MAX3243E
SLLS657D – APRIL 2005 – REVISED SEPTEMBER 2011
www.ti.com
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
Check for Samples: MAX3243E
FEATURES
1
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
32 31
30
29
28 27
26
NC
VCC
V+
C1+
C2+
QFN PACKAGE
(TOP VIEW)
25
RIN1
1
24
GND
RIN2
2
23
C1–
RIN3
3
22
FORCEON
RIN4
4
21
FORCEOFF
RIN5
5
20
INVALID
DOUT1
6
19
ROUTB2
DOUT2
7
18
ROUT1
DOUT3
8
17
ROUT2
9
10
11
12
13 14
15
16
NC
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
25
5
ROUT3
•
•
•
•
•
•
26
4
C1+
V+
VCC
GND
C1−
FORCEON
FORCEOFF
INVALID
ROUT2B
ROUT1
ROUT2
ROUT3
ROUT4
ROUT5
ROUT4
APPLICATIONS
27
3
ROUT5
•
2
C2–
•
•
28
DIN1
•
•
•
•
1
DIN2
•
V–
•
•
C2+
C2−
V−
RIN1
RIN2
RIN3
RIN4
RIN5
DOUT1
DOUT2
DOUT3
DIN3
DIN2
DIN1
NC
•
DB, DW, OR PW PACKAGE
(TOP VIEW)
NC
•
Single-Chip and Single-Supply Interface for
IBM™ PC/AT™ Serial Port
ESD Protection for RS-232 Bus Pins
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC61000-4-2, Contact Discharge
– ±15-kV IEC61000-4-2, Air-Gap Discharge
Meets or Exceeds Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Always-Active Noninverting Receiver Output
(ROUT2B)
Designed to Transmit at a Data Rate up to
500 kbit/s
Low Standby Current . . . 1 μA Typ
External Capacitors . . . 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
Designed to Be Interchangeable With Maxim
MAX3243E
Serial-Mouse Driveability
Auto-Powerdown Feature to Disable Driver
Outputs When No Valid RS-232 Signal Is
Sensed
Package Options Include Plastic Small-Outline
(DW), Shrink Small-Outline (DB), and Thin
Shrink Small-Outline (PW) Packages
DIN3
•
2
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
IBM, PC/AT are trademarks of International Business Machines Corporation.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2011, Texas Instruments Incorporated
MAX3243E
SLLS657D – APRIL 2005 – REVISED SEPTEMBER 2011
www.ti.com
DESCRIPTION
The MAX3243E device consists of three line drivers, five line receivers, and a dual charge-pump circuit with
±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge)
protection on serial-port connection pins. The device meets the requirements of TIA/EIA-232-F and provides the
electrical interface between an asynchronous communication controller and the serial-port connector. This
combination of drivers and receivers matches that needed for the typical serial port used in an IBM PC/AT, or
compatible. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. In addition, the device includes an always-active noninverting output (ROUT2B), which allows
applications using the ring indicator to transmit data while the device is powered down. The device operates at
data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver output slew rate.
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is
set low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 μA.
Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high, and should be done when driving
a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is
applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any
receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than –2.7 V
or has been between –0.3 V and 0.3 V for less than 30 μs. INVALID is low (invalid data) if all receiver input
voltages are between –0.3 V and 0.3 V for more than 30 μs. Refer to Figure 5 for receiver input levels.
The MAX3243EC is characterized for operation from 0°C to 70°C. The MAX3243EI is characterized for operation
from –40°C to 85°C.
ORDERING INFORMATION
PACKAGE (1)
TA
0°C to 70°C
–40°C to 85°C
(1)
(2)
2
(2)
SOIC – DW
Tape and reel
SSOP – DB
Tape and reel
TSSOP – PW
Tape and reel
QFN – RHB
Tape and reel
SSOP – DB
Tape and reel
SOIC – DW
Tape and reel
TSSOP – PW
Tape and reel
QFN – RHB
Tape and reel
ORDERABLE PART NUMBER
MAX3243ECDW
MAX3243ECDWR
MAX3243ECDB
MAX3243ECDBR
MAX3243ECPW
MAX3243ECPWR
MAX3243ECRHBR
MAX3243EIDB
MAX3243EIDBR
MAX3243EIDW
MAX3243EIDWR
MAX3243EIPW
MAX3243EIPWR
MAX3243EIRHBR
TOP-SIDE MARKING
MAX3243EC
MAX3243EC
MP243EC
MP243E
MAX3243EI
MAX3243EI
MP243EI
MR243E
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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MAX3243E
SLLS657D – APRIL 2005 – REVISED SEPTEMBER 2011
www.ti.com
FUNCTION TABLES
ABC
Each Driver (1)
INPUTS
DIN
(1)
FORCEON
OUTPUT
FORCEOFF
VALID RIN
RS-232 LEVEL
DRIVER STATUS
DOUT
X
X
L
X
Z
Powered off
L
H
H
X
H
H
H
H
X
L
Normal operation with
auto-powerdown disabled
L
L
H
Yes
H
H
L
H
Yes
L
X
L
H
No
Z
Normal operation with
auto-powerdown enabled
Powered off by auto-powerdown
feature
H = high level, L = low level, X = irrelevant, Z = high impedance
Each Receiver (1)
INPUTS
(1)
OUTPUT
RIN
FORCEON
FORCEOFF
ROUT
X
X
L
Z
L
X
H
H
H
X
H
L
Open
X
H
H
RECEIVER STATUS
Powered off
Normal operation with
auto-powerdown disabled/enabled
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
ROUT2B and Outputs INVALID
(1)
INPUTS
VALID RIN
RS-232 LEVEL
(1)
OUTPUTS
RIN2
FORCEON
FORCEOFF
INVALID
ROUT2B
Yes
L
X
X
H
L
Yes
H
X
X
H
H
Yes
Open
X
X
H
L
No
Open
X
X
L
L
OUTPUT STATUS
Always active
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
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3
MAX3243E
SLLS657D – APRIL 2005 – REVISED SEPTEMBER 2011
www.ti.com
LOGIC DIAGRAM (POSITIVE LOGIC)
DIN1
DIN2
DIN3
FORCEOFF
FORCEON
ROUT1
ROUT2B
ROUT2
ROUT3
ROUT4
ROUT5
4
14
9
13
10
12
11
DOUT1
DOUT2
DOUT3
22
23
Auto-powerdown
19
21
4
INVALID
RIN1
20
18
5
17
6
16
7
15
8
RIN2
RIN3
RIN4
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RIN5
Copyright © 2005–2011, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
MAX3243E
SLLS657D – APRIL 2005 – REVISED SEPTEMBER 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
(2)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.3
6
V
V+
Positive output supply voltage range (2)
–0.3
7
V
V–
Negative output supply voltage range (2)
0.3
–7
V
V+ – V–
Output supply voltage difference (2)
13
V
VI
Input voltage range
VO
Output voltage range
θJA
Package thermal impedance (3)
Driver (FORCEOFF, FORCEON)
–0.3
6
Receiver
–25
25
–13.2
13.2
–0.3
VCC + 0.3
Driver
Receiver (INVALID)
(4)
DB package
62
DW package
46
PW package
(1)
(2)
(3)
(4)
V
°C/W
62
Lead temperature 1,6 mm (1/16 in) from case for 10 s
Tstg
V
–65
Storage temperature range
260
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) - TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
See Figure 6
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver and control high-level input voltage
DIN, FORCEOFF, FORCEON
VIL
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON
VI
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
Receiver input voltage
TA
(1)
VCC = 3.3 V
NOM
MAX UNIT
3
3.3
3.6
4.5
5
5.5
V
2
VCC = 5 V
V
2.4
MAX3243EC
Operating free-air temperature
MIN
MAX3243EI
0.8
V
0
5.5
V
–25
25
V
0
70
–40
85
°C
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
ELECTRICAL CHARACTERISTICS (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
II
ICC
(1)
(2)
Input leakage current
Supply current
(TA = 25°C)
TEST CONDITIONS
FORCEOFF, FORCEON
MIN
TYP (2) MAX
UNIT
±0.01
±1
μA
0.3
1
mA
Auto-powerdown disabled
No load,
FORCEOFF and FORCEON at VCC
Powered off
No load, FORCEOFF at GND
1
10
Auto-powerdown enabled
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded,
All DIN are grounded
1
10
μA
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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MAX3243E
SLLS657D – APRIL 2005 – REVISED SEPTEMBER 2011
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DRIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
MIN TYP (2) MAX
TEST CONDITIONS
UNIT
VOH
High-level output voltage
All DOUT at RL = 3 kΩ to GND
5
5.4
V
VOL
Low-level output voltage
All DOUT at RL = 3 kΩ to GND
–5
–5.4
V
VO
Output voltage
(mouse driveability)
DIN1 = DIN2 = GND, DIN3 = VCC, 3-kΩ to GND at DOUT3,
DOUT1 = DOUT2 = 2.5 mA
±5
IIH
High-level input current
VI = VCC
±0.01
±1
μA
IIL
Low-level input current
VI at GND
±0.01
±1
μA
Vhys
Input hysteresis
±1
V
±60
mA
±25
μA
VCC = 3.6 V,
VO = 0 V
VCC = 5.5 V,
VO = 0 V
IOS
Short-circuit output current (3)
ro
Output resistance
VCC, V+, and V– = 0 V,
VO = ±2 V
Ioff
Output leakage current
FORCEOFF = GND,
VO = ±12 V,
(1)
(2)
(3)
300
V
Ω
10M
VCC = 0 to 5.5 V
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics (1)
switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise
noted) (see Figure 6)
PARAMETER
MIN TYP (2)
TEST CONDITIONS
MAX
Maximum data rate
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ
See Figure 1
tsk(p)
Pulse skew (3)
CL = 150 pF to 2500 pF,
RL = 3 kΩ to 7 kΩ, See Figure 2
Slew rate, transition region
(see Figure 1)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ,
PRR = 250 kbit/s
CL = 150 pF to 1000 pF
6
30
SR(tr)
CL = 150 pF to 2500 pF
4
30
(1)
(2)
(3)
250
UNIT
500
kbit/s
100
ns
V/μs
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V + 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
PARAMETER
Driver outputs (pins 9–11)
6
TEST CONDITIONS
TYP
UNIT
HBM
±15
kV
IEC61000-4-2, Air-Gap Discharge
±15
kV
IEC61000-4-2, Contact Discharge
±8
kV
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MAX3243E
SLLS657D – APRIL 2005 – REVISED SEPTEMBER 2011
www.ti.com
RECEIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOH = 1.6 mA
TYP (2)
VCC – 0.6
VCC – 0.1
MAX
0.4
1.6
2.4
VCC = 5 V
1.9
2.4
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT– )
Ioff
Output leakage current (except ROUT2B)
FORCEOFF = 0 V
ri
Input resistance
VI = ±3 V or ±25 V
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.8
1.4
UNIT
V
VCC = 3.3 V
VIT+
(1)
(2)
MIN
V
V
V
0.5
V
±0.05
±10
μA
5
7
kΩ
3
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
tPLH
Propagation delay time, low- to high-level output
tPHL
Propagation delay time, high- to low-level output
ten
Output enable time
tdis
Output disable time
tsk(p)
Puse skew (3)
(1)
(2)
(3)
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ, See Figure 4
See Figure 3
TYP (2)
UNIT
150
ns
150
ns
200
ns
200
ns
50
ns
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH - tPHL| of each channel of the same device.
ESD Protection
PARAMETER
Driver outputs (pins 4–8)
TEST CONDITIONS
TYP
UNIT
HBM
±15
kV
IEC61000-4-2, Air-Gap discharge
±15
kV
IEC61000-4-2, Contact Discharge
±8
kV
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AUTO-POWERDOWN SECTION
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
VIT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VIT–(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–0.3
VOH
INVALID high-level output voltage
IOH = -1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
MAX
UNIT
2.7
V
V
0.3
V
VCC – 0.6
V
0.4
V
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
TYP (1)
UNIT
tvalid
Propagation delay time, low- to high-level output
VCC = 5 V
1
μs
tinvalid
Propagation delay time, high- to low-level output
VCC = 5 V
30
μs
ten
Supply enable time
VCC = 5 V
100
μs
(1)
8
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
0V
Output
SR(tr) +
tTLH
tTHL
6V
t THL or tTLH
VOH
3V
3V
−3 V
−3 V
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
tPHL
50 Ω
3V
FORCEOFF
tPLH
CL
(see Note A)
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
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PARAMETER MEASUREMENT INFORMATION
3V
Input
VCC
3 V or 0 V
FORCEON
1.5 V
GND
S1
−3 V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
RL
3 V or 0 V
1.5 V
VOH
Output
50%
Output
CL
(see Note A)
FORCEOFF
Generator
(see Note B)
50 Ω
0.3 V
tPZL
(S1 at VCC)
tPLZ
(S1 at VCC)
0.3 V
Output
50%
VOL
TEST CIRCUIT
NOTES: A.
B.
C.
D.
VOLTAGE WAVEFORMS
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 4. Receiver Enable and Disable Times
10
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PARAMETER MEASUREMENT INFORMATION
2.7 V
2.7 V
0V
Receiver
Input
0V
−2.7 V
−2.7 V
ROUT
Generator
(see Note B)
3V
50 Ω
tinvalid
tvalid
50% VCC
50% VCC
−3 V
VCC
Autopowerdown
ten
INVALID
≈V+
V+
CL = 30 pF
(see Note A)
0.3 V
VCC
0V
0.3 V
Supply
Voltages
FORCEOFF
FORCEON
0V
INVALID
Output
DIN
DOUT
V−
TEST CIRCUIT
≈V−
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
Indeterminate
0.3 V
0V
−0.3 V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdown disables drivers and reduces supply
current to 1 µA.
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 5. INVALID Propagation Delay Timnes and Supply Enabling Time
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11
MAX3243E
SLLS657D – APRIL 2005 – REVISED SEPTEMBER 2011
www.ti.com
APPLICATION INFORMATION
C1+
1
+
C2
−
2
3
C2−
VCC
V−
GND
+
C1−
RIN1
RIN2
RIN3
RS-232 Inputs
RIN4
RIN5
DOUT1
RS-232 Outputs
DOUT2
4
27
+
−
26
25
C3†
+
−
+ CBYPASS
− = 0.1 µF
C1
24
23
FORCEON
5
Autopowerdown
C4
−
V+
C2+
28
6
7
22
FORCEOFF
8
21
9
20
10
19
INVALID
ROUT2B
ROUT1
5 kΩ
DOUT3
11
18
ROUT2
5 kΩ
DIN3
12
Logic Outputs
17
ROUT3
5 kΩ
Logic Inputs
DIN2
13
16
ROUT4
5 kΩ
DIN1
14
15
ROUT5
5 kΩ
† C3 can be connected to V
CC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or
electrolytic capacitors are used, they should be connected as shown.
VCC vs CAPACITOR VALUES
VCC
C1
C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
12
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MAX3243E
SLLS657D – APRIL 2005 – REVISED SEPTEMBER 2011
www.ti.com
APPLICATION INFORMATION
ESD Protection
TI MAX3243E devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15-kV in all states: normal
operation, shutdown, and powered down. The MAX3243E devices are designed to continue functioning properly
after an ESD occurrence without any latchup.
The MAX3243E devices have three specified ESD limits on the driver outputs and receiver inputs, with respect to
GND:
• ±15-kV Human Body Model (HBM)
• ±15-kV IEC61000-4-2, Air-Gap Discharge (formerly IEC1000-4-2)
• ±8-kV IEC61000-4-2, Contact Discharge
ESD Test Conditions
ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a
reliability report that documents test setup, methodology, and results.
Human Body Model (HBM)
The Human Body Model of ESD testing is shown in Figure 7, while Figure 8 shows the current waveform that is
generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the
ESD voltage of concern, and subsequently discharged into the DUT through a 1.5k-Ω resistor.
RD
1.5 kΩ
VHBM
+
−
CS
100 pF
DUT
Figure 7. HBM ESD Test Circuit
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MAX3243E
SLLS657D – APRIL 2005 – REVISED SEPTEMBER 2011
www.ti.com
APPLICATION INFORMATION
1.5
VHBM = 2 kV
I DUT (A)
1.0
0.5
DUT = 10-V 1-Ω Zener Diode
0.0
0
50
100
150
200
Time (ns)
Figure 8. Typical HBM Current Waveform
IEC61000-4-2 (Formerly Known as IEC1000-4-2)
Unlike the HBM, MM, and CDM ESD tests that apply to component level integrated circuits, the IEC61000-4-2 is
a system-level ESD testing and performance standard that pertains to the end equipment. The MAX3243E is
designed to enable the manufacturer in meeting the highest level (Level 4) of IEC61000-4-2 ESD protection with
no further need of external ESD protection circuitry. The more stringent IEC test standard has a higher peak
current than the HBM, due to the lower series resistance in the IEC model.
Figure 9 shows the IEC61000-4-2 model, and Figure 10 shows the current waveform for the corresponding
±8-kV Contact-Discharge (Level 4) test. This waveform is applied to a probe that has been connected to the
DUT. On the other hand, the corresponding ±15-kV (Level 4) Air-Gap Discharge test involves approaching the
DUT with an already energized probe.
High-Voltage
DC Source
+
−
50−100 MΩ
330 Ω
RC
RD
CS
150 pF
DUT
Figure 9. Simplified IEC61000-4-2 ESD Test Circuit
14
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MAX3243E
SLLS657D – APRIL 2005 – REVISED SEPTEMBER 2011
www.ti.com
APPLICATION INFORMATION
I
(30A) 100%
(Vcontact = 8 kV)
I Peak
90%
(16A)
(8A)
10%
t
30 ns
60 ns
tr = 0.7 ns to 1 ns
Figure 10. Typical Current Waveform of IEC61000-4-2 ESD Generator
Machine Model
The Machine Model (MM) ESD test applies to all pins using a 200-pF capacitor with no discharge resistance.
The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and
assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins.
However, after PC board assembly, the MM test is no longer as pertinent to the RS-232 pins.
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15
MAX3243E
SLLS657D – APRIL 2005 – REVISED SEPTEMBER 2011
www.ti.com
REVISION HISTORY
Changes from Revision C (February 2009) to Revision D
Page
•
Deleted "VALID RIN RS-232 LEVEL" from INPUTS. ........................................................................................................... 3
•
Deleted "ROUT2B is active" RECEIVER STATUS and combined ROUT outputs. .............................................................. 3
•
Added New Table "ROUT2B and INVALID Outputs" defining truth table for ROUT2B and INVALID outputs. ................... 3
•
Changed “VALID_RIN” entry from “YES” to “NO.” ............................................................................................................... 3
16
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PACKAGE OPTION ADDENDUM
www.ti.com
13-Aug-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
MAX3243ECDB
ACTIVE
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243EC
MAX3243ECDBG4
ACTIVE
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243EC
MAX3243ECDBR
ACTIVE
SSOP
DB
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243EC
MAX3243ECDW
ACTIVE
SOIC
DW
28
20
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243EC
MAX3243ECDWR
ACTIVE
SOIC
DW
28
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243EC
MAX3243ECPW
ACTIVE
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MP243EC
MAX3243ECPWE4
ACTIVE
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MP243EC
MAX3243ECPWR
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MP243EC
MAX3243ECPWRG4
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MP243EC
MAX3243ECRHBR
ACTIVE
VQFN
RHB
32
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
0 to 70
MP243E
MAX3243EIDB
ACTIVE
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243EI
MAX3243EIDBR
ACTIVE
SSOP
DB
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243EI
MAX3243EIDW
ACTIVE
SOIC
DW
28
20
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243EI
MAX3243EIDWR
ACTIVE
SOIC
DW
28
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243EI
MAX3243EIDWRG4
ACTIVE
SOIC
DW
28
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243EI
MAX3243EIPW
ACTIVE
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP243EI
MAX3243EIPWE4
ACTIVE
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP243EI
MAX3243EIPWG4
ACTIVE
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP243EI
MAX3243EIPWR
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP243EI
MAX3243EIPWRE4
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP243EI
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
13-Aug-2021
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
MAX3243EIPWRG4
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP243EI
MAX3243EIRHBR
ACTIVE
VQFN
RHB
32
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
MR243E
MAX3243EIRHBRG4
ACTIVE
VQFN
RHB
32
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
MR243E
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of