User's Guide
SLAU680 – May 2018
MSP430FR2355 LaunchPad™ Development Kit
(MSP‑EXP430FR2355)
The MSP-EXP430FR2355 LaunchPad™ Development Kit is an easy-to-use Evaluation Module (EVM) for
the MSP430FR2355 microcontroller (MCU). The kit contains everything needed to start developing on the
ultra-low-power MSP430FRx FRAM microcontroller platform, including onboard debug probe for
programming, debugging, and energy measurements. The board also features onboard buttons and LEDs
for quick integration of a simple user interface, an onboard Grove connector for external Grove sensors,
as well as an ambient light sensor to showcase the integrated analog peripherals.
Figure 1 shows the MSP-EXP430FR2355 LaunchPad development kit.
Figure 1. MSP-EXP430FR2355 LaunchPad Development Kit
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
1
www.ti.com
1
2
3
4
5
6
Contents
Getting Started ............................................................................................................... 4
1.1
Introduction .......................................................................................................... 4
1.2
Key Features ........................................................................................................ 4
1.3
What’s Included ..................................................................................................... 4
1.4
First Steps: Out-of-Box Experience .............................................................................. 4
1.5
Next Steps: Looking Into the Provided Code ................................................................... 5
Hardware...................................................................................................................... 6
2.1
Block Diagram ....................................................................................................... 6
2.2
Hardware Features ................................................................................................. 7
2.3
Power ............................................................................................................... 12
2.4
Measure Current Draw of the MSP430 MCU .................................................................. 12
2.5
Clocking ............................................................................................................ 13
2.6
Using the eZ-FET Debug Probe with a Different Target ..................................................... 13
2.7
BoosterPack Plug-in Module Pinout ............................................................................ 13
2.8
Design Files ........................................................................................................ 15
2.9
Hardware Change Log............................................................................................ 15
Software Examples ........................................................................................................ 15
3.1
Out-of-Box Software Example ................................................................................... 16
3.2
Blink LED Example................................................................................................ 18
Resources ................................................................................................................... 18
4.1
Integrated Development Environments ......................................................................... 18
4.2
LaunchPad Development Kit Websites......................................................................... 22
4.3
MSPWare and TI Resource Explorer ........................................................................... 22
4.4
FRAM Utilities ...................................................................................................... 23
4.5
MSP430FR2355 MCU ............................................................................................ 23
4.6
Community Resources ........................................................................................... 23
FAQ .......................................................................................................................... 24
Schematics .................................................................................................................. 25
List of Figures
1
MSP-EXP430FR2355 LaunchPad Development Kit .................................................................... 1
2
MSP-EXP430FR2355 Overview ........................................................................................... 6
3
MSP-EXP430FR2355 Block Diagram..................................................................................... 6
4
MSP430FR2355 Pinout ..................................................................................................... 8
5
eZ-FET Debug Probe ....................................................................................................... 9
6
eZ-FET Isolation Jumper Block Diagram
7
8
9
10
11
12
13
14
15
16
17
18
...............................................................................
Application Backchannel UART in Device Manager ...................................................................
MSP-EXP430FR2355 Power Block Diagram...........................................................................
BoosterPack Checker Tool ...............................................................................................
LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout ..................................
Default Waveform of the Function Generator Mode ...................................................................
TI Resource Explorer Cloud ..............................................................................................
CCS Cloud ..................................................................................................................
Directing the Project>Import Function to the Demo Project ..........................................................
When CCS Has Found the Project ......................................................................................
Using TI Resource Explorer to Browse MSP-EXP430FR2355 in MSPWare ......................................
Schematics (1 of 2) ........................................................................................................
Schematics (2 of 2) ........................................................................................................
10
11
12
14
15
17
19
20
21
21
22
25
26
List of Tables
1
2
EnergyTrace Technology ................................................................................................... 9
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
www.ti.com
2
3
4
5
6
7
8
..............................................................................................
Hardware Change Log ....................................................................................................
Software Examples ........................................................................................................
IDE Minimum Requirements for MSP-EXP430FR2355 ...............................................................
Source File and Folders ...................................................................................................
Source File and Folders ...................................................................................................
How MSP Device Documentation is Organized ........................................................................
Isolation Block Connections
10
15
15
16
16
18
23
Trademarks
LaunchPad, BoosterPack, Code Composer Studio, EnergyTrace, MSP430, E2E are trademarks of Texas
Instruments.
IAR Embedded Workbench, C-SPY are registered trademarks of IAR Systems.
All other trademarks are the property of their respective owners.
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
3
Getting Started
1
Getting Started
1.1
Introduction
www.ti.com
The 24-MHz MSP430FR2355 device features 32KB of embedded FRAM (ferroelectric random access
memory), a nonvolatile memory known for its ultra-low power, high endurance, and high speed write
access. Combined with 4KB of on-chip RAM, users have access to 32KB of memory to split between their
program and data as required. For example, a data logging application may require a large data memory
with relatively small program memory, so the memory may be allocated as required between program and
data memory.
Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide
range of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity,
graphical displays, environmental sensing, and much more. Design your own BoosterPack plug-in module
or choose among many already available from TI and third-party developers.
Free software development tools are also available, such as TI’s Eclipse-based Code Composer Studio™
IDE (CCS) and IAR Embedded Workbench® IDE. Both of these IDEs support EnergyTrace™ technology
for real-time power profiling and debugging when paired with the MSP430FR2355 LaunchPad
development kit.
1.2
Key Features
•
•
•
•
•
•
•
MSP ULP FRAM technology based MSP430FR2355 16-bit MCU
EnergyTrace technology available for ultra-low-power debugging
40-pin LaunchPad development kit standard leveraging the BoosterPack plug-in module ecosystem
Onboard eZ-FET debug probe
2 buttons and 2 LEDs for user interaction
Ambient light sensor for the Out-of-Box Experience demo
Grove connector for external Grove sensors
1.3
What’s Included
1.3.1
Kit Contents
• 1 MSP-EXP430FR2355 LaunchPad Development Kit
• 1 Micro USB cable
• 1 Quick Start Guide
1.3.2
•
1.4
Software Examples
Out-of-Box Software
First Steps: Out-of-Box Experience
An easy way to get started with the EVM is by using its preprogrammed out-of-box code. It demonstrates
some key features of the EVM.
1.4.1
Connecting to the Computer
Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED
should illuminate. For proper operation, drivers are needed. TI recommends that you get the drivers by
installing an IDE such as TI's CCS or IAR EW430. Drivers are also available at www.ti.com/MSPdrivers.
4
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
Getting Started
www.ti.com
1.4.2
Running the Out-of-Box Experience
The Out-of-Box Experience (OOBE) of the MSP-EXP430FR2355 LaunchPad development kit
demonstrates how to set up multiple integrated Smart Analog Combo (SAC) peripherals of the
MSP430FR2355 MCU and how to use the interconnections between SAC pairs in various demo
scenarios. The OOBE includes two modes, a Light Sensor mode and a Function Generator mode. In the
Function Generator mode, the LaunchPad development kit transmits digital data to the PC and can be
visualized using the accompanying cloud GUI (visit MSP-EXP430FR2355 OOB GUI).
By default after power up, the MSP-EXP430FR2355 LaunchPad development kit enters the Light Sensor
mode, in which LED1 or LED2 brightens or dims based on the amount of ambient light sensed by the
photodiode, D1. A default brightness threshold is set at approximately half of the full brightness detection
range of D1 at which both LED1 and LED2 are off. Shine a light source such as a flashlight or cover up
D1 using your hand, and notice the green LED2 gets brighter as more light reaches D1, while the red
LED1 gets brighter as less light reaches D1. Press button S1 in the Light Sensor mode to set the new
brightness threshold at the current ambient light level.
Next, try pressing S2 to enter Function Generator mode. By default, the LaunchPad development kit starts
to generate a 1-Hz inverted sine wave at 0.8-V amplitude on pin P1.5. This signal is a result of using one
of the SAC 12-bit DACs to generate a sine wave and feeding it into a second SAC, which is configured as
an inverting programmable gain amplifier (PGA). The resulting waveform on pin P1.5 is also captured by
the MSP430FR2355 internal ADC, and the live data are transmitted to the PC. An accompanying cloud
GUI (visit MSP-EXP430FR2355 OOB GUI) is available to visualize the ADC measurements of the
generated waveform. This GUI also provides various controls for changing the signal type (sinusoidal,
square, or sawtooth), frequency, and amplitude of the DAC waveform generation and for configuring the
PGA mode (inverting or noninverting) and gain. See Section 3.1 for more details on the OOBE and how to
use its accompanying cloud GUI.
This GUI is created with GUI Composer 2.0 with the source available for customization, imported from the
TI Cloud Gallery. The serial communication port on the PC must be configured with 115200 bps, one stop
bit, and no flow control.
NOTE: The OOB cloud GUI is only supported in the latest versions of Chrome, Firefox, and Safari
browsers. An installer for the offline standalone GUI can also be downloaded from the TI
Cloud Gallery.
1.5
Next Steps: Looking Into the Provided Code
After the EVM features have been explored, the fun can begin. It’s time to open an integrated
development environment and start editing the code examples. See Section 4 for available IDEs and
where to download them.
The quickest way to get started using the LaunchPad development kit is to use TI’s Cloud Development
Tools. The cloud-based Resource Explorer provides access to all of the examples and resources in
MSPWare. Code Composer Studio Cloud is a simple Cloud-based IDE that enables developing and
running applications on the LaunchPad development kit.
The out-of-box source code and more code examples are provided and available on the download page.
Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.
Section 3 describes all functions in detail and provides a project structure to help familiarize you with the
code.
With the onboard eZ-FET debug probe, debugging and downloading new code is simple. A USB
connection between the EVM and a PC through the provided USB cable is all that is needed.
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
5
Hardware
2
www.ti.com
Hardware
Figure 2 shows an overview of the MSP-EXP430FR2355 hardware.
Figure 2. MSP-EXP430FR2355 Overview
2.1
Block Diagram
Figure 3 shows the block diagram.
Micro-B
USB
LED
Red, Green
ESD
Protection
Crystal
4 MHz
Reset
button
Debug
MCU
EnergyTrace
Technology
UART, SBW to Target
Power to Target
3.3-V LDO
Crystal
32.768 kHz
40-pin
LaunchPad
standard headers
Target device
MSP430FR2355
Ambient Light
Sensor
User interface
2 buttons, 2 LEDs
Grove
Connector
Figure 3. MSP-EXP430FR2355 Block Diagram
6
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
Hardware
www.ti.com
2.2
2.2.1
Hardware Features
MSP430FR2355 MCU
The MSP430FR2355 is an ultra-low-power MSP430FRx FRAM-based microcontroller (MCU), which offer
extended data logging and security capabilities. The MSP430FR2355 offers the small LQFP package (7
mm × 7 mm) in the FRAM microcontroller portfolio, combined with a variety of integrated peripherals and
ultra-low power consumption. FRAM is a cutting edge memory technology, combining the best features of
flash and RAM into one nonvolatile memory. More information on FRAM can be found at www.ti.com/fram.
Device features include:
• 1.8-V to 3.6-V operation
• 16-Bit RISC architecture up to 24-MHz system clock and 8-MHz FRAM access
• 32KB of Program FRAM, 512 bytes of Information FRAM, and 4KB of RAM
• 12-channel 12-bit ADC
• Two enhanced comparator with integrated 6-bit DAC as reference voltage
• Four Smart Analog Combo (SAC-L3)
• Three 16-bit timers with three capture/compare registers (Timer_B3)
• One 16-bit timer with seven capture/compare registers (Timer_B7)
• 32-bit hardware multiplier (MPY)
• 44 GPIOs
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
7
Hardware
48
47
46
45
44
43
42
41
40
39
38
37
P1.3/UCB0SOMI/UCB0SCL/OA0+/A3
P3.0/MCLK
P3.1/OA2O
P3.2/OA2P3.3/OA2+
P5.0/TB2.1/MFM.RX/A8
P5.1/TB2.2/MFM.TX/A9
P5.2/TB2CLK/A10
P5.3/TB2TRG/A11
P5.4
P3.4/SMCLK
P3.5/OA3O
www.ti.com
1
2
3
4
5
6
7
8
9
10
11
12
MSP430FR2355TPT
MSP430FR2353TPT
36
35
34
33
32
31
30
29
28
27
26
25
P3.6/OA3P3.7/OA3+
P1.4/UCA0STE/TCK/A4
P1.5/UCA0CLK/TMS/OA1O/A5
P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/OA1-/A6
P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/OA1+/A7/VREF+
P2.0/TB1.1/COMP0.O
P2.1/TB1.2/COMP1.O
P2.2/TB1CLK
P2.3/TB1TRG
P4.0/UCA1STE/ISOTXD/ISORXD
P4.1/UCA1CLK
P4.6/UCB1SIMO/UCB1SDA
P4.5/UCB1CLK
P4.4/UCB1STE
P6.6/TB3CLK
P6.5/TB3.6
P6.4/TB3.5
P6.3/TB3.4
P6.2/TB3.3
P6.1/TB3.2
P6.0/TB3.1
P4.3/UCA1TXD/UCA1SIMO/UCA1TXD
P4.2/UCA1RXD/UCA1SOMI/UCA1RXD
13
14
15
16
17
18
19
20
21
22
23
24
P1.2/UCB0SIMO/UCB0SDA/TB0TRG/OA0-/A2/VerefP1.1/UCB0CLK/ACLK/OA0O/COMP0.1/A1
P1.0/UCB0STE/SMCLK/COMP0.0/A0/Veref+
TEST/SBWTCK
RST/NMI/SBWTDIO
DVCC
DVSS
P2.7/TB0CLK/XIN
P2.6/MCLK/XOUT
P2.5/COMP1.0
P2.4/COMP1.1
P4.7/UCB1SOMI/UCB1SCL
Figure 4. MSP430FR2355 Pinout
8
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
Hardware
www.ti.com
2.2.2
eZ-FET Onboard Debug Probe With EnergyTrace™ Technology
To keep development easy and cost effective, TI’s LaunchPad development kits integrate an onboard
debug probe, which eliminates the need for expensive programmers. The MSP-EXP430FR2355 has the
eZ-FET debug probe (see Figure 5), which is a simple and low-cost debugger that supports all MSP430™
device derivatives.
Figure 5. eZ-FET Debug Probe
The MSP-EXP430FR2355 LaunchPad development kit features EnergyTrace technology but does not
have support for EnergyTrace++ technology. The EnergyTrace technology functionality varies across the
MSP portfolio.
Table 1. EnergyTrace Technology
Features
Current Monitoring
EnergyTrace Technology
EnergyTrace++ Technology
✔
✔
✔
CPU State
✔
Peripheral and System State
Devices Supported
Development Tool Required
All MSP430 MCUs
MSP430FR59xx and MSP430FR69xx
MCUs
MSP-FET or eZ-FET
MSP-FET or eZ-FET
The dotted line through J101 shown in Figure 5 divides the eZ-FET debug probe from the target area. The
signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. More
details on the isolation jumper block are in Section 2.2.3.
The eZ-FET also provides a "backchannel" UART-over-USB connection with the host, which can be very
useful during debugging and for easy communication with a PC. More details can be found in
Section 2.2.4.
The eZ-FET hardware can be found in the schematics in Section 6 and in the hardware design files
download page. The software and more information about the debugger can be found on the eZ-FET wiki.
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
9
Hardware
2.2.3
www.ti.com
Debug Probe Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from
the eZ-FET domain into the MSP430FR2355 target domain. This includes eZ-FET Spy-Bi-Wire signals,
application UART signals, and 3.3-V and 5-V power.
Reasons to open these connections:
• To remove any and all influence from the eZ-FET debug probe for high accuracy target power
measurements
• To control 3-V and 5-V power flow between the eZ-FET and target domains
• To expose the target MCU pins for other use than onboard debugging and application UART
communication
• To expose the programming and UART interface of the eZ-FET so that it can be used for devices other
than the onboard MCU.
Table 2. Isolation Block Connections
Jumper
GND
Description
Ground
5V
5-V VBUS from USB
3V3
3.3-V rail, derived from VBUS in the eZ-FET domain
RXD >
Backchannel UART: The target FR2355 sends data through this signal. The arrows indicate the direction of the
signal.
SBW RST
Spy-Bi-Wire debug: SBWTDIO data signal. This pin also functions as the RST signal (active low).
SBW TST
Spy-Bi-Wire debug: SBWTCK clock signal. This pin also functions as the TST signal.
USB Connector
USB
eZ-FET
in
eZ-FET Debug
Probe
out
LDO
EnergyTrace
Technology
Target
MSP430FR2355
BoosterPack Header
Spy-Bi-Wire (SBW)
Emulation
Application UART
3.3-V Power
BoosterPack Header
MSP430 Target
5-V Power
Isolation
Jumper Block
Figure 6. eZ-FET Isolation Jumper Block Diagram
10
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
Hardware
www.ti.com
2.2.4
Application (or "Backchannel") UART
The backchannel UART allows communication with the USB host that is not part of the target application’s
main functionality. This is very useful during development, and also provides a communication channel to
the PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the
PC that communicate with the LaunchPad development kit.
Figure 6 shows the pathway of the backchannel UART. The backchannel UART is the UART on
eUSCI_A1.
On the host side, a virtual COM port for the application backchannel UART is generated when the
LaunchPad development kit enumerates on the host. You can use any PC application that interfaces with
COM ports, including terminal applications like Hyperterminal or Docklight, to open this port and
communicate with the target application. You need to identify the COM port for the backchannel. On
Windows PCs, Device Manager can assist.
Figure 7. Application Backchannel UART in Device Manager
The backchannel UART is the "MSP Application UART1" port. In this case, Figure 7 shows COM13, but
this port can vary from one host PC to the next. After you identify the correct COM port, configure it in
your host application according to its documentation. You can then open the port and begin
communication to it from the host.
On the target MSP430FR2355 side, the backchannel is connected to the eUSCI_A1 module. The eZ-FET
has a configurable baud rate; therefore, it is important that the PC application configures the baud rate to
be the same as what is configured on the eUSCI_A1.
2.2.5
Special Features
2.2.5.1
Smart Analog Combo (SAC)
The MSP430FR2355 MCU LaunchPad development kit features pins to access the SAC on the device.
These pins are accessed on jumpers J7, J8 and J9 where the SAC operational amplifier is connected to
the onboard photodiode circuit. These pins are also connected to the BoosterPack plug-in module header
pins. For applications that use the SAC and a connected BoosterPack plug-in module, be sure to check
for any pin conflicts. The photodiode circuit can be disconnected from the SAC using jumpers J7, J8 and
J9. The user can connect an external analog sensor circuit to the SAC by removing jumpers J7, J8 and J9
and connecting their circuit to the appropriate header pins through the BoosterPack plug-in module
headers or the jumpers near the light sensor circuit. To adjust the sensitivity of the light sensor circuit, the
user can adjust either the software or the hardware. By changing the values of R3 and C6, the user can
change the operational amplifier low-pass filter and sensitivity to the current of the photodiode. The user
can also adjust the calculations performed in the software to adjust the sensitivity of the circuit to their
desired level.
2.2.5.2
Grove Connector
The MSP430FR2355 MCU LaunchPad development kit features an onboard Grove connector for Analog
and Digital Grove modules from Seeed Studio. The Grove connector consists of 4 pins that are routed to
3.3 V, GND, P1.1, and P1.4. Users can take advantage of this connector and begin prototyping with
different Grove sensors and actuators without the need to interface the LaunchPad development kit with a
Grove Base BoosterPack plug-in module.
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
11
Hardware
2.3
www.ti.com
Power
The board accommodates various powering methods, including through the onboard eZ-FET as well as
external or BoosterPack plug-in module power (see Figure 8).
Figure 8. MSP-EXP430FR2355 Power Block Diagram
2.3.1
eZ-FET USB Power
The most common power-supply scenario is from USB through the eZ-FET debugger. This provides 5-V
power from the USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to the
target side of the LaunchPad development kit. Power from the eZ-FET is controlled by jumper J101. For
3.3 V, make sure that a jumper is connected across the J101 3V3 terminal.
2.3.2
BoosterPack Plug-in Module and External Power Supply
Header J5 is present on the board to supply external power directly. It is important to comply with the
device voltage operation specifications when supplying external power. The MSP430FR2355 has an
operating range of 1.8 V to 3.6 V. More information can be found in the MSP430FR2355 Mixed-Signal
Microcontroller data sheet.
2.4
Measure Current Draw of the MSP430 MCU
To measure the current draw of the MSP430FR2355 MCU using a multimeter, use the 3V3 jumper on the
J101 jumper isolation block. The current measured includes the target device and any current drawn
through the BoosterPack plug-in module headers.
To measure ultra-low power, follow these steps:
• Remove the 3V3 jumper in the J101 isolation block, and attach an ammeter across this jumper.
• Consider the effect that the backchannel UART and any circuitry attached to the MSP430FR2355 may
have on current draw. Consider disconnecting these at the isolation jumper block, or at least consider
their current sinking and sourcing capability in the final measurement.
12
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
Hardware
www.ti.com
•
•
•
Make sure there are no floating inputs/outputs (I/Os) on the MSP430FR2355. These cause
unnecessary extra current draw. Every I/O should either be driven out or, if it is an input, should be
pulled or driven to a high or low level.
Begin target execution.
Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a
stable measurement. It is easier to measure quiescent states.
EnergyTrace technology can also be used to compare various current profiles and better optimize your
energy performance!
2.5
Clocking
The MSP-EXP430FR2355 provides an external clock in addition to the internal clocks in the device.
• Q1: 32.768-kHz 12.5-pF crystal
The 32.768-kHz crystal allows for lower LPM sleep currents than do the other low-frequency clock
sources. Therefore, the presence of the crystal allows the full range of low-power modes to be used.
The internal clocks in the device default to the following configuration:
• MCLK: DCO at 1 MHz
• SMCLK: DCO at 1 MHz
• ACLK: REFO at 32.768 kHz
For more information about configuring internal clocks and using the external oscillators, see the
MSP430FR4xx and MSP430FR2xx Family User's Guide.
2.6
Using the eZ-FET Debug Probe with a Different Target
The eZ-FET debug probe on the LaunchPad development kit can interface to most MSP430 derivative
devices, not just the onboard MSP430FR2355 target device.
To do this, disconnect every jumper in the isolation jumper block. This is necessary, because the debug
probe cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection.
Next, make sure the target board has proper connections for SBW. Note that to be compatible with SBW,
the capacitor on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430
JTAG interface circuitry is the MSP430 Hardware Tools User's Guide.
Finally, wire together these signals from the debug probe side of the isolation jumper block to the target
hardware:
• 5 V (if 5 V is needed)
• 3.3 V
• GND
• SBWTDIO
• SBWTCK
• TXD (if the UART backchannel is to be used)
• RXD (if the UART backchannel is to be used)
This wiring can be done either with jumper wires or by designing the board with a connector that plugs into
the isolation jumper block.
2.7
BoosterPack Plug-in Module Pinout
The LaunchPad development kit adheres to the 40-pin LaunchPad development kit pinout standard. A
standard was created to aid compatibility between LaunchPad development kits and BoosterPack plug-in
modules across the TI ecosystem.
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
13
Hardware
www.ti.com
While most BoosterPack plug-in modules are compliant with the standard, some are not. The MSPEXP430FR2355 LaunchPad development kit is compatible with all 40-pin BoosterPack plug-in modules
that are compliant with the standard. If the reseller or owner of the BoosterPack plug-in module does not
explicitly indicate compatibility with the MSP-EXP430FR2355 LaunchPad development kit, compare the
schematic of the candidate BoosterPack plug-in module with the LaunchPad development kit to ensure
compatibility. Keep in mind that sometimes conflicts can be resolved by changing the MSP430FR2355
device pin function configuration in software.
Figure 9. BoosterPack Checker Tool
To check the compatibility of a BoosterPack plug-in module with the LaunchPad development kit of your
choice, use the BoosterPack Checker tool. This allows you to select any LaunchPad development kit we
offer and determine its compatibility with any number of BoosterPack plug-in modules that we offer. You
can also add your own BoosterPack plug-in module to check its compatibility as you prototype that next
design.
Figure 10 shows the 40-pin pinout of the MSP430FR2355 LaunchPad development kit.
Note that software's configuration of the pin functions plays a role in compatibility. The LaunchPad
development kit side of the dashed line shows only the applicable function for conforming to the standard.
However, each pin has other functionality that can be configured by the software. See the
MSP430FR2355 device data sheet for more details on individual pin functions.
14
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
Hardware
www.ti.com
Figure 10. LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout
2.8
2.8.1
Design Files
Hardware
Schematics can be found in Section 6. All design files including schematics, layout, bill of materials
(BOM), Gerber files, and documentation are available on the MSP-EXP430FR2355 Design File download
page.
2.8.2
Software
All design files including TI-TXT object-code firmware images, software example projects, and
documentation are available on the MSP-EXP430FR2355 Design File download page.
2.9
Hardware Change Log
Table 3 lists the hardware revision history.
Table 3. Hardware Change Log
PCB Revision
Rev A
3
Description
Initial release
Software Examples
Two software examples are included with the MSP430FR2355 LaunchPad development kit (see Table 4),
which can be found in the MSP430FR2355 LaunchPad development kit download page and are also
available inside MSPWare.
Table 4. Software Examples
Demo Name
BoosterPack
Plug-in Module
Required
Description
More Details
OutofBox_MSP-EXP430FR2355
None
The out-of-box demo preprogrammed on the
LaunchPad development kit from the factory.
Demonstrates features of MSP430FR2355 device
Section 3.1
BlinkLED_MSP-EXP430FR2355
None
Blinks an LED on the LaunchPad development kit at a
fixed interval
Section 3.2
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
15
Software Examples
www.ti.com
To use any of the software examples with the LaunchPad development kit, you must have an integrated
development environment (IDE) that supports the MSP430FR2355 device (see Table 5).
Table 5. IDE Minimum Requirements for MSP-EXP430FR2355
Code Composer Studio IDE
IAR Embedded Workbench for Texas
Instruments MSP430 IDE
v8.0 or later
v7.12.1 or later
For more details on how to get started quickly and where to download the latest CCS and IAR IDEs, see
Section 4.
3.1
Out-of-Box Software Example
This section describes the functionality and structure of the Out-of-Box software that is preloaded in the
EVM.
The Out-of-Box Experience (OOBE) of the MSP-EXP430FR2355 LaunchPad development kit
demonstrates how to set up the integrated SAC and use it to condition an analog output so that it can be
properly sampled by the ADC converter on the MCU.
3.1.1
Source File Structure
The project is split into multiple files (see Table 6). This makes it easier to navigate and reuse parts of it
for other projects.
Table 6. Source File and Folders
Name
3.1.2
Description
main.c
Out-of-Box demo main function
lightsensor.c
Contains functions for the Light Sensor mode
functiongenerator.c
Contains functions for the Function Generator mode
Library: driverlib
Device driver library
Library: jsmn
Minimalistic third-party library for parsing JSON formatted strings
Overview
Upon powering up the Out-of-Box demo, the board enters the Light Sensor mode where LED1 or LED2
brightens/dims based on the intensity of the ambient light hitting the on-board photodiode. By pressing
button S2, the board enters the Function Generator mode where an input signal (sourced internally or
externally) is fed into a SAC configured in PGA mode, and the final output waveform is captured with the
internal ADC. At any time, press S2 to switch between the Light Sensor mode and Function Generator
mode.
When the demo is in Function Generator mode, an online cloud GUI (MSP-EXP430FR2355 OOB GUI)
can be used with the development kit to control the input signal source and visualize the real-time ADC
measurement. In addition to S2, the GUI provides buttons that can also be used to switch between
modes.
NOTE: The MSP430FR2355 microcontroller is equipped with four on-chip Smart Analog Combos
(SAC), which come in pairs of two, SAC0 with SAC2 and SAC1 with SAC3. Each pair of
SACs is interconnected, where the output of one SAC can be fed into the input of its paired
SAC. The Out-of-Box demonstrates these interconnections and uses one SAC pair in the
Light Sensor mode and the second SAC pair in the Function Generator mode.
16
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
Software Examples
www.ti.com
3.1.3
Light Sensor Mode
The Light Sensor mode uses the SAC0 and SAC2 pair, two Timer_B modules, and the ADC of the
MSP430FR2355 MCU, combined with the on-board photodiode and LEDs of the LaunchPad development
kit, to implement a simple light sensing application. It configures SAC2 as a generic op-amp and, together
with R3 and C6, implements a transimpedance amplifier to convert the photodiode current to a voltage. To
measure this voltage with the device’s ADC, the output voltage of SAC2 is then fed through SAC0
(configured as a buffer), whose output is connected internally to the ADC.
When the Out-of-Box demo is first programmed onto the LaunchPad development kit, a default ADC
threshold is set to approximately half of the full brightness detection range of D1. If the ADC measurement
is below this brightness threshold, the red LED1 illuminates, and if the ADC measurement is above the
default threshold, the green LED2 illuminates corresponding to the intensity of the ambient light. To
recalibrate the threshold to the ADC value measured from the ambient light, press S1. The user can
influence the amount of light reaching the photodiode by using a flashlight or covering the photodiode
observing the changes in the LED brightness.
3.1.4
Function Generator Mode
In the Function Generator mode, an input signal (sourced internally or externally) is fed into the SAC1
configured in the Programmable Gain Amplifier (PGA) mode to be manipulated and captured with the
internal ADC. The LaunchPad kit repeatedly measures and transfers this data to the PC through UART.
When the Out-of-Box demo is first programmed onto the LaunchPad development kit, the Function
Generator mode is initially configured to generate a 1-Hz sine wave at 0.8-V amplitude using the SAC3
DAC, and the sine wave is fed into SAC1 configured in the inverting PGA mode with a gain of 1. When
visualized in the OOB GUI, you should see an inverted sine wave as shown in Figure 11.
Figure 11. Default Waveform of the Function Generator Mode
Using the GUI, the input signal source can be selected between the internal 12-bit DAC (SAC3) and an
external signal source. When the “Internal DAC” is selected as the input signal source, the GUI can be
used to generate different types of signals (sinusoidal, square, or sawtooth) of various frequencies and
amplitudes. The SAC1 PGA inverting or noninverting gain can be used to manipulate the generated signal
of the SAC3 DAC, and the output waveform is captured with the internal ADC connection and displayed
on the cloud GUI.
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
17
Software Examples
www.ti.com
NOTE: When SAC1 is configured in the Inverting PGA mode, the SAC3 DAC generates sine,
square, or sawtooth waveforms with a DC bias of +1.65 V, and the SAC1 DAC is used to
generate a +1.65-V DC bias for the SAC1 PGA.
When SAC1 is configured in the Noninverting PGA mode, the SAC1 DAC is not available to
generate a DC bias for its PGA and is based to 0 V by default. Therefore, the SAC3 DAC
generates sine, square, or sawtooth waveforms with minimum peaks at 0 V.
Alternatively, an external signal source can be directly fed into the inverting input of the SAC1 PGA by
selecting "P1.6 OA1- Inverting PGA IN" or the noninverting input of the SAC1 PGA by selecting "P1.7
OA1+ Non-inverting PGA IN" as the input signal source using the GUI. In these two input signal source
configurations, the SAC1 PGA inverting or noninverting gain can be used to manipulate the external input
signal on P1.6 or P1.7, and the output waveform is captured with the internal ADC connection and
displayed on the cloud GUI.
Finally, SAC3 and SAC1 can be completely bypassed by selecting "P1.5 ADC Direct IN" as the input
signal source. In this case, an external signal can be connected to P1.5 and measured directly by the
internal ADC of the MCU, acting as a primitive oscilloscope.
3.2
Blink LED Example
This simple software example shows how to software toggle a GPIO to blink an LED on the LaunchPad
development kit.
3.2.1
Source File Structure
The project is split into multiple files (see Table 7). This makes it easier to navigate and reuse parts of it
for other projects.
Table 7. Source File and Folders
Name
Description
main.c
The Blink LED main function
Library: Driverlib
Device driver library
The main code uses the MSP430 Driver Library to halt the watchdog timer and to configure and toggle the
P1.0 GPIO pin connected to the LED inside a software loop.
4
Resources
4.1
Integrated Development Environments
Although the source files can be viewed with any text editor, more can be done with the projects if they’re
opened with a development environment like Code Composer Studio IDE (CCS) or IAR Embedded
Workbench IDE.
4.1.1
TI Cloud Development Tools
TI’s Cloud-based software development tools provide instant access to MSPWare content and a webbased IDE.
4.1.1.1
TI Resource Explorer Cloud
TI Resource Explorer Cloud provides a web interface for browsing examples, libraries and documentation
found in MSPWare without having to download files to your local drive.
Go check out TI Resource Explorer Cloud now at dev.ti.com.
18
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
Resources
www.ti.com
Figure 12. TI Resource Explorer Cloud
4.1.1.2
Code Composer Studio Cloud
Code Composer Studio Cloud (CCS Cloud) is a web-based IDE that enables you to quickly create, edit,
build and debug applications for your LaunchPad development kit. No need to download and install large
software packages, simply connect your LaunchPad development kit and begin. You can choose to select
from a large variety of examples in MSPWare software and Energia or develop your own application. CCS
Cloud supports debug features such as execution control, breakpoints and viewing variables.
For more information, see the full comparison between CCS Cloud and CCS Desktop.
Go check out Code Composer Studio Cloud now at dev.ti.com.
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
19
Resources
www.ti.com
Figure 13. CCS Cloud
4.1.2
Code Composer Studio IDE
Code Composer Studio Desktop is a professional integrated development environment that supports TI's
Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools
used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code
editor, project build environment, debugger, profiler, and many other features.
Learn more about CCS and download it at http://www.ti.com/tool/ccstudio.
CCS v8.0 or higher is required. When CCS has been launched, and a workspace directory chosen, use
Project>Import Existing CCS Eclipse Project. Direct it to the desired demo project directory that contains
main.c.
20
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
Resources
www.ti.com
Figure 14. Directing the Project>Import Function to the Demo Project
Selecting the \CCS subdirectory also works. The CCS-specific files are located there.
When you click OK, CCS should recognize the project and allow you to import it. The indication that CCS
has found it is that the project appears in the box shown in Figure 15, and it has a checkmark to the left of
it.
Figure 15. When CCS Has Found the Project
Sometimes CCS finds the project but does not show a checkmark; this might mean that your workspace
already has a project by that name. You can resolve this by renaming or deleting that project. (Even if you
do not see it in the CCS workspace, be sure to check the workspace directory on the file system.)
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
21
Resources
4.1.3
www.ti.com
IAR Embedded Workbench for Texas Instruments 430 IDE
IAR Embedded Workbench for MSP430 is another very powerful integrated development environment that
allows you to develop and manage complete embedded application projects. It integrates the IAR C/C++
Compiler, IAR Assembler, IAR ILINK Linker, editor, project manager, command line build utility, and IAR
C-SPY® Debugger.
Learn more about IAR Embedded Workbench for MSP430 and download it at
http://supp.iar.com/Download/SW/?item=EW430-EVAL.
IAR v7.12.1 or higher is required. To open the demo in IAR, click File>Open>Workspace…, and browse to
the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is
contained within this file.
The subdirectory also has an *.ewp project file. This file can be opened into an existing workspace by
clicking Project>Add-Existing-Project….
Although the software examples have all of the code required to run them, IAR users may download and
install MSPWare, which contains MSP430 libraries and the TI Resource Explorer. These are already
included in a CCS installation (unless the user selected otherwise).
4.2
LaunchPad Development Kit Websites
More information about the LaunchPad development kit, supported BoosterPack plug-in modules, and
available resources can be found at:
• MSP-EXP430FR2355 tool folder: resources specific to this particular LaunchPad development kit
• TI’s LaunchPad development kit portal: information about all LaunchPad development kits from TI
4.3
MSPWare and TI Resource Explorer
TI Resource Explorer is a tool integrated into CCS that allows you to browse through available design
resources. TI Resource Explorer will help you quickly find what you need inside packages including
MSPWare, ControlSuite, TivaWare and more. TI Resource Explorer is well organized to find everything
that you need quickly, and you can import software projects into your workspace in one click!
TI Resource Explorer Cloud is one of the TI Cloud Development tools, and is tightly integrated with CCS
Cloud. See Section 4.1.1 for more information.
MSPWare is a collection of code examples, software libraries, data sheets and other design resources for
ALL MSP devices delivered in a convenient package – essentially everything developers need to become
MSP experts!
In addition to providing a complete collection of existing MSP design resources, MSPWare also includes a
high level API called MSP Driver Library. This library makes it easy to talk to MSP hardware. More
information can be found at http://www.ti.com/tool/mspware.
Figure 16. Using TI Resource Explorer to Browse MSP-EXP430FR2355 in MSPWare
22
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
Resources
www.ti.com
Inside TI Resource Explorer, these examples and many more can be found, and easily imported into CCS
with one click.
4.4
FRAM Utilities
The Texas Instruments FRAM Utilities is a collection of embedded software utilities that leverage the ultralow-power and virtually unlimited write endurance of FRAM. The utilities are available for MSP430FRxx
FRAM microcontrollers and provide example code to help start application development.
4.4.1
Compute Through Power Loss
Compute Through Power Loss is a utility API set that enables ease of use with LPMx.5 low-power modes
and a powerful shutdown mode that allows an application to save and restore critical system components
when a power loss is detected.
4.4.2
Nonvolatile Storage (NVS)
The nonvolatile storage (NVS) library makes handling of nonvolatile data easy and robust against
intermittent power loss or asynchronous device resets. To keep data storage constant, the nonvolatile
storage library contains functions that store data in a way that is guaranteed to recover the last valid entry
without data corruption.
4.5
4.5.1
MSP430FR2355 MCU
Device Documentation
At some point, you will probably want more information about the MSP430FR2355 device. For every MSP
device, the documentation is organized as shown in Table 8.
Table 8. How MSP Device Documentation is Organized
4.5.2
Document
For MSP430FR2355
Device family
user’s guide
MSP430FR4xx and MSP430FR2xx Family
User's Guide
Architectural information about the device, including all modules
and peripherals such as clocks, timers, ADC, and so on
Description
Device-specific
data sheet
MSP430FR2355 Mixed-Signal
Microcontroller data sheet
Device-specific information and all parametric information for this
device
MSP430FR2355 Code Examples
MSP430FR243x, MSP430FR253x, MSP430FR263x Code Examples is a set of simple C examples that
demonstrate how to use the entire set of peripherals on the MSP430FR2533 MCU, including serial
communication, ADC10, Timer, and others, through direct register access. Every MSP derivative has a set
of these code examples. When starting a new project or adding a new peripheral, these examples serve
as a great starting point.
4.5.3
MSP430 Application Notes and TI Designs
Many application notes can be found at www.ti.com/msp430. Also see TI Designs for practical design
examples and topics.
4.6
4.6.1
Community Resources
TI E2E™ Community
Search the forums at e2e.ti.com. If you cannot find your answer, post your question to the community!
4.6.2
Community at Large
Many online communities focus on the LaunchPad development kit – for example, www.43oh.com. You
can find additional tools, resources, and support from these communities.
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
23
FAQ
5
www.ti.com
FAQ
Q: I can’t get the backchannel UART to connect. What’s wrong?
A:
•
•
•
Check the following:
Do the baud rate in the host terminal application and the eUSCI settings match?
Are the appropriate jumpers in place, on the isolation jumper block?
Probe on RXD and send data from the host. If you don’t see data, it might be a problem on the host
side.
• Probe on TXD while sending data from the MSP. If you don’t see data, it might be a configuration
problem with the eUSCI module.
• Consider the use of the hardware flow control lines (especially for higher baud rates).
Q: The MSP430G2 LaunchPad development kit had a socket, allowing me change the target device.
Why doesn’t this LaunchPad development kit use one?
A: The target device on this LaunchPad development kit does not come in the dual in-line package.
Sockets for the available device package are too expensive for this kit’s target price.
24
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
Schematics
www.ti.com
6
Schematics
Figure 17. Schematics (1 of 2)
SLAU680 – May 2018
Submit Documentation Feedback
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
25
Schematics
www.ti.com
Figure 18. Schematics (2 of 2)
26
MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
SLAU680 – May 2018
Submit Documentation Feedback
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.
www.ti.com
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
2
www.ti.com
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
3
www.ti.com
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
4
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
www.ti.com
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
5
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
