LMX2592RHAT

LMX2592 SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 LMX2592 High Performance, Wideband PLLatinum™ RF Synthesizer With Integrated VCO 1 Features 3 Description • • The LMX2592 device is a low-noise, wideband RF PLL with integrated VCO that supports a frequency range from 20 MHz to 9.8 GHz. The device supports both fractional-N and integer-N modes, with a 32-bit fractional divider allowing fine frequency selection. Integrated noise of 49 fs for 6-GHz output makes it an ideal low-noise source. Combining best-in-class PLL and integrated VCO noise with integrated LDOs, this device removes the need for multiple discrete devices in high performance systems. • • • • • • • • • • Output Frequency Range from 20 to 9800 MHz Industry Leading Phase Noise Performance – VCO Phase Noise: –134.5 dBc/Hz at 1-MHz Offset for 6-GHz Output – Normalized PLL Noise Floor: –231 dBc/Hz – Normalized PLL Flicker Noise: –126 dBc/Hz – 49-fs RMS Jitter (12 kHz to 20 MHz) for 6 GHz Output Input Clock Frequency Up to 1400 MHz Phase Detector Frequency Up to 200 MHz, and Up to 400 MHz in Integer-N Mode Supports Fractional-N and Integer-N Modes Dual Differential Outputs Innovative Solution to Reduce Spurs Programmable Phase Adjustment Programmable Charge Pump Current Programmable Output Power Level SPI or uWire (4-Wire Serial Interface) Single Power Supply Operation: 3.3 V The device accepts input frequencies up to 1.4 GHz, which combined with frequency dividers and programmable low noise multiplier allows flexible frequency planning. The additional programmable low-noise multiplier lets users mitigate the impact of integer boundary spurs. In Fractional-N mode, the device can adjust the output phase by a 32-bit resolution. For applications that need fast frequency changes, the device supports a fast calibration option which takes less than 25 µs. 2 Applications • • • • • This performance is achieved by using single 3.3-V supply. It supports 2 flexible differential outputs that can be configured as single-ended outputs as well. Users can choose to program one output from the VCO (or doubler) and the second from the channel divider. When not being used, each output can be muted separately. Test and Measurement Equipment Defense and RADAR Microwave Backhaul High-Performance Clock Source for High-Speed Data Converters Satellite Communications Package Information (1) PART NUMBER LMX2592RHAT LMX2592RHAR (1) DESCRIPTION BODY SIZE (NOM) VQFN (40) 6.00 mm × 6.00 mm For all available packages, see the orderable addendum at the end of the data sheet. External Loop Filter Cpout (pin 12) OSCinP (pin 8) Input Signal OSCin Buffer Phase Detector OSCin Douber OSCinM (pin 9) CSB (pin 24) SCK (pin 16) SDI (pin 17) Vtune (pin 35) Pre-R Divider Multiplier Post-R Divider ϕ RFoutAP MUX Charge Pump VCO doubler Sigma-Delta Modulator Serial Interface Control MUX Vcc RFoutAM Channel Divider RFoutBM Vcc MUX RFoutBP Output Buffer N Divider Prescaler SDO / LD (pin 20) Simplified Schematic An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................4 6 Specifications.................................................................. 6 6.1 Absolute Maximum Ratings........................................ 6 6.2 ESD Ratings............................................................... 6 6.3 Recommended Operating Conditions.........................6 6.4 Thermal Information....................................................6 6.5 Electrical Characteristics.............................................7 6.6 Timing Requirements.................................................. 8 6.7 Typical Characteristics.............................................. 10 7 Detailed Description......................................................13 7.1 Overview................................................................... 13 7.2 Functional Block Diagram......................................... 13 7.3 Functional Description.............................................. 13 7.4 Device Functional Modes..........................................17 7.5 Programming............................................................ 18 7.6 Register Maps...........................................................19 8 Application and Implementation.................................. 30 8.1 Application Information............................................. 30 8.2 Typical Application.................................................... 37 8.3 Power Supply Recommendations.............................38 8.4 Layout....................................................................... 39 9 Device and Documentation Support............................40 9.1 Device Support......................................................... 40 9.2 Documentation Support............................................ 40 9.3 Receiving Notification of Documentation Updates....40 9.4 Support Resources................................................... 40 9.5 Trademarks............................................................... 40 9.6 Electrostatic Discharge Caution................................40 9.7 Glossary....................................................................40 10 Mechanical, Packaging, and Orderable Information.................................................................... 40 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision F (October 2017) to Revision G (August 2022) Page • Changed package description from WQFN to VQFN......................................................................................... 1 • Added a new requirement to Vtune pin description............................................................................................ 4 • Added HD2 and HD3 information to the Electrical Characteristics table............................................................ 7 • Removed sentence: The CLK signal should not be high when LE transitions to low......................................... 8 • Changed the Channel Divider requirement...................................................................................................... 16 • Added a new register field, VTUNE_ADJ, in register R30................................................................................19 • Changed the position of register field, PFD_CTL, in register R13....................................................................19 • Added read only register R68, R69 and R70....................................................................................................19 • Added additional requirement for register CP_ICOARSE in Table 7-16 ..........................................................20 • Added additional information for register MUXOUT_HDRV in Table 7-44 .......................................................20 • Added a new register field, VTUNE_ADJ, in Table 7-25 ..................................................................................20 • Changed the register R0 FCAL_LPFD_ADJ configurable values.................................................................... 20 • Changed the register R13 PFD_CTL position.................................................................................................. 20 • Added the R68, R69 and R70 register field descriptions..................................................................................20 • Added External Loop Filter section...................................................................................................................36 • Moved the Power Supply Recommendations and Layout sections to the Application and Implementation section.............................................................................................................................................................. 38 Changes from Revision E (July 2017) to Revision F (October 2017) Page • Switched the RFoutBP and RFoutBM pins in the pinout diagram...................................................................... 4 • Changed register 7 and the register descriptions of 4, 20 and 46.................................................................... 19 Changes from Revision D (February 2017) to Revision E (July 2017) Page • Changed Channel Divider Setting as a Function of the Desired Output Frequency table................................16 Changes from Revision C (October 2016) to Revision D (January 2017) Page • Removed < 25-µs Fast Calibration Mode bullet from Features ......................................................................... 1 • Changed the high level input voltage minimum value of from: 1.8 to: 1.4 ......................................................... 7 • Changed text from: the rising edge of the LE signal to: the rising edge of the last CLK signal.......................... 8 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com • • • • SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Changed text from: the shift registers to an actual counter to: the shift registers to a register bank.................. 8 Added content to the Voltage Controlled Oscillator section..............................................................................15 Changed Channel Divider Setting as a Function of the Desired Output Frequency table................................16 Changed register 0, 22, and 64 descriptions.................................................................................................... 19 Changes from Revision B (July 2016) to Revision C (September 2016) Page • Updated data sheet text to the latest documentation and translations standards ............................................. 1 • Changed pin 30 name from: Rext to: NC............................................................................................................4 • Changed CDM value from: ±1250 V to: ±750 V................................................................................................. 6 • Changed parameter name from: Maximum reference input frequency to: reference input frequency............... 7 • Removed the charge pump current TYP range '0 to 12' and split range into MIN (0) and MAX (12) columns.... 7 • Moved all typical values in the Timing Requirements table to minimum column ...............................................8 • Changed output frequency units from: MHz to: Hz in graphic ......................................................................... 10 • Changed high input value from: 700 to: 200 ....................................................................................................14 • Changed high input value from: 1400 to: 400 ..................................................................................................14 • Changed minimum output frequency step from: Fpd / PLL_DEN to: Fpd × PLL_N_PRE / PLL_DEN / [Channel divider value].....................................................................................................................................................14 • Changed text from: output dividers to: channel dividers ..................................................................................15 • Changed output frequency from: 3600 to: 3550 .............................................................................................. 16 • Changed VCO frequency from: 7200 to: 7100 ................................................................................................ 16 • Changed Phase shift (degrees) from: 360 × MASH_SEED / PLL_N_DEN / [Channel divider value] to: 360 x MASH_SEED x PLL_N_PRE / PLL_N_DEN / [Channel divider value]" .......................................................... 17 • Changed register 7, 8, 19, 23, 32, 33, 34, 46, and 64 descriptions ................................................................. 19 • Added registers 20, 22, 25, 59, and 61 ............................................................................................................19 • Changed register descriptions from: Program to default to: Program to Register Map default values.............20 • Updated content in the Decreasing Lock Time section.................................................................................... 35 • Changed typical application image .................................................................................................................. 37 • Changed charge pump value from: 4.8 to: 20.................................................................................................. 38 • Changed R2 value from: 0.068 to: 68...............................................................................................................38 Changes from Revision A (December 2015) to Revision B (July 2016) Page • Added VCO Calibration Time to Electrical Characteristics ................................................................................ 7 • Added registers 2, 4, and 62 to Register Table ................................................................................................19 • Changed register 38 in Register Table ............................................................................................................ 19 • Added R2 Register Field Descriptions .............................................................................................................20 • Added R4 Register Field Descriptions .............................................................................................................20 • Added R62 Register Field Descriptions ...........................................................................................................20 Changes from Revision * (December 2015) to Revision A (December 2015) Page • Changed device status from product preview to production data, and released full data sheet ........................1 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 3 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 31 GND 32 NC 33 VbiasVARAC 34 GND 35 Vtune 36 VrefVCO 37 VccVCO 38 VregVCO 39 GND 40 GND 5 Pin Configuration and Functions CE 1 30 NC GND 2 29 VrefVCO2 VbiasVCO 3 28 NC GND 4 27 VbiasVCO2 NC 5 26 VccVCO2 GND GND 6 25 GND VccDIG 7 24 CSB OSCinP 8 23 RFoutAP OSCinM 9 22 RFoutAM VregIN 10 MUXout 20 RFoutBP 19 RFoutBM 18 SDI 17 SCK 16 GND 14 VccMASH 15 GND 13 CPout 12 VccCP 11 21 VccBUF Figure 5-1. RHA Package 40-Pin VQFN Top View Table 5-1. Pin Functions PIN NAME TYPE DESCRIPTION CE 1 Input CPout 12 Output CSB 24 Input DAP GND Ground RFout ground. GND 2, 4, 6, 13, 14, 25, 31, 34, 39, 40 Ground VCO ground. 20 Output Programmable with register MUXOUT_SEL to be readback SDO or lock detect indicator (active high). 5, 28, 30, 32 — OSCinP 8 Input Differential reference input clock (+). High input impedance. Requires connecting series capacitor (0.1-µF recommended). OSCinM 9 Input Differential reference input clock (–). High input impedance. Requires connecting series capacitor (0.1-µF recommended). RFoutAM 22 Output Differential output A (–). This output requires a pullup component for proper biasing. A 50-Ω resistor or inductor may be used. Place as close to output as possible. RFoutAP 23 Output Differential output A (+). This output requires a pullup component for proper biasing. A 50-Ω resistor or inductor may be used. Place as close to output as possible. RFoutBP 19 Output Differential output B (+). This output requires a pullup component for proper biasing. A 50-Ω resistor or inductor may be used. Place as close to output as possible. RFoutBM 18 Output Differential output B (–). This output requires a pullup component for proper biasing. A 50-Ω resistor or inductor may be used. Place as close to output as possible. SCK 16 Input SPI or uWire clock (abbreviated as CLK in Figure 6-1). High impedance CMOS input. 1.8 to 3.3-V logic. SDI 17 Input SPI or uWire data (abbreviated as DATA in Figure 6-1). High impedance CMOS input. 1.8 to 3.3-V logic. MUXout NC 4 NO. Chip Enable input. Active high powers on the device. Charge pump output. Recommend connecting C1 of loop filter close to pin. SPI chip select bar or uWire latch enable (abbreviated as LE in Figure 6-1). High impedance CMOS input. 1.8 to 3.3-V logic. Not connected. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table 5-1. Pin Functions (continued) PIN NAME NO. TYPE DESCRIPTION VbiasVARAC 33 Bypass VCO varactor internal voltage, access for bypass. Requires connecting 10-µF capacitor to VCO ground. VbiasVCO 3 Bypass VCO bias internal voltage, access for bypass. Requires connecting 10-µF capacitor to VCO ground. Place close to pin. VbiasVCO2 27 Bypass VCO bias internal voltage, access for bypass. Requires connecting 1-µF capacitor to VCO ground. VCCBUF 21 Supply Output buffer supply. Requires connecting 0.1-µF capacitor to RFout ground. VCCCP 11 Supply Charge pump supply. Recommend connecting 0.1-µF capacitor to charge pump ground. VCCDIG 7 Supply Digital supply. Recommend connecting 0.1-µF capacitor to digital ground. VCCMASH 15 Supply Digital supply. Recommend connecting 0.1-µF and 10-µF capacitor to digital ground. VCCVCO 37 Supply VCO supply. Recommend connecting 0.1-µF and 10-µF capacitor to ground. VCCVCO2 26 Supply VCO supply. Recommend connecting 0.1-µF and 10-µF capacitor to VCO ground. VrefVCO 36 Bypass VCO supply internal voltage, access for bypass. Requires connecting 10-µF capacitor to ground. VrefVCO2 29 Bypass VCO supply internal voltage, access for bypass. Requires connecting 10-µF capacitor to VCO ground. VregIN 10 Bypass Input reference path internal voltage, access for bypass. Requires connecting 1-µF capacitor to ground. Place close to pin. VregVCO 38 Bypass VCO supply internal voltage, access for bypass. Requires connecting 1-µF capacitor to ground. Vtune 35 Input VCO tuning voltage input. This signal should be kept away from noise sources. Connect a 3.3-nF or more capacitor to VCO ground. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 5 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) VCC Power supply voltage VIN Input voltage to pins other than VCC pins MIN MAX UNIT –0.3 3.6 V –0.3 VCC + 0.3 V ≤1.8 with VCC Applied ≤1 with VCC= 0 Vpp VOSCin Voltage on OSCin (pin 8 and pin 9) TL Lead temperature (solder 4 s) 260 °C TJ Junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750 Machine model (MM) ESD stress voltage ±250 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2500 V may actually have higher performance. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±1250 V may actually have higher performance. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Power supply voltage 3.15 3.45 V TA Ambient temperature –40 85 °C TJ Junction temperature 125 °C 6.4 Thermal Information LMX2592 THERMAL METRIC(1) RHA (VQFN) UNIT 40 PINS RθJA Junction-to-ambient thermal resistance 30.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 15.3 °C/W RθJB Junction-to-board thermal resistance 5.4 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 5.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 °C/W (1) 6 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 6.5 Electrical Characteristics 3.15 V ≤ VCC ≤ 3.45 V, –40°C ≤ TA ≤ 85°C. Typical values are at VCC = 3.3 V, 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLY VCC Supply voltage ICC Supply current IPD Powerdown current Single 6-GHz, 0-dBm output(1) 3.3 V 250 mA 3.7 mA OUTPUT CHARACTERISTICS Fout Output frequency 20 Pout Typical high output power Output = 3 GHz, 50-Ω pullup, singleended(2) Tcal VCO calibration time Reference input = 100 MHz, 7-GHz desired output(8) 9800 8 590 MHz dBm 800 µs 5 1400 MHz 0.2 2 Vppd 40 70 MHz 180 250 MHz INPUT SIGNAL PATH REFin Reference input frequency REFv Reference input voltage MULin Input signal path multiplier input frequency MULout Input signal path multiplier output frequency AC-coupled, differential(3) PHASE DETECTOR AND CHARGE PUMP PDF Phase detector frequency CPI Charge pump current Extended range mode(4) Programmable 5 200 MHz 0.25 400 MHz 0 12 mA PLL PHASE NOISE PLL_flicker_Nor m PLL_FOM Normalized PLL Flicker Noise(5) –126 dBc/Hz Normalized PLL Noise Floor (PLL Figure of Merit)(5) –231 dBc/Hz VCO |ΔTCL| Allowable temperature drift(6) Output = 3 GHz PNopen loop Output = 6 GHz Output = 9.8 GHz VCO not being recalibrated 125 100 kHz –118.8 1 MHz –140.3 10 MHz –155.1 100 MHz –156.3 100 kHz –112.6 1 MHz –134.2 10 MHz –152.6 100 MHz –156.2 100 kHz –108.2 1 MHz –129.1 10 MHz –140.5 100 MHz –141.1 °C dBc/Hz HARMONIC DISTORTION(7) HD_fund 8 GHz, Harmonic Distortion fundamental feed- VCO through with doubler enabled doubler enabled Fundamental (4 GHz) –26 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 7 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 3.15 V ≤ VCC ≤ 3.45 V, –40°C ≤ TA ≤ 85°C. Typical values are at VCC = 3.3 V, 25°C (unless otherwise noted) PARAMETER HD2 HD3 TEST CONDITIONS 2nd Order Harmonic Distortion(9) 3rd Order Harmonic Distortion(9) MIN TYP Testing output A, output at 5 GHz, output power level at 8.5-dBm, single-ended output, other end terminated with 50 Ω. MAX UNIT –27 dBc –25 dBc DIGITAL INTERFACE VIH High level input voltage 1.4 VCC V VIL Low level input voltage 0 0.4 V IIH High level input current –25 25 µA IIL Low level input current –25 25 µA VCC – 0.4 V 0.4 V VOH High level output voltage Load/Source Current of –350 µA VOL Low level output voltage Load/Sink Current of 500 µA SPIW Highest SPI write speed 75 MHz SPIR SPI read speed 50 MHz (1) (2) (3) (4) (5) (6) (7) (8) (9) For typical total current consumption of 250 mA: 100-MHz input frequency, OSCin doubler bypassed, pre-R divider bypassed, multiplier bypassed, post-R divider bypassed, 100-MHz phase detector frequency, 0.468-mA charge pump current, channel divider off, one output on, 6GHz output frequency, 50-Ω output pullup, 0-dBm output power (differential). See the Application and Implementation section for more information. For a typical high output power for a single-ended output, with 50-Ω pullup on both M and P side, register OUTx_POW = 63. Un-used side terminated with 50-Ω load. There is internal voltage biasing so the OSCinM and OSCinP pins must always be AC-coupled (capacitor in series). Vppd is differential peak-to-peak voltage swing. If there is a differential signal (two are negative polarity of each other), the total swing is one subtracted by the other, each should be 0.1 to 1-Vppd. If there is a single-ended signal, it can have 0.2 to 2 Vppd. See the Application and Implementation section for more information. To use phase detector frequencies lower than 5-MHz set register FCAL_LPFD_ADJ = 3. To use phase detector frequencies higher than 200 MHz, you must be in integer mode, set register PFD_CTL = 3 (to use single PFD mode), set FCAL_HPFD_ADJ = 3. For more information, see the Detailed Description section. The PLL noise contribution is measured using a clean reference and a wide loop bandwidth and is composed into flicker and flat components. PLL_flat = PLL_FOM + 20 × log(Fvco/Fpd) + 10 × log(Fpd / 1Hz). PLL_flicker (offset) = PLL_flicker_Norm + 20 × log(Fvco / 1GHz) – 10 × log(offset / 10kHz). Once these two components are found, the total PLL noise can be calculated as PLL_Noise = 10 × log(10PLL_Flat / 10 + 10PLL_flicker / 10). Not tested in production. Ensured by characterization. Allowable temperature drift refers to programming the device at an initial temperature and allowing this temperature to drift without reprogramming the device, and still have the device stay in lock. This change could be up or down in temperature and the specification does not apply to temperatures that go outside the recommended operating temperatures of the device. Not tested in production. Typical numbers from characterization with output settings: 50-Ω pullup, OUTA_POW = 15, channel divider off. The is the calibration time from the time of FCAL_EN = 1 is triggered to the calibration algorithm completing and output at 7 GHz. A reference input signal of 100 MHz is used and register CAL_CLK_DIV = 0 for state machine clock to be 100 MHz. Faster calibration times can be achieve through changes of other register settings. See the Application and Implementation section for more information. This parameter is ensured by bench. This parameter is verified by characterization on evaluation board, not tested in production. 6.6 Timing Requirements 3.15 V ≤ VCC ≤ 3.45 V, –40°C ≤ TA ≤ 85°C, except as specified. Typical values are at VCC = 3.3 V, TA = 25°C MIN TYP MAX UNIT MICROWIRE TIMING 8 tES Clock to enable low time 5 ns tCS Data to clock setup time 2 ns tCH Data to clock hold time 2 ns tCWH Clock pulse width high 5 ns tCWL Clock pulse width low 5 ns tCES Enable to clock setup time 5 ns tEWH Enable pulse width high 2 ns See Figure 6-1 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 DATA MSB ttCSt LSB ttCHt CLK tCES ttCWLt ttCWHt ttESt LE tEWH Figure 6-1. Serial Data Input Timing Diagram There are several considerations for programming: • A slew rate of at least 30 V/µs is recommended for the CLK, DATA, LE • The DATA is clocked into a shift register on each rising edge of the CLK signal. On the rising edge of the last CLK signal, the data is sent from the shift registers to a register bank • The LE pin may be held high after programming and clock pulses are ignored • When CLK and DATA lines are shared between devices, TI recommends diving down the voltage to the CLK, DATA, and LE pins closer to the minimum voltage. This provides better noise immunity • If the CLK and DATA lines are toggled while the VCO is in lock, as is sometimes the case when these lines are shared with other parts, the phase noise may be degraded during the time of this programming Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 9 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 6.7 Typical Characteristics TA = 25°C (unless otherwise noted) -50 -50 Output = 3 GHz -60 -70 Phase Noise (dBc/Hz) Phase Noise (dBc/Hz) -70 -80 -90 -100 -110 -120 -130 -90 -100 -110 -120 -130 -140 -150 -150 10k 100k Offset (Hz) 1M -160 1k 10M 100k Offset (Hz) 10M D002 -50 Output = 6 GHz -60 Output = 6 GHz -60 -70 Phase Noise (dBc/Hz) -70 -80 -90 -100 -110 -120 -130 -80 -90 -100 -110 -120 -130 -140 -140 -150 -150 10k 100k Offset (Hz) 1M -160 1k 10M 10k 100k Offset (Hz) D003 1M 10M D004 Figure 6-5. 6-GHz Output - Open-Loop Phase Noise Figure 6-4. 6-GHz Output - Closed-Loop Phase Noise 0 -40 Output = 9.8 GHz -50 VCO direct = 4900 MHz VCO doubler enabled = 9800 MHz -20 -60 -70 Phase Noise (dBc/Hz) Phase Noise (dBc/Hz) 1M Figure 6-3. 3-GHz Output - Open-Loop Phase Noise -50 -160 1k 10k D001 Figure 6-2. 3-GHz Output - Closed-Loop Phase Noise Phase Noise (dBc/Hz) -80 -140 -160 1k Output = 3 GHz -60 -80 -90 -100 -110 -120 -130 -40 -60 -80 -100 -120 -140 -140 -160 -150 -160 1k 10k 100k Offset (Hz) 1M -180 100 10M D005 Figure 6-6. 9.8-GHz Output - Closed-Loop Phase Noise 10 1k 10k 100k Offset (Hz) 1M 10M D005 Figure 6-7. 9.8-GHz Output - Open-Loop Phase Noise Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 6.7 Typical Characteristics (continued) TA = 25°C (unless otherwise noted) -90 -50 49 fs jitter for 6-GHz output (integrate 12k to 20 MHz) -60 -70 -80 -100 Noise (dBc/Hz) Phase Noise (dBc/Hz) Data Flicker Flat Model -95 -90 -100 -110 -120 -105 -110 -115 -130 -140 -120 -150 -160 1k 10k 100k Offset (Hz) 1M -125 1k 10M Figure 6-8. Integrated Jitter (49 fs) - 6-GHz Output -90 3.3 V on VCC 3.3 V + 10-mVpp (830-kHz) ripple on VCC -60 -70 Phase Noise (dBc/Hz) Phase Noise (dBc/Hz) D008 -50 -100 -110 -120 -130 -140 -80 -90 -100 -110 -120 -130 -140 -150 -150 -160 1k 10k 100k Offset (Hz) 1M -160 1k 10M D009 Figure 6-10. Variation of Phase Noise Across Temperature Single Ended (dBm) 8 6 Output Power 4 2 -40°C 25°C 85°C 1G Output Frequency (Hz) 10G D011 Figure 6-12. High Output Power (50-Ω Pullup, Single-Ended) vs Output Frequency 10k 100k Offset (Hz) 1M 10M D010 Figure 6-11. Impact of Supply Ripple on 6-GHz Output Phase Noise 10 Output Power (dBm) 1M Figure 6-9. 6-GHz Output Wide Loop Bandwidth – Showing PLL Performance Output = 6000 M (at -40°C) Output = 6000 M (at 25°C) Output = 6000 M (at 85°C) -80 -2 100M 100k Offset (Hz) -70 0 10k D007 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 18-nH pull-up 5400 50-: pull-up 5400 2 4 6 8 10121416182022242628304850525456586062 Output Power Code (OUTx_POW) D012 Figure 6-13. Output Power at 5.4-GHz Output vs OUTx_POW Code (1 - 31, 48 - 63) Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 11 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 6.7 Typical Characteristics (continued) TA = 25°C (unless otherwise noted) -50 8 5.4-GHz output with 20-MHz PFD spur -60 Calibrating to 6G (GHz) Output Frequency (GHz) Phase Noise (dBc/Hz) -70 -80 -90 -100 -110 -120 -130 -140 7 6 5 -150 -160 1k 10k 100k Offset (Hz) 1M 4 10M 0 Figure 6-14. Typical PFD Spur for 5.4-GHz Output 20 30 40 Time (µs) 50 D014 Figure 6-15. 20-µs Frequency Change Time to 6 GHz With Fast Calibration -140 -60 5400-MHz VCO direct Divide by 2 Divide by 4 Divide by 8 Divide by 16 -80 -90 -100 Approximate Noise Floor (dBc/Hz) Approximate VCO Doubler Noise Floor (dBc/Hz) -145 Noise Floor (dBc/Hz) -70 Phase Noise (dBc/Hz) 10 D013 -110 -120 -130 -140 -150 -150 -155 -160 -160 -170 -180 100 -165 1k 10k 100k Offset (Hz) 1M 0 10M D015 Figure 6-16. Impact of Channel Divider Settings on Phase Noise 12 2000 4000 6000 Output Frequency (MHz) 8000 10000 D016 Figure 6-17. Noise Floor Variation With Output Frequency Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 7 Detailed Description 7.1 Overview The LMX2592 is a high performance wideband synthesizer (PLL with integrated VCO). The output frequency range is from 20 MHz to 9.5 GHz. The VCO core covers an octave from 3.55 to 7.1 GHz. The output channel divider covers the frequency range from 20 MHz to the low bound of the VCO core. The VCO-doubler covers the frequency range from the upper bound of the VCO to 9800MHz. The input signal frequency has a wide range from 5 to 1400 MHz. Following the input, there is an programmable OSCin doubler, a pre-R divider (previous to multiplier), a multiplier, and then a post-R divider (after multiplier) for flexible frequency planning between the input (OSCin) and the phase detector. The phase detector (PFD) can take frequencies from 5 to 200 MHz, but also has extended modes down to 0.25 MHz and up to 400 MHz. The phase-lock loop (PLL) contains a Sigma-Delta modulator (1st to 4th order) for fractional N-divider values. The fractional denominator is programmable to 32-bit long, allowing a very fine resolution of frequency step. There is a phase adjust feature that allows shifting of the output phase in relation to the input (OSCin) by a fraction of the size of the fractional denominator. The output power is programmable and can be designed for high power at a specific frequency by the pullup component at the output pin. The digital logic is a standard 4-wire SPI or uWire interface and is 1.8-V and 3.3-V compatible. 7.2 Functional Block Diagram CP_ICOARSE CP_IUP CP_IDN REF_EN OSCin Douber Pre-R Divider Multiplier OSC_2X PLL_R_PRE MULT Post-R Divider MUX Charge Pump PLL_R Channel Divider MUX VCO doubler Sigma-Delta Modulator MUX VCO_2X_EN PFD_DLY MASH_ORDER N Divider Prescaler PLL_N PLL_N_PRE CHDIV_SEG1 CHDIV_SEG2 OUTx_MUX CHDIV_SEG3 CHDIV_SEG_SEL OUTx_PD OUTx_POW 7.3 Functional Description 7.3.1 Input Signal An input signal is required for the PLL to lock. The input signal is also used for the VCO calibration, so a proper signal needs to be applied before the start of programming. The input signal goes to the OSCinP and OSCinM pins of the device (there is internal biasing which requires AC-coupling caps in series before the pin). This is a differential buffer so the total swing is the OSCinM signal subtracted by the OSCinP signal. Both differential signals and single-ended signal can be used. Below is an example of the max signal level in each mode. It is important to have proper termination and matching on both sides (see Application and Implementation). Single-ended Input Differential Input +0.5 V Vbias -0.5 V +0.5 V Vbias -0.5 V OSCinP (pin 8) OSCin Buffer 1V 0.5 V Vbias -0.5 V -1 V OSCinM (pin 9) 1V 0.5 V Vbias -0.5 V -1 V OSCinP (pin 8) OSCin Buffer OSCinM (pin 9) 1V 0.5 V Vbias -0.5 V -1 V Figure 7-1. Differential vs. Single-Ended Mode Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 13 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 7.3.2 Input Signal Path The input signal path contains the components between the input (OSCin) buffer and the phase detector. The best PLL noise floor is achieved with a 200-MHz input signal for the highest dual-phase detector frequency. To address a wide range of applications, the input signal path contains the below components for flexible configuration before the phase detector. Each component can be bypassed. See Table 7-1 for usage boundaries if engaging a component. • • • • OSCin doubler: This is low noise frequency doubler which can be used to multiply input frequencies by two. The doubler uses both the rising and falling edge of the input signal so the input signal must have 50% duty cycle if enabling the doubler. The best PLL noise floor is achieved with 200-MHz PFD, thus the doubler is useful if, for example, a very low-noise, 100-MHz input signal is available instead. Pre-R divider: This is a frequency divider capable of very high frequency inputs. Use this to divide any input frequency up to 1400-MHz, and then the post-R divider if lower frequencies are needed. Multiplier: This is a programmable, low noise multiplier. In combination with the Pre-R and Post-R dividers, the multiplier offers the flexibility to set a PFD away from frequencies that may create critical integer boundary spurs with the VCO and output frequencies. See the Application and Implementation section for an example. The user should not use the doubler while using the low noise programmable multiplier. Post-R divider: Use this divider to divide down to frequencies below 5 MHz in extended PFD mode. Table 7-1. Boundaries for Input Path Components INPUT Input signal OUTPUT LOW (MHz) HIGH (MHz) 5 1400 LOW (MHz) HIGH (MHz) OSCin doubler 5 200 10 400 Pre-R divider 10 1400 5 700 Multiplier 40 70 180 250 Post-R divider 5 250 0.25 125 PFD 0.25 400 7.3.3 PLL Phase Detector and Charge Pump The PLL phase detector, also known as phase frequency detector (PFD), compares the outputs of the post-R divider and N divider and generates a correction current with the charge pump corresponding to the phase error until the two signals are aligned in phase (the PLL is locked). The charge pump output goes through external components (loop filter) which turns the correction current pulses into a DC voltage applied to the tuning voltage (Vtune) of the VCO. The charge pump gain level is programmable and allow to modify the loop bandwidth of the PLL. The default architecture is a dual-loop PFD which can operate between 5 to 200 MHz. To use it in extended range mode the PFD has to be configured differently: • Extended low phase detector frequency mode: For frequencies between 250 kHz and 5 MHz, low PFD mode can be activated (FCAL_LPFD_ADJ = 3). PLL_N_PRE also needs to be set to 4. • Extended high phase detector frequency mode: For frequencies between 200 and 400 MHz, high PFD mode can be activated (FCAL_HPFD_ADJ = 3). The PFD also has to be set to single-loop PFD mode (PFD_CTL = 3). This mode only works if using integer-N, and PLL noise floor will be about 6-dB higher than in dual-loop PFD mode. 7.3.4 N Divider and Fractional Circuitry The N divider (12 bits) includes a multi-stage noise shaping (MASH) sigma-delta modulator with programmable order from 1st to 4th order, which performs fractional compensation and can achieve any fractional denominator from 1 to (232 – 1). Using programmable registers, PLL_N is the integer portion and PLL_NUM / PLL_DEN is the fractional portion, thus the total N divider value is determined by PLL_N + PLL_NUM / PLL_DEN. This allows the output frequency to be a fractional multiplication of the phase detector frequency. The higher the denominator the finer the resolution step of the output. There is a N divider prescaler (PLL_N_PRE) between the VCO and 14 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 the N divider which performs a division of 2 or 4. 2 is selected typically for higher performance in fractional mode and 4 may be desirable for lower power operation and when N is approaching max value. Fvco = Fpd × PLL_N_PRE × (PLL_N + PLL_NUM / PLL_DEN) Minimum output frequency step = Fpd × PLL_N_PRE / PLL_DEN / [Channel divider value] Typically, higher modulator order pushes the noise out in frequency and may be filtered out with the PLL. However, several tradeoff needs to be made. Table 7-2 shows the suggested minimum N value while in fractional mode as a function of the sigma-delta modulator order. It also describe the recommended register setting for the PFD delay (register PFD_DLY_SEL). Table 7-2. MASH Order and N Divider INTEGER-N 1st ORDER 2nd ORDER 3rd ORDER 4th ORDER Minimum N divider (low bound) 9 11 16 18 30 PFD delay recommended setting (PFD_DLY_SEL) 1 1 2 2 8 7.3.5 Voltage Controlled Oscillator The voltage controlled oscillator (VCO) is fully integrated. The frequency range of the VCO is from 3.55 to 7.1 GHz so it covers one octave. Channel dividers allow the generation of all other lower frequencies. The VCO-doubler allow the generation of all other higher frequencies. The output frequency of the VCO is inverse proportional to the DC voltage present at the tuning voltage point on pin Vtune. The tuning range is 0 V to 2.5 V. 0 V generates the maximum frequency and 2.5 V generates the minimum frequency. This VCO requires a calibration procedure for each frequency selected to lock on. Each VCO calibration will force the tuning voltage to mid value and calibrate the VCO circuit. Any frequency setting in fast calibration occurs in the range of Vtune pin 0 V to 2.5 V. The VCO is designed to remained locked over the entire temperature range the device can support. Table 7-3 shows the VCO gain as a function of frequency. Table 7-3. Typical kVCO VCO FREQUENCY (MHz) kVCO (MHz/V) 3700 28 4200 30 4700 33 5200 36 5700 41 6200 47 6800 51 7.3.6 VCO Calibration The VCO calibration is responsible of setting the VCO circuit to the target frequency. The frequency calibration routine is activated any time that the R0 register is programmed with the FCAL_EN = 1. A valid input (OSCin) signal to the device must present before the VCO calibration begins. To see how to reduce the calibration time, refer to the Application and Implementation section. 7.3.7 VCO Doubler To go above the VCO upper bound, the VCO-doubler must be used (VCO_2X_EN=1). The doubling block can be enabled while the VCO is between 3.55 GHz (lowest VCO frequency) and 4.9 GHz. When VCO doubler is enabled, the N divider prescalar is automatically forced to divide by 4. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 15 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 7.3.8 Channel Divider 1 2 MUX Divide by 2 or 3 Divide by 2,4,6, or 8 Divide by 2,4,6, or 8 CHDIV_SEG1 CHDIV_SEG2 CHDIV_SEG3 4 CHDIV_SEG_SEL Figure 7-2. Channel Divider Diagram To go below the VCO lower bound, the channel divider must be used. The channel divider consists of three programmable dividers controlled by the registers CHDIV_SEG1, CHDIV_SEG2, CHDIV_SEG3. The Multiplexer (programmed with register CHDIV_SEG_SEL) selects which divider is included in the path. The minimum division is 2 while the maximum division is 192. Un-used dividers can be powered down to save current consumption. The entire channel divider can be powered down with register CHDIV_EN = 0 or selectively setting registers CHDIV_SEG1_EN = 0, CHDIV_SEG2_EN = 0 ,CHDIV_SEG3_EN = 0. Unused buffers may also be powered down with registers CHDIV_DISTA_EN and CHDIV_DIST_EN. There are restrictions on the maximum VCO frequency when channel divider is engaged. Table 7-4. Channel Divider vs VCO Frequency OUTPUT FREQUENCY (MHz) 16 CHDIV SEGMENT TOTAL DIVISION VCO FREQUENCY (MHz) MIN MAX SEG1 SEG2 SEG3 MIN MAX 1775 3550 2 1 1 2 3550 7100 1184 2200 3 1 1 3 3552 6600 888 1184 2 2 1 4 3552 4736 592 888 3 2 1 6 3552 5328 444 592 2 4 1 8 3552 4736 296 444 2 6 1 12 3552 5328 222 296 2 8 1 16 3552 4736 148 222 3 8 1 24 3552 5328 111 148 2 8 2 32 3552 4736 99 111 3 6 2 36 3564 3996 74 99 3 8 2 48 3552 4752 56 74 2 8 4 64 3584 4736 37 56 2 8 6 96 3552 5376 28 37 2 8 8 128 3584 4736 20 28 3 8 8 192 3840 5376 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 7.3.9 Output Distribution VCO_DISTA_PD 1 OUTA_MUXSEL CHDIV_DISTA_EN Output Buffer A MUX Output Buffer B 0 Channel Divider VCO MUX 0 CHDIV_DIST_PD CHDIV_DISTB_EN VCO_DISTB_PD 1 OUTB_MUXSEL Figure 7-3. Output Distribution Diagram For each output A or B, there is a mux which select the VCO output directly or the channel divider output. Before these selection MUX there are several buffers in the distribution path which can be configured depending on the route selected. By disabling unused buffers, unwanted signals can be isolated and unneeded current consumption can be eliminated. 7.3.10 Output Buffer Each output buffer (A and B) have programmable gain with register OUTA_POW and OUTB_POW. The RF output buffer configuration is open-collector and requires an external pullup from RFout pin to VCC. There are two pullup options that can be used with either resistor or inductor. Refer to the Application and Implementation section for design considerations. 1. Resistor pullup: placing a 50-Ω resistor pullup matches the output impedance to 50-Ω. However, maximum output power is limited. Output buffer current settings should be set to a value before output power is saturated (output power increases less for every step increase in output current value). 2. Inductor pullup: placing an inductor pullup creates a resonance at the frequency of interest. This offers higher output power for the same current and higher maximum output power. However, the output impedance is higher and additional matching may be required.. 7.3.11 Phase Adjust In fractional mode, the phase relationship between the output and the input can be changed with very fine resolution. Every time MASH_SEED register is written, it will trigger a phase shift of the amount described in Equation 1. The seed value should be less then the fractional-N denominator register PLL_N_DEN. The actual phase shift can be obtained with the following equation: Phase shift (degrees) = 360 × MASH_SEED × PLL_N_PRE / PLL_N_DEN / [Channel divider value] (1) 7.4 Device Functional Modes 7.4.1 Power Down Power up and down can be achieved using the CE pin (logic HIGH or LOW voltage) or the POWERDOWN register bit (0 or 1). When the device comes out of the powered-down state, either by pulling back CE pin HIGH (if it was powered down by CE pin) or by resuming the POWERDOWN bit to 0 (if it was powered down by register write), it is required that register R0 be programmed again to re-calibrate the device. 7.4.2 Lock Detect The MUXout pin can be configured to output a signal that gives an indication for the PLL being locked. If lock detect is enabled (LD_EN = 1) and the MUXout pin is configured as lock detect output (MUXOUT_SEL = 1), Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 17 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 when the device is locked, the MUXout pin output is a logic HIGH voltage, and when the device is unlocked, MUXout output is a logic LOW voltage. 7.4.3 Register Readback The MUXout pin can be programmed (MUXOUT_SEL = 0) to use register readback serial data output. Timing requirements for MUXout to CLK follow the same specifications as Data to CLK in Timing Requirements. To read back a certain register value, use the following steps: 1. Set the R/W bit to 1; the data field contents are ignored. 2. Program this register to the device, readback serial data will be output starting at the 9th clock. DATA CLK MUXout R/W =1 Data = Ignored Address 7-bit 1st 9th - 24th 2nd - 8th Read back register value 16-bit LE Figure 7-4. Register Readback Timing Diagram 7.5 Programming The programming using 24-bit shift registers. The shift register consists of a R/W bit (MSB), followed by a 7-bit address field and a 16-bit data field. For the R/W (bit 23), 1 is read and 0 is write. The address field ADDRESS (bits 22:16) is used to decode the internal register address. The remaining 16 bits form the data field DATA (bits 15:0). While CSB is low, serial data is clocked into the shift register upon the rising edge of clock (data is programmed MSB first). When CSB goes high, data is transferred from the data field into the selected register bank. 7.5.1 Recommended Initial Power on Programming Sequence When the device is first powered up, the device needs to be initialized and the ordering of this programming is very important. After this sequence is completed, the device should be running and locked to the proper frequency. 1. 2. 3. 4. 5. Apply power to the device and ensure the VCC pins are at the proper levels Ensure that a valid reference is applied to the OSCin pin Soft reset the device (write R0[1] = 1) Program the remaining registers Frequency calibrate (write R0[3] = 1) 7.5.2 Recommended Sequence for Changing Frequencies The recommended sequence for changing frequencies is as follows: 1. Set the new N divider value (write R38[12:1]) 2. Set the new PLL numerator (R45 and R44) and denominator (R41 and R40) 3. Frequency calibrate (write R0[3] = 1) 18 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 7.6 Register Maps 7.6.1 LMX2592 Register Map – Default Values Figure 7-5. Register Table REG 23 22 21 R/ W 20 19 18 17 16 15 14 13 12 11 10 9 ADDRESS[6:0] 8 7 6 5 4 3 2 1 0 DATA [15:0] 0 R/ W 0 0 0 0 0 0 0 0 0 LD_EN 0 0 0 1 FCAL_HPFD _ADJ 1 R/ W 0 0 0 0 0 0 1 0 0 0 0 1 0 0 0 0 0 0 0 1 2 R/ W 0 0 0 0 0 1 0 0 0 0 0 0 1 0 1 0 0 0 0 0 0 0 0 4 R/ W 0 0 0 0 1 0 0 0 1 0 0 0 0 1 1 7 R/ W 0 0 0 0 1 1 1 0 0 1 0 1 0 0 0 1 0 1 1 0 0 1 0 8 R/ W 0 0 0 1 0 0 0 0 0 VCO_ID AC_OV R 1 0 VCO_ CAPC TRL_ OVR 0 0 1 0 0 0 0 1 0 0 9 R/ W 0 0 0 1 0 0 1 0 0 0 0 OSC _2X 0 REF_E N 1 0 0 0 0 0 0 1 0 10 R/ W 0 0 0 1 0 1 0 0 0 0 1 1 0 1 1 0 0 0 11 R/ W 0 0 0 1 0 1 1 0 0 0 0 1 0 0 0 12 R/ W 0 0 0 1 1 0 0 0 1 1 1 13 R/ W 0 0 0 1 1 0 1 0 CP_E N 0 0 0 0 PFD_CTL 14 R/ W 0 0 0 1 1 1 0 0 0 0 0 19 R/ W 0 0 1 0 0 1 1 0 0 0 0 20 R/ W 0 0 1 0 1 0 0 0 0 0 0 0 0 0 22 R/ W 0 0 1 0 1 1 0 0 0 1 0 0 0 1 1 23 R/ W 0 0 1 0 1 1 1 1 FCAL _VC O_S EL_S TRT VCO_ SEL_ FORC E 0 0 0 1 0 0 24 R/ W 0 0 1 1 0 0 0 0 0 0 0 0 1 0 1 0 0 0 25 R/ W 0 0 1 1 0 0 1 0 0 0 0 0 0 0 0 0 0 28 R/ W 0 0 1 1 1 0 0 0 0 1 0 1 0 0 1 0 29 R/ W 0 0 1 1 1 0 1 0 0 0 0 0 0 0 0 1 30 R/ W 0 0 1 1 1 1 0 0 0 0 0 0 MASH _DITH ER 0 0 31 R/ W 0 0 1 1 1 1 1 0 0 0 0 0 VCO_ VCO_D DIST ISTA_P B_PD D 32 R/ W 0 1 0 0 0 0 0 0 0 1 0 0 0 33 R/ W 0 1 0 0 0 0 1 0 0 1 0 1 34 R/ W 0 1 0 0 0 1 0 1 1 0 0 0 35 R/ W 0 1 0 0 0 1 1 0 0 0 ACAL_CMP_DLY FCAL_LPFD_ ADJ MULT ACA FCAL_EN MUXO RES L_E UT_S ET N EL PLL_R POWE RDOW N CAL_CLK_DIV PLL_R_PRE 0 0 0 0 0 0 0 CP_IDN 0 CP_IUP CP_ICOARSE VCO_IDAC VCO_SEL 1 0 1 0 0 1 0 0 1 0 0 1 0 0 0 0 0 0 0 1 0 0 1 0 0 0 0 0 0 1 0 0 VTUNE_ADJ 1 1 0 1 0 VCO_2 X_EN 0 CHDIV _DIST _PD 0 0 0 0 0 0 1 0 1 0 0 0 0 1 0 1 0 0 1 0 0 0 0 0 1 0 1 0 0 1 1 1 1 CHDIV _EN 0 1 0 1 0 0 0 1 1 CHDIV_SEG2 ACAL_VCO_IDAC_STRT VCO_CAPCTRL CHD CHDIV IV_S _SEG EG3 2_EN _EN CHDIV CHD _SEG IV_S 1 EG1 _EN Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 1 19 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Figure 7-5. Register Table (continued) REG 23 22 21 R/ W 20 19 18 17 16 15 14 13 12 11 10 9 8 ADDRESS[6:0] 7 6 5 4 3 2 1 0 DATA [15:0] 36 R/ W 0 1 0 0 1 0 0 0 0 0 0 CHDI CHDI V_DI V_DIS STB_ TA_E EN N 37 R/ W 0 1 0 0 1 0 1 0 1 0 PLL_N _PRE 38 R/ W 0 1 0 0 1 1 0 0 0 0 39 R/ W 0 1 0 0 1 1 1 1 0 40 R/ W 0 1 0 1 0 0 0 PLL_DEN[31:16] 41 R/ W 0 1 0 1 0 0 1 PLL_DEN[15:0] 42 R/ W 0 1 0 1 0 1 0 MASH_SEED[31:16] 43 R/ W 0 1 0 1 0 1 1 MASH_SEED[15:0] 44 R/ W 0 1 0 1 1 0 0 PLL_NUM[31:16] 45 R/ W 0 1 0 1 1 0 1 PLL_NUM[15:0] 46 R/ W 0 1 0 1 1 1 0 0 0 47 R/ W 0 1 0 1 1 1 1 0 0 0 48 R/ W 0 1 1 0 0 0 0 0 0 0 0 59 R/ W 0 1 1 1 0 1 1 0 0 0 61 R/ W 0 1 1 1 1 0 1 0 0 62 R/ W 0 1 1 1 1 1 0 0 64 R/ W 1 0 0 0 0 0 0 0 0 0 0 0 0 CHDIV_SEG_SEL 0 0 0 0 0 0 CHDIV_SEG3 0 0 0 PLL_N PFD_DLY 0 OUTA_POW OUTA_MUX 0 0 OUTB _PD OUT A_P D 0 0 0 0 1 0 0 1 0 0 MASH_ORDER 0 0 0 1 1 0 0 1 1 1 1 1 1 1 1 OUTB_MUX 0 0 0 0 0 0 0 MUXO UT_HD RV 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 LD_TY PE 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 ACAL_ FCA FAST L_FA ST 68 R 1 0 0 0 1 0 0 0 0 0 0 0 69 R 1 0 0 0 1 0 1 0 0 0 0 0 rb_LD_VTUNE 0 0 70 R 1 0 0 0 1 1 0 0 0 0 0 0 0 0 0 OUTB_POW AJUMP_SIZE 1 rb_VCO_SEL 0 0 FJUMP_SIZE 0 0 0 0 rb_VCO_CAPCTRL rb_VCO_DACISET 7.6.1.1 Register Descriptions Table 7-5. R0 Register Field Descriptions BIT FIELD 15:14 13 DEFAULT R/W LD_EN 12:9 20 TYPE R/W DESCRIPTION Program to Register Map default values 1 R/W Lock detect enable 1: enable 0: disable Program to Register Map default values 8:7 FCAL_HPFD_ADJ R/W 0 Used for when PFD freq is high 3: PFD > 200 MHz 2: PFD > 150 MHz 1: PFD > 100 MHz 0: not used 6:5 FCAL_LPFD_ADJ R/W 0 Used for when PFD freq is low 3: PFD < 2.5 MHz 2: 2.5 MHz ≤ PFD < 5 MHz 1: 5 MHz ≤ PFD < 10 MHz 0: PFD ≥ 10 MHz Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table 7-5. R0 Register Field Descriptions (continued) BIT FIELD TYPE DEFAULT DESCRIPTION 4 ACAL_EN R/W 1 Enable amplitude calibration 1: enable (calibration algorithm will set VCO amplitude. For manual mode set register VCO_IDAC_OVR=1, and then set the VCO amplitude by register VCO_IDAC) 0: disable 3 FCAL_EN R/W 1 Enable frequency calibration 1: enable (writing 1 to this register triggers the calibration sequence) 0: disable 2 MUXOUT_SEL R/W 1 Signal at MUXOUT pin 1: Lock Detect (3.3 V if locked, 0 V if unlocked) 0: Readback (3.3-V digital output) 1 RESET R/W 0 Reset Write with a value of 1 to reset device (this register will selfswitch back to 0) 0 POWERDOWN R/W 0 Powerdown whole device 1: power down 0: power up Table 7-6. R1 Register Field Descriptions BIT FIELD TYPE 15:3 2:0 DEFAULT R/W CAL_CLK_DIV R/W DESCRIPTION Program to Register Map default values 3 Divides down the OSCin signal for calibration clock Calibration Clock = OSCin / 2^CAL_CLK_DIV Set this value so that calibration clock is less than but as close to 200MHz as possible if fast calibration time is desired. Table 7-7. R2 Register Field Descriptions BIT FIELD TYPE 15:0 DEFAULT R/W DESCRIPTION Program to Register Map default values Table 7-8. R4 Register Field Descriptions BIT 15:8 FIELD ACAL_CMP_DLY 7:0 TYPE DEFAULT DESCRIPTION R/W 25 VCO amplitude calibration delay. Lowering this value can speed calibration time. The guideline for this register is 2 x [ACAL_CMP_DLY value] x [calibration clock period] > 200ns. As described in CAL_CLK_DIV, the calibration clock is defined as OSCin / 2^CAL_CLK_DIV. For example, with the fastest calibration clock of 200MHz (OSCin=200MHz and CAL_CLK_DIV=0), the period is 5ns. So ACAL_CMP_DLY should be > 20. With the same derivation, an example of a OSCin=100MHz, ACAL_CMP_DLY should be > 10. This register is left at a default value of 25 if there is no need to shorten calibration time. R/W Program to Register Map default values Table 7-9. R7 Register Field Descriptions BIT FIELD TYPE 15:0 DEFAULT R/W DESCRIPTION Program to Register Map default values Table 7-10. R8 Register Field Descriptions BIT FIELD 15:14 TYPE R/W DEFAULT DESCRIPTION Program to Register Map default values Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 21 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table 7-10. R8 Register Field Descriptions (continued) BIT 13 FIELD VCO_IDAC_OVR 12:11 10 TYPE DEFAULT R/W 0 R/W VCO_CAPCTRL_OVR 9:0 R/W DESCRIPTION This is the override bit for VCO amplitude (or IDAC value). When this is enabled, the VCO amplitude calibration function (ACAL_EN) is not used. VCO_IDAC register can be programmed to set the amplitude. Keep the VCO_IDAC value within 250 and 450. Program to Register Map default values 0 R/W This is the override bit for VCO capacitor bank code (or CAPCTRL value). When this is enabled, the VCO frequency calibration function (FCAL_EN) is not used. the VCO_CAPCTRL register can be programmed to set the VCO frequency within the selected VCO core. The VCO core is selected by setting VCO_SEL_FORCE=1 and then selecting the core with VCO_SEL=1,2,3,4,5,6, or 7 Program to Register Map default values Table 7-11. R9 Register Field Descriptions BIT FIELD 15:12 11 DEFAULT R/W OSC_2X R/W 10 9 TYPE 0 R/W REF_EN R/W 8:0 DESCRIPTION Program to Register Map default values Reference path doubler 1: enable 0: disable Program to Register Map default values 1 R/W Enable reference path 1: enable 0: disable Program to Register Map default values Table 7-12. R10 Register Field Descriptions BIT FIELD 15:12 11:7 TYPE DEFAULT R/W MULT R/W 6:0 DESCRIPTION Program to Register Map default values 1 R/W Input signal path multiplier (input range from 40 - 70 MHz, output range from 180 - 250 MHz) Program to Register Map default values Table 7-13. R11 Register Field Descriptions BIT FIELD 15:12 11:4 TYPE DEFAULT R/W PLL_R R/W 3:0 DESCRIPTION Program to Register Map default values 1 R/W R divider after multiplier and before PFD Program to Register Map default values Table 7-14. R12 Register Field Descriptions BIT FIELD 15:12 11:0 TYPE DEFAULT R/W PLL_R_PRE R/W DESCRIPTION Program to Register Map default values 1 R divider after OSCin doubler and before multiplier Table 7-15. R13 Register Field Descriptions BIT FIELD 15 14 DEFAULT R/W CP_EN 13:2 22 TYPE R/W R/W DESCRIPTION Program to Register Map default values 1 Enable charge pump 1: enable 0: disable Program to Register Map default values Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table 7-15. R13 Register Field Descriptions (continued) BIT 1:0 FIELD PFD_CTL TYPE DEFAULT R/W 0 DESCRIPTION PFD mode 0: Dual PFD (default) 3: Single PFD (ONLY use if PFD freq is higher than 200MHz) Table 7-16. R14 Register Field Descriptions BIT FIELD TYPE 15:12 DEFAULT R/W DESCRIPTION Program to Register Map default values 11:7 CP_IDN R/W 3 Charge pump current (DN) – must equal to charge pump current (UP). Can activate any combination of bits. : 1.25 mA : 2.5 mA : 0.625 mA : 0.312 mA : 0.156 mA 6:2 CP_IUP R/W 3 Charge pump current (UP) – must equal to charge pump current (DN). Can activate any combination of bits. : 1.25 mA : 2.5 mA : 0.625 mA : 0.312 mA : 0.156 mA 1:0 CP_ICOARSE R/W 1 Charge pump gain multiplier - multiplies charge pump current by a given factor: 3: multiply by 2.5 2: multiply by 1.5 1: multiply by 2 0: no multiplication For optimal accuracy of the lock detect circuit over temperature, it is recommended that only set this register to either 0 or 2. Table 7-17. R19 Register Field Descriptions BIT FIELD TYPE 15:12 11:3 DEFAULT R/W VCO_IDAC R/W 2:0 DESCRIPTION Program to Register Map default values 300 R/W This is the VCO amplitude (or IDAC value). When VCO_IDAC is overridden with VCO_IDAC_OVR=1, VCO amplitude calibration function (ACAL_EN) is not used. VCO_IDAC register can be programmed to set the amplitude. VCO_IDAC value must be kept within 250 and 450. Program to Register Map default values Table 7-18. R20 Register Field Descriptions BIT FIELD TYPE 15:9 8:0 DEFAULT R/W ACAL_VCO_IDAC_STRT R/W DESCRIPTION Program to Register Map default values 300 This register is used to aid the VCO amplitude calibration function (ACAL_EN). By default the amplitude calibration function searches from the low end of VCO_IDAC until it reaches the target value. Like the VCO_IDAC, this must be kept within 250 and 450. This can be set to a value closer to the target value, then the amplitude calibration time can be shortened typically final VCO_IDAC is somewhere around 300. Table 7-19. R22 Register Field Descriptions BIT FIELD 15:8 TYPE R/W DEFAULT DESCRIPTION Program to Register Map default values Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 23 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table 7-19. R22 Register Field Descriptions (continued) BIT 7:0 FIELD VCO_CAPCTRL TYPE DEFAULT DESCRIPTION R/W 0 This is the VCO capacitor bank code (or CAPCTRL value). When VCO_CAPCTRL is overridden with VCO_CAPCTRL_OVR=1, VCO frequency calibration function (FCAL_EN) is not used. VCO_CAPCTRL register can be programmed to set the frequency in that core. VCO_SEL_FORCE=1 has to be set and VCO_SEL to select the VCO core, then CAPCTRL values between 0 to 183 will produce frequencies within this core (0 being the highest frequency and 183 the lowest). Table 7-20. R23 Register Field Descriptions BIT FIELD 15 14 13:11 10 TYPE DEFAULT R/W DESCRIPTION Program to Register Map default values FCAL_VCO_SEL_STRT R/W 0 This is a register that aids the frequency calibration function. When this is enabled, a VCO core can be selected for the frequency calibration to start at, set by register VCO_SEL. By default the frequency calibration starts from VCO core 7 and works its way down. If you want for example to lock to a frequency in VCO core 1, you can set VCO_SEL to 2, so the calibration will start at VCO core 2 and end at target frequency at VCO core 1 faster. VCO_SEL R/W 1 This is the register used to select VCO cores. It works for VCO_CAPCTRL when VCO_CAPCTRL_OVR=1 and VCO_SEL_FORCE=1. It also aids the frequency calibration function with FCAL_VCO_SEL_STRT. VCO_SEL_FORCE R/W 0 This register works to force selection of VCO cores. If VCO_CAPTRL_OVR=1 and this register is enabled, you can select the VCO core to use with VCO_SEL. 9:0 R/W Program to Register Map default values Table 7-21. R24 Register Field Descriptions BIT FIELD 15:0 TYPE DEFAULT R/W DESCRIPTION Program to default Table 7-22. R25 Register Field Descriptions BIT FIELD 15:0 TYPE DEFAULT R/W DESCRIPTION Program to Register Map default values Table 7-23. R28 Register Field Descriptions BIT FIELD 15:0 TYPE DEFAULT R/W DESCRIPTION Program to Register Map default values Table 7-24. R29 Register Field Descriptions BIT FIELD 15:0 TYPE DEFAULT R/W DESCRIPTION Program to Register Map default values Table 7-25. R30 Register Field Descriptions BIT FIELD 15:11 10 VTUNE_ADJ 5:1 24 DEFAULT R/W MASH_DITHER 9:8 7:6 TYPE R/W DESCRIPTION Program to Register Map default values 0 MASH dithering: toggle on/off to randomize R/W Program to Register Map default values R/W Change this register field according to the VCO frequency 0: fVCO < 6500 MHz 3: fVCO ≥ 6500 MHz R/W Program to Register Map default values Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table 7-25. R30 Register Field Descriptions (continued) BIT 0 FIELD VCO_2X_EN TYPE DEFAULT R/W 0 DESCRIPTION Enable VCO doubler 1: enable 0: disable Table 7-26. R31 Register Field Descriptions BIT FIELD TYPE 15:11 DEFAULT R/W DESCRIPTION Program to Register Map default values 10 VCO_DISTB_PD R/W 1 Power down buffer between VCO and output B 1: power down 0: power up 9 VCO_DISTA_PD R/W 0 Power down buffer between VCO and output A 1: power down 0: power up 8 7 R/W CHDIV_DIST_PD R/W 6:0 Program to Register Map default values 0 R/W Power down buffer between VCO and channel divider Program to Register Map default values Table 7-27. R32 Register Field Descriptions BIT FIELD TYPE 15:0 DEFAULT R/W DESCRIPTION Program to Register Map default values Table 7-28. R33 Register Field Descriptions BIT FIELD TYPE 15:0 DEFAULT R/W DESCRIPTION Program to Register Map default values Table 7-29. R34 Register Field Descriptions BIT FIELD TYPE 15:6 5 DEFAULT R/W CHDIV_EN R/W 4:0 DESCRIPTION Program to Register Map default values 1 R/W Enable entire channel divider 1: enable 0: power down Program to Register Map default values Table 7-30. R35 Register Field Descriptions BIT FIELD 15:13 12:9 TYPE DEFAULT R/W DESCRIPTION Program to Register Map default values CHDIV_SEG2 R/W 1 Channel divider segment 2 8: divide-by-8 4: divide-by-6 2: divide-by-4 1: divide-by-2 0: PD 8 CHDIV_SEG3_EN R/W 0 Channel divider segment 3 1: enable 0: power down (power down if not needed) 7 CHDIV_SEG2_EN R/W 0 Channel divider segment 2 1: enable 0: power down (power down if not needed) 6:3 2 R/W CHDIV_SEG1 R/W Program to Register Map default values 1 Channel divider segment 1 1: divide-by-3 0: divide-by-2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 25 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table 7-30. R35 Register Field Descriptions (continued) BIT 1 FIELD CHDIV_SEG1_EN 0 TYPE DEFAULT R/W 0 R/W DESCRIPTION Channel divider segment 1 1: enable 0: power down (power down if not needed) Program to Register Map default values Table 7-31. R36 Register Field Descriptions BIT FIELD 15:12 TYPE DEFAULT R/W DESCRIPTION Program to Register Map default values 11 CHDIV_DISTB_EN R/W 0 Enable buffer between channel divider and output B 1: enable 0: disable 10 CHDIV_DISTA_EN R/W 1 Enable buffer between channel divider and output A 1: enable 0: disable 9:7 R/W Program to Register Map default values 6:4 CHDIV_SEG_SEL R/W 1 Channel divider segment select 4: includes channel divider segment 1,2 and 3 2: includes channel divider segment 1 and 2 1: includes channel divider segment 1 0: PD 3:0 CHDIV_SEG3 R/W 1 Channel divider segment 3 8: divide-by-8 4: divide-by-6 2: divide-by-4 1: divide-by-2 0: PD Table 7-32. R37 Register Field Descriptions BIT FIELD 15:13 12 TYPE DEFAULT R/W PLL_N_PRE R/W 11:0 DESCRIPTION Program to Register Map default values 0 R/W N-divider pre-scalar 1: divide-by-4 0: divide-by-2 Program to Register Map default values Table 7-33. R38 Register Field Descriptions BIT FIELD 15:13 12:1 TYPE DEFAULT R/W PLL_N R/W 0 DESCRIPTION Program to Register Map default values 27 R/W Integer part of N-divider Program to Register Map default values Table 7-34. R39 Register Field Descriptions BIT FIELD 15:14 13:8 DEFAULT R/W PFD_DLY 7:0 26 TYPE R/W R/W DESCRIPTION Program to Register Map default values 2 PFD Delay 32: Not used 16: 16 clock cycle delay 8: 12 clock cycle delay 4: 8 clock cycle delay 2: 6 clock cycle delay 1: 4 clock cycle delay Program to Register Map default values Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table 7-35. R40 Register Field Descriptions BIT 15:0 FIELD PLL_DEN[31:16] TYPE DEFAULT R/W 1000 DESCRIPTION Denominator MSB of N-divider fraction Table 7-36. R41 Register Field Descriptions BIT 15:0 FIELD PLL_DEN[15:0] TYPE DEFAULT R/W 1000 DESCRIPTION Denominator LSB of N-divider fraction Table 7-37. R42 Register Field Descriptions BIT 15:0 FIELD MASH_SEED[31:16] TYPE DEFAULT R/W 0 DESCRIPTION MASH seed MSB Table 7-38. R43 Register Field Descriptions BIT 15:0 FIELD MASH_SEED[15:0] TYPE DEFAULT R/W 0 DESCRIPTION MASH seed LSB Table 7-39. R44 Register Field Descriptions BIT 15:0 FIELD PLL_NUM[31:16] TYPE DEFAULT R/W 0 DESCRIPTION Numerator MSB of N-divider fraction Table 7-40. R45 Register Field Descriptions BIT 15:0 FIELD PLL_NUM[15:0] TYPE DEFAULT R/W 0 DESCRIPTION Numerator LSB of N-divider fraction Table 7-41. R46 Register Field Descriptions BIT FIELD TYPE 15 13:8 DEFAULT R/W DESCRIPTION Program to Register Map default values OUTA_POW R/W 15 Output buffer A power increase power from 0 to 31 extra boost from 48 to 63 7 OUTB_PD R/W 1 Output buffer B power down 1: power down 0: power up 6 OUTA_PD R/W 0 Output buffer A power down 1: power down 0: power up 5:3 2:0 R/W MASH_ORDER R/W Program to Register Map default values 3 Sigma-delta modulator order 4: fourth order 3: third order 2: second order 1: first order 0: integer mode Table 7-42. R47 Register Field Descriptions BIT FIELD 15:13 12:11 DEFAULT R/W OUTA_MUX 10:6 5:0 TYPE R/W 0 R/W OUTB_POW R/W DESCRIPTION Program to Register Map default values Selects signal to the output buffer 2,3: reserved 1: Selects output from VCO 0: Selects the channel divider output Program to Register Map default values 0 Output buffer B power increase power from 0 to 31 extra boost from 48 to 63 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 27 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table 7-43. R48 Register Field Descriptions BIT FIELD 15:2 1:0 TYPE DEFAULT R/W OUTB_MUX R/W DESCRIPTION Program to Register Map default values 0 Selects signal to the output buffer 2,3: reserved 1: Selects output from VCO 0: Selects the channel divider output Table 7-44. R59 Register Field Descriptions BIT FIELD 15:6 5 TYPE DEFAULT R/W MUXOUT_HDRV 4:0 R/W DESCRIPTION Program to Register Map default values 0 R/W This bit enables higher current output (approximately 3 mA) at MUXOUT pin if value is 1. Program to Register Map default values Table 7-45. R61 Register Field Descriptions BIT FIELD 15:1 0 TYPE DEFAULT R/W LD_TYPE R/W DESCRIPTION Program to Register Map default values 1 To use lock detect, set MUXOUT_SEL=1. Use this register to select type of lock detect: 0: Calibration status detect (this indicates if the auto-calibration process has completed successfully and will output from MUXout pin a logic HIGH when successful). 1: vtune detect (this checks if vtune is in the expected range of voltages and outputs from MUXout pin a logic HIGH if device is locked and LOW if unlocked). Table 7-46. R62 Register Field Descriptions BIT FIELD 15:0 TYPE DEFAULT R/W DESCRIPTION Program to Register Map default values Table 7-47. R64 Register Field Descriptions BIT FIELD 15:10 TYPE DEFAULT R/W DESCRIPTION Program to Register Map default values 9 ACAL_FAST R/W 0 Enable fast amplitude calibration 1: enable 0: disable 8 FCAL_FAST R/W 0 Enable fast frequency calibration 1: enable 0: disable 7:5 AJUMP_SIZE R/W 3 When ACAL_FAST=1, use this register to select the jump increment 4 3:0 R/W FJUMP_SIZE R/W Program to Register Map default values 15 When FCAL_FAST=1, use this register to select the jump increment Table 7-48. R68 Register Field Descriptions BIT 10:9 28 FIELD rb_LD_VTUNE TYPE DEFAULT R – DESCRIPTION Readback of Vtune detect (LD_TYPE = 1). 0: Unlocked 1: Invalid 2: Locked 3: Unlocked Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table 7-48. R68 Register Field Descriptions (continued) BIT 7:5 FIELD rb_VCO_SEL TYPE DEFAULT R – DESCRIPTION Reads back the actual VCO that the calibration has selected. 1: VCO1 2: VCO2 …… 7: VCO7 Table 7-49. R69 Register Field Descriptions BIT 7:0 FIELD rb_VCO_CAPCTRL TYPE DEFAULT DESCRIPTION R – Reads back the actual CAPCTRL value that the VCO calibration has chosen. Table 7-50. R70 Register Field Descriptions BIT 8:0 FIELD rb_VCO_DACISET TYPE DEFAULT DESCRIPTION R - Reads back the actual DACISET value that the VCO calibration has chosen. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 29 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 8 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 8.1 Application Information 8.1.1 Optimization of Spurs 8.1.1.1 Understanding Spurs by Offsets The first step in optimizing spurs is to be able to identify them by offset. Figure 8-1 gives a good example that can be used to isolate the following spur types. x6 1/2 fPD 120 MHz Phase Detector 1/8 fOUT 606.25 MHz fOSC 40 MHz fVCO 4850 MHz 20 + 50/240 Fnum = 5 Fden = 24 1/2 PLL_N_PRE = 2 Figure 8-1. Spur Offset Frequency Example Based on Figure 8-1, the most common spurs can be calculated from the frequencies. Note that the % is the modulus operator and is meant to mean the difference to the closest integer multiple. Some examples of how to use this operator are: 36 % 11 = 3, 1000.1 % 50 = 0.1, and 5023.7 % 122.88 = 14.38. Applying this concept, the spurs at various offsets can be identified from Figure 8-1. Table 8-1. Spur Definition Table SPUR TYPE 30 OFFSET IN Figure 8-1 COMMENTS OSCin OFFSET fOSC 40 MHz This spur occurs at harmonics of the OSCin frequency. Fpd fPD 120 MHz The phase detector spur has many possible mechanisms and occurs at multiples of the phase detector frequency. fOUT % fOSC fOUT % fOSC 606.25 % 40 = 6.25 MHz This spur is caused by mixing between the output and input frequencies. fVCO% fOSC fVCO % fOSC 4850 % 40 = 10 MHz This spur is caused by mixing between the VCO and input frequencies. fVCO% fPD fVCO % fPD 4850 % 120 = 50 MHz This spur would be the same offset as the integer boundary spur if PLL_N_PRE=1, but can be different if this value is greater than one. Integer Boundary fPD *(Fnum%Fden)/ Fden) 120 × (5%24)/24 = 25 MHz This is a single spur Primary Fractional fPD / Fden 120 / 24 = 5 MHz The primary fractional Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table 8-1. Spur Definition Table (continued) SPUR TYPE OFFSET Sub-Fractional fPD / Fden / k k=2,3, or 6 OFFSET IN Figure 8-1 COMMENTS First Order Modulator: None 2nd Order Modulator: 120/24/2 = 2.5 MHz 3rd Order Modulator: 120/24/6 = 0.83333 MHz 4th Order Modulator: 120/24/12 = 0.416666 MHz To Calculate k: 1st Order Modulator: k=1 2nd Order Modulator: k=1 if Fden is odd, k=2 if Fden is even 3rd Order Modulator: k=1 if Fden not divisible by 2 or 3, k=2 if Fden divisible by 2 not 3, k=3 if Fden divisible by 3 but not 2, Fden = 6 if Fden divisible by 2 and 3 4th Order Modulator: k=1 if Fden not divisible by 2 or 3. k=3 if Fden divisible by 3 but not 2, k=4 if Fden divisible by 2 but not 3, k=12 if Fden divisible by 2 and 3 Sub-Fractional Spurs exist if k>1 In the case that two different spur types occur at the same offset, either name would be correct. Some may name this by the more dominant cause, while others would simply name by choosing the name that is near the top of Table 8-1. 8.1.1.2 Spur Mitigation Techniques Once the spur is identified and understood, there will likely be a desire to try to minimize them. Spurs and Mitigation Techniques gives some common methods. Spurs and Mitigation Techniques SPUR TYPE WAYS TO REDUCE TRADE-OFF OSCin 1. 2. Use PLL_N_PRE = 2 Use an OSCin signal with low amplitude and high slew rate (like LVDS). Phase Detector 1. 2. Decrease PFD_DLY To pin 11, use a series ferrite bead and a shunt 0.1-µF capacitor. fOUT % fOSC Use an OSCin signal with low amplitude and high slew rate (like LVDS) fVCO% fOSC 1. 2. 3. To pin 7, use a series ferrite bead and a shunt 0.1-µF capacitor. Increase the offset of this spur by shifting the VCO frequency If multiple VCO frequencies are possible that yield the same spur offset, choose the higher VCO frequency. . fVCO% fPD Avoid this spur by shifting the phase detector frequency (with the programmable input multiplier or R divider) or shifting the VCO frequency. This spur is better at higher VCO frequency. Methods for PLL Dominated Spurs 1. 2. 3. 4. Integer Boundary 5. Avoid the worst case VCO frequencies if possible. Strategically choose which VCO core to use if possible. Ensure good slew rate and signal integrity at the OSCin pin Reduce the loop bandwidth or add more filter poles for out of band spurs Experiment with modulator order and PFD_DLY Reducing the loop bandwidth may degrade the total integrated noise if the bandwidth is too narrow. Methods for VCO Dominated Spurs 1. 2. 3. 4. Avoid the worst case VCO frequencies if possible. Reduce Phase Detector Frequency Ensure good slew rate and signal integrity at the OSCin pin Make the impedance looking outwards from the OSCin pin Reducing the phase detector may degrade the phase noise and also reduce the capacitance at the Vtune pin. close to 50 Ω. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 31 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Spurs and Mitigation Techniques (continued) SPUR TYPE Primary Fractional Sub-Fractional WAYS TO REDUCE TRADE-OFF 1. 2. 3. Decrease Loop Bandwidth Change Modulator Order Use Larger Unequivalent Fractions Decreasing the loop bandwidth too much may degrade in-band phase noise. Also, larger unequivalent fractions only sometimes work 1. 2. 3. 4. 5. 6. Use Dithering Use MASH seed Use Larger Equivalent Fractions Use Larger Unequivalent Fractions Reduce Modulator Order Eliminate factors of 2 or 3 in denominator (see AN-1879 Fractional N Frequency Synthesis (SNAA062) Dithering and larger fractions may increase phase noise. MASH_SEED can be set between values 0 and Fden, which changes the sub-fractional spur behavior. This is a deterministic relationship and there will be one seed value that will give best result for this spur. 8.1.2 Configuring the Input Signal Path The input path is considered the portion of the device between the OSCin pin and the phase detector, which includes the input buffer, R dividers, and programmable multipliers. The way that these are configured can have a large impact on phase noise and fractional spurs. 8.1.2.1 Input Signal Noise Scaling The input signal noise scales by 20 × log(output frequency / input signal frequency), so always check this to see if the noise of the input signal scaled to the output frequency is close to the PLL in-band noise level. When that happens, the input signal noise is the dominant noise source, not the PLL noise floor. 0 0 5400 MHz output phase noise 100 MHz input signal phase noise 100 MHz input signal phase noise scaled to 5400 MHz -40 -60 -80 -100 -120 -40 -60 -80 -100 -120 -140 -140 -160 -160 -180 100 1k 10k 100k Offset (Hz) 1M 5400 MHz output phase noise 100 MHz input signal phase noise 100 MHz input signal phase noise scaled to 5400 MHz -20 Phase Noise (dBc/Hz) Phase Noise (dBc/Hz) -20 -180 100 10M D001 Figure 8-2. Phase Noise of 5.4-GHz Output With Low-Noise Input Signal 1k 10k 100k Offset (Hz) 1M 10M D002 Figure 8-3. Phase Noise of 5.4-GHz Output With High-Noise Input Signal 8.1.3 Input Pin Configuration The OSCinM and OSCinP can be used to support both a single-ended or differential clock. In either configuration, the termination on both sides should match for best common-mode noise rejection. The slew rate and signal integrity of this signal can have an impact on both the phase noise and fractional spurs. Standard clocking types, LVDS, LVPECL, HCSL, and CMOS can all be used. 8.1.4 Using the OSCin Doubler The lowest PLL flat noise is achieved with a low-noise 200-MHz input signal. If only a low-noise input signal with lower frequency is available (for example a 100-MHz source), you can use the low noise OSCin doubler to attain 200-MHz phase detector frequency. Because PLL_flat = PLL_FOM + 20 × log(Fvco/Fpd) + 10 × log(Fpd / 1Hz), doubling Fpd theoretically gets –6 dB from the 20 × log(Fvco/Fpd) component, +3 dB from the 10 × log(Fpd / 1Hz) component, and cumulatively a –3-dB improvement. 32 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 -80 Input = 100M_PFD = 100M_VCO = 6000M Input = 100M_osc2x = 2_PFD = 200M _VCO = 6000M Phase Noise (dBc/Hz) -85 -90 -95 -100 -105 -110 -115 -120 100 1k 10k Offset (Hz) 100k 1M D008 Figure 8-4. 100-MHz Input With OSCin Doubler 8.1.5 Using the Input Signal Path Components The ideal input is a low-noise, 200-MHz (or multiples of it) signal and 200-MHz phase detector frequency (highest dual PFD frequency). However, if spur mechanisms are understood, certain combinations of the Rdivider and Multiplier can help. Refer to the Optimization of Spurs section for understanding spur types and their mechanisms first, then try this section for these specific spurs. 8.1.5.1 Moving Phase Detector Frequency Engaging the multiplier in the reference path allows more flexibility in setting the PFD frequency. One example use case of this is if Fvco % Fpd is the dominant spur. This method can move the PFD frequency and thus the Fvco % Fpd. Example: Fvco = 3720.12 MHz, Fosc = 300 MHz, Pre-R divider = 5, Fpd = 60 MHz, Fvco%Fosc = 120.12 MHz (Far out), Fvco%Fpd = 120 kHz (dominant). There is a Fvco%Fpd spur at 120 kHz (refer to Figure 8-5). Figure 8-5. Fvco % Fpd Spur Then second case, using divider and multiplier, is Fpd = 53.57 MHz away from 120-kHz spur. Fvco = 3720.12MHz, Fosc = 300MHz, Pre-R divider = 7, Multiplier = 5, Post-R divider = 4, Fpd = 53.57 MHz, Fvco%Fosc = 120.12 MHz (Far out). Fvco % Fpd = 23.79 MHz (far out). There is a 20–dB reduction for the Fvco % Fpd spur at 120 kHz (refer to Figure 8-6). Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 33 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Figure 8-6. Moving Away From Fvco % Fpd Spur 8.1.5.2 Multiplying and Dividing by the Same Value Although it may not seem like the first thing to try, the Fvco%Fosc and Fout%Fosc spur can sometimes be improved engaging the OSC_2X bit and then dividing by 2. Although this gives the same phase detector frequency, the spur can be improved. 8.1.6 Designing for Output Power If there is a desired frequency for highest power, use an inductor pullup and design for the value so that the resonance is at that frequency. Use the formula SRF = 1 / (2π× sqrt[L × C]). Example: C = 1.4 pF (characteristic). If maximum power is targeted at 1 GHz, L = 18 nH. If maximum power is targeted at 3.3 GHz, L = 1.6 nH 25 1.6 nH pull-up 18 nH pull-up 50 : pull-up Output Power (dBm) 20 15 10 5 0 -5 -10 100 200 500 1000 2000 Output Frequency (MHz) 5000 9500 D006 Figure 8-7. Output Power vs Pullup Type 8.1.7 Current Consumption Management The starting point is the typical total current consumption of 250 mA: 100-MHz input frequency, OSCin doubler bypassed, Pre-R divider bypassed, multiplier bypassed, post-R divider bypassed, 100-MHz phase detector frequency, 0.468-mA charge pump current, channel divider off, one output on, 6000-MHz output frequency, 50-Ω output pullup, 0-dBm output power (differential). To understand current consumption changes due to engaging different functional blocks , refer to Table 8-2. 34 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 Table 8-2. Typical Current Consumption Impact By Function ACTION STEPS PROGRAMMING INCREASE IN CURRENT (mA) Use input signal path Enable OSCin doubler OSC_2X = 1 7 Enable multiplier MULT = 3,4,5, or 6 10 Add an output Route VCO to output B VCO_DISTB_PD = 0 8 Enable output B buffer OUTB_PD = 0 54 Increase output power from 0 to +10dBm (differential) Set highest output buffer current OUTA_POW = 63 53 Use channel divider Route channel divider to output CHDIV_DISTA_EN = 1 5 Enable channel divider CHDIV_EN = 1 18 Enable chdiv_seg1 CHDIV_SEG1_EN = 1 2 Enable chdiv_seg2 CHDIV_SEG2_EN = 1 5 Enable chdiv_seg3 CHDIV_SEG3_EN = 1 5 Enable VCO doubler VCO2X_EN 16 Using VCO doubler 8.1.8 Decreasing Lock Time A calibration time of 590 µs typically to lock to 7-GHz VCO can be achieved with default settings as specified in the Electrical Characteristics table. There are several registers that can be programmed to speed up this time. Lock time consists of the calibration time (time required to calibrate the VCO to the correct frequency range) plus the analog settling time (time lock the PLL in phase and frequency). For fast calibration set registers FCAL_FAST = 1 and ACAL_FAST = 1. Also set the calibration clock frequency [input reference frequency] / 2^CAL_CLK_DIV) to 200 MHz. The 20-µs range lock time can be achieved if the amplitude comparator delay is low, set by register ACAL_CMP_DLY (5 in this example). If this is too low there is not enough time to make the decision of VCO amplitude to use and may result in non-optimal phase noise. The other approach is to turn off amplitude calibration with ACAL_EN=0, then manually choose the amplitude with VCO_IDAC (350 for example). This will also result in 20-µs range calibration time. There are many other registers that can aid calibration time, for example ACAL_VCO_IDAC_STRT lets the user choose what VCO amplitude to start with during amplitude calibration. Setting this value to around 350 will give faster times because it is close to the final amplitude for most final frequencies. FCAL_VCO_SEL_START allows you to choose the VCO core to start with for the calibration instead of starting from core 7 by default. If you know you are locking to a frequency around VCO core 1, you can start from VCO 2 by setting VCO_SEL=2, which should give faster lock times. Go to the Register Maps section for detailed information of these registers and their related registers. For fast analog settling time, design loop filter for very wide loop bandwidth (MHz range). Figure 8-8. Lock Time Screenshot Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 35 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 The calibration example as shown in Figure 8-8 sweeps from the top of the VCO frequency range to the bottom. This example does a calibration to lock at 3.7 GHz (which is longest lock time scenario). For the left screenshot (Wideband Frequency view), see the sweeping from top to bottom of the VCO range. On the right screenshot (Narrowband Frequency view), see the analog settling time to the precise target frequency. 8.1.9 Modeling and Understanding PLL FOM and Flicker Noise Follow these recommended settings to design for wide loop bandwidth and extract FOM and flicker noise. The flat model is the PLL noise floor modeled by: PLL_flat = PLL_FOM + 20 × log(Fvco/Fpd) + 10 × log(Fpd / 1 Hz). The flicker noise (also known as 1/f noise) which changes by –10dB / decade, is modeled by: PLL_flicker (offset) = PLL_flicker_Norm + 20 × log(Fvco / 1 GHz) – 10 × log(offset / 10k Hz). The cumulative model is the addition of both components: PLL_Noise = 10*log(10PLL_Flat / 10 + 10PLL_flicker / 10). This is adjusted to fit the measured data to extract the PLL_FOM and PLL_flicker_Norm spec numbers. Table 8-3. Wide Loop Filter Design PARAMETER VALUE PFD (MHz) 200 Charge pump (mA) 12 VCO frequency (MHz) 5400 Loop bandwidth (kHz) 2000 Phase margin (degrees) 30 Gamma 1.4 Loop filter (2nd order) C1 (nF) 0.01 C2 (nF) 0.022 R2 (kΩ) 4.7 -90 Data Flicker Flat Model -95 Noise (dBc/Hz) -100 -105 -110 -115 -120 -125 1k 10k 100k Offset (Hz) 1M D003 Figure 8-9. FOM and Flicker Noise Modeling 8.1.10 External Loop Filter The LMX2592 requires an external loop filter that is application-specific and can be configured by the PLLatinum™ simulation tool found here. For the LMX2592, it matters what impedance is seen from the Vtune pin looking outwards. This impedance is dominated by the component C3 for a third order filter or C1 for a second order filter. If there is at least 3.3 nF for the capacitance that is shunt with this pin, the VCO phase noise will be close to the best it can be. If there is less, the VCO phase noise in the 100-kHz to 1-MHz region will degrade. This capacitor should be placed close to the Vtune pin. 36 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 3 1 3 2 3 5 3 6 3 3 3 0 Vtune 1 3 4 3 7 3 8 3 9 4 0 C3 2 3 4 2 9 2 8 2 7 2 6 2 4 2 3 2 2 2 0 1 9 1 8 2 1 1 7 1 1 1 0 1 6 9 2 5 1 5 8 1 4 7 1 3 6 1 2 CPout 5 R3 C1 R2 C2 Figure 8-10. External Loop Filter 8.2 Typical Application 8.2.1 Design for Low Jitter Figure 8-11. Typical Application Schematic Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 37 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 8.2.1.1 Design Requirements Refer to the design parameters shown in Table 8-4. Table 8-4. Design Information PARAMETER VALUE PFD (MHz) 200 Charge pump (mA) 20 VCO frequency (MHz) 6000 Loop bandwidth (kHz) 210 Phase margin (degrees) 70 Gamma 3.8 Loop filter (2nd order) C1 (nF) 4.7 C2 (nF) 100 R2 (Ω) 68 8.2.1.2 Detailed Design Procedure The integration of phase noise over a certain bandwidth (jitter) is an performance specification that translates to signal-to-noise ratio. Phase noise inside the loop bandwidth is dominated by the PLL, while the phase noise outside the loop bandwidth is dominated by the VCO. As a rule of thumb, jitter is lowest if loop bandwidth is designed to the point where the two intersect. A higher phase margin loop filter design has less peaking at the loop bandwidth and thus lower jitter. The tradeoff with this as longer lock times and spurs should be considered in design as well. 8.2.1.3 Application Curve Figure 8-12. Typical Jitter 8.3 Power Supply Recommendations TI recommends placing 100-nF spurs close to each of the power supply pins. If fractional spurs are a large concern, using a ferrite bead to each of these power supply pins can reduce spurs to a small degree. 38 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 8.4 Layout 8.4.1 Layout Guidelines See EVM instructions for details. In general, the layout guidelines are similar to most other PLL devices. The followings are some outstanding guidelines. • • • • Place output pull up components close to the pin. Place capacitors close to the pins. Make sure input signal trace is well matched. Do not route any traces that carrying switching signal close to the charge pump traces and external VCO. 8.4.2 Layout Example Figure 8-13. Recommended Layout Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 39 LMX2592 www.ti.com SNAS646G – DECEMBER 2015 – REVISED AUGUST 2022 9 Device and Documentation Support 9.1 Device Support 9.1.1 Development Support Texas Instruments has several software tools to aid in the development at www.ti.com. Among these tools are: • • • • Codeloader to understand how to program the EVM board. Clock Design Tool for designing loop filters, simulating phase noise, and simulating spurs. EVM board instructions for seeing typical measured data with detailed measurement conditions and a complete design. Clock Architect for designing and simulating the device and understanding how it might work with other devices. 9.2 Documentation Support 9.2.1 Related Documentation The following are recommended reading. • • • • • • AN-1879 Fractional N Frequency Synthesis (SNAA062) PLL Performance, Simulation, and Design Handbook (SNAA106) 9.8 GHz RF High Performance Synthesizer Operating From a Buck Converter Reference Design (TIDUC22) RF Sampling S-Band Radar Receiver Reference Design (TIDUBS6) 9.8GHz RF CW Signal Generator Using Integrated Synthesizer With Spur Reduction Reference Design (TIDUBM1) 2-GHz Complex Bandwidth DC-Coupled 14-bit Digitizer Reference Design (TIDRLM6) 9.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 9.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 9.5 Trademarks PLLatinum™ and TI E2E™ are trademarks of Texas Instruments. All trademarks are the property of their respective owners. 9.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 9.7 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 10 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 40 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMX2592 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LMX2592RHAR ACTIVE VQFN RHA 40 2500 RoHS & Green NIPDAUAG Level-3-260C-168 HR -40 to 85 LMX2592 LMX2592RHAT ACTIVE VQFN RHA 40 250 RoHS & Green NIPDAUAG Level-3-260C-168 HR -40 to 85 LMX2592 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of