LM8364BALMFX20

LM8364 www.ti.com SNVS232B – MARCH 2003 – REVISED APRIL 2013 LM8364 Micropower Undervoltage Sensing Circuits Check for Samples: LM8364 FEATURES DESCRIPTION • The LM8364 series are micropower undervoltage sensing circuits that are ideal for use in battery powered microprocessor based systems, where extended battery life is a key requirement. 1 2 • • • • • Extremely Low Quiescent Current: 0.65μA, at VIN = 2.87V High Accuracy Threshold Voltage (±2.5%) Open Drain Output Input Voltage Range: 1V to 6V Surface Mount Package (5-Pin SOT-23) Pin for Pin Compatible with MC33464 APPLICATIONS • • • • Low Battery Detection Microprocessor Reset Controller Power Fail Indicator Battery Backup Detection A range of threshold voltages from 2.0V to 4.5V are available with an active low open drain output. These devices feature a very low quiescent current of 0.65µA typical. The LM8364 series features a highly accurate voltage reference, a comparator with precise thresholds and built-in hysterisis to prevent erratic reset operation, and ensured Reset operation down to 1.0V with extremely low standby current. These devices are available in the space saving SOT-23 5-pin surface mount package. For other undervoltage thresholds and output options, please contact Texas Instruments. Functional Block Diagram Connection Diagram INPUT RESET 1 5 N/C RESET - INPUT 2 + VREF GND GND 3 4 N/C Figure 1. 5-Pin SOT-23 Top View 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2013, Texas Instruments Incorporated LM8364 SNVS232B – MARCH 2003 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage −0.3V to 6.5V RESET Output Voltage −0.3V to 6.5V RESET Output Current 70mA −65°C to 150°C Storage Temperature Range Mounting Temp. Lead Temp (Soldering, 10 sec) 260°C Junction Temperature (1) 125° Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (2) Operating Ratings (1) −40°C to 85°C Temperature Range Thermal Resistance to ambient (θJA) 265°C/W ESD Tolerance Human Body Model 2000V Machine Model (1) 200V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. Electrical Characteristics Unless otherwise specified, all limits ensured for TA = 25°C. Symbol VDET− Parameter Detector Threshold Voltage VHYS Detector Threshold Hysteresis Conditions Min Typ Max 20 Suffix 1.950 2.0 2.050 27 Suffix 2.633 2.7 2.767 30 Suffix 2.925 3.0 3.075 32 Suffix 3.120 3.2 3.280 45 Suffix 4.388 4.5 4.613 20 Suffix 0.060 0.100 0.140 27 Suffix 0.081 0.135 0.189 30 Suffix 0.090 0.150 0.210 32 Suffix 0.096 0.160 0.224 45 Suffix 0.135 0.225 0.315 (1) Units V VIN Increasing Detector Threshold Voltage Temperature Coefficient VOL RESET Output Voltage Low State (Open Drain Output: ISINK = 1mA) IOL RESET Output Sink Current VIN = 1.5V, VOL = 0.5V VIN Operating Input Voltage Range 2 (2) High to Low State Output (VIN Decreasing) ΔVdet/ΔT (1) (2) (1) ±100 0.25 1.0 1.0 V PPM/°C 0.5 2.5 V mA 6.0 V All limits are ensured by testing or statistical analysis. Typical values represent the most likely parametric norm Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LM8364 LM8364 www.ti.com SNVS232B – MARCH 2003 – REVISED APRIL 2013 Electrical Characteristics (continued) Unless otherwise specified, all limits ensured for TA = 25°C. Symbol IIN Parameter Quiescent Input Current Conditions Min Typ Max VIN = 1.9V 0.55 0.8 VIN = 4.0V 0.70 1.3 VIN = 2.6V 0.62 0.9 VIN = 4.7V 0.75 1.3 VIN = 2.87V 0.65 0.9 VIN = 5.0V 0.77 1.3 VIN = 3.08V 0.66 0.9 VIN = 5.20V 0.79 1.3 VIN = 4.34V 0.70 1.0 VIN = 6.0 0.85 1.4 60 300 (1) (2) (1) Units 20 Suffix 27 Suffix 30 Suffix μA 32 Suffix 45 Suffix tp Propagation Delay Time Figure 7 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LM8364 μs 3 LM8364 SNVS232B – MARCH 2003 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics Input Current vs. Input Voltage LM8364BALMF45 Reset Output Voltage vs. Input Voltage LM8364BALMF45 6 1.0 RL = 470k: TO VIN 0.9 80°C 0.7 25°C 0.6 0.5 0.4 -30°C 0.3 0.2 0.1 5 RESET OUTUT VOTLAGE (V) INPUT CURRENT (PA) 0.8 4 3 2 1 RL = 470k: to 5V 0 0.0 0 1 2 3 4 5 1 0 6 2 4 5 6 Figure 2. Figure 3. Reset Output Sink Current vs. Input Voltage LM8364BALMF45 Reset Output Sink Current vs. Output Voltage LM8364BALMF45 12 40 VOL = 0.5V RL = 470k: TO 5V RL = 470k: TO VIN 10 OUTPUT SINK CURRENT (mA) OUTPUT SINK CURRENT (mA) 3 INPUT VOLTAGE (V) INPUT VOLTAGE (V) -30°C 8 25°C 6 4 80°C 2 0 35 VIN = 4.0V 30 VIN = 3.5V 25 VIN = 3.0V 20 15 VIN = 2.5V 10 VIN = 2.0V 5 VIN = 1.5V 0 0 1 2 3 4 5 6 0 1 2 3 4 5 RESET OUTPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 4. Figure 5. Detector Threshold Voltage vs. Temperature LM8364BALMF45 DETECTOR THRESHOLD VOLATE (V) 4.8 VDET+ 4.7 4.6 VHYS 4.5 VDET4.4 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE (°C) Figure 6. 4 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LM8364 LM8364 www.ti.com SNVS232B – MARCH 2003 – REVISED APRIL 2013 APPLICATION NOTES The propagation delay time for the LM8364 is measured using a 470kΩ pull-up resistor connected to from the RESET output pin to 5V in addition to a 10pF capacitive load connected from the same pin to GND. Figure 7 shows the timing diagram for the measurement for the propagation delay. VDET+ is equal to the sum of the detector threshold, VDET−, and the built in hysteresis, VHYS. VDET+ +2 INPUT VOLTAGE, PIN 2 1V 0V 5V 2.5V RESET OUTPUT (ACTIVE LOW), PIN 1 0.5V 0V tPLH tPHL Figure 7. Propagation Delay Timing Diagrams The LM8364 ultra-low current voltage detector was designed to monitor voltages and to provide an indication when the monitored voltage, VIN, dropped below a precisely trimmed threshold voltage. This characteristic is displayed in the typical operating timing diagram below. VIN is the voltage that is being monitored and a pull up resistor is connected from the RESET output pin to VIN. VIN is at some value above VDET+ and then begins to decrease. Since this is an Active Low device the RESET output is pulled High through the pull-up resistor and tracks VIN until VIN crosses the trimmed threshold VDET−. At this point the LM8364 recognizes that VIN is now in a fault condition and the output immediately changes to the Logic Low State. The RESET output will remain in this low state until VIN increases above the threshold VDET− + VHYS. This point is also known as VDET+ as indicated earlier. This built-in hysteresis has been added to the design to help prevent erratic reset operation when the input voltage crosses the threshold. The LM8364 has a wide variety of applications that can take advantage of its precision and low current consumption to monitor Input voltages even though it was designed as a reset controller in portable microprocessor based systems. It is a very cost effective and space saving device that will protect your more expensive investments of microprocessors and other devices that need a specified supply voltage for proper operation. VIN INPUT VOLTAGE, PIN 2 VDET+ VDET- VIN VDET+ RESET OUTPUT (ACTIVE LOW), PIN 1 VDET0V Figure 8. Timing Waveforms Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LM8364 5 LM8364 SNVS232B – MARCH 2003 – REVISED APRIL 2013 www.ti.com Typical Applications VIN VSUPPLY 5.0V INPUT VCC 470k: 2 INPUT PP RESET RESET VDET- = 4.5V 1 RESET OUTPUT GND GND 3 GND 2 INPUT 3.3V 1 VDET- = 3.0V RESET OUTPUT 3 Figure 9. Microprocessor Reset Circuit GND Figure 10. Dual Power Supply Undervoltage Supervision VSUPPLY VDD RSENSE INPUT 2 470k: 1 MICROCONTROLLER VDET- = 2.0V RESET OUTPUT GND 3 GND THIS CIRCUIT MONITORS THE CURRENT AT THE LOAD. AS CURRENT FLOW THROUGH THE LOAD, A VOLTAGE DROP WITH RESPECT TO GROUND APPEARS ACROSS RSENSE WHERE VSENSE = ILOAD * RSENSE. THE FOLLOWING CONDITIONS APPLY: IF: THEN: ILOAD < VDET- /RSENSE RESET OUTPUT = 0V ILOAD t (VDET- +VHYS)/RSENSE RESET OUTPUT = VDD Figure 11. Microcontroller System Load Sensing 6 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LM8364 LM8364 www.ti.com SNVS232B – MARCH 2003 – REVISED APRIL 2013 VSUPPLY 2 INPUT VDET- = 4.5V RESET OUTPUT 3 GND 2 INPUT VDET- = 3.0V RESET OUTPUT 3 GND 2 INPUT VIN = 1.0V TO 6V VDET- = 2.0V RESET OUTPUT 3 GND EACH LED WILL SEQUENTIALLY TURN ON WHEN THE RESPECTIVE VOLTAGE DETECTOR THRESHOLD (VDET- +VHYS) IS EXCEEDED. Figure 12. LED Bar Graph Voltage Monitor Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LM8364 7 LM8364 SNVS232B – MARCH 2003 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision A (April 2013) to Revision B • 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LM8364 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM8364BALMF20 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 85 F01A LM8364BALMF20/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 F01A LM8364BALMFX20 ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 85 F01A LM8364BALMFX20/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 F01A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ SOT-23 DBV 5 1000 178.0 8.4 LM8364BALMF20/NOPB SOT-23 LM8364BALMF20 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM8364BALMFX20/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM8364BALMFX20 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM8364BALMF20 SOT-23 DBV 5 1000 210.0 185.0 35.0 LM8364BALMF20/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM8364BALMFX20 SOT-23 DBV 5 3000 210.0 185.0 35.0 LM8364BALMFX20/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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