device helps in reducing the impact of the PC board stresses on the output voltage of the
reference. This approach would also provide some thermal isolation from the rest of the circuit.
Figure 32 shows a recommended printed board layout for LM4120 along with an in-set diagram. The in-set
diagram exhibits a slot cut on three sides of the reference IC, which provides a relief to the IC from external PCB
stress.
10.2
Layout Example
PCB Top View
VOUT
PCB Length
VIN
LM4120
PCB Side View
STRESS
U - SLOT
REF
GND
STRESS
EN
U - SLOT
VOUT
LM4120
REF
PCB Length
GND
Set CIN
close to VIN
and GND
EN
CIN
REF
COUT
LM4120
VIN
Set COUT
close to VOUT
and GND
VOUT
Figure 32. Typical Layout Example With LM4120
16
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11 Device and Documentation Support
11.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Product Folder Links: LM4120
17
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LM4120AIM5-1.8/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R21A
LM4120AIM5-2.0/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R14A
LM4120AIM5-2.5
NRND
SOT-23
DBV
5
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 85
R08A
LM4120AIM5-2.5/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R08A
LM4120AIM5-3.0
NRND
SOT-23
DBV
5
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 85
R15A
LM4120AIM5-3.0/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R15A
LM4120AIM5-3.3
NRND
SOT-23
DBV
5
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 85
R16A
LM4120AIM5-3.3/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R16A
LM4120AIM5-4.1/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R17A
LM4120AIM5-5.0
NRND
SOT-23
DBV
5
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 85
R18A
LM4120AIM5-5.0/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R18A
LM4120AIM5X-1.8/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R21A
LM4120AIM5X-2.0/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R14A
LM4120AIM5X-2.5/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R08A
LM4120AIM5X-3.0/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R15A
LM4120AIM5X-3.3/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R16A
LM4120AIM5X-4.1
NRND
SOT-23
DBV
5
3000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 85
R17A
LM4120AIM5X-4.1/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R17A
LM4120AIM5X-5.0/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R18A
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
23-Apr-2022
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LM4120IM5-1.8/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R21B
LM4120IM5-2.0/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R14B
LM4120IM5-2.5/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R08B
LM4120IM5-3.0
NRND
SOT-23
DBV
5
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 85
R15B
LM4120IM5-3.0/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R15B
LM4120IM5-3.3
NRND
SOT-23
DBV
5
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 85
R16B
LM4120IM5-3.3/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R16B
LM4120IM5-4.1/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R17B
LM4120IM5-5.0/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R18B
LM4120IM5X-1.8/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R21B
LM4120IM5X-2.0/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R14B
LM4120IM5X-2.5/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R08B
LM4120IM5X-3.0/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R15B
LM4120IM5X-3.3/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R16B
LM4120IM5X-4.1/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R17B
LM4120IM5X-5.0/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
R18B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2022
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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