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MAX3222IDWR

MAX3222IDWR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOIC20

  • 描述:

    MAX3222 3-V TO 5.5-V MULTICHANNE

  • 数据手册
  • 价格&库存
MAX3222IDWR 数据手册
Sample & Buy Product Folder Support & Community Tools & Software Technical Documents MAX3222 SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 MAX3222 3-V to 5.5-V Multichannel RS-232 Line Driver and Receiver With ±15-kV ESD Protection 1 Features 3 Description • The MAX3222 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver output slew rate. 1 • • • • • • • • RS-232 Bus-Pin ESD Protection Exceeds ±15 kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates Up to 250 kbps Two Drivers and Two Receivers Low Standby Current: 1 µA Typical External Capacitors: 4 × 0.1 µF Accepts 5-V Logic Input With 3.3-V Supply Alternative High-Speed Pin-Compatible Device (1 Mbps) – SNx5C3222 2 Applications • • • • • • Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-held Equipment The MAX3222 can be placed in the power-down mode by setting PWRDOWN low, which draws only 1 μA from the power supply. When the device is powered down, the receivers remain active while the drivers are placed in the high-impedance state. Receiver outputs also can be placed in the highimpedance state by setting EN high. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) MAX3222CDW, MAX322IDW SOIC (20) 12.80 mm × 7.50 mm MAX3222CDB, MAX322IDB SSOP (20) 7.20 mm × 5.30 mm MAX3222CPW, MAX322IPW TSSOP (20) 6.50 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Block Diagram DIN1 DIN2 PWRDOWN EN ROUT1 ROUT2 13 17 DOUT1 12 8 DOUT2 20 Powerdown 1 15 16 10 9 RIN1 RIN2 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. MAX3222 SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 4 4 4 5 5 5 6 6 6 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: Device.............................. Electrical Characteristics: Driver ............................... Electrical Characteristics: Receiver .......................... Switching Characteristics: Driver .............................. Switching Characteristics: Receiver.......................... Typical Characteristics ............................................ Parameter Measurement Information .................. 8 Detailed Description ............................................ 10 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 10 10 11 11 Application and Implementation ........................ 12 9.1 Application Information............................................ 12 9.2 Typical Application ................................................. 12 10 Power Supply Recommendations ..................... 13 11 Layout................................................................... 13 11.1 Layout Guidelines ................................................. 13 11.2 Layout Example .................................................... 14 12 Device and Documentation Support ................. 15 12.1 12.2 12.3 12.4 12.5 Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 15 15 15 15 15 13 Mechanical, Packaging, and Orderable Information ........................................................... 15 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (March 2004) to Revision H Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1 • Deleted ODERING INFORMATION table; see POA at the end of the datasheet. ................................................................ 3 • Changed RθJA for DB, DW and PW package from: 70 °C/W to 84.4°C/W (DB), 58 °C/W to 70.2 °C/W (DW) and 83 °C/W to 94.3 °C/W (PW) in the Thermal Information table. ................................................................................................... 5 2 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 MAX3222 www.ti.com SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 5 Pin Configuration and Functions DB, DW, or PW Package 20-Pin SOIC, SSOP, TSSOP Top View EN C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 ROUT2 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 PWRDOWN VCC GND DOUT1 RIN1 ROUT1 NC DIN1 DIN2 NC NC − No internal connection Pin Functions PIN NAME NO. I/O DESCRIPTION C1+ 2 — Charge pump capacitor pin C1- 4 — Charge pump capacitor pin C2+ 5 — Charge pump capacitor pin C2- 6 — Charge pump capacitor pin DIN1 13 I Driver logic input DIN2 12 I Driver logic input DOUT1 17 O RS-232 driver output DOUT2 8 O RS-232 driver output Receiver enable, active low EN 1 I GND 18 — Ground 11,14 — No internal connection PWRDOWN 20 I Driver disable, active low RIN1 16 I RS-232 receiver input RIN2 9 I RS-232 receiver input ROUT1 15 O Receiver logic output ROUT2 10 O Receiver logic output VCC 19 — Power Supply V+ 3 — Charge pump capacitor pin V- 7 — Charge pump capacitor pin NC Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 3 MAX3222 SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) Supply voltage, VCC (2) Positive output supply voltage, V+ (2) Negative output supply voltage, V– (2) MIN MAX UNIT –0.3 6 V –0.3 7 V 0.3 -7 V 13 V Supply voltage difference, V+ – V– Input voltage, VI Output voltage, VO Drivers, EN, PWRDOWN –0.3 6 Receiver –25 25 Drivers –13.2 13.2 Receivers –0.3 VCC + 0.3 Operating virtual junction temperature, TJ Storage temperature, Tstg (1) (2) –65 V V 150 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. 6.2 ESD Ratings VALUE V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 RIN, DOUT, and GND pins (1) Charged-device model (CDM), per JEDEC specification JESD22C101 (2) (1) (2) Pins 8, 9, 16, 17 and 18 ±15000 All other pins ±3000 All pins ±1500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1). See Figure 8. Supply voltage VCC = 3.3 V VCC = 5 V VIH Driver and control high-level input voltage DIR, EN, PWRDOWN VIL Driver and control low-level input voltage DIR, EN, PWRDOWN VI Driver and control input voltage DIR, EN, PWRDOWN VI Receiver input voltage TA (1) 4 Operating free-air temperature VCC = 3.3 V VCC = 5 V MAX3222C MAX3222I MIN NOM MAX 3 3.3 3.6 4.5 5 5.5 2 UNIT V V 2.4 0.8 V 0 5.5 V –25 25 V 0 70 –40 85 ºC Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 MAX3222 www.ti.com SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 6.4 Thermal Information MAX3222 THERMAL METRIC (1) (2) (3) DB (SSOP) DW (SOIC) PW (TSSOP) UNIT 20 PINS 20 PINS 20 PINS RθJA Junction-to-ambient thermal resistance 84.4 70.2 94.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 44.1 36.2 29.9 °C/W RθJB Junction-to-board thermal resistance 40 37.9 45.1 °C/W ψJT Junction-to-top characterization parameter 11 11.1 1.4 °C/W ψJB Junction-to-board characterization parameter 39.5 37.5 44.6 °C/W (1) (2) (3) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. 6.5 Electrical Characteristics: Device over operating free-air temperature range (unless otherwise noted) (1). See Figure 8. PARAMETER II ICC (1) (2) TEST CONDITIONS MIN Input leakage current (EN, PWRDOWN) Supply current No load, PWRDOWN at VCC Supply current (powered off) No load, PWRDOWN at GND TYP (2) MAX ±0.01 ±1 µA 0.3 1 mA 1 10 µA UNIT Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. 6.6 Electrical Characteristics: Driver over operating free-air temperature range (unless otherwise noted) (1). See Figure 8. PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 V VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 V IIH High-level input current VI = VCC ±0.01 ±1 µA IIL Low-level input current VI at GND ±0.01 ±1 µA ±35 ±60 mA IOS Short-circuit output current ro Output resistance Ioff (1) (2) Output leakage current VCC = 3.6 V, VO = 0 V VCC = 5.5 V, VO = 0 V VCC, V+, and V– = 0 V, VO = ±2 V 300 10M Ω PWRDOWN = GND, VO = ±12 V, VCC = 3 V to 3.6 V ±25 PWRDOWN = GND, VO = ±10 V, VCC = 4.5 V to 5.5 V ±25 µA Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 5 MAX3222 SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 www.ti.com 6.7 Electrical Characteristics: Receiver over operating free-air temperature range (unless otherwise noted) (1). See Figure 8. PARAMETER MIN TYP (2) VCC – 0.6 VCC – 0.1 TEST CONDITIONS MAX VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA VIT+ Positive-going input threshold voltage VCC = 3.3 V 1.5 2.4 VCC = 5 V 1.8 2.4 VIT– Negative-going input threshold voltage VCC = 3.3 V 0.6 1.2 VCC = 5 V 0.8 1.5 Vhys Input hysteresis (VIT+ – VIT–) Ioff Output leakage current EN = VCC ri Input resistance VI = ±3 V to ±25 V (1) (2) V 0.4 V V V 0.3 3 UNIT V ±0.05 ±10 µA 5 7 kΩ Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. 6.8 Switching Characteristics: Driver over operating free-air temperature range (unless otherwise noted) (1). See Figure 8. PARAMETER TEST CONDITIONS MIN TYP (2) Maximum data rate CL = 1000 pF, RL = 3 kΩ, One DOUT switching, see Figure 3 150 250 kbps tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, see Figure 4 300 ns SR(tr) Slew rate, transition region (see Figure 3) RL = 3 kΩ to 7 kΩ, VCC = 3.3 V (1) (2) (3) MAX CL = 150 pF to 1000 pF 6 30 CL = 150 pF to 2500 pF 4 30 UNIT V/µs Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. 6.9 Switching Characteristics: Receiver over operating free-air temperature range (unless otherwise noted) (1). See Figure 8. PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT tPLH Propagation delay time, low- to highCL = 150 pF, see Figure 5 level output 300 ns tPHL Propagation delay time, high- to lowCL = 150 pF, see Figure 5 level output 300 ns ten Output enable time CL = 150 pF, RL = 3 kΩ, see Figure 6 200 ns tdis Output disable time CL = 150 pF, RL = 3 kΩ, see Figure 6 200 ns tsk(p) Pulse skew (3) See Figure 5 300 ns (1) (2) (3) 6 Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 MAX3222 www.ti.com SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 6.10 Typical Characteristics 6 0 5 -1 4 -2 DOUT (V) DOUT (V) TA = 25° C; VCC = 3.3V 3 -3 2 -4 1 -5 0 -6 0 2 4 6 8 10 12 14 16 DOUT VOH vs. DOUT Current 18 20 0 2 D001 Figure 1. Driver VOH vs Load Current 4 6 8 10 12 14 16 DOUT VOL vs. DOUT Current 18 Product Folder Links: MAX3222 D002 Figure 2. Driver VOL vs Load Current Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated 20 7 MAX3222 SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 www.ti.com 7 Parameter Measurement Information 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V CL (see Note A) tTHL 3V PWRDOWN tTLH VOH 3V 3V Output −3 V −3 V VOL TEST CIRCUIT VOLTAGE WAVEFORMS SR(tr) t THL 6V or t TLH NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω RL Input 1.5 V 1.5 V 0V CL (see Note A) tPHL tPLH VOH 3V PWRDOWN 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 4. Driver Pulse Skew EN 0V 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 5. Receiver Propagation Delay Times 8 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 MAX3222 www.ti.com SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 Parameter Measurement Information (continued) VCC S1 GND RL Output 3 V or 0 V CL (see Note A) EN 3V Input 1.5 V 0V tPZH (S1 at GND) tPHZ S1 at GND) VOH Output 50% 0.3 V Generator (see Note B) 1.5 V 50 Ω tPLZ (S1 at VCC) 0.3 V Output 50% VOL tPZL (S1 at VCC) TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 6. Receiver Enable and Disable Times Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 9 MAX3222 SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 www.ti.com 8 Detailed Description 8.1 Overview The MAX3222 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA232-F and provides the electrical interface between an asynchronous communication controller and the serialport connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver output slew rate. The MAX3222 can be placed in the power-down mode by setting PWRDOWN low, which draws only 1 μA from the power supply. When the device is powered down, the receivers remain active while the drivers are placed in the high-impedance state. Also, during power down, the onboard charge pump is disabled; V+ is lowered to VCC, and V− is raised toward GND. Receiver outputs also can be placed in the high-impedance state by setting EN high. 8.2 Functional Block Diagram DIN1 DIN2 PWRDOWN EN ROUT1 ROUT2 13 17 DOUT1 12 8 DOUT2 20 Powerdown 1 15 16 10 9 RIN1 RIN2 Figure 7. Logic Diagram (Positive Logic) 10 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 MAX3222 www.ti.com SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 8.3 Feature Description 8.3.1 Power The power block increases, inverts, and regulates voltage at V+ and V- pins using a charge pump that requires four external capacitors. 8.3.2 RS232 Driver Two drivers interface standard logic level to RS232 levels. PWRDOWN input low turns driver off and PWRDOWN input high turns driver on. Both DIN inputs and PWRDOWN input must be valid high or low. Do not float logic input pins. 8.3.3 RS232 Receiver Two receivers interface RS232 levels to standard logic levels. An open input will result in a high output on ROUT. Each RIN input includes an internal standard RS232 load. EN input low turns on both ROUT pins. EN input high puts both ROUT pins into high impedance state, output off. EN input must be valid high or low. Do not float logic input pins. 8.4 Device Functional Modes Driver and receiver outputs are controlled by the functional truth tables. Table 1. Functional Table - Each Driver (1) INPUTS DIN (1) PWRDOWN OUTPUT DOUT X L Z L H H H H L H = high level, L = low level, X = irrelevant, Z = high impedance Table 2. Functional Table - Each Receiver (1) INPUTS (1) RIN EN OUTPUT ROUT L L H L H L X H Z Open L H H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 11 MAX3222 SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The MAX3222 interfaces a universal asynchronous receiver / transmitter (UART) to RS-232 port voltage levels. External capacitors are used to generate RS-232 compliant voltages. For proper operation, add capacitors as shown in Figure 8. 9.2 Typical Application ROUT and DIN connect to UART or general purpose logic lines. RIN and DOUT lines connect to a RS232 connector or cable. 1 EN Powerdown 2 VCC C1+ + C1 − 3 PWRDOWN 19 18 V+ + 20 + C BYPASS − = 0.1 µF GND C3 − 17 4 DOUT1 C1− 5 16 C2+ RIN1 + C2 − 6 7 − C4 DOUT2 RIN2 ROUT2 15 C2− ROUT1 14 V− NC + 8 13 9 12 10 11 DIN1 DIN2 NC C3 can be connected to VCC or GND. Resistor values shown are nominal. NC − No internal connection Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Figure 8. Recommended Application Schematic 9.2.1 Design Requirements • • Recommended VCC is 3.3 V or 5 V. 3 V to 5.5 V is also possible Maximum recommended bit rate is 250 kbit/s. Table 3. VCC vs Capacitor Values 12 VCC C1 C2, C3, and C4 3.3 V ± 0.3 V 0.1 µF 0.1 µF 5 V ± 0.5 V 0.047 µF 0.33 µF 3 V ± 5.5 V 0.1 µF 0.47 µF Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 MAX3222 www.ti.com SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 9.2.2 Detailed Design Procedure • • All DIN, PWRDOWN and EN inputs must be connected to valid low or high logic levels. Select capacitor values based on VCC level for best performance. 8 8 6 6 4 4 Voltage (V) Voltage (V) 9.2.3 Application Curves 2 0 -2 2 0 -2 DIN DOUT ROUT -4 DIN DOUT ROUT -4 -6 -6 0 1 2 3 4 5 6 Time (us) 7 8 9 10 0 1 D004 Figure 9. Loopback Waveforms VCC = 3.3 V, Data Rate 250 kbit/s 2 3 4 5 6 Time (us) 7 8 9 10 D003 Figure 10. Loopback Waveforms with 1-nF load VCC = 3.3 V, Data Rate 250 kbit/s 10 Power Supply Recommendations VCC should be between 3 V and 5.5 V. Charge pump capacitors should be chosen using table in Table 3. 11 Layout 11.1 Layout Guidelines Keep the external capacitor traces short. This is more important on C1 and C2 nodes that have the fastest rise and fall times. Make the impedance from MAX3222 ground pin and circuit board's ground plane as low as possible for best ESD performance. Use wide metal and multiple vias on both sides of ground pin Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 13 MAX3222 SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 www.ti.com 11.2 Layout Example 1 EN Ground C3 PWRDOWN 20 2 C1+ VCC 19 VCC PF C1 3 V+ GND 18 4 C1- DOUT1 17 5 C2+ RIN1 16 6 C2- ROUT1 15 Ground C2 7 V- Ground NC 14 C4 8 DOUT2 DIN1 13 9 RIN2 DIN2 12 10 ROUT2 NC 11 Figure 11. MAX3222 Layout 14 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 MAX3222 www.ti.com SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: MAX3222 15 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) MAX3222CDB ACTIVE SSOP DB 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3222C Samples MAX3222CDBR ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3222C Samples MAX3222CDBRE4 ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3222C Samples MAX3222CDBRG4 ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3222C Samples MAX3222CDW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3222C Samples MAX3222CDWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3222C Samples MAX3222CPWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3222C Samples MAX3222IDB ACTIVE SSOP DB 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3222I Samples MAX3222IDBR ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3222I Samples MAX3222IDBRE4 ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3222I Samples MAX3222IDW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3222I Samples MAX3222IDWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3222I Samples MAX3222IPWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3222I Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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