LM95071EVAL/NOPB

Order Now Product Folder Support & Community Tools & Software Technical Documents LM95071 SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 LM95071 SPI/MICROWIRE 13-Bit Plus Sign Temperature Sensor 1 Features 3 Description • • The LM95071 is a low-power, high-resolution digital temperature sensor with an SPI and MICROWIRE compatible interface, available in the 5-pin SOT-23. The host can query the LM95071 at any time to read temperature. Its low operating current is useful in systems where low power consumption is critical. 1 • • • Small SOT-23 package saves space Shutdown mode conserves power between temperature readings Operates over a full −40°C to +150°C range SPI and MICROWIRE bus interface Key specifications: – Supply voltage: 2.4 V to 5.5 V – Supply current: – Operating: 280 µA (typical) – Shutdown: 6 µA (typical) – Temperature accuracy: – 0°C to 70°C ±1°C (maximum) – −40°C to 150°C ±2°C (maximum) – Temperature resolution: 0.03125°C The 2.4-V to 5.5-V supply voltage range, fast conversion rate, low supply current, and simple SPI interface of the LM95071 make it ideal for a wide range of applications. Device Information(1) PART NUMBER LM95071 PACKAGE SOT-23 (5) BODY SIZE (NOM) 2.90 mm × 1.60 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 2 Applications • • • • • • The LM95071 has 13-bit plus sign temperature resolution (0.03125°C per LSB) while operating over a temperature range of −40°C to +150°C. System thermal management Portable electronic devices Personal computers Disk drives Office electronics Electronic test equipment Temperature Monitor Application +3.3V SimpleLink MSP432P4 LM95071 0.1 µF GPIO CS UCxSOMI (GPIO) VDD SI/O 10k UCxSIMO SC GND UCxCLK 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM95071 SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 3 3 4 4 4 Absolute Maximum Ratings ..................................... ESD Ratings.............................................................. Recommended Operating Ratings............................ Thermal Information .................................................. Temperature-to-Digital Converter Characteristics..... Logic Electrical Characteristics - Digital DC Characteristics ........................................................... 6.7 Logic Electrical Characteristics - Serial Bus Digital Switching Characteristics........................................... 6.8 Timing Diagrams ....................................................... 6.9 Typical Characteristics .............................................. 4 5 5 7 7 8 Parameter Measurement Information .................. 8 Detailed Description .............................................. 9 8.1 8.2 8.3 8.4 8.5 8.6 9 Overview ................................................................... 9 Functional Block Diagram ......................................... 9 Feature Description................................................... 9 Device Functional Modes........................................ 10 Programming .......................................................... 10 Register Maps ......................................................... 12 Device and Documentation Support.................. 14 9.1 9.2 9.3 9.4 9.5 Receiving Notification of Documentation Updates.. 14 Community Resource.............................................. 14 Trademarks ............................................................. 14 Electrostatic Discharge Caution .............................. 14 Glossary .................................................................. 14 10 Mechanical, Packaging, and Orderable Information ........................................................... 14 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision F (May 2019) to Revision G • Page Changed Temperature Monitor Application graphic ............................................................................................................... 1 Changes from Revision E (December 2018) to Revision F Page • Added the TYPE column to the Pin Functions table ............................................................................................................. 3 • Changed V(ESD) for CDM from ±200 V to ±250 V .................................................................................................................. 3 Changes from Revision D (September 2013) to Revision E Page • Updated data sheet layout to the latest SDS format ............................................................................................................. 1 • Moved the automotive device to a standalone data sheet (SNIS207) .................................................................................. 1 • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .............................. 1 • Changed key graphics on the first page ................................................................................................................................ 1 • Replaced the Thermal Characteristics table with the Thermal Information table and added new thermal resistance values .................................................................................................................................................................................... 4 • Changed Temperature-to-Digital Converter Characteristics tablenote to clarify conversion interval ..................................... 4 2 Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 LM95071 www.ti.com SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 5 Pin Configuration and Functions DBV Package 5-Pin SOT-23 Top View 1 5 CS 2 GND VDD LM95071/ LM95071-Q1 3 4 SI/O SC Pin Function PIN NO. TYPE NAME 1 CS Input 2 GND Ground 3 SI/O Input/Output 4 SC Input 5 VDD Supply DESCRIPTION Chip Select input. This pin receives an active-low signal from the controller to select the device. Ground. This is the power and signal ground return. Serial Input/Output. This serial, bidirectional, data bus pin transmits and receives signals to and from the controller. Schmitt trigger input in the input mode. Serial bus clock. This serial clock signal comes from the controller. Schmitt trigger input. Positive Supply Voltage. Supply a DC voltage from 2.4V to 5.5V to this pin and bypass with a 0.1-µF ceramic capacitor to ground. 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) (3) MIN MAX UNIT Supply voltage −0.3 6 V Voltage at any pin −0.3 VDD + 0.3 V 5 mA −65 150 °C Input current at any pin (4) Storage temperature, Tstg (1) (2) (3) (4) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. Soldering process must comply with Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging. Reflow temperature profiles are different for lead-free and non-lead-free packages. When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD) the current at that pin should be limited to 5 mA. 6.2 ESD Ratings VALUE V(ESD) (1) (2) (3) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (3) ±250 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 3 LM95071 SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 www.ti.com 6.3 Recommended Operating Ratings MIN MAX UNIT Specified temperature (1), TMIN to TMAX −40 150 °C Supply voltage (VDD) 2.4 5.5 V (1) The life expectancy of the of the LM95071 will be reduced when operating at elevated temperatures. of the LM95071 θJA (thermal resistance, junction-to-ambient) when attached to a printed-circuit board with 2-oz. foil is summarized in the table below. 6.4 Thermal Information LM95071 THERMAL METRIC (1) DBV (SOT-23) UNIT 5 PINS RθJA Junction-to-ambient thermal resistance 167.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 118.8 °C/W RθJB Junction-to-board thermal resistance 30.7 °C/W ψJT Junction-to-top characterization parameter 14.4 °C/W ψJB Junction-to-board characterization parameter 30.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Temperature-to-Digital Converter Characteristics Unless otherwise noted, these specifications apply for VDD = 3.3 V. All limits TA = TJ = +25°C, unless otherwise noted. PARAMETER Temperature error (3) Line regulation MIN (1) TEST CONDITIONS MAX (1) VDD = 3.0V to 3.6V; TA = 0°C to +70°C, TA = TJ = TMIN to TMAX UNIT ±1.0 °C VDD = 3.0V to 3.6V; TA = −40°C to +150°C, TA = TJ = TMIN to TMAX ±2.0 °C VDD = 3.6V to 5.5V; TA = 0°C to +70°C +0.3 VDD = 3.0V to 2.4V; TA = 0°C to +70°C -0.6 °C/V 14 0.03125 Resolution Temperature conversion time See TA = TJ = +25°C (4) Quiescent current ms 228 TA = TJ = +25°C 280 TA = TJ = TMIN to TMAX µA 520 TA = TJ = +25°C Shutdown Bits °C 130 TA = TJ = TMIN to TMAX Operating, serial bus inactive (1) (2) (3) (4) TYP (2) 6 TA = TJ = TMIN to TMAX µA 28 Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level). Typicals are at TA = 25°C and represent most likely parametric norm. The of the LM95071 will operate properly over the VDD supply voltage range of 2.4V to 5.5V. Following a power on reset, the user must allow at least 228 ms before making the first read transaction to ensure a first valid temperature read. After the first read, in order to ensure an accurate temperature result, the time interval between any two consecutive temperature reads must be greater than the maximum conversion time of 228 ms. 6.6 Logic Electrical Characteristics - Digital DC Characteristics Unless otherwise noted, these specifications apply for VDD = 2.4 V to 5.5 V (1). PARAMETER TEST CONDITIONS MIN (2) TYP (3) MAX (2) UNIT VIN(1) Logical “1” Input Voltage TA = TJ = TMIN to TMAX 0.7 × VDD VDD + 0.3 V VIN(0) Logical “0” Input Voltage TA = TJ = TMIN to TMAX −0.3 0.3 × VDD V (1) (2) (3) 4 The of the LM95071 will operate properly over the VDD supply voltage range of 2.4V to 5.5V. Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level). Typicals are at TA = 25°C and represent most likely parametric norm. Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 LM95071 www.ti.com SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 Logic Electrical Characteristics - Digital DC Characteristics (continued) Unless otherwise noted, these specifications apply for VDD = 2.4 V to 5.5 V(1). PARAMETER TYP (3) TA = TJ = +25°C Input Hysteresis Voltage VDD = 3 V to 3.6 V IIN(1) Logical “1” Input Current VIN = VDD IIN(0) Logical “0” Input Current VIN = 0 V CIN All Digital Inputs TA = TJ = +25°C VOH High Level Output Voltage IOH = −400 µA, TA = TJ = TMIN to TMAX VOL Low Level Output Voltage IOL = +1.6 mA, TA = TJ = TMIN to TMAX IO_TRI- TRI-STATE VO = GND ® Output V = VDD, TA = TJ = TMIN to TMAX Leakage Current O STATE MIN (2) TEST CONDITIONS MAX (2) UNIT 0.4 TA = TJ = TMIN to TMAX V 0.33 TA = TJ = +25°C 0.005 TA = TJ = TMIN to TMAX µA 3 −0.005 TA = TJ = +25°C µA −3 TA = TJ = TMIN to TMAX 20 pF 2.25 V −1 0.4 V +1 µA 6.7 Logic Electrical Characteristics - Serial Bus Digital Switching Characteristics Unless otherwise noted, these specifications apply for VDD = 2.4 V to 5.5 V (1); CL (load capacitance) on output lines = 100 pF unless otherwise specified. MIN (2) (1) (2) (3) TA = TJ = TMIN to TMAX TYP (3) MAX (2) 0.16 UNIT t1 SC (Clock) Period t2 CS Low to SC (Clock) High Set-Up Time TA = TJ = TMIN to TMAX t3 CS Low to Data Out (SO) Delay TA = TJ = TMIN to TMAX 70 ns t4 SC (Clock) Low to Data Out (SO) Delay TA = TJ = TMIN to TMAX 70 ns t5 CS High to Data Out (SO) TRI-STATE TA = TJ = TMIN to TMAX 200 ns t6 SC (Clock) High to Data In (SI) Hold Time TA = TJ = TMIN to TMAX 50 ns t7 Data In (SI) Set-Up Time to SC (Clock) High TA = TJ = TMIN to TMAX 30 ns t8 SC (Clock) High to CS High Hold Time TA = TJ = TMIN to TMAX 50 ns TA = TJ = +25°C DC 100 µs ns The of the LM95071 will operate properly over the VDD supply voltage range of 2.4V to 5.5V. Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level). Typicals are at TA = 25°C and represent most likely parametric norm. 6.8 Timing Diagrams SC tr t1 t2 t4 t4 tf CS t3 SO Figure 1. Data Output Timing Diagram Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 5 LM95071 SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 www.ti.com Timing Diagrams (continued) SC SC CS CS t5 SO t5 SO Figure 2. TRI-STATE Data Output Timing Diagram SC SC t7 t7 t8 t8 t6 t6 CS CS SI SI Figure 3. Data Input Timing Diagram 6 Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 LM95071 www.ti.com SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 6.9 Typical Characteristics Figure 4. Static Supply Current vs. Temperature Figure 6. Conversion Time vs Temperature Figure 5. Maximum Temperature Error Figure 7. Typical Output Noise at 30°C Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 7 LM95071 SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 www.ti.com 7 Parameter Measurement Information 01,0010,1100,0000 Output Code +25°C +0.03125°C 00,0011,0010,0000 00,0000,0000,0001 Temperature 00,0000,0000,0000 0°C -40°C +150°C 11,1111,1111,1111 -0.03125°C 11,1100,1110,0000 -25°C 11,1011,0000,0000 Figure 8. Temperature-to-Digital Transfer Function (Non-Linear Scale for Clarity) +3.3V IOL = 1.6 mA To LM95071/ LM95071-Q1 SI/O Pin 80 pF 1.4V IOH = -1.6 mA Figure 9. TRI-STATE Test Circuit 8 Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 LM95071 www.ti.com SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 8 Detailed Description 8.1 Overview The LM95071 temperature sensor incorporates a temperature sensor and 13-bit-plus-sign ΔΣ ADC (Delta-Sigma Analog-to-Digital Converter). Compatibility of the LM95071's three-wire serial interface with SPI and MICROWIRE allows simple communications with common microcontrollers and processors. Shutdown mode can be used to optimize current drain for different applications. A Manufacturer/Device ID register identifies the LM95071 as a Texas Instruments product. 8.2 Functional Block Diagram VDD LM95071/ LM95071-Q1 Temperature Sensor Circuitry Control Logic 14-Bit Delta-Sigma A/D Converter Manufacturer's ID Register Temperature Register SI/O Three-Wire Serial Interface CS SC 8.3 Feature Description 8.3.1 Power Up and Power Down The LM95071 always powers up in a known state and in the continuous conversion mode. Immediately after power up, the LM95071 will output an erroneous code until the first temperature conversion has completed. When the supply voltage is less than about 1.6V (typical), the LM95071 is considered powered down. As the supply voltage rises above the nominal 1.6-V power up threshold, the internal registers are reset to the power up default state described above. 8.3.2 Temperature Data Format Temperature data is represented by a 14-bit, two's complement word with an LSB (Least Significant Bit) equal to 0.03125°C: Table 1. Digital Output for Temperature Data Temperature Digital Output Binary Hex +150°C 0100 1011 0000 0011 4B03 +125°C 0011 1110 1000 0011 3E83 +25°C 0000 1100 1000 0011 0C83 +0.03125°C 0000 0000 0000 0111 0007 0°C 0000 0000 0000 0011 0003 Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 9 LM95071 SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 www.ti.com Table 1. Digital Output for Temperature Data (continued) Temperature Digital Output Binary Hex −0.03125°C 1111 1111 1111 1111 FFFF −25°C 1111 0011 1000 0011 F383 −40°C 1110 1100 0000 0011 EC03 The first data byte is the most significant byte with most significant bit first, permitting only as much data as necessary to be read to determine temperature condition. For instance, if the first four bits of the temperature data indicate an overtemperature condition, the host processor could immediately take action to remedy the excessive temperatures. 8.3.3 Tight Accuracy, Fine Resolution and Low Noise The LM95071 is well suited for applications that require tight temperature measurement accuracy. In many applications, from process control to HVAC, the low temperature error can mean better system performance and, by eliminating a system calibration step, lower production cost. With fine digital resolution, the LM95071 senses and reports very small changes in its temperature, making it ideal for applications where temperature sensitivity is important. For example, the LM95071 enables the system to quickly identify the direction of temperature change, allowing the processor to take compensating action before the system reaches a critical temperature. The LM95071 has very low output noise (see Figure 7 in the Typical Characteristics section), which makes it ideal for applications where stable thermal compensation is a priority. For example, in a temperaturecompensated oscillator application, the very small deviation in successive temperature readings translates to a stable frequency output from the oscillator. 8.4 Device Functional Modes 8.4.1 Shutdown Mode/Manufacturer ID The master controller may enable the shutdown mode for the purpose of reducing power consumption or for reading the Manufacturer/Device ID information. The shutdown mode is enabled by writing XX FF hex to the LM95071 as shown in Figure 13c. The serial bus is still active when the LM95071 is in shutdown. When in shutdown mode the LM95071 always will output 1000 0000 0000 1111. This is the Manufacturer/Device ID information. The first 5-bits of the field (1000 0XXX) are reserved for the manufacturer ID. 8.5 Programming 8.5.1 Serial Bus Interface The LM95071 operates as a slave and is compatible with SPI or MICROWIRE bus specifications. Data is clocked out on the falling edge of the serial clock (SC), while data is clocked in on the rising edge of SC. A complete communication is framed by falling and rising chip select (CS) signal. The CS signal should be held high for at least one clock cycle (160 ns minimum) between communications. The transmit-only communication (register read) consists of 16 clock cycles. A complete transmit/receive communication will consist of 32 serial clocks (see Serial Bus Timing Diagrams). The first 16 clocks comprise the transmit phase of communication, while the second 16 clocks are the receive phase. When CS is high SI/O will be in TRI-STATE. Communication should be initiated by taking chip select (CS) low. This should not be done when SC is changing from a low to high state. Once CS is low the serial I/O pin (SI/O) will transmit the first bit of data. The master can then read this bit with the rising edge of SC. The remainder of the data will be clocked out by the falling edge of SC. CS can be taken high at any time during the transmit phase. If CS is brought low in the middle of a conversion the LM95071 will complete the conversion and the output shift register will be updated after CS is brought back high. 10 Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 LM95071 www.ti.com SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 Programming (continued) The receive phase of a communication starts after 16 SC periods. CS can remain low for 32 SC cycles. The LM95071/LM95071-Q1 will read the data available on the SI/O line on the rising edge of the serial clock. Input data is to an 8-bit shift register. The part will detect the last eight bits shifted into the register. The receive phase can last up to 16 SC periods. All ones must be shifted in order to place the part into shutdown. All zeros must be shifted in order to place the LM95071 into continuous conversion mode. Only the following codes should be transmitted to the LM95071: • 00 hex for continuous conversion • FF hex for shutdown Another code may place the part into a test mode. Test modes are used by Texas Instruments to thoroughly test the function of the LM95071 during production testing. Only eight bits have been defined above since only the last eight transmitted are detected by the LM95071, before CS is taken HIGH. The following communication can be used to determine the Manufacturer's/Device ID and then immediately place the part into continuous conversion mode. With CS continuously low: • Read 16 bits of temperature data • Write 16 bits of data commanding shutdown • Read 16 bits of Manufacture's/Device ID data • Write 8 to 16 bits of data commanding Conversion Mode • Take CS HIGH. Note that 228 ms (max) will have to pass for a conversion to complete before the LM95071 actually transmits temperature data. 8.5.2 Serial Bus Timing Diagrams 1 8 SC CS SO D15 D14 D8 Figure 10. Reading Continuous Conversion - Single Eight-Bit Frame 1 8 1 8 SC CS SO D15 D14 D7 D2 TRI-STATE Figure 11. Reading Continuous Conversion - Two Eight-Bit Frames Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 11 LM95071 SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 www.ti.com Programming (continued) 1 8 1 8 1 8 1 8 SC CS SI/O D15 D14 D7 D15 D14 D2 Data from the LM95071/ LM95071-Q1 D8 TRISTATE D7 D0 D6 Data from the Controller Figure 12. Writing Shutdown Mode 1 8 1 8 1 8 1 8 SC CS SI/O D15 D14 D7 D15 D14 D2 Data from the LM95071/ LM95071-Q1 D8 TRISTATE D7 D0 D6 Data from the Controller Figure 13. Writing Conversion Mode 8.6 Register Maps 8.6.1 Internal Register Structure The LM95071 has three registers: the temperature register, the configuration register and the Manufacturer/Device identification register. The temperature and Manufacturer/Device identification registers are read only. The configuration register is write only. 8.6.1.1 Configuration Register (Selects shutdown or continuous conversion modes): Table 2. (Write Only): D15 D14 D13 D12 D11 D10 D9 D8 X X X X X X X X D7 D6 D5 D4 D3 D2 D1 D0 Shutdown D0–D15 set to XX FF hex enables shutdown mode. D0–D15 set to XX 00 hex sets continuous-conversion mode. Note: setting D0-D15 to any other values may place the LM95071 into a manufacturer's test mode, upon which the LM95071 will stop responding as described. These test modes are to be used for Texas Instruments production testing only. See Serial Bus Interface for a complete discussion. 8.6.1.2 Temperature Register Table 3. (Read Only): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 MSB Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit1 LSB 1 1 12 Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 LM95071 www.ti.com SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 D0–D1: Logic 1 will be output on SI/0. D2–D15: Temperature Data. One LSB = 0.03125°C. Two's complement format. 8.6.1.3 Manufacturer/Device ID Register Table 4. (Read Only): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 D0–D1: Logic 1 will be output on SI/0. D2–D15: Manufacturer/Device ID Data. This register is accessed whenever the LM95071 is in shutdown mode. Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 13 LM95071 SNIS137G – AUGUST 2004 – REVISED AUGUST 2019 www.ti.com 9 Device and Documentation Support 9.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 9.2 Community Resource The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 9.3 Trademarks E2E is a trademark of Texas Instruments. TRI-STATE is a registered trademark of National Semiconductor Corporation. All other trademarks are the property of their respective owners. 9.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 9.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 10 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 14 Submit Documentation Feedback Copyright © 2004–2019, Texas Instruments Incorporated Product Folder Links: LM95071 PACKAGE OPTION ADDENDUM www.ti.com 30-Sep-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM95071CIMF NRND SOT-23 DBV 5 1000 Non-RoHS & Green Call TI Level-1-260C-UNLIM -40 to 150 T18C LM95071CIMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 150 T18C LM95071CIMFX NRND SOT-23 DBV 5 3000 Non-RoHS & Green Call TI Level-1-260C-UNLIM -40 to 150 T18C LM95071CIMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 150 T18C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of