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LMV931-N
LMV932-N, LMV934-N
SNOS993P – NOVEMBER 2001 – REVISED APRIL 2017
LMV93x-N Single, Dual, Quad 1.8-V, RRIO Operational Amplifiers
1 Features
3 Description
•
The LMV93x-N family (LMV931-N single, LMV932-N
dual and LMV934-N quad) are low-voltage, lowpower operational amplifiers. The LMV93x-N family
operates from 1.8-V to 5.5-V supply voltages and
have rail-to-rail input and output. The input commonmode voltage extends 200 mV beyond the supplies
which enables user enhanced functionality beyond
the supply voltage range. The output can swing railto-rail unloaded and within 105 mV from the rail with
600-Ω load at 1.8-V supply. The LMV93x-N devices
are optimized to work at 1.8 V, which make them
ideal for portable two-cell, battery-powered systems
and single-cell Li-Ion systems.
1
•
•
•
•
•
•
•
•
•
Typical 1.8-V Supply Values; Unless Otherwise
Noted
Specified at 1.8 V, 2.7 V and 5 V
Output Swing
– With 600-Ω Load 80 mV from Rail
– With 2-kΩ Load 30 mV from Rail
VCM 200 mV Beyond Rails
Supply Current (per Channel) 100 μA
Gain Bandwidth Product 1.4 MHz
Maximum VOS 4 mV
Ultra Tiny Packages
Temperature Range −40°C to +125°C
Create a Custom Design Using the LMV93x-N
With the WEBENCH® Power Designer
2 Applications
•
•
•
•
•
•
Phones
Tablets
Wearables
Health Monitoring
Portable and Battery-Powered Electronic
Equipment
Battery Monitoring
High-Side Current Sense Amplifier
LMV93x-N devices exhibit an excellent speed-power
ratio, achieving 1.4-MHz gain bandwidth product at
1.8-V supply voltage with very low supply current.
The LMV93x-N devices can drive a 600-Ω load and
up to 1000-pF capacitive load with minimal ringing.
These devices also have a high DC gain of 101 dB,
making them suitable for low-frequency applications.
The single LMV93x-N is offered in space-saving 5-pin
SC70 and SOT-23 packages. The dual LMV932-N
are in 8-pin VSSOP and SOIC packages and the
quad LMV934-N are in 14-pin TSSOP and SOIC
packages. These small packages are ideal solutions
for area constrained PC boards and portable
electronics such as mobile phones and tablets.
Device Information(1)
PART NUMBER
LMV931-N
LMV932-N
LMV934-N
PACKAGE
BODY SIZE (NOM)
SOT-23 (5)
2.90 mm × 1.60 mm
SC-70 (5)
2.00 mm × 1.25 mm
VSSOP (8)
3.00 mm × 3.00 mm
SOIC (8)
4.90 mm × 3.91 mm
TSSOP (8)
5.00 mm × 4.40 mm
SOIC (14)
8.60 mm × 3.90 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMV931-N
LMV932-N, LMV934-N
SNOS993P – NOVEMBER 2001 – REVISED APRIL 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
7
1
1
1
2
3
4
Absolute Maximum Ratings ...................................... 4
ESD Ratings (Commercial) ...................................... 4
Recommended Operating Ratings............................ 4
Thermal Information .................................................. 4
DC Electrical Characteristics 1.8 V .......................... 5
AC Electrical Characteristics 1.8 V ........................... 6
DC Electrical Characteristics 2.7 V .......................... 6
AC Electrical Characteristics 2.7 V ........................... 7
Electrical Characteristics 5 V DC .............................. 9
AC Electrical Characteristics 5 V ......................... 10
Typical Characteristics .......................................... 11
Detailed Description ............................................ 16
7.1 Overview ................................................................. 16
7.2 Functional Block Diagram ....................................... 16
7.3 Feature Description................................................. 16
7.4 Device Functional Modes........................................ 16
8
Application and Implementation ........................ 19
8.1 Application Information............................................ 19
8.2 Typical Applications ............................................... 19
8.3 Dos and Don'ts ....................................................... 23
9 Power Supply Recommendations...................... 23
10 Layout................................................................... 24
10.1 Layout Guidelines ................................................. 24
10.2 Layout Example .................................................... 24
11 Device and Documentation Support ................. 25
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
Device Support ....................................................
Documentation Support .......................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
25
25
25
25
26
26
26
26
12 Mechanical, Packaging, and Orderable
Information ........................................................... 26
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision O (December 2014) to Revision P
Page
•
Deleted information specific to automotive grade - created separate automotive data sheet SNOSD49 ............................ 1
•
Added links for WEBENCH ................................................................................................................................................... 1
•
Moved storage temperature to Abs Max table and changed Handling Ratings tables to ESD Ratings tables per new
format...................................................................................................................................................................................... 4
•
Changed values in the Thermal Information table to align with JEDEC standards................................................................ 4
•
Changed Slew Rate vs Supply Voltage title to reflect LMV931 and LMV934 only .............................................................. 14
•
Added Slew Rate vs Supply graph for LMV932 only ........................................................................................................... 14
•
Added Receiving Notification of Documentation Updates and Community Resources subsections ................................... 25
Changes from Revision N (June 2014) to Revision O
•
Page
Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation, Power Supply Recommendations, Layout , Device and
Documentation Support , and Mechanical, Packaging, and Orderable Information sections ............................................... 1
Changes from Revision M (November 2013) to Revision N
Page
•
Complete rewrite for GDS standard. ...................................................................................................................................... 1
•
Added LMV934-N-Q1. The other Q grades were added in previous revision........................................................................ 1
Changes from Revision L (March 2013) to Revision M
•
2
Page
Added Automotive Q Grade. ................................................................................................................................................. 1
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Copyright © 2001–2017, Texas Instruments Incorporated
Product Folder Links: LMV931-N LMV932-N LMV934-N
LMV931-N
LMV932-N, LMV934-N
www.ti.com
SNOS993P – NOVEMBER 2001 – REVISED APRIL 2017
5 Pin Configuration and Functions
DBV and DCK Package
5-Pin SC-70 and SOT-23
LMV931-N Top View
DGK and D Package
8-Pin VSSOP and SOIC
LMV932-N Top View
1
8
+
V
OUT A
A
-
2
+
7
-IN A
OUT B
3
6
+IN A
V
-
-IN B
B
+
-
4
5
+IN B
DGK and D Package
14-Pin TSSOP and SOIC
LMV934-N Top View
Pin Functions: LMV931
PIN
I/O
DESCRIPTION
NAME
LMV931 DBV, DCK
+IN
1
I
Noninverting Input
-IN
3
I
Inverting Input
OUT
4
O
Output
V-
2
P
Negative Supply
V+
5
P
Positive Supply
Pin Functions: LMV932 and LMV934
PIN
I/O
DESCRIPTION
NAME
LMV932 D, DGK
LMV934 D, PW
+IN A
3
3
I
Noninverting input, channel A
+IN B
5
5
I
Noninverting input, channel B
+IN C
—
10
I
Noninverting input, channel C
+IN D
—
12
I
Noninverting input, channel D
–IN A
2
2
I
Inverting input, channel A
–IN B
6
6
I
Inverting input, channel B
–IN C
—
9
I
Inverting input, channel C
–IN D
—
13
I
Inverting input, channel D
OUT A
1
1
O
Output, channel A
OUT B
7
7
O
Output, channel B
OUT C
—
8
O
Output, channel C
OUT D
—
14
O
Output, channel D
V+
8
4
P
Positive (highest) power supply
V–
4
11
P
Negative (lowest) power supply
Copyright © 2001–2017, Texas Instruments Incorporated
Product Folder Links: LMV931-N LMV932-N LMV934-N
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LMV932-N, LMV934-N
SNOS993P – NOVEMBER 2001 – REVISED APRIL 2017
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6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
See
.
Supply voltage ( V+– V− )
MIN
MAX
UNIT
–0.3
6
V
–
Differential input voltage
+
V
V
(V– ) - 0.3
(V+) + 0.3
V
Junction temperature (3)
–40
150
°C
Storage temperature, Tstg
–65
150
°C
Voltage at input/output pins
(1)
(2)
(3)
V
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate
conditions for which the device is intended to be functional, but specific performance is not specified. For specifications and the test
conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.
The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PC board.
6.2 ESD Ratings (Commercial)
VALUE
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±750
Machine model (MM)
(1)
(2)
(3)
(3)
UNIT
V
±200
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Machine model, 200 Ω in series with 100 pF.
6.3 Recommended Operating Ratings
See (1).
MIN
MAX
Supply voltage range ( V+– V− )
1.8
5.5
V
Ambient temperature
−40
125
°C
(1)
UNIT
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate
conditions for which the device is intended to be functional, but specific performance is not specified. For specifications and the test
conditions, see the Electrical Characteristics.
6.4 Thermal Information
LMV931-N
THERMAL METRIC
(1)
LMV932-N
LMV934-N
DBV
(SOT-23)
DCK
(SC70)
D
(SOIC)
DGK
(VSSOP)
D
(SOIC)
PW
(TSSOP)
UNIT
5 PINS
5 PINS
8 PINS
8 PINS
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal
resistance
197.2
285.9
125.9
184.5
94.4
124.8
°C/W
RθJC(top)
Junction-to-case (top) thermal
resistance
156.7
115.9
70.2
74.3
52.5
51.4
°C/W
RθJB
Junction-to-board thermal
resistance
55.6
63.7
66.5
105.1
48.9
67.2
°C/W
ψJT
Junction-to-top
characterization parameter
41.4
4.5
19.8
13.1
14.3
6.6
°C/W
ψJB
Junction-to-board
characterization parameter
55
62.9
65.9
103.6
48.6
66.6
°C/W
RθJC(bot)
Junction-to-case (bottom)
thermal resistance
—
—
—
—
—
—
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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Copyright © 2001–2017, Texas Instruments Incorporated
Product Folder Links: LMV931-N LMV932-N LMV934-N
LMV931-N
LMV932-N, LMV934-N
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SNOS993P – NOVEMBER 2001 – REVISED APRIL 2017
6.5 DC Electrical Characteristics 1.8 V
Unless otherwise specified, all limits specified for TJ = 25°C. V+ = 1.8 V, V − = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 MΩ.
PARAMETER
TEST CONDITIONS
LMV931 (Single)
VOS
MIN
25°C
TYP
(1)
MAX
1
4
Full Range
Input Offset Voltage
LMV932 (Dual),
LMV934 (Quad)
25°C
1
5.5
Full Range
Full Range
5.5
IB
Input Bias Current
25°C
15
μV/°C
35
Full Range
50
25°C
13
25
Full Range
IS
Supply Current (per channel)
40
25°C
103
185
Full Range
CMRR
PSRR
CMVR
Common-Mode Rejection Ratio
Power Supply Rejection Ratio
Input Common-Mode Voltage
Range
25°C
60
Full Range
55
LMV932 and LMV934
0 ≤ VCM ≤ 0.6 V
1.4 V ≤ VCM ≤ 1.8 V (2)
25°C
55
Full Range
50
−0.2 V ≤ VCM ≤ 0 V
1.8 V ≤ VCM ≤ 2.0 V
25°C
50
72
+
25°C
75
100
Full Range
70
For CMRR Range ≥ 50dB
25°C
AV
Large Signal Voltage Gain
LMV932-N (Dual)
LMV934-N (Quad)
VO
Output Swing
V− − 0.2
−
−40°C to 85°C
125°C
Large Signal Voltage Gain
LMV931-N (Single)
205
LMV931, 0 ≤ VCM ≤ 0.6 V
1.4 V ≤ VCM ≤ 1.8 V (2)
1.8 V ≤ V ≤ 5 V
V
V + 0.2
25°C
77
Full Range
73
RL = 2 kΩ to 0.9 V,
VO = 0.2 V to 1.6 V,
VCM = 0.5 V
25°C
80
Full Range
75
RL = 600 Ω to 0.9 V,
VO = 0.2 V to 1.6 V,
VCM = 0.5 V
25°C
75
Full Range
72
RL = 2 kΩ to 0.9 V,
VO = 0.2 V to 1.6 V,
VCM = 0.5 V
25°C
78
Full Range
75
RL = 600 Ω to 0.9 V
VIN = ±100 mV
25°C
(2)
1.65
78
Full Range
1.63
25°C
1.75
nA
μA
dB
dB
−0.2
to
2.1
dB
dB
V+ + 0.2
V+
V
+
V − 0.2
101
dB
105
dB
90
dB
100
dB
1.72
0.105
V
0.120
1.77
0.024
1.74
nA
76
0.077
Full Range
(1)
−
RL = 600 Ω to 0.9 V,
VO = 0.2 V to 1.6 V,
VCM = 0.5 V
RL = 2 kΩ to 0.9 V
VIN = ±100 mV
mV
7.5
Input Offset Voltage
Average Drift
Input Offset Current
mV
6
TCVOS
IOS
UNIT
0.035
V
0.04
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration.
For specified temperature ranges, see the CMVR parameter in DC Electrical Characteristics 1.8 V for the input common-mode voltage
specifications.
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Product Folder Links: LMV931-N LMV932-N LMV934-N
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LMV932-N, LMV934-N
SNOS993P – NOVEMBER 2001 – REVISED APRIL 2017
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DC Electrical Characteristics 1.8 V (continued)
Unless otherwise specified, all limits specified for TJ = 25°C. V+ = 1.8 V, V − = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 MΩ.
PARAMETER
IO
(3)
Output Short Circuit Current
TEST CONDITIONS
MIN
Sourcing, VO = 0 V
VIN = 100 mV
25°C
Sinking, VO = 1.8 V
VIN = −100 mV
25°C
7
Full Range
5
(3)
TYP
4
Full Range
(1)
MAX
8
UNIT
mA
3.3
9
mA
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 45 mA over long term may adversely
affect reliability.
6.6 AC Electrical Characteristics 1.8 V
Unless otherwise specified, all limits specified for TJ = 25°C. V+ = 1.8 V, V − = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 MΩ.
PARAMETER
SR
Slew Rate
GBW
TEST CONDITIONS
(1)
MAX
UNIT
V/μs
Gain-Bandwidth Product
1.4
MHz
Φm
Phase Margin
67
deg
Gm
Gain Margin
en
Input-Referred Voltage Noise
f = 10 kHz, VCM = 0.5 V
in
Input-Referred Current Noise
f = 10 kHz
Total Harmonic Distortion
f = 1 kHz, AV = +1
RL = 600 Ω, VIN = 1 VPP
Amplifier-to-Amplifier Isolation
See (3)
(1)
(2)
(3)
.
TYP
0.35
THD
See
MIN
(2)
7
dB
60
nV/√Hz
0.08
pA/√Hz
0.023%
123
dB
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration.
Connected as voltage follower with input step from V− to V+. Number specified is the slower of the positive and negative slew rates.
Input referred, RL = 100 kΩ connected to V+/2. Each amplifier excited in turn with 1 kHz to produce VO = 3 VPP (For supply voltages < 3
V, VO = V+).
6.7 DC Electrical Characteristics 2.7 V
Unless otherwise specified, all limits specified for TJ = 25°C. V+ = 2.7 V, V − = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 MΩ.
PARAMETER
TEST CONDITIONS
LMV931 (Single)
VOS
Input Offset Voltage
MIN
25°C
TYP
(1)
MAX
1
4
Full Range
LMV932 (Dual)
LMV934 (Quad)
6
25°C
1
Full Range
TCVOS
Input Offset Voltage Average
Drift
Full Range
IB
Input Bias Current
25°C
7.5
5.5
15
Full Range
IOS
Input Offset Current
25°C
8
Supply Current (per channel)
105
Full Range
(1)
6
35
25
40
25°C
mV
mV
μV/°C
50
Full Range
IS
5.5
UNIT
190
210
nA
nA
μA
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration.
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SNOS993P – NOVEMBER 2001 – REVISED APRIL 2017
DC Electrical Characteristics 2.7 V (continued)
Unless otherwise specified, all limits specified for TJ = 25°C. V+ = 2.7 V, V − = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 MΩ.
PARAMETER
CMRR
TEST CONDITIONS
Common-Mode Rejection Ratio
LMV931, 0 ≤ VCM ≤ 1.5 V
2.3 V ≤ VCM ≤ 2.7 V (2)
25°C
60
Full Range
55
LMV932 and LMV934
0 ≤ VCM ≤ 1.5 V
2.3 V ≤ VCM ≤ 2.7 V (2)
25°C
55
Full Range
50
−0.2 V ≤ VCM ≤ 0 V
2.7 V ≤ VCM ≤ 2.9 V
PSRR
Power Supply Rejection Ratio
VCM
Input Common-Mode Voltage
Range
25°C
AV
Large Signal Voltage Gain
LMV932-N (Dual)
LMV934-N (Quad)
VO
Output Swing
70
For CMRR Range ≥ 50 dB
25°C
IO
(2)
(3)
Output Short Circuit Current
V− − 0.2
V−
−
25°C
87
Full Range
86
RL = 2 kΩ to 1.35 V,
VO = 0.2 V to 2.5 V
25°C
92
Full Range
91
RL = 600 Ω to 1.35 V,
VO = 0.2 V to 2.5 V
25°C
78
Full Range
75
RL = 2 kΩ to 1.35 V,
VO = 0.2 V to 2.5 V
25°C
81
Full Range
78
RL = 600 Ω to 1.35 V
VIN = ±100 mV
25°C
2.55
Full Range
2.53
25°C
2.65
Full Range
2.64
20
Full Range
15
Sinking,
VO = 2.7 V
VIN = −100 mV
25°C
18
Full Range
12
(3)
−0.2
to
3.0
dB
dB
V+ + 0.2
V+
V
+
V − 0.2
104
dB
110
dB
90
dB
100
dB
2.62
0.110
V
0.130
2.675
0.025
25°C
dB
dB
0.083
Sourcing, VO = 0 V
VIN = +100 mV
UNIT
80
V + 0.2
RL = 600 Ω to 1.35 V,
VO = 0.2 V to 2.5 V
MAX
81
100
75
Full Range
RL = 2 kΩ to 1.35 V
VIN = ±100 mV
(1)
74
25°C
−40°C to 85°C
TYP
50
1.8 V ≤ V+ ≤ 5 V
VCM = 0.5 V
125°C
Large Signal Voltage Gain
LMV931-N (Single)
MIN
0.04
V
0.045
30
mA
25
mA
For specified temperature ranges, see the CMVR parameter in DC Electrical Characteristics 1.8 V for the input common-mode voltage
specifications.
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 45 mA over long term may adversely
affect reliability.
6.8 AC Electrical Characteristics 2.7 V
Unless otherwise specified, all limits specified for TJ = 25°C. V+ = 2.7 V, V − = 0 V, VCM = 1.0 V, VO = 1.35 V and RL > 1 MΩ.
PARAMETER
SR
Slew Rate
GBW
Φm
TEST CONDITIONS
See (2)
MIN
TYP
(1)
MAX
UNIT
0.4
V/µs
Gain-Bandwidth Product
1.4
MHz
Phase Margin
70
deg
Gm
Gain Margin
7.5
dB
en
Input-Referred Voltage Noise
f = 10 kHz, VCM = 0.5 V
in
Input-Referred Current Noise
f = 10 kHz
(1)
(2)
57
nV√Hz
0.08
pA/√Hz
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration.
Connected as voltage follower with input step from V− to V+. Number specified is the slower of the positive and negative slew rates.
Copyright © 2001–2017, Texas Instruments Incorporated
Product Folder Links: LMV931-N LMV932-N LMV934-N
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LMV932-N, LMV934-N
SNOS993P – NOVEMBER 2001 – REVISED APRIL 2017
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AC Electrical Characteristics 2.7 V (continued)
Unless otherwise specified, all limits specified for TJ = 25°C. V+ = 2.7 V, V − = 0 V, VCM = 1.0 V, VO = 1.35 V and RL > 1 MΩ.
PARAMETER
THD
Total Harmonic Distortion
Amp-to-Amp Isolation
(3)
8
TEST CONDITIONS
MIN
f = 1 kHz, AV = +1
RL = 600 Ω, VIN = 1 VPP
See
TYP
(1)
MAX
UNIT
0.022%
(3)
123
dB
Input referred, RL = 100 kΩ connected to V+/2. Each amplifier excited in turn with 1 kHz to produce VO = 3 VPP (For supply voltages < 3
V, VO = V+).
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6.9 Electrical Characteristics 5 V DC
Unless otherwise specified, all limits specified for TJ = 25°C. V+ = 5 V, V − = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 MΩ.
PARAMETER
TEST CONDITIONS
LMV931 (Single)
VOS
Input Offset Voltage Average
Drift
IB
Input Bias Current
25°C
TYP
(1)
MAX
1
4
Full Range
Input Offset Voltage
TCVOS
MIN
LMV932 (Dual)
LMV934 (Quad)
25°C
1
Full Range
25°C
14
9
25°C
116
PSRR
Power Supply Rejection Ratio
CMVR
Input Common-Mode Voltage
Range
25°C
60
Full Range
55
−0.2 V ≤ VCM ≤ 0 V
5 V ≤ VCM ≤ 5.2 V
25°C
+
Large Signal Voltage Gain
LMV931-N (Single)
AV
Large Signal Voltage Gain
LMV932-N (Dual)
LMV934-N (Quad)
VO
Output Swing
1.8 V ≤ V ≤ 5 V
VCM = 0.5 V
For CMRR Range ≥ 50 dB
25°C
78
25°C
75
100
Full Range
70
V− − 0.2
−
−40°C to 85°C
V
V− + 0.3
RL = 600 Ω to 2.5 V,
VO = 0.2 V to 4.8 V
25°C
88
Full Range
87
RL = 2 kΩ to 2.5 V,
VO = 0.2 V to 4.8 V
25°C
94
Full Range
93
RL = 600 Ω to 2.5 V,
VO = 0.2 V to 4.8 V
25°C
81
Full Range
78
RL = 2 kΩ to 2.5 V,
VO = 0.2 V to 4.8 V
25°C
85
Full Range
82
RL = 600 Ω to 2.5 V
VIN = ±100 mV
25°C
RL = 2 kΩ to 2.5 V
VIN = ±100 mV
(1)
(2)
(3)
Output Short Circuit Current (3)
4.855
−0.2
to
5.3
Full Range
4.835
25°C
4.945
80
Full Range
68
Sinking, VO = 5 V
VIN = −100 mV
25°C
58
Full Range
45
μA
dB
V+ + 0.2
V+
V
V+ − 0.3
dB
dB
90
dB
100
dB
4.890
0.160
V
0.180
4.967
4.935
25°C
nA
dB
113
0.037
LMV931, Sourcing, VO = 0
V
VIN = +100 mV
nA
dB
102
0.120
Full Range
IO
210
86
50
125°C
25
230
0 ≤ VCM ≤ 3.8 V
4.6 V ≤ VCM ≤ 5 V (2)
Common-Mode Rejection Ratio
35
40
Full Range
CMRR
μV/°C
50
25°C
Supply Current (per channel)
mV
7.5
Full Range
IS
5.5
5.5
Input Offset Current
mV
6
Full Range
IOS
UNIT
0.065
V
0.075
100
mA
65
mA
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration.
For specified temperature ranges, see the CMVR parameter in DC Electrical Characteristics 1.8 V for the input common-mode voltage
specifications.
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 45 mA over long term may adversely
affect reliability.
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6.10 AC Electrical Characteristics 5 V
Unless otherwise specified, all limits specified for TJ = 25°C. V+ = 5 V, V − = 0 V, VCM = V+/2, VO = 2.5 V and R L > 1 MΩ.
PARAMETER
TEST CONDITIONS
(2)
TYP
(1)
MAX
UNIT
SR
Slew Rate
0.42
V/µs
GBW
Gain-Bandwidth Product
1.5
MHz
Φm
Phase Margin
71
deg
Gm
Gain Margin
8
dB
en
Input-Referred Voltage Noise
f = 10 kHz, VCM = 1 V
50
nV/√Hz
in
Input-Referred Current Noise
f = 10 kHz
0.08
pA/√Hz
Total Harmonic Distortion
f = 1 kHz, AV = 1
RL = 600 Ω, VO = 1 VPP
Amplifier-to-Amplifier Isolation
See (3)
THD
(1)
(2)
(3)
10
See .
MIN
0.022%
123
dB
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration.
Connected as voltage follower with input step from V− to V+. Number specified is the slower of the positive and negative slew rates.
Input referred, RL = 100 kΩ connected to V+/2. Each amplifier excited in turn with 1 kHz to produce VO = 3 VPP (For supply voltages < 3
V, VO = V+).
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6.11 Typical Characteristics
Unless otherwise specified, VS = 5 V, single-supply, TA = 25°C.
160
3
125°C
VS = 1.8V
2.5
120
2
100
1.5
25°C
VOS (mV)
SUPPLY CURRENT (éA)
140
85°C
25°C
80
-40°C
-40°C
1
60
0.5
40
0
20
-0.5
85°C
125°C
0
0
1
2
3
4
5
-1
-0.4
6
0
0.4
0.8
1.2
1.6
SUPPLY VOLTAGE (V)
Figure 1. Supply Current vs Supply Voltage (LMV931-N)
3
VS = 2.7V
VS = 5V
2.5
2.5
2
25°C
2
-40°C
-40°C
1.5
VOS (mV)
VOS (mV)
2.4
Figure 2. Offset Voltage vs Common-Mode Range
3
1
0.5
85°C
1.5
1
0.5
125°C
125°C
0
0
-0.5
-0.5
-1
-0.4
0.1
0.6
1.1
1.6
2.1
2.6
3.1
-1
-0.4
0.6
1.6
VCM (V)
2.6
85°C
5.6
4.6
3.6
Figure 4. Offset Voltage vs Common-Mode Range
100
100
VS = 5V
VS = 5V
10
ISINK (mA)
10
VS = 2.7V
1
VS = 1.8V
0.01
0.1
VS = 2.7V
1
VS = 1.8V
0.1
0.1
0.01
0.001
25°C
VCM (V)
Figure 3. Offset Voltage vs Common-Mode Range
ISOURCE (mA)
2
VCM (V)
1
10
OUTPUT VOLTAGE REFERENCED TO V+ (V)
Figure 5. Sourcing Current vs Output Voltage
0.01
0.001
0.01
0.1
1
10
OUTPUT VOLTAGE REF TO GND (V)
Figure 6. Sinking Current vs Output Voltage
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Typical Characteristics (continued)
12
OUTPUT VOLTAGE PROXIMITY TO
SUPPLY VOLTAGE (mV ABSOLUTE VALUE)
OUTPUT VOLTAGE PROXIMITY TO SUPPLY
VOLTAGE (mV ABSOLUTE VALUE)
Unless otherwise specified, VS = 5 V, single-supply, TA = 25°C.
140
RL = 600:
130
NEGATIVE SWING
120
110
100
90
80
POSITIVE SWING
70
60
0
1
4
2
3
SUPPLY VOLTAGE (V)
5
6
45
RL = 2k:
40
NEGATIVE SWING
35
30
25
POSITIVE SWING
20
0
1
2
3
4
5
6
SUPPLY VOLTAGE (V)
Figure 7. Output Voltage Swing vs Supply Voltage
Figure 8. Output Voltage Swing vs Supply Voltage
Figure 9. Gain and Phase vs Frequency
Figure 10. Gain and Phase vs Frequency
Figure 11. Gain and Phase vs Frequency
Figure 12. Gain and Phase vs Frequency
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Typical Characteristics (continued)
Unless otherwise specified, VS = 5 V, single-supply, TA = 25°C.
100
90
VS = 5V
VS = 5V
+PSRR
90
85
80
VS = 2.7V
PSRR (dB)
CMRR (dB)
80
75
VS = 1.8V
70
-PSRR
60
70
50
65
40
30
10
60
1k
100
FREQUENCY (Hz)
10
10k
100
1k
FREQUENCY (Hz)
Figure 13. CMRR vs Frequency
Figure 14. PSRR vs Frequency
1
INPUT CURRENT NOISE (pA/ Hz)
1000
INPUT VOLTAGE NOISE (nV/ Hz)
10k
100
10
10
100
1k
10k
0.1
0.01
10
100k
100
FREQUENCY (Hz)
1k
10k
100k
FREQUENCY (Hz)
Figure 15. Input Voltage Noise vs Frequency
Figure 16. Input Current Noise vs Frequency
10
10
RL = 600:
RL = 600:
AV = +1
AV = +10
THD (%)
1
THD (%)
1
5V
1.8V
0.1
0.1
1.8V
2.7V
2.7V
5V
0.01
10
100
1k
10k
100k
0.01
10
100
1k
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 17. THD vs Frequency
Figure 18. THD vs Frequency
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Typical Characteristics (continued)
Unless otherwise specified, VS = 5 V, single-supply, TA = 25°C.
0.5
0.5
FALLING EDGE
0.4
RISING EDGE
0.35
RL = 2k:
0.3
FALLING EDGE
0.45
SLEW RATE (V/Ps)
SLEW RATE (V/Ps)
0.45
0.4
0.35
RISING EDGE
RL = 2k:
AV = +1
VIN = 1VPP
0.3
AV = +1
VIN = 1VPP
0.25
0
1
2
3
4
5
6
0.25
0
SUPPLY VOLTAGE (V)
RL = 2 k:
6
VS = 2.7V
RL = 2 k:
TIME (2.5 Ps/DIV)
Figure 22. Small Signal Noninverting Response
VIN
VS = 5V
(900 mV/div)
RL = 2 k:
(50 mV/DIV)
OUTPUT SIGNAL
INPUT SIGNAL
TIME (2.5 Ps/DIV)
Figure 21. Small Signal Noninverting Response
VOUT
VS = 1.8V
RL = 2k:
AV = +1
TIME (10 Ps/div)
TIME (2.5 Ps/DIV)
Figure 23. Small Signal Noninverting Response
14
5
(50 mV/DIV)
INPUT SIGNAL
VS = 1.8V
2
3
4
SUPPLY VOLTAGE (V)
Figure 20. Slew Rate vs Supply Voltage
LMV932 Only
OUTPUT SIGNAL
INPUT SIGNAL
OUTPUT SIGNAL
(50 mV/DIV)
Figure 19. Slew Rate vs Supply Voltage
LMV931 and LMV934
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Figure 24. Large Signal Noninverting Response
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Typical Characteristics (continued)
Unless otherwise specified, VS = 5 V, single-supply, TA = 25°C.
VIN
(2.5 V/div)
(1.35V/DIV)
VIN
VOUT
VOUT
VS = 2.7V
VS = 5.0V
RL = 2 k:
RL = 2k:
AV = +1
AV = +1
TIME (10 Ps/div)
TIME (10 Ps/DIV)
Figure 25. Large Signal Noninverting Response
Figure 26. Large Signal Noninverting Response
90
90
SHORT CIRCUIT CURRENT (mA)
SHORT CIRCUIT CURRENT (mA)
5V
80
5V
70
60
50
40
2.7V
30
20
1.8V
10
0
-40
10
60
TEMPERATURE
(°C)
110
Figure 27. Short Circuit Current vs Temperature (Sinking)
80
70
60
50
40
2.7V
30
20
1.8V
10
0
-40
10
60
TEMPERATURE
(°C)
110
Figure 28. Short Circuit Current vs Temperature (Sourcing)
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7 Detailed Description
7.1 Overview
The LMV93x-N are low-voltage, low-power operational amplifiers (op-amp) operating from 1.8-V to 5.5-V
supply voltages and have rail-to-rail input and output. LMV93x-N input common-mode voltage extends 200
mV beyond the supplies which enables user enhanced functionality beyond the supply voltage range.
7.2 Functional Block Diagram
V
IN –
IN +
+
_
OUT
+
V
–
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(Each Amplifier)
7.3 Feature Description
The differential inputs of the amplifier consist of a noninverting input (+IN) and an inverting input (–IN). The
amplifer amplifies only the difference in voltage between the two inputs, which is called the differential input
voltage. The output voltage of the op-amp VOUT is given by Equation 1:
VOUT = AOL (IN+ - IN-)
where
•
AOL is the open-loop gain of the amplifier, typically around 100 dB (100,000x, or 10 µV per volt).
(1)
7.4 Device Functional Modes
7.4.1 Input and Output Stage
The rail-to-rail input stage of this family provides more flexibility for the designer. The LMV93x-N use a
complimentary PNP and NPN input stage in which the PNP stage senses common-mode voltage near V− and
the NPN stage senses common-mode voltage near V+. The transition from the PNP stage to NPN stage occurs 1
V below V+. Because both input stages have their own offset voltage, the offset of the amplifier becomes a
function of the input common-mode voltage and has a crossover point at 1 V below V+.
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Device Functional Modes (continued)
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Figure 29. Simplified Schematic Diagram
This VOS crossover point can create problems for both DC− and AC-coupled signals if proper care is not taken.
Large input signals that include the VOS crossover point will cause distortion in the output signal. One way to
avoid such distortion is to keep the signal away from the crossover. For example, in a unity gain buffer
configuration with VS = 5 V, a 5-V peak-to-peak signal will contain input-crossover distortion while a 3-V peak-topeak signal centered at 1.5 V will not contain input-crossover distortion as it avoids the crossover point. Another
way to avoid large signal distortion is to use a gain of −1 circuit which avoids any voltage excursions at the input
terminals of the amplifier. In that circuit, the common-mode DC voltage can be set at a level away from the VOS
cross-over point. For small signals, this transition in VOS shows up as a VCM dependent spurious signal in series
with the input signal and can effectively degrade small signal parameters such as gain and common-mode
rejection ratio. To resolve this problem, the small signal should be placed such that it avoids the VOS crossover
point. In addition to the rail-to-rail performance, the output stage can provide enough output current to drive 600Ω loads. Because of the high-current capability, take care not to exceed the 150°C maximum junction
temperature specification.
7.4.2 Input Bias Current Consideration
The LMV93x-N family has a complementary bipolar input stage. The typical input bias current (IB) is 15 nA. The
input bias current can develop a significant offset voltage. This offset is primarily due to IB flowing through the
negative feedback resistor, RF. For example, if IB is 50 nA and RF is 100 kΩ, then an offset voltage of 5 mV will
develop (VOS = IB x RF). Using a compensation resistor (RC), as shown in Figure 30, cancels this effect. But the
input offset current (IOS) will still contribute to an offset voltage in the same manner.
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Device Functional Modes (continued)
Figure 30. Canceling the Offset Voltage due to Input Bias Current
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LMV93x-N devices bring performance, economy and ease-of-use to low-voltage, low-power systems. They
provide rail-to-rail input and rail-to-rail output swings into heavy loads.
8.2 Typical Applications
8.2.1 High-Side Current-Sensing Application
Figure 31. High-Side Current Sensing
8.2.1.1 Design Requirements
The high-side current-sensing circuit (Figure 31) is commonly used in a battery charger to monitor charging
current to prevent overcharging. A sense resistor RSENSE is connected to the battery directly. This system
requires an op amp with rail-to-rail input. The LMV93x-N are ideal for this application because its common-mode
input range extends up to the positive supply.
8.2.1.1.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the LMV93x-N device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
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Typical Applications (continued)
8.2.1.2 Detailed Design Procedure
As seen in Figure 31, the ICHARGE current flowing through sense resistor RSENSE develops a voltage drop equal to
VSENSE. The voltage at the negative sense point will now be less than the positive sense point by an amount
proportional to the VSENSE voltage.
The low-bias currents of the LMV93x cause little voltage drop through R2, so the negative input of the LMV93x
amplifier is at essentially the same potential as the negative sense input.
The LMV93x will detect this voltage error between its inputs and servo the transistor base to conduct more
current through Q1, increasing the voltage drop across R1 until the LMV93x inverting input matches the
noninverting input. At this point, the voltage drop across R1 now matches VSENSE.
IG, a current proportional to ICHARGE, will flow according to the following relation:
IG = VRSENSE / R1 = ( RSENSE * ICHARGE ) / R1
(2)
IG also flows through the gain resistor R3 developing a voltage drop equal to:
V3 = IG * R3 = ( VRSENSE / R1 ) * R3 = ( ( RSENSE * ICHARGE ) / R2 ) * R3
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(3)
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Typical Applications (continued)
VOUT = (RSENSE * ICHARGE ) * G
where
•
G = R3 / R1
(4)
The other channel of the LMV93x may be used to buffer the voltage across R3 to drive the following stages.
8.2.1.3 Application Curve
Figure 32 shows the results of the example current sense circuit.
5
VOUT (V)
4
3
2
1
0
0
1
2
3
4
5
ICHARGE (A)
C001
NOTE: the error after 4 V where transistor Q1 runs out of headroom and saturates, limiting the upper output swing.
Figure 32. Current Sense Amplifier Results
8.2.2 Half-Wave Rectifier Applications
RI
VIN
VOUT
RI
VIN
VCC
3
VOUT
LMV931
4
+
0
t
1
t
Figure 33. Half-Wave Rectifier With Rail-To-Ground Output Swing Referenced to Ground
VCC
VIN
VOUT
3
+
VCC
4
VIN
VCC
t
VOUT
LMV931
RI
1
t
RI
Figure 34. Half-Wave Rectifier With Negative-Going Output Referenced to VCC
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Typical Applications (continued)
8.2.2.1 Design Requirements
Because the LMV931-N, LMV932-N, LMV934-N input common-mode range includes both positive and negative
supply rails and the output can also swing to either supply, achieving half-wave rectifier functions in either
direction is an easy task. All that is needed are two external resistors; there is no need for diodes or matched
resistors. The half-wave rectifier can have either positive or negative going outputs, depending on the way the
circuit is arranged.
8.2.2.2 Detailed Design Procedure
In Figure 33 the circuit is referenced to ground, while in Figure 34 the circuit is biased to the positive supply.
These configurations implement the half-wave rectifier because the LMV93x-N can not respond to one-half of the
incoming waveform. It can not respond to one-half of the incoming because the amplifier cannot swing the output
beyond either rail therefore the output disengages during this half cycle. During the other half cycle, however, the
amplifier achieves a half wave that can have a peak equal to the total supply voltage. RI should be large enough
not to load the LMV93x-N.
8.2.2.3 Application Curve
Figure 35. Output of Ground-to-Rail Circuit
Figure 36. Output of Rail-to-Ground Circuit
8.2.3 Instrumentation Amplifier With Rail-to-Rail Input and Output Application
R2
R1
R3
R4
Figure 37. Rail-to-Rail Instrumentation Amplifier
8.2.3.1 Design Requirements
Using three of the LMV93x-N amplifiers, an instrumentation amplifier with rail-to-rail inputs and outputs can be
made as shown in Figure 37.
8.2.3.2 Detailed Design Procedure
In this example, amplifiers on the left side act as buffers to the differential stage. These buffers assure that the
input impedance is very high. They also assure that the difference amp is driven from a voltage source. This is
necessary to maintain the CMRR set by the matching R1-R2 with R3-R4. The gain is set by the ratio of R2/R1 and
R3 should equal R1 and R4 equal R2. With both rail-to-rail input and output ranges, the input and output are only
limited by the supply voltages. Remember that even with rail-to-rail outputs, the output can not swing past the
supplies so the combined common-mode voltages plus the signal should not be greater that the supplies or
limiting will occur.
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Typical Applications (continued)
8.2.3.3 Application Curve
Figure 38 shows the results of the instrumentation amplifier with R1 and R3 = 1 K, and R2 and R4 = 100 kΩ, for a
gain of 100, running on a single 5-V supply with a input of VCM = VS/2. The combined effects of the individual
offset voltages can be seen as a shift in the offset of the curve.
5
VOUT (V)
4
3
2
1
0
0
10
20
30
40
VDIFF (mV)
50
C001
Figure 38. Instrumentation Amplifier Output Results
8.3 Dos and Don'ts
Do properly bypass the power supplies.
Do add series resistence to the output when driving capacitive loads, particularly cables, Muxes and ADC inputs.
Do add series current limiting resistors and external schottky clamp diodes if input voltage is expected to exceed
the supplies. Limit the current to 1 mA or less (1 kΩ per volt).
9 Power Supply Recommendations
For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines, TI
recommends that 10-nF capacitors be placed as close as possible to the op amp power supply pins. For singlesupply, place a capacitor between V+ and V− supply leads. For dual supplies, place one capacitor between V+
and ground, and one capacitor between V– and ground.
Copyright © 2001–2017, Texas Instruments Incorporated
Product Folder Links: LMV931-N LMV932-N LMV934-N
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LMV932-N, LMV934-N
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10 Layout
10.1 Layout Guidelines
The V+ pin must be bypassed to ground with a low-ESR capacitor.
The optimum placement is closest to the V+ and ground pins.
Take care to minimize the loop area formed by the bypass capacitor connection between V+ and ground.
The ground pin must be connected to the PCB ground plane at the pin of the device.
The feedback components should be placed as close as possible to the device minimizing strays.
10.2 Layout Example
Figure 39. SOT-23 Layout Example
24
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Copyright © 2001–2017, Texas Instruments Incorporated
Product Folder Links: LMV931-N LMV932-N LMV934-N
LMV931-N
LMV932-N, LMV934-N
www.ti.com
SNOS993P – NOVEMBER 2001 – REVISED APRIL 2017
11 Device and Documentation Support
11.1 Device Support
11.1.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the LMV93x-N device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
11.1.2 Development Support
LMV931 PSPICE Model (also applicable to the LMV932 and LMV934), http://www.ti.com/lit/zip/snom028
TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti
DIP Adapter Evaluation Module, http://www.ti.com/tool/dip-adapter-evm
TI Universal Operational Amplifier Evaluation Module, http://www.ti.com/tool/opampevm
TI Filterpro Software, http://www.ti.com/tool/filterpro
11.2 Documentation Support
11.2.1 Related Documentation
For additional applications, see
AN-31 Op Amp Circuit Collection
11.3 Related Links
Table 1 lists quick access links. Categories include technical documents, support and community resources,
tools and software, and quick access to order now.
Table 1. Related Links
PARTS
PRODUCT FOLDER
ORDER NOW
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LMV931-N
Click here
Click here
Click here
Click here
Click here
LMV932-N
Click here
Click here
Click here
Click here
Click here
LMV934-N
Click here
Click here
Click here
Click here
Click here
11.4 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
Copyright © 2001–2017, Texas Instruments Incorporated
Product Folder Links: LMV931-N LMV932-N LMV934-N
Submit Documentation Feedback
25
LMV931-N
LMV932-N, LMV934-N
SNOS993P – NOVEMBER 2001 – REVISED APRIL 2017
www.ti.com
11.5 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.6 Trademarks
E2E is a trademark of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.7 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.8 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
26
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Feb-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LMV931MF
NRND
SOT-23
DBV
5
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 125
A79A
LMV931MF/NOPB
ACTIVE
SOT-23
DBV
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
A79A
LMV931MFX
NRND
SOT-23
DBV
5
3000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 125
A79A
LMV931MFX/NOPB
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
A79A
LMV931MG
NRND
SC70
DCK
5
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 125
A74
LMV931MG/NOPB
ACTIVE
SC70
DCK
5
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
A74
LMV931MGX/NOPB
ACTIVE
SC70
DCK
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
A74
LMV932MA/NOPB
ACTIVE
SOIC
D
8
95
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
LMV9
32MA
LMV932MAX
NRND
SOIC
D
8
2500
Non-RoHS
& Green
Call TI
Level-1-235C-UNLIM
-40 to 125
LMV9
32MA
LMV932MAX/NOPB
ACTIVE
SOIC
D
8
2500
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
LMV9
32MA
LMV932MM
NRND
VSSOP
DGK
8
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 125
A86A
LMV932MM/NOPB
ACTIVE
VSSOP
DGK
8
1000
RoHS & Green
NIPDAUAG | SN
Level-1-260C-UNLIM
-40 to 125
A86A
LMV932MMX/NOPB
ACTIVE
VSSOP
DGK
8
3500
RoHS & Green
NIPDAUAG | SN
Level-1-260C-UNLIM
-40 to 125
A86A
LMV934MA
NRND
SOIC
D
14
55
Non-RoHS
& Green
Call TI
Level-1-235C-UNLIM
-40 to 125
LMV934MA
LMV934MA/NOPB
ACTIVE
SOIC
D
14
55
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
LMV934MA
LMV934MAX/NOPB
ACTIVE
SOIC
D
14
2500
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
LMV934MA
LMV934MT/NOPB
ACTIVE
TSSOP
PW
14
94
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 125
LMV93
4MT
LMV934MTX
NRND
TSSOP
PW
14
2500
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 125
LMV93
4MT
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
11-Feb-2022
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
RoHS & Green
NIPDAU | SN
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LMV934MTX/NOPB
ACTIVE
TSSOP
PW
14
2500
Level-1-260C-UNLIM
-40 to 125
LMV93
4MT
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of