MAX3243
SLLS350P – APRIL 1999 – REVISED OCTOBER 2022
MAX3243 3-V to 5.5-V Multichannel RS-232 Line Driver/Receiver With ±15-kV ESD
(HBM) Protection
1 Features
2 Applications
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Operates With 3-V to 5.5-V VCC Supply
Single-Chip and Single-Supply Interface
for IBM™ PC/AT™ Serial Port
RS-232 Bus-Pin ESD Protection of
±15 kV Using Human-Body Model (HBM)
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU V.28 Standards
Three Drivers and Five Receivers
Operates Up To 250 kbit/s
Low Active Current: 300 μA Typical
Low Standby Current: 1 μA Typical
External Capacitors: 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
Always-Active Noninverting Receiver
Output (ROUT2B)
Operating Temperature
– MAX3243C: 0°C to 70°C
– MAX3243I: –40°C to 85°C
Serial-Mouse Driveability
Auto-Powerdown Feature to Disable Driver
Outputs When No Valid RS-232 Signal Is
Sensed
Battery-Powered Systems
Tablets
Notebooks
Laptops
Hand-Held Equipment
3 Description
The MAX3243 device consists of three line drivers,
five line receivers which is ideal for DE-9 DTE
interface. ±15-kV ESD (HBM) protection pin to pin
(serial- port connection pins, including GND). Flexible
power features saves power automatically. Special
outputs ROUT2B and INVALID are always enabled
to allow checking for ring indicator and valid RS232
input.
Device Information
PART NUMBER
MAX3243
(1)
PACKAGE(1)
BODY SIZE
SSOP (28)
10.29 mm × 5.30 mm
SOIC (28)
17.90 mm × 7.50 mm
TSSOP (28)
9.70 mm × 4.40 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
3.3 V, 5 V
POWER
FORCEON
FORCEOFF
DIN
3
5
ROUT
INVALID
TX
RX
3
DOUT
RS232
5
RIN
RS232
STATUS
Simplified Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MAX3243
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................5
6.5 Electrical Characteristics –– Auto Power Down..........5
6.6 Electrical Characteristics –– Driver............................. 6
6.7 Electrical Characteristics –– Receiver........................ 6
6.8 Switching Characteristics –– Auto Power Down......... 6
6.9 Switching Characteristics –– Driver............................ 7
6.10 Switching Characteristics –– Receiver......................7
6.11 Typical Characteristics.............................................. 7
7 Parameter Measurement Information............................ 8
8 Detailed Description......................................................10
8.1 Overview................................................................... 10
8.2 Functional Block Diagram......................................... 10
8.3 Feature Description...................................................11
8.4 Device Functional Modes..........................................12
9 Application and Implementation.................................. 13
9.1 Application Information............................................. 13
9.2 Typical Application.................................................... 13
9.3 Power Supply Recommendations.............................14
9.4 Layout....................................................................... 14
10 Device and Documentation Support..........................16
10.1 Receiving Notification of Documentation Updates..16
10.2 Support Resources................................................. 16
10.3 Trademarks............................................................. 16
10.4 Electrostatic Discharge Caution..............................16
10.5 Glossary..................................................................16
11 Mechanical, Packaging, and Orderable
Information.................................................................... 16
4 Revision History
Changes from Revision O (January 2015) to Revision P (October 2022)
Page
• Changed the Thermal Information table............................................................................................................. 5
• Changed the MAX value of ICC Supply current auto-powerdown disabled from 1 mA to 1.2 mA in Electrical
Characteristics—Auto Power Down ...................................................................................................................5
Changes from Revision N (May 2009) to Revision O (January 2015)
Page
• Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information
table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section................... 1
• Deleted Ordering Information table.....................................................................................................................1
2
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5 Pin Configuration and Functions
C2+
1
28
C1+
C2–
2
27
V+
V–
3
26
V
CC
RIN1:RIN5
4
25
GND
RIN1:RIN5
5
24
C1–
RIN1:RIN5
6
23
FORCEON
RIN1:RIN5
7
22
FORCEOFF
RIN1:RIN5
8
21
INVALID
DOUT1:DOUT3
9
20
ROUT2B
DOUT1:DOUT3
10
19
ROUT5:ROUT1
DOUT1:DOUT3
11
18
ROUT5:ROUT1
DIN3:DIN1
12
17
ROUT5:ROUT1
DIN3:DIN1
13
16
ROUT5:ROUT1
DIN3:DIN1
14
15
ROUT5:ROUT1
Not to scale
Figure 5-1. DB, DW, or PW Package
(Top View)
Table 5-1. Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
C2+
1
—
Positive lead of C2 capacitor
C2–
2
—
Negative lead of C2 capacitor
V–
3
O
Negative charge pump output for storage capacitor only
RIN1:RIN5
4, 5, 6, 7, 8
I
RS232 line data input (from remote RS232 system)
DOUT1:DOUT3
9, 10, 11
O
RS232 line data output (to remote RS232 system)
DIN3:DIN1
12, 13, 14
I
Logic data input (from UART)
ROUT5:ROUT1
15, 16, 17, 18, 19
O
Logic data output (to UART)
ROUT2B
20
O
Always Active non-inverting output for RIN2 (normally used for ring
indicator)
INVALID
21
O
Active low output when all RIN are unpowered
FORCEOFF
22
I
Low input forces DOUT1-5, ROUT1-5 high Z per Section 8.4
FORCEON
23
I
High forces drivers on. Low is automatic mode per Section 8.4
C1–
24
—
Negative lead on C1 capacitor
GND
25
—
Ground
VCC
26
—
Supply Voltage, Connect to 3V to 5.5V power supply
V+
27
O
Positive charge pump output for storage capacitor only
C1+
28
—
Positive lead of C1 capacitor
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Supply voltage range(2)
VCC
range(2)
V+
Positive output supply voltage
V–
Negative output supply voltage range(2)
V+ – V–
Supply voltage
MAX
6
V
–0.3
7
V
0.3
–7
V
13
V
difference(2)
VI
Input voltage range
VO
Output voltage range
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
MIN
–0.3
Driver, FORCEOFF, FORCEON
–0.3
6
Receiver
–25
25
–13.2
13.2
–0.3
VCC + 0.3
Driver
Receiver, INVALID
UNIT
V
V
150
–65
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Section 6.3 is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
(2)
6.2 ESD Ratings
MAX
V(ESD)
(1)
(2)
Electrostatic discharge
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
RIN , DOUT, and GND pins (1)
15000
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
All other pins(1)
3000
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins(2)
1000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
(1)
(See Figure 9-1)
VCC = 3.3 V
VCC Supply voltage
VCC = 5 V
NOM
3
3.3
3.6
4.5
5
5.5
V
2
5.5
5.5
DIN, FORCEOFF, FORCEON
0
0.8
V
DIN, FORCEOFF, FORCEON
0
5.5
V
–25
25
V
0
70
–40
85
DIN, FORCEOFF,
FORCEON
VIL
Driver and control low-level input voltage
VI
Driver and control input voltage
VI
Receiver input voltage
VCC = 5 V
MAX3243C
TA
Operating free-air temperature
(1)
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
4
MAX UNIT
2.4
VIH Driver and control high-level input voltage
VCC = 3.3 V
MIN
MAX3243I
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°C
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6.4 Thermal Information
THERMAL METRIC(1)
DB
DW
PW
16 PINS
16 PINS
16 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
76.1
59.0
70.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
35.8
28.8
21.0
°C/W
RθJB
Junction-to-board thermal resistance
37.4
30.3
29.2
°C/W
ψJT
Junction-to-top characterization parameter
7.4
7.8
1.3
°C/W
ψJB
Junction-to-board characterization parameter
37.0
30.0
28.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
6.5 Electrical Characteristics –– Auto Power Down
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (see Figure 9-1)
PARAMETER
TEST CONDITIONS
MIN
TYP(1)
MAX
UNIT
Supply current
Auto-powerdown
disabled
No load, FORCEOFF and FORCEON at VCC. TA = 25°C
For DB and PW package
0.3
1.2
mA
Supply current
Auto-powerdown
disabled
No load, FORCEOFF and FORCEON at VCC. TA = 25°C
For DW package
0.3
1
mA
Supply current
Powered off
No load, FORCEOFF at GND. TA = 25°C
1
10
Supply current
Auto-powerdown
enabled
No load, FORCEOFF at VCC, FORCEON at GND,
All RIN are open or grounded, All DIN are grounded. TA =
25°C
1
10
Input leakage current
of FORCEOFF, FORCEON
VI = VCC or VI at GND
±0.01
±1
μA
VIT+
Receiver input threshold
for INVALID high-level output
voltage
FORCEON = GND,
FORCEOFF = VCC
2.7
V
VIT–
Receiver input threshold
for INVALID high-level output
voltage
FORCEON = GND,
FORCEOFF = VCC
–2.7
VT
Receiver input threshold
for INVALID low-level output
voltage
FORCEON = GND,
FORCEOFF = VCC
–0.3
VOH
INVALID high-level output
voltage
IOH = -1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
ICC
II
(1)
μA
V
0.3
VCC – 0.6
V
V
0.4
V
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
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6.6 Electrical Characteristics –– Driver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (see Figure 9-1)
PARAMETER
TEST CONDITIONS
MIN
TYP(2)
MAX
UNIT
VOH
High-level output voltage
All DOUT at RL = 3 kΩ to GND
5
5.4
V
VOL
Low-level output voltage
All DOUT at RL = 3 kΩ to GND
–5
–5.4
V
VO
Output voltage
(mouse driveability)
DIN1 = DIN2 = GND, DIN3 = VCC, 3-kΩ to GND at DOUT3,
DOUT1 = DOUT2 = 2.5 mA
±5
IIH
High-level input current
VI = VCC
±0.01
±1
μA
IIL
Low-level input current
VI at GND
±0.01
±1
μA
Vhys
Input hysteresis
±1
V
IOS
Short-circuit output current(3)
±60
mA
ro
Output resistance
Ioff
(1)
(2)
(3)
Output leakage current
VCC = 3.6 V,
VO = 0 V
VCC = 5.5 V,
VO = 0 V
VCC, V+, and V– = 0 V,
VO = ±2 V
FORCEOFF = GND,
V
±35
300
10M
Ω
VO = ±12 V,
VCC = 3 to 3.6 V
±25
VO = ±10 V,
VCC = 4.5 to 5.5 V
±25
μA
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
6.7 Electrical Characteristics –– Receiver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (see Figure 9-1)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOH = 1.6 mA
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
Ioff
Output leakage current (except ROUT2B)
FORCEOFF = 0 V
rI
Input resistance
VI = ±3 V or ±25 V
(1)
(2)
MIN
TYP(2)
VCC – 0.6
VCC – 0.1
MAX
V
0.4
VCC = 3.3 V
1.6
2.4
VCC = 5 V
1.9
2.4
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.8
1.4
V
V
V
0.5
3
UNIT
V
±0.05
±10
μA
5
7
kΩ
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
6.8 Switching Characteristics –– Auto Power Down
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7-5)
PARAMETER
TYP(1)
UNIT
tvalid
Propagation delay time, low- to high-level output
VCC = 5 V
1
μs
tinvalid
Propagation delay time, high- to low-level output
VCC = 5 V
30
μs
ten
Supply enable time
VCC = 5 V
100
μs
(1)
6
TEST CONDITIONS
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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6.9 Switching Characteristics –– Driver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) (see Figure 9-1)
MAX3243C, MAX3243I
PARAMETER
TEST CONDITIONS
Maximum data rate
RL = 3 kΩ
One DOUT switching,
CL = 1000 pF
See Figure 7-1
tsk(p)
Pulse skew(3)
RL = 3 kΩ to 7 kΩ
CL = 150 pF to 2500 pF
See Figure 7-3
SR(tr)
Slew rate, transition region
(see Figure 7-1)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ
(1)
(2)
(3)
MIN
TYP(1)
150
250
kbit/s
100
ns
MAX
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
UNIT
V/μs
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V + 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
6.10 Switching Characteristics –– Receiver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2)
PARAMETER
tPLH
Propagation delay time, low- to high-level output
tPHL
Propagation delay time, high- to low-level output
ten
Output enable time
tdis
Output disable time
tsk(p)
(1)
(2)
(3)
Pulse
TYP(1)
TEST CONDITIONS
skew(3)
UNIT
CL = 150 pF,
See Figure 7-3
150
ns
150
ns
CL = 150 pF, RL = 3 kΩ,
See Figure 7-4
200
ns
200
ns
50
ns
See Figure 7-3
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
Pulse skew is defined as |tPLH - tPHL| of each channel of the same device.
6.11 Typical Characteristics
VCC = 3.3 V
0
6
5
±1
4
±2
VOL (V)
VOH (V)
VOH
3
±3
2
±4
1
±5
0
±6
VOL
0
5
10
15
20
25
30
Load Current (mA)
35
0
Figure 6-1. DOUT VOH vs Load Current
5
10
15
20
25
Load Current (mA)
C001
30
35
C001
Figure 6-2. DOUT VOL vs Load Current
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7 Parameter Measurement Information
7.1
3V
Generator
(see Note B)
Input
RS-232
Output
50 W
RL
0V
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
−3 V
−3 V
6V
t THL or tTLH
VOH
3V
3V
Output
SR(tr)
tTLH
tTHL
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s (MAX3243C/I) and 1 Mbit/s (MAX3243FC/I),
ZO = 50 W, 50% duty cycle, tr ≤10 ns, tf ≤10 ns.
Figure 7-1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 W
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPLH
tPHL
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s (MAX3243C/I) and 1 Mbit/s (MAX3243FC/I),
ZO = 50 W, 50% duty cycle, tr ≤10 ns, tf ≤10 ns.
Figure 7-2. Driver Pulse Skew
3 V or 0 V
FORCEON
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
tPHL
50 W
3V
FORCEOFF
tPLH
CL
(see Note A)
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 W, 50% duty cycle, tr ≤10 ns, tf ≤10 ns.
Figure 7-3. Receiver Propagation Delay Times
8
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3V
Input
VCC
3 V or 0 V
FORCEON
1.5 V
GND
S1
0V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
RL
3 V or 0 V
1.5 V
VOH
Output
50%
Output
FORCEOFF
Generator
(see Note B)
CL
(see Note A)
0.3 V
tPZL
(S1 at VCC)
tPLZ
(S1 at VCC)
50 W
0.3 V
Output
50%
VOL
TEST CIRCUIT
NOTES: A.
B.
C.
D.
VOLTAGE WAVEFORMS
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: ZO = 50 W, 50% duty cycle, tr ≤10 ns, tf ≤10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 7-4. Receiver Enable and Disable Times
2.7 V
2.7 V
0V
Receiver
Input
0V
50 W
−2.7 V
−2.7 V
ROUT
Generator
(see Note B)
3V
−3 V
tvalid
tinvalid
VCC
50% VCC
FORCEOFF
DIN
ten
INVALID
CL = 30 pF
(see Note A)
FORCEON
0V
INVALID
Output
Autopowerdown
50% VCC
V+
≈V+
Supply
Voltages
0.3 V
VCC
0V
0.3 V
DOUT
≈V−
V−
TEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
Indeterminate
0.3 V
0V
If Signal Remains Within This Region
For More Than 30 ms, INVALID Is Low (see Note C)
−0.3 V
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 W, 50% duty cycle, tr ≤10 ns, tf ≤10 ns.
C. Auto-powerdown disables drivers and reduces supply current to 1 mA.
Figure 7-5. INVALID Propagation Delay Times and Supply Enabling Time
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8 Detailed Description
8.1 Overview
The MAX3243 device consists of three line drivers, five line receivers, and a dual charge-pump circuit with
±15-kV ESD (HBM) protection pin to pin (serial- port connection pins, including GND). The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication
controller and the serial-port connector. This combination of drivers and receivers matches that needed for the
typical serial port used in an IBM PC/AT, or compatible. The charge pump and four small external capacitors
allow operation from a single 3-V to 5.5-V supply. In addition, the device includes an always-active noninverting
output (ROUT2B), which allows applications using the ring indicator to transmit data while the device is powered
down. Flexible control options for power management are available. when the serial port is inactive. The
auto-power-down feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF
is set low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1
µA. Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to
occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high and should be done when
driving a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal
is applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at
any receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than
–2.7 V or has been between –0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver
input voltages are between –0.3 V and 0.3 V for more than 30 µs.
8.2 Functional Block Diagram
DIN1
DIN2
DIN3
FORCEOFF
FORCEON
ROUT1
ROUT2B
ROUT2
14
9
13
10
12
11
DOUT1
DOUT2
DOUT3
22
23
Auto-powerdown
21
19
4
20
5 kW
18
5
INVALID
RIN1
RIN2
5 kW
ROUT3
17
6
RIN3
5 kW
ROUT4
7
16
RIN4
5 kW
ROUT5
15
8
RIN5
5 kW
10
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8.3 Feature Description
8.3.1 Auto-Power-Down
Auto-Power-Down can be used to automatically save power when the receivers are unconnected or connected
to a powered down remote RS232 port. FORCEON being high will override Auto power down and the drivers will
be active. FORCEOFF being low will override FORCEON and will power down all outputs except for ROUT2B
and INVALID.
8.3.2 Charge Pump
The charge pump increases, inverts, and regulates voltage at V+ and V– pins and requires four external
capacitors.
8.3.3 RS232 Driver
Three drivers interface standard logic level to RS232 levels. All DIN inputs must be valid high or low.
8.3.4 RS232 Receiver
Five receivers interface RS232 levels to standard logic levels. An open input will result in a high output on ROUT.
Each RIN input includes an internal standard RS232 load.
8.3.5 ROUT2B Receiver
ROUT2B is an always-active noninverting output of RIN2 input, which allows applications using the ring indicator
to transmit data while the device is powered down.
8.3.6 Invalid Input Detection
The INVALID output goes active low when all RIN inputs are unpowered. The INVALID output goes inactive high
when any RIN input is connected to an active RS232 voltage level.
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8.4 Device Functional Modes
Table 8-1. Each Driver(1)
INPUTS
OUTPUT
DIN
(1)
FORCEON
VALID RIN
RS-232 LEVEL
FORCEOFF
DRIVER STATUS
DOUT
X
X
L
X
Z
Powered off
L
H
H
X
H
H
H
H
X
L
Normal operation with
auto-powerdown disabled
L
L
H
YES
H
H
L
H
YES
L
X
L
H
NO
Z
Normal operation with
auto-powerdown enabled
Power off by
auto-powerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance, YES = any RIN valid, NO = all RIN invalid
Table 8-2. Each Receiver(1)
INPUTS
OUTPUTS
RIN
(1)
FORCEON
FORCEOFF
ROUT
X
X
L
Z
L
X
H
H
H
X
H
L
Open
X
H
H
RECEIVER STATUS
Powered off
Normal operation
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
Table 8-3. INVALID and ROUT2B Outputs(1)
INPUTS
OUTPUTS
VALID RIN
RIN2
RS-232 LEVEL
(1)
12
FORCEON
FORCEOFF
INVALID
ROUT2B
YES
L
X
X
H
L
YES
H
X
X
H
H
YES
OPEN
X
X
H
L
NO
OPEN
X
X
L
L
OUTPUT STATUS
Always Active
Always Active
H = high level, L = low level, X = irrelevant, Z = high impedance (off),
OPEN = input disconnected or connected driver off, YES = any RIN valid, NO = all RIN invalid
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
It is recommended to add capacitors as shown in Figure 9-1.
9.2 Typical Application
ROUT and DIN connect to UART or general purpose logic lines. RIN and DOUT lines connect to a RS232
connector or cable.
C1+
1
+
C2
−
2
3
−
C2−
VCC
V−
GND
+
C1−
RIN1
RIN2
RS-232 Inputs
RIN3
RIN4
RIN5
DOUT1
RS-232 Outputs
DOUT2
4
27
+
−
26
25
C3(1) +
+ CBYPASS
− = 0.1 mF
−
C1
24
23
FORCEON
5
Autopowerdown
C4
V+
C2+
28
6
7
22
FORCEOFF
8
21
9
20
10
19
INVALID
ROUT2B
ROUT1
5 kW
DOUT3
18
11
ROUT2
5 kW
DIN3
12
Logic Outputs
17
ROUT3
5 kW
Logic Inputs
DIN2
13
16
ROUT4
5 kW
DIN1
14
15
ROUT5
5 kW
(1) C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum
or electrolytic capacitors are used, they should be connected as
shown.
VCC vs CAPACITOR VALUES
VCC
C1
C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 mF
0.047 mF
0.1 mF
0.1 mF
0.33 mF
0.47 mF
Figure 9-1. Typical Operating Circuit and Capacitor Values
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9.2.1 Design Requirements
•
•
VCC minimum is 3 V and maximum is 5.5V.
Maximum recommended bit rate is 250 kbit/s.
9.2.2 Detailed Design Procedure
•
•
All DIN, FORCEOFF and FORCEON inputs must be connected to valid low or high logic levels.
Select capacitor values based on VCC level for best performance.
9.2.3 Application Curves
Voltage (V)
VCC= 3.3 V
6
5
4
3
2
1
0
±1
±2
±3
±4
±5
±6
±7
±8
±9
DIN
DOUT to RIN
ROUT
0
1
2
3
4
5
Time ( s)
6
7
C001
Figure 9-2. Driver to Receiver Loopback Timing Waveform
9.3 Power Supply Recommendations
VCC should be between 3 V and 5.5 V. Charge pump capacitors should be chosen using table in Figure 9-1.
9.4 Layout
9.4.1 Layout Guidelines
Keep the external capacitor traces short. This is more important on C1 and C2 nodes that have the fastest rise
and fall times.
In the Layout Example diagram, only critical layout sections are shown. Input and output traces will vary in shape
and size depending on the customer application. FORCEON and FORCEOFF should be pulled up to VCC or
GND via a pullup resistor, depending on which configuration the user desires upon power-up.
14
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9.4.2 Layout Example
C1
1
C2+
C1+
28
2
C2-
V+
27
C2
Ground
C3
Ground
3
V-
VCC 26
4
RIN1
GND
25
5
RIN2
C1-
24
6
RIN3
FORCEON 23
7
RIN4
FORCEOFF 22
8
RIN5
INVALID 21
9
DOUT1
ROUT2B 20
10
DOUT2
ROUT1 19
11
DOUT3
ROUT2 18
12
DIN3
ROUT3 17
13
DIN2
ROUT4 16
14
DIN1
ROUT5 15
C4
VCC
0.1 μF
Ground
Figure 9-3. Layout Diagram
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10 Device and Documentation Support
10.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
10.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
10.3 Trademarks
IBM™ and PC/AT™ are trademarks of IBM.
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
10.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
16
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Nov-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
(1)
MAX3243CDB
LIFEBUY
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243C
MAX3243CDBG4
LIFEBUY
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243C
MAX3243CDBR
ACTIVE
SSOP
DB
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243C
Samples
MAX3243CDBRE4
ACTIVE
SSOP
DB
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243C
Samples
MAX3243CDBRG4
ACTIVE
SSOP
DB
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243C
Samples
MAX3243CDW
LIFEBUY
SOIC
DW
28
20
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243C
MAX3243CDWE4
LIFEBUY
SOIC
DW
28
20
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243C
MAX3243CDWR
ACTIVE
SOIC
DW
28
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243C
Samples
MAX3243CDWRG4
ACTIVE
SOIC
DW
28
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243C
Samples
MAX3243CPW
LIFEBUY
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MA3243C
MAX3243CPWE4
LIFEBUY
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MA3243C
MAX3243CPWR
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MA3243C
Samples
MAX3243CPWRG4
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MA3243C
Samples
MAX3243IDB
LIFEBUY
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243I
MAX3243IDBG4
LIFEBUY
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243I
MAX3243IDBR
ACTIVE
SSOP
DB
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243I
Samples
MAX3243IDW
ACTIVE
SOIC
DW
28
20
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243I
Samples
MAX3243IDWR
ACTIVE
SOIC
DW
28
1000
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
MAX3243I
Samples
MAX3243IDWRG4
ACTIVE
SOIC
DW
28
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243I
Samples
MAX3243IPW
LIFEBUY
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB3243I
MAX3243IPWR
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB3243I
Samples
MAX3243IPWRE4
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB3243I
Samples
The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Nov-2022
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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