MAX3232EIDRG4

MAX3232E SLLS664E – AUGUST 2005 – REVISED JUNE 2021 MAX3232E 3-V to 5.5-V Multichannel RS-232 Line Driver and Receiver With ±15-kV IEC ESD Protection 1 Features 3 Description • The MAX3232E device consists of two line drivers, two-line receivers, and a dual charge-pump circuit with ±15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). • • • • • • • • ESD protection for RS-232 bus pins – ±15 kV (HBM) – ±8 kV (IEC61000-4-2, Contact discharge) – ±15 kV (IEC61000-4-2, Air-gap discharge) Meets or exceeds the requirements of TIA/ EIA-232-F and ITU V.28 standards Operates with 3-V to 5.5-V VCC supply Operates up to 250 kbit/s Two drivers and two receivers Low supply current: 300 μA (typical) External capacitors: 4 × 0.1 μF Accepts 5-V logic input with 3.3-V supply Pin compatible to alternative high-speed devices (1 Mbit/s) – SN65C3232E (–40°C to +85°C) – SN75C3232E (0°C to 70°C) The device meets the requirements of TIA/EIA-232F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver output slew rate. Device Information(1) PART NUMBER 2 Applications • • • • • • • MAX3232E Industrial PCs Wired networking Data center and enterprise computing Battery-powered systems Notebooks Palmtop PCs Hand-held equipment (1) 3.3 V, 5 V BODY SIZE (NOM) SOIC (D) (16) 9.90 mm × 3.91 mm SSOP (DB) (16) 6.20 mm × 5.30 mm SOIC (DW) (16) 10.30 mm × 7.50 mm TSSOP (PW) (16) 5.00 mm × 4.40 mm For all available packages, see the orderable addendum at the end of the data sheet. POWER 2 DIN 2 TX DOUT RS232 2 ROUT PACKAGE RX 2 RIN RS232 Simplified Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Ratings........................................ 4 6.2 ESD Ratings............................................................... 4 6.3 ESD Ratings - IEC Specifications............................... 4 6.4 Recommended Operating Conditions(1) .................... 4 6.5 Thermal Information....................................................5 6.6 Electrical Characteristics — Device(1) ........................5 6.7 Electrical Characteristics — Driver(1) ......................... 5 6.8 Electrical Characteristics — Receiver(2) .................... 6 6.9 Switching Characteristics(1) ....................................... 6 6.10 Typical Characteristics.............................................. 7 7 Parameter Measurement Information............................ 8 8 Detailed Description........................................................9 8.1 Overview..................................................................... 9 8.2 Functional Block Diagram........................................... 9 8.3 Feature Description.....................................................9 8.4 Device Functional Modes..........................................10 9 Application and Implementation.................................. 11 9.1 Application Information..............................................11 9.2 Typical Application.................................................... 11 10 Power Supply Recommendations..............................12 11 Layout........................................................................... 13 11.1 Layout Guidelines................................................... 13 11.2 Layout Example...................................................... 13 12 Device and Documentation Support..........................14 12.1 Receiving Notification of Documentation Updates..14 12.2 Support Resources................................................. 14 12.3 Trademarks............................................................. 14 12.4 Electrostatic Discharge Caution..............................14 12.5 Glossary..................................................................14 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (May 2017) to Revision E (June 2021) Page • Added Applications: Industrial PCs, Wired networking, and Data center and enterprise computing..................1 • Added the ESD Ratings - IEC Specifications table. Added a table note about 1-uF capacitor requirement between VCC and GND for D, DB and PW packages......................................................................................... 4 • Changed the thermal parameter values for D, DB and PW packages in the Thermal Information table............5 Changes from Revision C (June 2015) to Revision D (May 2017) Page • Changed 3 V ± 5.5 V to 3 V to 5.5 V in the VCC column of Table 9-1 .............................................................. 11 Changes from Revision B (December 2013) to Revision C (May 2015) Page • Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ..................................................................................................1 Changes from Revision A (April 2007) to Revision B (December 2013) Page • Updated document to new TI data sheet format.................................................................................................1 • Deleted Ordering Information table.....................................................................................................................1 • Added Thermal Information table....................................................................................................................... 5 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 5 Pin Configuration and Functions C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 Figure 5-1. D, DW, DB and PW Package, 16-Pin SOIC, SSOP and TSSOP, Top View Table 5-1. Pin Functions PIN NAME NO. I/O DESCRIPTION C1+ 1 — Positive lead of C1 capacitor V+ 2 O Positive charge pump output for storage capacitor only C1– 3 — Negative lead of C1 capacitor C2+ 4 — Positive lead of C2 capacitor C2– 5 — Negative lead of C2 capacitor V– 6 O Negative charge pump output for storage capacitor only DOUT2 7 O RS232 line data output (to remote RS232 system) RIN2 8 I RS232 line data input (from remote RS232 system) ROUT2 9 O Logic data output (to UART) DIN2 10 I Logic data input (from UART) DIN1 11 I Logic data input (from UART) ROUT1 12 O Logic data output (to UART) RIN1 13 I RS232 line data input (from remote RS232 system) DOUT1 14 O RS232 line data output (to remote RS232 system) GND 15 — Ground VCC 16 — Supply Voltage, Connect to external 3-V to 5.5-V power supply Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E 3 MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) Supply voltage(2) VCC voltage(2) V+ Positive output supply V– Negative output supply voltage(2) V+ – V– VI Supply voltage Drivers Input voltage UNIT 6 V –0.3 7 V 0.3 –7 V 13 V 6 V –0.3 Receivers Output voltage TJ Operating virtual junction temperature Tstg Storage temperature (2) MAX difference(2) VO (1) MIN –0.3 –25 25 V Drivers –13.2 13.2 V Receivers –0.3 VCC + 0.3 V 150 °C 150 °C –65 Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime All voltages are with respect to network GND. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge All pins except RIN and DOUT Human body model (HBM), per ANSI/ ESDA/JEDEC JS-001(1) RIN and DOUT Pins Charged-device model (CDM), per JEDEC specification JESD22-C101(2) UNIT ±2000 ±15,000 All pins V ±1500 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 ESD Ratings - IEC Specifications VALUE V (ESD) (1) Electrostatic discharge IEC61000-4-2, Contact Discharge(1) RS232 port pins (RIN, DOUT) ±8000 IEC61000-4-2, Air-Gap Discharge(1) RS232 port pins (RIN, DOUT) ±15,000 UNIT V For D, DB and PW packages only: Minimum of 1-µF capacitor is required between VCC and GND to meet the specified IEC 16000-4-2 rating. 6.4 Recommended Operating Conditions(1) See Typical Operating Circuit and Capacitor Values. VCC = 3.3 V Supply voltage 4 VCC = 5 V NOM MAX 3 3.3 3.6 4.5 5 5.5 UNIT V 2 5.5 2.4 5.5 DIN 0 0.8 V RIN –25 25 V VIH Driver high-level input voltage DIN VIL Driver low-level input voltage VI Receiver input voltage VCC = 3.3 V MIN VCC = 5 V Submit Document Feedback V Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 6.4 Recommended Operating Conditions(1) (continued) See Typical Operating Circuit and Capacitor Values. MIN TA (1) MAX3232EC Operating free-air temperature MAX3232EI NOM MAX 0 70 –40 85 UNIT °C Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. 6.5 Thermal Information MAX3232E THERMAL METRIC(1) PW (TSSOP) D (SOIC) DW (SOIC) DB (SSOP) 16 PINS 16 PINS 16 PINS 16 PINS UNIT RθJA Junction-to-ambient thermal resistance 108.2 85.9 72.3 103.1 °C/W RθJCtop Junction-to-case (top) thermal resistance 39.0 43.1 33.5 49.2 °C/W RθJB Junction-to-board thermal resistance 54.4 44.5 37.1 54.8 °C/W ψJT Junction-to-top characterization parameter 3.3 10.1 7.5 12 °C/W ψJB Junction-to-board characterization parameter 53.8 44.1 37.1 54.1 °C/W RθJCbot Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.6 Electrical Characteristics — Device(1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Typical Operating Circuit and Capacitor Values). PARAMETER ICC (1) (2) MIN TYP(2) MAX TEST CONDITIONS Supply current No load, VCC = 3.3 V or 5 V 0.3 1 UNIT mA Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. 6.7 Electrical Characteristics — Driver(1) over operating free-air temperature range (unless otherwise noted) (see Typical Operating Circuit and Capacitor Values). PARAMETER TEST CONDITIONS MIN TYP(2) 5.4 VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 IIH High-level input current VI = VCC IIL Low-level input current VI at GND IOS (3) Short-circuit output current rO Output resistance (1) (2) (3) VCC = 3.6 V, VO = 0 V VCC = 5.5 V, VO = 0 V VCC, V+, and V– = 0 V, VO = ±2 V 300 MAX UNIT V –5.4 V ±0.01 ±1 μA ±0.01 ±1 μA ±35 ±60 mA 10M Ω Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E 5 MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 6.8 Electrical Characteristics — Receiver(2) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Typical Operating Circuit and Capacitor Values). PARAMETER VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) ri Input resistance (1) (2) MIN TYP(1) VCC – 0.6 VCC – 0.1 TEST CONDITIONS MAX UNIT V 0.4 VCC = 3.3 V 1.5 2.4 VCC = 5 V 1.8 2.4 VCC = 3.3 V 0.6 1.2 VCC = 5 V 0.8 1.5 3 5 V V 0.3 VI = ±3 V to ±25 V V V 7 kΩ All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. 6.9 Switching Characteristics(1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Typical Operating Circuit and Capacitor Values) PARAMETER Maximum data rate RL = 3 kΩ, One DOUT switching, CL = 1000 pF, see Driver Slew Rate tsk(p) Driver pulse skew(3) RL = 3 kΩ to 7 kΩ, see Driver Pulse Skew CL = 150 pF to 2500 pF, SR(tr) Driver slew rate, transition region (see Driver Slew Rate) RL = 3 kΩ to 7 kΩ, VCC = 3.3 V tPLH Receiver propagation delay time, low- to high-level output tPHL Receiver propagation delay time, high- to low-level output tsk(p) Receiver pulse skew(3) (1) (2) (3) 6 TEST CONDITIONS MIN TYP(2) 150 250 kbit/s 300 ns MAX CL = 150 pF to 1000 pF 6 30 CL = 150 pF to 2500 pF 4 30 CL = 150 pF, see Receiver Propagation Delay Times UNIT V/μs 300 ns 300 ns 300 ns Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 6 0 5 ±1 DOUT Voltage (V) DOUT Voltage (V) 6.10 Typical Characteristics 4 3 2 1 ±2 ±3 ±4 ±5 VOH VOL 0 ±6 0 5 10 15 DOUT Current (mA) 20 25 0 VCC = 3.3 V 5 10 15 DOUT Current (mA) C001 20 25 C001 VCC = 3.3 V Figure 6-1. DOUT VOH vs Load Current, Both Drivers Loaded Figure 6-2. DOUT VOL vs Load Current, Both Drivers Loaded Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E 7 MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 7 Parameter Measurement Information 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tTHL CL (see Note A) tTLH 3V Output −3 V TEST CIRCUIT SR(tr) t THL 6V or t VOH 3V −3 V VOL VOLTAGE WAVEFORMS TLH A. CL includes probe and jig capacitance B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns Figure 7-1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω RL 1.5 V Input 1.5 V 0V CL (see Note A) tPHL tPLH VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns Figure 7-2. Driver Pulse Skew 3V Input Generator (see Note B) 1.5 V 1.5 V −3 V Output 50 Ω tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns Figure 7-3. Receiver Propagation Delay Times 8 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 8 Detailed Description 8.1 Overview The MAX3232E device consists of two line drivers, two-line receivers, and a dual charge-pump circuit with IEC61000-4-2 ESD protection terminal to terminal (serial-port connection terminals, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver output slew rate. Outputs are protected against shorts to ground. 8.2 Functional Block Diagram 3.3 V, 5 V POWER 2 DIN 2 TX RS232 2 ROUT DOUT RX 2 RIN RS232 8.3 Feature Description 8.3.1 Power The power block increases, inverts, and regulates voltage at V+ and V– pins using a charge pump that requires four external capacitors. 8.3.2 RS232 Driver Two drivers interface standard logic level to RS232 levels. Both DIN inputs must be valid high or low. 8.3.3 RS232 Receiver Two receivers interface RS232 levels to standard logic levels. An open input will result in a high output on ROUT. Each RIN input includes an internal standard RS232 load. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E 9 MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 8.4 Device Functional Modes Table 8-1 and Table 8-2 list the functional modes of the drivers and receivers of MAX3232E. Table 8-1. Each Driver(1) INPUT DIN (1) OUTPUT DOUT L H H L H = high level, L = low level Table 8-2. Each Receiver(1) INPUT RIN (1) OUTPUT ROUT L H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off 11 14 DIN1 DOUT1 10 7 DIN2 DOUT2 12 13 ROUT1 RIN1 9 8 ROUT2 RIN2 Figure 8-1. Logic Diagram 8.4.1 VCC Powered by 3 V to 5.5 V The device is in normal operation. 8.4.2 VCC Unpowered, VCC = 0 V When MAX3232E is unpowered, it can be safely connected to an active remote RS232 device. 10 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 9 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 9.1 Application Information For proper operation, add capacitors as shown in Table 9-1. 9.2 Typical Application ROUT and DIN connect to UART or general-purpose logic lines. RIN and DOUT lines connect to a RS232 connector or cable. 1 16 + CBYPASS − = 0.1µF + C1 VCC C1+ 2 (1) + − C3 V+ GND 15 − 3 4 14 DOUT1 C1− 13 + C2 RIN1 C2+ 5 kΩ − 5 C2− 12 6 C4 − V− ROUT1 11 DIN1 + DOUT2 RIN2 7 10 8 9 DIN2 ROUT2 5 kΩ A. C3 can be connected to VCC or GND A. Resistor values shown are nominal. B. Nonpolorized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Figure 9-1. Typical Operating Circuit and Capacitor Values Table 9-1. VCC vs Capacitor Values VCC C1 C2, C3, C4 3.3 V ± 0.3 V 0.1 µF 0.1 µF 5 V ± 0.5 V 0.047 µF 0.33 µF 3 V to 5.5 V 0.1 µF 0.47 µF Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E 11 MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 9.2.1 Design Requirements The recommended VCC is 3.3 V or 5 V. 3 V to 5.5 V is also possible The maximum recommended bit rate is 250 kbit/s. 9.2.2 Detailed Design Procedure All DIN inputs must be connected to valid low or high logic levels. Select capacitor values based on VCC level for best performance. 9.2.3 Application Curve Voltage (V) Figure 9-2 curves are for 3.3-V VCC and 250-kbit/s alternative bit data stream. 6 5 4 3 2 1 0 ±1 ±2 ±3 ±4 ±5 ±6 ±7 ±8 ±9 DIN DOUT to RIN ROUT 0 1 2 3 4 5 6 7 Time ( s) 8 9 10 C001 Figure 9-2. 250 kbit/s Driver to Receiver Loopback Timing Waveform, VCC = 3.3 V 10 Power Supply Recommendations The supply voltage, VCC, should be between 3 V and 5.5 V. Select the values of the charge-pump capacitors using Table 9-1. 12 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 11 Layout 11.1 Layout Guidelines Keep the external capacitor traces short, specifically on the C1 and C2 nodes that have the fastest rise and fall times. 11.2 Layout Example Ground C3 C1 1 C1+ VCC 16 2 V+ GND 15 3 C1– DOUT1 14 4 C2+ RIN1 13 5 C2– ROUT1 12 VCC 0.1µF Ground C2 Ground 6 V– DIN1 11 7 DOUT2 DIN2 10 C4 8 RIN2 ROUT2 9 Figure 11-1. Layout Diagram Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E 13 MAX3232E www.ti.com SLLS664E – AUGUST 2005 – REVISED JUNE 2021 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.3 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.5 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser based versions of this data sheet, refer to the left hand navigation. 14 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232E PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) MAX3232ECDBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MP232EC Samples MAX3232ECDR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC Samples MAX3232ECDRE4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC Samples MAX3232ECDW ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC Samples MAX3232ECDWG4 ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC Samples MAX3232ECDWR ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC Samples MAX3232ECPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MP232EC Samples MAX3232EIDBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI Samples MAX3232EIDBRE4 ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI Samples MAX3232EIDR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232EI Samples MAX3232EIDW ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232EI Samples MAX3232EIDWG4 ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232EI Samples MAX3232EIDWR ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232EI Samples MAX3232EIPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI Samples MAX3232EIPWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of