LMV301
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LMV301 Low Input Bias Current, 1.8V Op Amp w/ Rail-to-Rail Output
Check for Samples: LMV301
FEATURES
DESCRIPTION
•
•
•
•
•
The LMV301 CMOS operational amplifier is ideal for
single supply, low voltage operation with an ensured
operating voltage range from 1.8V to 5V. The low
input bias current of less than 0.182pA typical,
eliminates input voltage errors that may originate from
small input signals. This makes the LMV301 ideal for
electrometer applications requiring low input leakage
such as sensitive photodetection transimpedance
amplifiers and sensor amplifiers. The LMV301 also
features a rail-to-rail output voltage swing in addition
to a input common-mode range that includes ground.
The LMV301 will drive a 600Ω resistive load and up
to 1000pF capacitive load in unity gain follower
applications. The low supply voltage also makes the
LMV301 well suited for portable two-cell battery
systems and single cell Li-Ion systems.
1
2
•
•
•
Input Bias Current: 0.182 pA
Gain Bandwidth Product: 1 MHz
Supply Voltage at 1.8V: 1.8 to 5 V
Supply Current: 150 µA
Input Referred Voltage Noise at 1kHz:
40nV/√Hz
DC Gain (600Ω Load): 100 dB
Output Voltage Range at 1.8V: 0.024 to 1.77 V
Input Common-Mode Voltage Range: −0.3 to
±1.2 V
APPLICATIONS
•
•
•
•
•
Thermocouple Amplifiers
Photo Current Amplifiers
Transducer Amplifiers
Sample and Hold Circuits
Low Frequency Active Filters
Connection Diagram
The LMV301 exhibits excellent speed-power ratio,
achieving 1MHz at unity gain with low supply current.
The high DC gain of 100dB makes it ideal for other
low frequency applications.
The LMV301 is offered in a space saving SC70
package, which is only 2.0X2.1X1.0mm. It is also
similar to the LMV321 except the LMV301 has a
CMOS input.
Applications Circuit
Top View
Figure 2. Low Leakage Sample and Hold
Figure 1. SC70-5 Package
See Package Number DCK0005A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2013, Texas Instruments Incorporated
LMV301
SNOS968A – MAY 2004 – REVISED MAY 2013
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Absolute Maximum Ratings (1) (2)
Machine Model
ESD Tolerance (3)
200V
Human Body Model
2000V
Differential Input Voltage
±Supply Voltage
Supply Voltage (V+ - V−)
5.5V
+ (4)
Output Short Circuit to V
Output Short Circuit to V− (4)
−65°C to 150°C
Storage Temperature Range
Mounting Temperature
Infrared or Convection (20 sec)
235°C
Junction Temperature (5)
(1)
(2)
(3)
(4)
(5)
150°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
Human body model, 1.5kΩ in series with 100pF. Machine model, 200Ω in series with 100pF.
Applies to both single supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150°C. Output currents in excess of 45mA over long term may adversely affect reliability.
The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) – TA)θJA. All numbers apply for packages soldered directly into a PC board.
Operating Ratings
(1)
Supply Voltage
1.8V to 5.0V
−40°C ≤ TJ ≤ +85°C
Temperature Range
Thermal Resistance (θJA)
(1)
2
Ultra Tiny SC70-5 Package
5-pin Surface Mount
478°C/W
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
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1.8V DC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 1.8V, V− = 0V, VCM = V+/2, VO = V+/2, and RL > 1MΩ.
Boldface limits apply at the temperature extremes.
Parameter
Min (1)
Test Conditions
+
−
VCM = 0.4V, V = 1.3V, = V = −0.5V
Typ (2)
Max (1)
Units
0.9
8
9
mV
0.182
35
50
pA
150
250
275
µA
VOS
Input Offset Voltage
IB
Input Bias Current
IS
Supply Current
VCM = 0.4V, V+ = 1.3V, = V− = −0.5V
CMRR
Common Mode Rejection Ratio
0.3V ≤ VCM ≤ 0.9V
62
60
108
dB
PSRR
Power Supply Rejection Ratio
1.8V ≤ V+ ≤ 5V,
0.9 ≤ VCM ≤ 2.5V
67
62
110
dB
VCM
Input Common-Mode Voltage
Range
For CMRR ≥ 50dB
AV
Large Signal Voltage Gain
Sourcing
RL = 600Ω to 0V, V+ = 1.2V, V− = −0.6V,
VO = −0.2V to 0.8V, VCM = 0V
80
75
119
RL = 2kΩ to 0V, V+ = 1.2V, V− = −0.6V, VO
= −0.2V to 0.8V, VCM = 0V
80
75
111
RL = 600Ω to 0V, V+ = 1.2V, V− = −0.6V,
VO = −0.2V to 0.8V, VCM = 0V
80
75
94
RL = 2kΩ to 0V, V+ = 1.2V, V− = −0.6V, VO
= −0.2V to 0.8V, VCM = 0V
80
75
96
1.65
1.63
1.72
Sinking
VO
Output Swing
RL = 600Ω to 0.9V
VIN = ±100mV
−0.3
0
VOH
VOL
RL = 2kΩ to 0.9V
VIN = ±100mV
VOH
0.074
1.75
1.74
VOL
IO
Output Short Circuit Current
Sourcing,
VO = 0V, VIN = 100mV
Sinking,
VO = 1.8V, VIN = −100mV
(1)
(2)
0.6
V
dB
dB
V
0.100
V
1.77
0.024
V
0.035
0.040
V
4
3.3
8.4
mA
7
9.8
mA
All limits are ensured by testing or statistical analysis.
Typical value represent the most likely parametric norm.
1.8V AC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 1.8V, V− = 0V, VCM = V+/2, VO = V+/2, and RL > 1MΩ.
Boldface limits apply at the temperature extremes.
Parameter
Test Conditions
Typ (1)
Units
SR
Slew Rate
0.57
V/µs
GBW
Gain Bandwidth Product
1
MHz
φm
Phase Margin
60
Deg
Gm
Gain Margin
en
Input-Referred Voltage Noise
f = 1kHz, VCM = 0.5V
f = 100kHz
THD
Total Harmonic Distortion
f = 1kHz, AV = +1
RL = 600kΩ, VIN = 1VPP
(1)
(2)
See
(2)
10
dB
40
30
nV/√Hz
0.089
%
Typical value represent the most likely parametric norm.
V+ = 5V. Connected as voltage follower with 5V step input. Number specified is the slower of the positive and negative slew rates.
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2.7V DC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 2.7V, V− = 0V, VCM = V+/2, VO = V+/2, and RL > 1MΩ.
Boldface limits apply at the temperature extremes.
Parameter
Min (1)
Test Conditions
−
+
VCM = 0.35V, V = 1.7V, V = −1V
Typ (2)
Max (1)
Units
0.9
8
9
mV
0.182
35
50
pA
153
250
275
µA
VOS
Input Offset Voltage
IB
Input Bias Current
IS
Supply Current
VCM = 0.35V, V+ = 1.7V, V− = −1V
CMRR
Common Mode Rejection Ratio
−0.15V ≤ VCM ≤ 1.35V
62
60
115
dB
PSRR
Power Supply Rejection Ratio
1.8V ≤ V+ ≤ 5V
67
62
110
dB
VCM
Input Common-Mode Voltage
Range
For CMRR ≥ 50dB
AV
Large Signal Voltage Gain
Sourcing
RL = 600Ω to 0V, V+ = 1.35V, V− =
−1.35V, VO = −1V to 1V, VCM = 0V
80
75
100
RL = 2kΩ to 0V, V+ = 1.35V, V− = −1.35V,
VO = −1V to 1V, VCM = 0V
83
77
114
RL = 600Ω to 0V, V+ = 1.35V, V− =
−1.35V, VO = −1V to 1V, VCM = 0V
80
75
98
RL = 2kΩ to 0V, V+ = 1.35V, V− = −1.35V,
VO = −1V to 1V, VCM = 0V
80
75
99
2.550
2.530
2.62
Sinking
VO
Output Swing
−0.3
0
RL = 600Ω to 1.35V
VIN = ±100mV
VOH
VOL
RL = 2kΩ to 1.35V
VIN = ±100mV
VOH
0.078
2.650
2.640
VOL
IO
(1)
(2)
Output Short Circuit Current
1.5
V
dB
dB
V
0.100
V
2.675
0.024
V
0.045
V
Sourcing,
VO = 0V, VIN = 100mV
20
15
32
mA
Sinking,
VO = 2.7V, VIN = −100mV
19
12
24
mA
All limits are ensured by testing or statistical analysis.
Typical value represent the most likely parametric norm.
2.7V AC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 2.7V, V− = 0V, VCM = 1.0V, VO = 1.35V and RL > 1MΩ.
Boldface limits apply at the temperature extremes.
Parameter
Test Conditions
See (2)
Typ (1)
Units
0.60
V/µs
SR
Slew Rate
GBW
Gain Bandwidth Product
1
MHz
φm
Phase Margin
65
Deg
Gm
Gain Margin
10
dB
en
Input-Referred Voltage Noise
f = 1kHz, VCM = 0.5V
f = 100kHz
40
30
nV/√Hz
THD
Total Harmonic Distortion
f = 1kHz, AV = +1
RL = 600kΩ, VIN = 1VPP
0.077
%
(1)
(2)
4
Typical value represent the most likely parametric norm.
V+ = 5V. Connected as voltage follower with 5V step input. Number specified is the slower of the positive and negative slew rates.
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5V DC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 5V, V− = 0V, VCM = V+/2, VO = V+/2, and RL > 1MΩ.
Boldface limits apply at the temperature extremes.
Parameter
Min (1)
Test Conditions
+
−
VCM = 0.5V, V = 3V, V = −2V
Typ (2)
Max (1)
Units
0.9
8
9
mV
0.182
35
50
pA
163
260
285
µA
VOS
Input Offset Voltage
IB
Input Bias Current
IS
Supply Current
VCM = 0.5V, V+ = 3V, V− = −2V
CMRR
Common Mode Rejection Ratio
−1.3V ≤ VCM ≤ 2.5V
62
61
111
dB
PSRR
Power Supply Rejection Ratio
1.8V ≤ V+ ≤ 5V
67
62
110
dB
VCM
Input Common-Mode Voltage
Range
For CMRR ≥ 50dB
AV
Large Signal Voltage Gain
Sourcing
RL = 600Ω to 0V, V+ = 2.5V, V− = −2.5V,
VO = −2V to 2V, VCM = 0V
86
82
117
RL = 2kΩ to 0V, V+ = 2.5V, V− = −2.5V,
VO = −2V to 2V, VCM = 0V
89
85
116
RL = 600Ω to 0V, V+ = 2.5V, V− = −2.5V,
VO = −2V to 2V, VCM = 0V
80
75
105
RL = 2kΩ to 0V, V+ = 2.5V, V− = −2.5V,
VO = −2V to 2V, VCM = 0V
80
75
107
4.850
4.840
4.893
Sinking
VO
Output Swing
RL = 600Ω to 2.5V
VIN = ±100mV
−0.3
0
VOH
VOL
RL = 2kΩ to 2.5V
VIN = ±100mV
IO
(1)
(2)
Output Short Circuit Current
VOH
3.8
0.1
4.935
VOL
V
dB
dB
V
0.150
1.160
V
4.966
0.034
V
0.065
0.075
V
Sourcing,
VO = 0V, VIN = 100mV
85
68
108
mA
Sinking,
VO = 5V, VIN = −100mV
60
45
69
mA
All limits are ensured by testing or statistical analysis.
Typical value represent the most likely parametric norm.
5V AC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 5V, V− = 0V, VCM = V+/2, VO = 2.5V and RL > 1MΩ.
Boldface limits apply at the temperature extremes.
Parameter
Test Conditions
Typ (1)
Units
SR
Slew Rate
0.66
V/µs
GBW
Gain Bandwidth Product
1
MHz
φm
Phase Margin
70
Deg
Gm
Gain Margin
en
Input-Referred Voltage Noise
f = 1kHz, VCM = 1V
f = 100kHz
THD
Total Harmonic Distortion
f = 1kHz, AV = +1
RL = 600Ω, VO = 1VPP
(1)
(2)
See
(2)
15
dB
40
30
nV/√Hz
0.069
%
Typical value represent the most likely parametric norm.
V+ = 5V. Connected as voltage follower with 5V step input. Number specified is the slower of the positive and negative slew rates.
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Simplified Schematic
6
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Typical Performance Characteristics
Unless otherwise specified, TA = 25°C.
Supply Current vs. Supply Voltage
Output Negative Swing vs. Supply Voltage
Figure 3.
Figure 4.
Output Negative Swing vs. Supply Voltage
Output Positive Swing vs. Supply Voltage
Figure 5.
Figure 6.
Output Positive Swing vs. Supply Voltage
VOS vs. VCM
Figure 7.
Figure 8.
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Typical Performance Characteristics (continued)
Unless otherwise specified, TA = 25°C.
8
VOS vs. VCM
VOS vs. VCM
Figure 9.
Figure 10.
Sourcing Current vs. Output Voltage
Sinking Current vs. Output Voltage
Figure 11.
Figure 12.
Sourcing Current vs. Output Voltage
Sinking Current vs. Output Voltage
Figure 13.
Figure 14.
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Typical Performance Characteristics (continued)
Unless otherwise specified, TA = 25°C.
Sourcing Current vs. Output Voltage
Sinking Current vs. Output Voltage
Figure 15.
Figure 16.
IBIAS Current vs. VCM
Open Loop Frequency Response
Figure 17.
Figure 18.
Open Loop Frequency Response
Open Loop Frequency Response
Figure 19.
Figure 20.
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Typical Performance Characteristics (continued)
Unless otherwise specified, TA = 25°C.
10
Open Loop Frequency Response
Open Loop Frequency Response
Figure 21.
Figure 22.
Open Loop Frequency Response
Noise vs. Frequency Response
Figure 23.
Figure 24.
Noise vs. Frequency Response
Noise vs. Frequency Response
Figure 25.
Figure 26.
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Typical Performance Characteristics (continued)
Unless otherwise specified, TA = 25°C.
Small Signal Response
Large Signal Response
Figure 27.
Figure 28.
Small Signal Response
Large Signal Response
Figure 29.
Figure 30.
Small Signal Response
Large Signal Response
Figure 31.
Figure 32.
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Typical Performance Characteristics (continued)
Unless otherwise specified, TA = 25°C.
12
Small Signal Response
Large Signal Response
Figure 33.
Figure 34.
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APPLICATION HINTS
Compensating Input Capacitance
The high input resistance of the LMV301 op amp allows the use of large feedback and source resistor values
without losing gain accuracy due to loading. However, the circuit will be especially sensitive to its layout when
these large value resistors are used.
Every amplifier has some capacitance between each input and AC ground, and also some differential
capacitance between the inputs. When the feedback network around an amplifier is resistive, this input
capacitance (along with any additional capacitance due to circuit board traces, the socket, etc.) and the feedback
resistors create a pole in the feedback path. In the following General Operational Amplifier circuit, Figure 35, the
frequency of this pole is
where
•
•
CS is the total capacitance at the inverting input, including amplifier input capacitance and any stray
capacitance from the IC socket (if one is used), circuit board traces, etc.,
RP is the parallel combination of RF and RIN
(1)
This formula, as well as all formulae derived below, apply to inverting and non-inverting op amp configurations.
When the feedback resistors are smaller than a few kΩ, the frequency of the feedback pole will be quite high,
since CS is generally less than 10pF. If the frequency of the feedback pole is much higher than the “ideal” closedloop bandwidth (the nominal closed-loop bandwidth in the absence of CS), the pole will have a negligible effect
on stability, as it will add only a small amount of phase shift.
However, if the feedback pole is less than approximately 6 to 10 times the “ideal” −3dB frequency, a feedback
capacitor, CF, should be connected between the output and the inverting input of the op amp. This condition can
also be stated in terms of the amplifier's low frequency noise gain. To maintain stability a feedback capacitor will
probably be needed if
(2)
Where
(3)
is the amplifier's low frequency noise gain and GBW is the amplifier's gain bandwidth product.
An amplifier's low frequency noise gain is represented by the formula
(4)
regardless of whether the amplifier is being used in inverting or non-inverting mode. Note that a feedback
capacitor is more likely to be needed when the noise gain is low and/or the feedback resistor is large.
If the above condition is met (indicating a feedback capacitor will probably be needed), and the noise gain is
large enough that:
(5)
the following value of feedback capacitor is recommended:
(6)
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If
(7)
the feedback capacitor should be:
(8)
Note that these capacitor values are usually significantly smaller than those given by the older, more
conservative formula:
(9)
CS consists of the amplifier's input capacitance plus any stray capacitance from the circuit board and socket. CF
compensates for the pole caused by CS and the feedback resistors.
Figure 35. General Operational Amplifier Circuit
Using the smaller capacitor will give much higher bandwidth with little degradation of transient response. It may
be necessary in any of the above cases to use a somewhat larger feedback capacitor to allow for unexpected
stray capacitance, or to tolerate additional phase shifts in the loop, or excessive capacitive load, or to decrease
the noise or bandwidth, or simply because the particular circuit implementation needs more feedback
capacitance to be sufficiently stable. For example, a printed circuit board's stray capacitance may be larger or
smaller than the breadboard's, so the actual optimum value for CF may be different from the one estimated using
the breadboard. In most cases, the values of CF should be checked on the actual circuit, starting with the
computed value.
Capacitive Load Tolerance
Like many other op amps, the LMV301 may oscillate when its applied load appears capacitive. The threshold of
oscillation varies both with load and circuit gain. The configuration most sensitive to oscillation is a unity gain
follower. The load capacitance interacts with the op amp’s output resistance to create an additional pole. If this
pole frequency is sufficiently low, it will degrade the op amp's phase margin so that the amplifier is no longer
stable. As shown in Figure 36, the addition of a small resistor (50Ω to 100Ω) in series with the op amp's output,
and a capacitor (5pF to 10pF) from inverting input to output pins, returns the phase margin to a safe value
without interfering with lower frequency circuit operation. Thus, larger values of capacitance can be tolerated
without oscillation. Note that in all cases, the output will ring heavily when the load capacitance is near the
threshold for oscillation.
14
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Figure 36. Rx, Cx Improve Capacitive Load Tolerance
Capacitive load driving capability is enhanced by using a pull up resistor to V+ (Figure 37). Typically a pull up
resistor conducting 500µA or more will significantly improve capacitive load responses. The value of the pull up
resistor must be determined based on the current sinking capability of the amplifier with respect to the desired
output swing. Open loop gain of the amplifier can also be affected by the pull up resistor.
Figure 37. Compensating for Large Capacitive Loads with a Pull Up Resistor
PRINTED-CIRCUIT-BOARD LAYOUT FOR HIGH-IMPEDANCE WORK
It is generally recognized that any circuit which must operate with less than 100pA of leakage current requires
special layout of the PC board. When one wishes to take advantage of the low bias current of the LMV301,
typically less than 0.182pA, it is essential to have an excellent layout. Fortunately, the techniques for obtaining
low leakages are quite simple. First, the user must not ignore the surface leakage of the PC board, even though
it may sometimes appear acceptable low, because under conditions of the high humidity or dust or
contamination, the surface leakage will be appreciable. To minimized the effect of any surface leakage, lay out a
ring of foil completely surrounding the LMV301's inputs and the terminals of capacitors, diodes, conductors,
resistors, relay terminals, etc. connected to the op amp's inputs. See Figure 38. To have a significant effect,
guard rings should be placed on both the top and bottom of the PC board. The PC foil must then be connected
to a voltage which is at the same voltage as the amplifier inputs, since no leakage current can flow between two
points at the same potential. For example, a PC board trace-to-pad resistance of 1012Ω, which is normally
considered a very large resistance, could leak 5pA if the trace were a 5V bus adjacent to the pad of an input.
This would cause a 100 times degradation from the LMV301's actual performance. However, if a guard ring is
held within 5mV of the inputs, then even a resistance of 1011Ω would cause only 0.05pA of leakage current, or
perhaps a minor (2:1) degradation of the amplifier performance. See Figure 39, Figure 40, and Figure 41 for
typical connections of guard rings for standard op amp configurations. If both inputs are active and at high
impedance, the guard can be tied to ground and still provide some protection; see Figure 42.
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Figure 38. Example, using the LMV301,
of Guard Ring in P.C. Board Layout
Guard Ring Connections
Figure 39. Inverting Amplifier
Figure 40. Non-Inverting Amplifier
Figure 41. Follower
16
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Figure 42. Howland Current Pump
The designer should be aware that when it is inappropriate to lay out a PC board for the sake of just a few
circuits, there is another technique which is even better than a guard ring on a PC board: Don't insert the
amplifier's input pin into the board at all, but bend it up in the air and use only air as an insulator. Air is an
excellent insulator. In this case you may have to forego some of the advantages of PC board construction, but
the advantages are sometimes well worth the effort of using point-to-point up-in-the-air wiring. See Figure 43.
(Input pins are lifted out of PC board and soldered directly to components. All other pins connected to PC board.)
Figure 43. Air Wiring
Typical Single-Supply Applications
(V+ = 5.0 VDC)
Figure 44. Low-Leakage Sample-and-Hold
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Product Folder Links: LMV301
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LMV301
SNOS968A – MAY 2004 – REVISED MAY 2013
www.ti.com
Figure 45. Sine-Wave Oscillator
Oscillator frequency is determined by R1, R2, C1, and C2:
fosc = 1/2πRC
where
•
•
R = R1 = R2
C = C1 = C2
(10)
This circuit, as shown, oscillates at 2.0kHz with a peak-to-peak output swing of 4.5V.
Figure 46. 1 Hz Square-Wave Oscillator
Figure 47. Power Amplifier
18
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LMV301
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SNOS968A – MAY 2004 – REVISED MAY 2013
fO = 10 Hz
Q = 2.1
Gain = −8.8
Figure 48. 10Hz Bandpass Filter
fc = 10 Hz
d = 0.895
Gain = 1
2 dB passband ripple
Figure 49. 10 Hz High-Pass Filter
fc = 1 Hz
d = 1.414
Gain = 1.57
Figure 50. 1 Hz Low-Pass Filter
(Maximally Flat, Dual Supply Only)
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Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMV301
19
LMV301
SNOS968A – MAY 2004 – REVISED MAY 2013
www.ti.com
REVISION HISTORY
Changes from Original (May 2013) to Revision A
•
20
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 19
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Product Folder Links: LMV301
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LMV301MG/NOPB
ACTIVE
SC70
DCK
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
A48
LMV301MGX/NOPB
ACTIVE
SC70
DCK
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
A48
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of