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LMH730245/NOPB

LMH730245/NOPB

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    EVALUATION BOARD

  • 数据手册
  • 价格&库存
LMH730245/NOPB 数据手册
CLC730245, CLC730136 (SOIC and SOT23) Single High-Speed Buffer Evaluation Boards • General Description The CLC730245 and the CLC730136 evaluation boards are designed to aid in the characterization of National Semiconductor’s High Speed SOIC and SOT23 buffers. Use these evaluation boards as a guide for high frequency layout and as a tool to aid in device testing and characterization. The evaluation boards schematic are shown in Figure 1 and Figure 2. Refer to the product data sheets for recommendations for component values. Basic Operation These boards are a very straight forward design and are intended to evaluate the parts behavior by offering 50Ω inputs and outputs traces for connection to coaxial cables with the same impedance. For other impedances the terminating resistors can be modified to help match different impedances. Both board and part are designed to handle very high frequencies. By changing the resistor connected to the input pin and ground the input impedance can be matched but keep in mind that the input trace is designed for 50Ω. By using e.g. 75Ω impedance, the results will be noticeable different especially for the highest frequencies. Also at the output it is possible to match different impedances but the output trace is designed for 50Ω. With the series resistor at the output the output cable can be matched, however this is not necessary. It is absolutely necessary to have the impedance at the end of the connected cable matched to the cable impedance but not the resistor at the beginning. Having the output series resistor matched to the cable impedance gives only an additional attenuation of −6dB. The SMA connectors are optimized for 50Ω operation. Even with optimal layout, board parasitics play a large part in high frequency performance and different termination resistors will change the frequency of the dominant parasitic poles/zeros. Layout Considerations Printed circuit board layout and supply bypassing play major roles in determining high frequency performance. When designing your own board use these evaluation boards as a guide and follow these steps to optimize high frequency performance: • Use a ground plane • Include large (10µF) capacitors on both supplies. • Near the device use 10nF ceramic capacitors from both supplies to ground. © 2003 National Semiconductor Corporation MS200707 Near the device use a 0.1µF ceramic capacitor between the supplies. Minimize all trace lengths • • Terminated always all transmission lines used. The Capacitor between both supplies is recommended for best 2nd Harmonic Distortion performance. The zenerdiode between both supplies protect the device from reverse polarity supply connections under the condition these supplies have the current limitation on. Most high-speed buffers perform best with capacitive loads if a small resistor is used in series between the amplifier and the capacitor. In that case change the output series resistor to a value of about 10Ω and evaluate what the output signal will do. Determine the right value by trial and error. While using rather high capacitive loads the matching at the output become less important because the frequency response will be dramatically lower, so a flat response will be more important. See the part’s datasheets for recommended values. Sample artwork for the CLC730245 and the CLC730136 Evaluation board is included on Figure 3. Measurement Hints Do not use normal oscilloscope probes to test these circuits. The capacitive loading will change circuit performance drastically. Instead use high frequency low ohmic passive probes. These probes have a load resistance in the range of several hundred ohms until some kΩ. For best performance use ground leads as short as possible otherwise ringing on pulse shaped signals will occur. The use of active probes gives also good results if basic rules are obtained, such as the short ground leads. Another good idea to isolate the load from the device is to change the output series resistor to a value of 450Ω. While measuring with a coaxial cable in a 50Ω system an attenuation of 10x (20dB) will occur and this acts as a resistive probe of 10:1. Even the best probes will interfere with circuit operation to some degree. Also, tools, power cables, fingers etc. near the device will change measurement results. If the circuit has a good layout and therefore exhibits a stable behavior the measurement results will only slightly changed by e.g. a fingertip on the circuit. If measurement results will change dramatically it is likely the circuit exhibits oscillations or other unwanted behavior. www.national.com CLC730245, CLC730136 (SOIC and SOT23), Single High-Speed Buffer Evaluation Boards April 2003 CLC730245, CLC730136 Board Schematics 20070707 FIGURE 1. Test Board Schematic SOIC (CLC730245) www.national.com 2 CLC730245, CLC730136 Board Schematics (Continued) 20070708 FIGURE 2. Test Board Schematic SOT23 (CLC730136) 3 www.national.com CLC730245, CLC730136 Board Layout SOIC Package (CLC730245) SOT23 Package (CLC730136) 20070702 20070701 Top Silk Top Silk 20070704 20070703 Top Copper Top Copper 20070706 20070705 Bottom Copper Bottom Copper FIGURE 3. Test Board Lay-Outs www.national.com 4 LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. CLC730245, CLC730136 (SOIC and SOT23), Single High-Speed Buffer Evaluation Boards Notes IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated
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