OPA336UJ

OPA OPA 433 6 336 OPA2 336 OPA336 OPA2336 OPA4336 SBOS068C – JANUARY 1997 – REVISED JANUARY 2005 SINGLE-SUPPLY, microPower CMOS OPERATIONAL AMPLIFIERS microAmplifier ™ Series FEATURES q q q q q q q SINGLE-SUPPLY OPERATION RAIL-TO-RAIL OUTPUT (within 3mV) microPOWER: IQ = 20µA/Amplifier microSIZE PACKAGES LOW OFFSET VOLTAGE: 125µV max SPECIFIED FROM VS = 2.3V to 5.5V SINGLE, DUAL, AND QUAD VERSIONS DESCRIPTION OPA336 series microPower CMOS operational amplifiers are designed for battery-powered applications. They operate on a single supply with operation as low as 2.1V. The output is rail-to-rail and swings to within 3mV of the supplies with a 100kΩ load. The common-mode range extends to the negative supply—ideal for single-supply applications. Single, dual, and quad versions have identical specifications for maximum design flexibility. In addition to small size and low quiescent current (20 µ A/amplifier), they feature low offset voltage (125µV max), low input bias current (1pA), and high openloop gain (115dB). Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom from interaction. OPA336 packages are the tiny SOT23-5 surface mount and SO-8 surface-mount. OPA2336 come in the miniature MSOP-8 surface-mount, SO-8 surface-mount, and DIP-8 packages. The OPA4336 package is the space-saving SSOP-16 surface-mount. All are specified from –40°C to +85°C and operate from –55°C to +125°C. A macromodel is available for download (at www.ti.com) for design analysis. 5 V+ APPLICATIONS q q q q q q q BATTERY-POWERED INSTRUMENTS PORTABLE DEVICES HIGH-IMPEDANCE APPLICATIONS PHOTODIODE PRE-AMPS PRECISION INTEGRATORS MEDICAL INSTRUMENTS TEST EQUIPMENT OPA336 Out V– +In 1 2 OPA4336 Out A 1 2 A D 14 13 12 B –In B Out B NC 6 7 8 SSOP-16 NC = No Connection C 11 10 9 –In C Out C NC +In D V– +In C 3 4 5 16 15 Out D –In D 3 4 –In –In A OPA336 NC –In +In V– 1 2 3 4 SO-8 NC = No Connection 8 7 6 5 NC V+ Output NC SOT23-5 OPA2336 Out A –In A +In A V– 1 2 3 4 DIP-8, SO-8, MSOP-8 A B 8 7 6 5 V+ Out B –In B +In B +In A V+ +In B Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1997-2005, Texas Instruments Incorporated www.ti.com PACKAGE/ORDERING INFORMATION(1) PACKAGE DRAWING DESIGNATOR DBV DBV DBV D D D DGK DGK P P D D DBQ PACKAGE MARKING A36(2) A36(2) J36 OPA336U OPA336UA OPA336UJ B36(2) B36(2) OPA2336P OPA2336PA OPA2336U OPA2336UA OPA4336EA PRODUCT Single OPA336N OPA336NA OPA336NJ OPA336U OPA336UA OPA336UJ Dual OPA2336E OPA2336EA OPA2336P OPA2336PA OPA2336U OPA2336UA Quad OPA4336EA PACKAGE-LEAD SOT23-5 SOT23-5 SOT23-5 SO-8 Surface-Mount SO-8 Surface-Mount SO-8 Surface-Mount MSOP-8 Surface-Mount MSOP-8 Surface-Mount DIP-8 DIP-8 SO-8 Surface-Mount SO-8 Surface-Mount SSOP-16 Surface-Mount NOTES: (1) For the most current package and ordering information, see the package option addendum at the end of this data sheet. (2) Grade will be marked on the Reel. ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage ................................................................................... 7.5V Signal Input Terminals, Voltage(2) ..................... (V–) –0.3V to (V+) +0.3V Current(2) .................................................... 10mA Output Short-Circuit(3) .............................................................. Continuous Operating Temperature .................................................. –55°C to +125°C Storage Temperature ..................................................... –55°C to +125°C Junction Temperature ...................................................................... 150°C Lead Temperature (soldering, 10s) ................................................. 300°C ESD Rating: Charged Device Model, OPA336 NJ and UJ only (CDM)(4) ....... 1000V Human Body Model (HBM)(4) ......................................................... 500V Machine Model (MM)(4) .................................................................. 100V NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only. Functional operation of the device at these conditions, or beyond the specified operating conditions, is not implied. (2) Input terminals are diode-clamped to the power supply rails. Input signals that can swing more than 0.3V beyond the supply rails should be current-limited to 10mA or less. (3) Short-circuit to ground, one amplifier per package. (4) OPA336 NJ and UJ have been tested to CDM of 1000V. All other previous package versions have been tested using HBM and MM. Results are shown. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 2 OPA336, 2336, 4336 www.ti.com SBOS068C ELECTRICAL CHARACTERISTICS: VS = 2.3V to 5.5V Boldface limits apply over the specified temperature range, TA = –40°C to +85°C. At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted. OPA336NA, UA OPA2336EA, PA, UA OPA4336EA MIN TYP T D T T ±10 ±10 T T T T T (V+) –1 90 T 76 74 T 86 T 76 74 T D T MAX ±500 T D T D OPA336N, U OPA2336E, P, U PARAMETER OFFSET VOLTAGE Input Offset Voltage vs Temperature vs Power Supply Over Temperature Channel Separation, dc INPUT BIAS CURRENT Input Bias Current Over Temperature Input Offset Current VOS dVOS/dT PSRR CONDITION MIN TYP(1) ±60 25 0.1 IB IOS ±1 ±1 3 40 30 –0.2 80 76 MAX ±125 100 130 OPA336NJ, UJ MIN TYP MAX UNITS ±500 ±2500 µV D µV/°C T T µV/V D µV/V T µV/V T T T T T T 86 T D T pA pA pA µVp-p nV/√Hz fA/√Hz V dB dB Ω || pF Ω || pF dB dB dB dB kHz V/µs µs mV mV mV mV mV mA pF V V µA µA °C °C °C °C/W °C/W °C/W °C/W °C/W °C/W ±1.5 VS = 2.3V to 5.5V VS = 2.3V to 5.5V ±60 NOISE Input Voltage Noise, f = 0.1 to 10Hz Input Voltage Noise Density, f = 1kHz en Current Noise Density, f = 1kHz in INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio Over Temperature INPUT IMPEDANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain Over Temperature Over Temperature FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate Overload Recovery Time OUTPUT Voltage Output Swing from Rail(2) Over Temperature Over Temperature Short-Circuit Current Capacitive Load Drive POWER SUPPLY Specified Voltage Range Minimum Operating Voltage Quiescent Current (per amplifier) Over Temperature TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance SOT-23-5 Surface-Mount MSOP-8 Surface-Mount SO-8 Surface-Mount DIP-8 SSOP-16 Surface-Mount DIP-14 AOL RL = 25kΩ, 100mV < VO < (V+) – 100mV RL = 25kΩ, 100mV < VO < (V+) – 100mV RL = 5kΩ, 500mV < VO < (V+) – 500mV RL = 5kΩ, 500mV < VO < (V+) – 500mV GBW SR VS = 5V, G = 1 VS = 5V, G = 1 VIN • G = VS RL = 100kΩ, AOL ≥ 70dB RL = 25kΩ, AOL ≥ 90dB RL = 25kΩ, AOL ≥ 90dB RL = 5kΩ, AOL ≥ 90dB RL = 5kΩ, AOL ≥ 90dB ISC CLOAD VS IQ IO = 0 IO = 0 –40 –55 –55 θJA 2.3 100 100 90 90 VCM CMRR –0.2V < VCM < (V+) –1V –0.2V < VCM < (V+) –1V 1013 || 2 1013 || 4 115 106 90 90 T D T T T T 90 90 T D T T T T 100 0.03 100 3 20 70 ±5 See Text 5.5 2.1 20 32 36 +85 +125 +125 200 150 150 100 100 80 T T T T T T T T T T T T T T T T D T T T T T T T T T T T T T T T T T T T T T T T 23 38 42 T T T T T 100 100 500 500 T D T D T D T D TSpecifications same as OPA2336E, P, U. NOTES: (1) VS = +5V. (2) Output voltage swings are measured between the output and positive and negative power-supply rails. OPA336, 2336, 4336 SBOS068C www.ti.com 3 TYPICAL CHARACTERISTICS At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted. OPEN-LOOP GAIN/PHASE vs FREQUENCY 100 80 G 0 –45 POWER-SUPPLY and COMMON-MODE REJECTION RATIO vs FREQUENCY 100 CMRR 80 PSRR, CMRR (dB) Voltage Gain (dB) 60 40 20 0 –20 1 10 100 1k Frequency (Hz) 10k 100k 1M Phase (°) 60 PSRR 40 Φ –90 –135 –180 20 0 1 10 100 1k 10k 100k Frequency (Hz) QUIESCENT CURRENT vs SUPPLY VOLTAGE 30 Per Amplifier QUIESCENT CURRENT vs TEMPERATURE 30 25 Per Amplifier VS = +5V Quiescent Current (µA) 25 Quiescent Current (µA) 20 15 10 5 VS = +2.3V 20 15 10 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage (V) 0 –75 –50 –25 0 25 50 75 100 125 Temperature (°C) SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE ±6 ±5 ±4 ±3 ±2 –ISC ±1 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage (V) +ISC 8 7 Short-Circuit Current (mA) 6 SHORT-CIRCUIT CURRENT vs TEMPERATURE Short-Circuit Current (mA) VS = +5V –ISC 5 4 3 2 1 0 –75 –50 –25 0 25 50 75 100 125 Temperature (°C) +ISC VS = +2.3V –ISC +ISC 4 OPA336, 2336, 4336 www.ti.com SBOS068C TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted. INPUT VOLTAGE AND CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY 1k Voltage Noise Voltage Noise (nV/√Hz) Current Noise (fA/√Hz) CHANNEL SEPARATION vs FREQUENCY 1k 150 Channel Separation (dB) 140 100 100 130 Dual and Quad devices, G = 1, all channels. Quad measured channel A to D or B to C—other combinations yield improved rejection. 100 1k Frequency (Hz) 10k 100k 10 10 120 Current Noise 1 1 10 100 1k 10k 100k Frequency (Hz) 110 MAXIMUM OUTPUT VOLTAGE vs FREQUENCY 6 5 VS = +5.5V 120 AOL, CMRR, PSRR vs TEMPERATURE AOL 4 3 VS = +2.3V 2 1 0 100 1k Frequency (Hz) 10k 100k AOL, CMRR, PSRR (dB) 110 Output Voltage (Vp-p) 100 PSRR 90 CMRR 80 70 –75 –50 –25 0 25 50 75 100 125 Temperature (°C) OFFSET VOLTAGE PRODUCTION DISTRIBUTION 25 Typical production distribution of packaged units. 25 OFFSET VOLTAGE DRIFT MAGNITUDE PRODUCTION DISTRIBUTION Typical production distribution of packaged units. Percent of Amplifiers (%) 15 Percent of Amplifiers (%) 20 20 15 10 10 5 0.1% 0.3% 0.2% 0.1% 5 0 –500 –400 –300 –200 –100 0 100 200 300 400 500 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3 3.25 3.5 3.75 4 Offset Voltage (µV) Offset Voltage Drift (µV/°C) OPA336, 2336, 4336 SBOS068C www.ti.com 5 TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted. INPUT BIAS CURRENT vs TEMPERATURE 1k 4 INPUT BIAS CURRENT vs INPUT COMMON-MODE VOLTAGE Input Bias Current (pA) Input Bias Current (pA) 100 3 VS = +5V 2 10 1 1 0.1 –75 –50 –25 0 25 50 Temperature (°C) 75 100 125 0 0 1 2 3 Common-Mode Voltage (V) 4 5 OUTPUT VOLTAGE SWING vs OUTPUT CURRENT 5 VS = +5V 4 –2.5 OUTPUT VOLTAGE SWING vs OUTPUT CURRENT VS = ±2.5V –2.0 Sinking Current –1.5 +125°C –1.0 –55°C –0.5 +25°C Output Voltage (V) +25°C 3 VS = +2.3V 2 –55°C 1 +25°C 0 0 1 2 3 4 5 Output Current (mA) 6 7 8 +125°C Output Voltage (V) Sourcing Current –55°C +125°C 0 –0 –1 –2 –3 –4 –5 Output Current (mA) –6 –7 –8 SMALL-SIGNAL STEP RESPONSE G = 1, CL = 200pF, VS = +5V LARGE-SIGNAL STEP RESPONSE G = 1, CL = 620pF, VS = +5V 500mV/div 20mV/div 50µs/div 200µs/div 6 OPA336, 2336, 4336 www.ti.com SBOS068C APPLICATIONS INFORMATION OPA336 series op amps are fabricated on a state-of-the-art 0.6 micron CMOS process. They are unity-gain stable and suitable for a wide range of general-purpose applications. Power-supply pins should be bypassed with 0.01µF ceramic capacitors. OPA336 series op amps are protected against reverse battery voltages. OPERATING VOLTAGE OPA336 series op amps can operate from a +2.1V to +5.5V single supply with excellent performance. Most behavior remains unchanged throughout the full operating voltage range. Parameters which vary significantly with operating voltage are shown in the typical characteristics. OPA336 series op amps are fully specified for operation from +2.3V to +5.5V; a single limit applies over the supply range. In addition, many parameters are ensured over the specified temperature range, –40°C to +85°C. INPUT VOLTAGE The input common-mode range of OPA336 series op amps extends from (V–) – 0.2V to (V+) – 1V. For normal operation, inputs should be limited to this range. The absolute maximum input voltage is 300mV beyond the supplies. Thus, inputs greater than the input common-mode range but less than maximum input voltage, while not valid, will not cause any damage to the op amp. Furthermore, the inputs may go beyond the power supplies without phase inversion, as shown in Figure 1, unlike some other op amps. Normally, input bias current is approximately 1pA. However, input voltages exceeding the power supplies can cause excessive current to flow in or out of the input pins. Momentary voltages greater than the power supply can be tolerated as long as the current on the input pins is limited to 10mA. This is easily accomplished with an input resistor, as shown in Figure 2. +5V IOVERLOAD 10mA max VIN 5kΩ OPAx336 VOUT FIGURE 2. Input Current Protection for Voltages Exceeding the Supply Voltage. CAPACITIVE LOAD AND STABILITY OPA336 series op amps can drive a wide range of capacitive loads. However, all op amps under certain conditions may become unstable. Op-amp configuration, gain, and load value are just a few of the factors to consider when determining stability. When properly configured, OPA336 series op amps can drive approximately 10,000pF. An op amp in unity-gain configuration is the most vulnerable to capacitive load. The capacitive load reacts with the op amp’s output resistance, along with any additional load resistance, to create a pole in the response which degrades the phase margin. In unity gain, OPA336 series op amps perform well with a pure capacitive load up to about 300pF. Increasing gain enhances the amplifier’s ability to drive loads beyond this level. One method of improving capacitive load drive in the unity-gain configuration is to insert a 50Ω to 100Ω resistor inside the feedback loop, as shown in Figure 3. This reduces ringing with large capacitive loads while maintaining DC 6V VOUT RS 100Ω OPAx336 0V VOUT CL RL VIN FIGURE 1. No Phase Inversion with Inputs Greater than the Power-Supply Voltage. FIGURE 3. Series Resistor in Unity-Gain Configuration Improves Capacitive Load Drive. OPA336, 2336, 4336 SBOS068C www.ti.com 7 accuracy. For example, with RL = 25kΩ, OPA336 series op amps perform well with capacitive loads in excess of 1000pF, as shown in Figure 4. Without RS, capacitive load drive is typically 350pF for these conditions, as shown in Figure 5. Direct Current (DC) error at the output; however, this error may be insignificant. For instance, with RL = 100kΩ and RS = 100Ω, there is only about a 0.1% error at the output. Figure 5 shows the recommended operating regions for the OPA336. Decreasing the load resistance generally improves capacitive load drive. Figure 5 also illustrates how stability differs depending on where the resistive load is connected. With G = +1 and RL = 10kΩ connected to VS/2, the OPA336 can typically drive 500pF. Connecting the same load to ground improves capacitive load drive to 1000pF. RS = 100Ω, Load = 2kΩ || 1000pF, VS = +5V 20mV/div 10k Operation Above Selected Gain Curve Not Recommended Capacitive Load (pF) G = +1 RL to Ground 1k G = +2 RL to Ground 50µs/div FIGURE 4. Small-Signal Step Response Using Series Resistor to Improve Capacitive Load Drive. Alternatively, the resistor may be connected in series with the output outside of the feedback loop. However, if there is a resistive load parallel to the capacitive load, it and the series resistor create a voltage divider. This introduces a G = +1 RL to VS/2 100 5 10 VS = +5V, VO = VS/2 100 Resistive Load (kΩ) FIGURE 5. Stability—Capacitive Load vs Resistive Load. 8 OPA336, 2336, 4336 www.ti.com SBOS068C PACKAGE OPTION ADDENDUM www.ti.com 15-Jun-2007 PACKAGING INFORMATION Orderable Device OPA2336E/250 OPA2336E/250G4 OPA2336E/2K5 OPA2336E/2K5G4 OPA2336EA/250 OPA2336EA/250G4 OPA2336EA/2K5 OPA2336EA/2K5G4 OPA2336P OPA2336PA OPA2336PAG4 OPA2336PG4 OPA2336U OPA2336U/2K5 OPA2336U/2K5G4 OPA2336UA OPA2336UA/2K5 OPA2336UA/2K5G4 OPA2336UAG4 OPA2336UG4 OPA336N/250 OPA336N/250G4 OPA336N/3K OPA336N/3KG4 OPA336NA/250 Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type MSOP MSOP MSOP MSOP MSOP MSOP MSOP MSOP PDIP PDIP PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 Package Drawing DGK DGK DGK DGK DGK DGK DGK DGK P P P P D D D D D D D D DBV DBV DBV DBV DBV Pins Package Eco Plan (2) Qty 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 5 5 5 5 5 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 50 50 50 50 100 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 100 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 100 100 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 Green (RoHS & no Sb/Br) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 15-Jun-2007 Orderable Device OPA336NA/250G4 OPA336NA/3K OPA336NA/3KG4 OPA336NJ/250 OPA336NJ/250G4 OPA336NJ/3K OPA336NJ/3KG4 OPA336P OPA336PA OPA336U OPA336U/2K5 OPA336U/2K5G4 OPA336UA OPA336UA/2K5 OPA336UA/2K5G4 OPA336UAG4 OPA336UG4 OPA4336EA/250 OPA4336EA/250G4 OPA4336EA/2K5 OPA4336EA/2K5G4 OPA4336PA (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE Package Type SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SSOP/ QSOP SSOP/ QSOP SSOP/ QSOP SSOP/ QSOP PDIP Package Drawing DBV DBV DBV DBV DBV DBV DBV P P D D D D D D D D DBQ DBQ DBQ DBQ N Pins Package Eco Plan (2) Qty 5 5 5 5 5 5 5 8 8 8 8 8 8 8 8 8 8 16 16 16 16 14 100 250 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Call TI 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) TBD TBD Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 100 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 100 100 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) TBD The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 15-Jun-2007 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing MSOP MSOP MSOP MSOP SOIC SOIC SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOIC SOIC SSOP/ QSOP SSOP/ QSOP DGK DGK DGK DGK D D DBV DBV DBV DBV DBV DBV D D DBQ DBQ 8 8 8 8 8 8 5 5 5 5 5 5 8 8 16 16 SPQ Reel Reel Diameter Width (mm) W1 (mm) 180.0 330.0 180.0 330.0 330.0 330.0 179.0 179.0 179.0 179.0 179.0 179.0 330.0 330.0 180.0 330.0 12.4 12.4 12.4 12.4 12.4 12.4 8.4 8.4 8.4 8.4 8.4 8.4 12.4 12.4 12.4 12.4 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 8.0 8.0 8.0 8.0 8.0 8.0 4.0 4.0 4.0 4.0 4.0 4.0 8.0 8.0 8.0 8.0 W Pin1 (mm) Quadrant 12.0 12.0 12.0 12.0 12.0 12.0 8.0 8.0 8.0 8.0 8.0 8.0 12.0 12.0 12.0 12.0 Q1 Q1 Q1 Q1 Q1 Q1 Q3 Q3 Q3 Q3 Q3 Q3 Q1 Q1 Q1 Q1 OPA2336E/250 OPA2336E/2K5 OPA2336EA/250 OPA2336EA/2K5 OPA2336U/2K5 OPA2336UA/2K5 OPA336N/250 OPA336N/3K OPA336NA/250 OPA336NA/3K OPA336NJ/250 OPA336NJ/3K OPA336U/2K5 OPA336UA/2K5 OPA4336EA/250 OPA4336EA/2K5 250 2500 250 2500 2500 2500 250 3000 250 3000 250 3000 2500 2500 250 2500 5.3 5.3 5.3 5.3 6.4 6.4 3.2 3.2 3.2 3.2 3.2 3.2 6.4 6.4 6.4 6.4 3.4 3.4 3.4 3.4 5.2 5.2 3.2 3.2 3.2 3.2 3.2 3.2 5.2 5.2 5.2 5.2 1.4 1.4 1.4 1.4 2.1 2.1 1.4 1.4 1.4 1.4 1.4 1.4 2.1 2.1 2.1 2.1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device OPA2336E/250 OPA2336E/2K5 OPA2336EA/250 OPA2336EA/2K5 OPA2336U/2K5 OPA2336UA/2K5 OPA336N/250 OPA336N/3K OPA336NA/250 OPA336NA/3K OPA336NJ/250 OPA336NJ/3K OPA336U/2K5 OPA336UA/2K5 OPA4336EA/250 OPA4336EA/2K5 Package Type MSOP MSOP MSOP MSOP SOIC SOIC SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOIC SOIC SSOP/QSOP SSOP/QSOP Package Drawing DGK DGK DGK DGK D D DBV DBV DBV DBV DBV DBV D D DBQ DBQ Pins 8 8 8 8 8 8 5 5 5 5 5 5 8 8 16 16 SPQ 250 2500 250 2500 2500 2500 250 3000 250 3000 250 3000 2500 2500 250 2500 Length (mm) 184.0 346.0 184.0 346.0 346.0 346.0 195.0 195.0 195.0 195.0 195.0 195.0 346.0 346.0 190.5 346.0 Width (mm) 184.0 346.0 184.0 346.0 346.0 346.0 200.0 200.0 200.0 200.0 200.0 200.0 346.0 346.0 212.7 346.0 Height (mm) 50.0 29.0 50.0 29.0 29.0 29.0 45.0 45.0 45.0 45.0 45.0 45.0 29.0 29.0 31.8 29.0 Pack Materials-Page 2 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) 0.400 (10,60) 0.355 (9,02) 8 5 PLASTIC DUAL-IN-LINE 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.015 (0,38) 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.010 (0,25) NOM Gage Plane 0.020 (0,51) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) M 0.430 (10,92) MAX 4040082/D 05/98 NOTES: A. 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