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LM4510SDEV

LM4510SDEV

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    KIT EVAL STEPUP DC/DC FOR LM4510

  • 数据手册
  • 价格&库存
LM4510SDEV 数据手册
User's Guide SNVA283A – September 2007 – Revised May 2013 AN-1697 LM4510 Evaluation Board 1 Introduction The LM4510 is a current mode synchronous step-up DC/DC converter designed for organic LED applications. The evaluation board is designed to provide adjustable output voltage from a single Li-Ion battery. By default, output voltage is set to 16 V. Output voltage can be configured by choosing RF1 and RF2. Loop compensation is achieved by RC, CC1 and CC2. RD provides the option of enabling LM4510 from VIN or external signal. For more details on the application information, see the device-specific data sheet. 2 Operating Conditions • • • • 3 VIN range: 2.7 V ≤ VIN ≤ 5.5 V 10 Pin WSON package Ambient temperature (TA) range: -40°C to +85°C Junction temperature (TJ) range: -40°C to +125°C Schematic VIN 2.7V ± 5.5V M RD L = 4.7 H VOUT 16.0V VIN SW VOUT Open RF1 240k L 4500 EN CIN 4.7 F FB LM4510 SS CS 10 nF PGND COUT 10 F COMP AGND RF2 LOAD 20.5k RC 46.4k CC2 CC1 Open 2.2 nF Figure 1. LM4510 Circuit Schematic All trademarks are the property of their respective owners. SNVA283A – September 2007 – Revised May 2013 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated AN-1697 LM4510 Evaluation Board 1 Bill of Materials (BOM) 4 www.ti.com Bill of Materials (BOM) Designator 5 Component Manufacturer U1 LM4510, WSON 10-lead Texas Instruments L 4.7 µH, DO3314-472ML Coilcraft CIN 4.7 µF, 6.3 V Ceramic C2012X5R0J475K TDK COUT 10 µF, 25 V Ceramic TMK316BJ106KL Taiyo Yuden CS 10 nF, 25 V Ceramic C1608C0G1E103J TDK CC1 2.2 nF, 25 V Ceramic TMK107SD222JA-T Taiyo Yuden RF1 240 KΩ, 0603 Case, 9T06031A2403FBHFT Yageo Corporation RF2 20.5 KΩ, 0603 Case, 9T06031A2052FBHFT Yageo Corporation RC 46.4 KΩ, 0603 Case, 9T06031A4642FBHFT Yageo Corporation CC2 Open RD Open PCB Layout Figure 2. Top Layer 2 AN-1697 LM4510 Evaluation Board SNVA283A – September 2007 – Revised May 2013 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated PCB Layout www.ti.com Figure 3. Bottom Layer SNVA283A – September 2007 – Revised May 2013 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated AN-1697 LM4510 Evaluation Board 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated
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