0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
OPA348AIDCKT

OPA348AIDCKT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SC70-5

  • 描述:

    OPA348 1MHZ, 45UA, RRIO, SINGLE

  • 数据手册
  • 价格&库存
OPA348AIDCKT 数据手册
OPA 348 OPA 348 ® OPA 234 8 OPA 434 8 OPA348 OPA2348 OPA4348 SBOS213C – NOVEMBER 2001 – REVISED MAY 2002 1MHz, 45µA, CMOS, Rail-to-Rail OPERATIONAL AMPLIFIERS FEATURES q q q q q q LOW IQ: 45µA typical LOW COST RAIL-TO-RAIL INPUT AND OUTPUT SINGLE SUPPLY: +2.1V to +5.5V INPUT BIAS CURRENT: 0.5pA MicroSIZE PACKAGES: SC70-5, SOT23-8 and TSSOP-14 q HIGH SPEED:POWER WITH BANDWIDTH: 1MHz DESCRIPTION The OPA348 series amplifiers are single supply, low-power, CMOS op amps in micro packaging. Featuring an extended bandwidth of 1MHz, and a supply current of 45µA, the OPA348 series is useful for low-power applications on single supplies of 2.1V to 5.5V. Low supply current of 45µA, and an input bias current of 0.5pA, make the OPA348 series an optimal candidate for low-power, high-impedance applications such as smoke detectors and other sensors. The OPA348 is available in the miniature SC70-5, SOT23-5 and SO-8 packages. The OPA2348 is available in SOT23-8 and SO-8 packages, and the OPA4348 is offered in space-saving TSSOP-14 and SO-14 packages. The extended temperature range of –40°C to +125°C over all supply voltages offers additional design flexibility. PACKAGES SOT23-5 SOT23-8 SO-8 X OPA348 X X X X X X OPA2348 OPA4348 APPLICATIONS q q q q q PORTABLE EQUIPMENT BATTERY-POWERED EQUIPMENT SMOKE ALARMS CO DETECTORS MEDICAL INSTRUMENTATION OPA348 OPA348 TSSOP-14 Out V– +In 1 2 3 SOT23-5 OPA2348 5 V+ +In 1 V– 2 –In 3 SC70-5 5 V+ 4 Out SO-14 SC70-5 4 –In OPA4348 Out A 1 2 A +In A 3 4 5 B –In B 6 7 TSSOP-14, SO-14 C 9 8 –In C Out C D 12 11 10 +In D V– +In C 14 13 Out D –In D OPA348 8 V+ Out B –In B +In B NC –In +In V– 1 2 3 4 SO-8 8 7 6 5 NC –In A Out A –In A +In A V– 1 2 3 4 SOT23-8, SO-8 A B 7 6 5 V+ V+ +In B Out NC Out B Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001, Texas Instruments Incorporated www.ti.com ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage, V– to V+ ................................................................... 7.5V Signal Input Terminals, Voltage(2) .................. (V–) – 0.5V to (V+) + 0.5V Current(2) .................................................... 10mA Output Short-Circuit(3) .............................................................. Continuous Operating Temperature .................................................. –65°C to +150°C Storage Temperature ..................................................... –65°C to +150°C Junction Temperature ...................................................................... 150°C Lead Temperature (soldering, 10s) ................................................. 300°C NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only. Functional operation of the device at these conditions, or beyond the specified operating conditions, is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Short-circuit to ground, one amplifier per package. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION PACKAGE DESIGNATOR(1) DBV SPECIFIED TEMPERATURE RANGE –40°C to +125°C PACKAGE MARKING A48 ORDERING NUMBER(2) OPA348AIDBVT OPA348AIDBVR OPA348AID OPA348AIDR OPA348AIDCKT OPA348AIDCKR OPA2348AIDCNT OPA2348AIDCNR OPA2348AID OPA2348AIDR OPA4348AID OPA4348AIDR OPA4348AIPWT OPA4348AIPWR TRANSPORT MEDIA, QUANTITY Tape and Reel, 250 Tape and Reel, 3000 Tubes, 100 Tape and Reel, 2500 Tape and Reel, 250 Tape and Reel, 3000 Tape and Reel, 250 Tape and Reel, 3000 Tubes, 100 Tape and Reel, 2500 Tubes, 58 Tape and Reel, 2500 Tubes, 250 Tape and Reel, 2500 PRODUCT Single OPA348AI PACKAGE-LEAD SOT23-5 " OPA348AI " SO-8 " D " –40°C to +125°C " 348A " OPA348AI " SC70-5 " DCK " –40°C to 125°C " S48 " Dual OPA2348AI " SOT23-8 " DCN " –40°C to +125°C " B48 " OPA2348AI " SO-8 " D " –40°C to +125°C " 2348A " Quad OPA4348AI " SO-14 " D " –40°C to +125°C " OPA4348 " OPA4348AI " TSSOP-14 " PW " –40°C to +125°C " 4348A " " " " " NOTES: (1) For the most current specifications and package information, refer to our web site at www.ti.com. (2) Models labeled with “T” indicate smaller quantity tape and reel, “R” indicates large quantity tape and reel and “D” indicates tubes of specified quantity. 2 OPA348, 2348, 4348 www.ti.com SBOS213C ELECTRICAL CHARACTERISTICS: VS = 2.5V to 5.5V Boldface limits apply over the specified temperature range, TA = –40°C to +125°C At TA = +25°C, RL = 100kΩ connected to VS / 2 and VOUT = VS / 2, unless otherwise noted. OPA348 OPA2348 OPA4348 PARAMETER OFFSET VOLTAGE Input Offset Voltage Over Temperature Drift vs Power Supply Over Temperature Channel Separation, dc f = 1kHz INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio over Temperature over Temperature INPUT BIAS CURRENT Input Bias Current Input Offset Current INPUT IMPEDANCE Differential Common-Mode NOISE Input Voltage Noise, f = 0.1Hz to 10Hz Input Voltage Noise Density, f = 1kHz Input Current Noise Density, f = 1kHz OPEN-LOOP GAIN Open-Loop Voltage Gain over Temperature over Temperature OUTPUT Voltage Output Swing from Rail over Temperature over Temperature Short-Circuit Current Capacitive Load Drive FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate Settling Time, 0.1% 0.01% Overload Recovery Time Total Harmonic Distortion + Noise POWER SUPPLY Specified Voltage Range Minimum Operating Voltage Quiescent Current (per amplifier) over Temperature TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance SOT23-5 Surface-Mount SOT23-8 Surface-Mount MSOP-8 Surface-Mount SO-8 Surface-Mount SO-14 Surface-Mount TSSOP-14 Surface-Mount SC70-5 Surface-Mount VCM < (V+) – 1.7V en in AOL VS = 5V, RL = 100kΩ, 0.025V < VO < 4.975V VS = 5V, RL = 100kΩ, 0.025V < VO < 4.975V VS = 5V, RL = 5kΩ, 0.125V < VO < 4.875V VS = 5V, RL = 5kΩ, 0.125V < VO < 4.875V RL = 100kΩ, AOL > 94dB RL = 100kΩ, AOL > 90dB RL = 5kΩ, AOL > 90dB RL = 5kΩ, AOL > 88dB ISC CLOAD CL = 100pF GBW SR tS G = +1 VS = 5.5V, 2V Step, G = +1 VS = 5.5V, 2V Step, G = +1 VIN • Gain > VS VS = 5.5V, VO = 3Vp-p, G = +1, f = 1kHz 2.5 IO = 0 2.1 to 5.5 45 1 0.5 5 7 1.6 0.0023 5.5 65 75 125 150 150 200 150 150 150 100 100 250 MHz V/µs µs µs µs % V V µA µA °C °C °C °C/W °C/W °C/W °C/W °C/W °C/W °C/W 94 90 90 88 10 35 4 108 98 IB IOS CONDITION MIN TYP MAX UNITS VOS dVOS/dT PSRR VS = 5V, VCM = (V–) + 0.8V 1 4 60 0.2 134 5 6 175 300 VS = 2.5V to 5.5V, VCM < (V+) – 1.7V VS = 2.5V to 5.5V, VCM < (V+) – 1.7V mV mV µV/°C µV/V µV/V µV/V dB V dB dB dB dB pA pA Ω || pF Ω || pF µVp-p nV/√Hz fA/√Hz dB dB dB dB VCM CMRR (V–) – 0.2V < VCM < (V+) – 1.7V (V–) < VCM < (V+) – 1.7V VS = 5.5V, (V–) – 0.2V < VCM < (V+) + 0.2V VS = 5.5V, (V–) < VCM < (V+) (V–) – 0.2 70 66 60 56 (V+) + 0.2 82 71 ±0.5 ±0.5 1013 || 3 1013 || 6 ±10 ±10 18 100 25 25 125 125 ±10 See Typical Characteristics mV mV mV mV mA THD+N VS IQ –40 –65 –65 θJA OPA348, 2348, 4348 SBOS213C www.ti.com 3 TYPICAL CHARACTERISTICS At TA = +25°C, RL = 100kΩ connected to VS / 2 and VOUT = VS / 2, unless otherwise noted. OPEN-LOOP GAIN AND PHASE vs FREQUENCY 140 120 0 100 PSRR AND CMRR vs FREQUENCY Open-Loop Gain (dB) PSRR, CMRR (dB) 100 80 60 40 20 0 –20 0.1 1 10 100 1k 10k 100k 1M Frequency (Hz) Gain Phase –45 80 CMRR 60 –90 Phase (°) 40 PSRR 20 –135 –180 10M 0 10 100 1k 10k 100k 1M 10M Frequency (Hz) MAXIMUM OUTPUT VOLTAGE vs FREQUENCY 6 5 Channel Separation (dB) Output Voltage (Vp-p) CHANNEL SEPARATION vs FREQUENCY 140 VS = 5.5V 4 3 2 VS = 5V 120 100 VS = 2.5V 1 0 1k 10k 100k Frequency (Hz) 1M 10M 80 60 10 100 1k 10k 100k 1M 10M Frequency (Hz) QUIESCENT AND SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE 65 ISC 13 2.5 2 OUTPUT VOLTAGE SWING vs OUTPUT CURRENT +125°C VS = ±2.5V +25°C –40°C Sourcing Current Short-Circuit Current (mA) 55 10 Output Voltage Swing (V) 1.5 1 0.5 0 –0.5 –1 –1.5 –2 +125°C 0 5 Sinking Current Quiescent Current (µA) 45 IQ 35 7 4 –40°C +25°C 25 2 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V) 1 –2.5 10 Output Current (mA) 15 20 4 OPA348, 2348, 4348 www.ti.com SBOS213C TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, RL = 100kΩ connected to VS / 2 and VOUT = VS / 2, unless otherwise noted. COMMON-MODE REJECTION vs TEMPERATURE 100 130 OPEN-LOOP GAIN AND PSRR vs TEMPERATURE AOL, RL = 100kΩ Common-Mode Rejection (dB) 90 V– < VCM < (V+) – 1.7V 80 V– < VCM < V+ 70 Open-Loop Gain and Power Supply Rejection (dB) 120 AOL, RL = 5kΩ 110 100 90 80 70 60 PSRR 60 50 –75 –50 –25 0 25 50 75 100 125 150 Temperature (°C) –75 –50 –25 0 25 50 75 100 125 150 Temperature (°C) QUIESCENT AND SHORT-CIRCUIT CURRENT vs TEMPERATURE 75 65 16 14 ISC 55 45 IQ 35 25 15 –75 –50 –25 0 25 50 75 100 125 150 Temperature (°C) 8 6 4 12 10 10k INPUT BIAS (IB) CURRENT vs TEMPERATURE Short-Circuit Current (mA) Quiescent Current (µA) Input Bias Current (pA) 1k 100 10 1 0.1 –75 –50 –25 0 25 50 75 100 125 150 Temperature (°C) OFFSET VOLTAGE PRODUCTION DISTRIBUTION 20 18 16 Percent of Amplifiers (%) OFFSET VOLTAGE DRIFT MAGNITUDE PRODUCTION DISTRIBUTION 25 Percentage of Amplifiers (%) Typical production distribution of packaged units. Typical production distribution of packaged units. 20 14 12 10 8 6 4 2 0 –6 –5 –4 –3 –2 –1 0 1 2 3 4 5 6 Offset Voltage (mV) 15 10 5 0 1 2 3 4 5 6 7 8 9 10 11 12 Offset Voltage Drift (µV/°C) OPA348, 2348, 4348 SBOS213C www.ti.com 5 TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, RL = 100kΩ connected to VS / 2 and VOUT = VS / 2, unless otherwise noted. SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE 60 G = –1V/V, RFB = 100kΩ 50 60 50 40 30 20 PERCENT OVERSHOOT vs LOAD CAPACITANCE Small-Signal Overshoot (%) 30 G = +1V/V, RL = 100kΩ 20 G = –1V/V, RFB = 5kΩ 10 0 10 100 1k 10k Load Capacitance (pF) Overshoot (%) 40 G = ±5V/V, RFB = 100kΩ 10 0 10 100 1k 10k Load Capacitance (pF) SMALL-SIGNAL STEP RESPONSE G = +1V/V, RL = 100kΩ, CL = 100pF LARGE-SIGNAL STEP RESPONSE G = +1V/V, RL = 100kΩ, CL = 100pF 2µs/div 500mV/div 20mV/div 10µs/div INPUT CURRENT AND VOLTAGE NOISE SPECTRAL DENSITY vs FREQUENCY 10k 1k TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 1.000 Total Harmonic Distortion + Noise (%) Voltage Noise (nV/√Hz) Current Noise (fA√Hz) 1k iN 100 eN 100 0.100 10 0.010 10 1 10 100 1k 10k 100k Frequency (Hz) 1 0.001 10 100 1k Frequency (Hz) 10k 100k 6 OPA348, 2348, 4348 www.ti.com SBOS213C APPLICATIONS INFORMATION OPA348 series op amps are unity-gain stable and suitable for a wide range of general-purpose applications. The OPA348 series features wide bandwidth and unity-gain stability with rail-to-rail input and output for increased dynamic range. Figure 1 shows the input and output waveforms for the OPA348 in unity-gain configuration. Operation is from a single +5V supply with a 100kΩ load connected to VS /2. The input is a 5Vp-p sinusoid. Output voltage is approximately 4.98Vp-p. on the high end. Within the 200mV transition region PSRR, CMRR, offset voltage, offset drift, and THD may be degraded compared to operation outside this region. OFFSET VOLTAGE vs FULL COMMON-MODE VOLTAGE RANGE 2 1.5 Offset Voltage (mV) Power-supply pins should be bypassed with 0.01µF ceramic capacitors. 1 0.5 0 –0.5 –1 V– –1.5 –2 –0.5 0 V+ G = +1V/V, VS = +5V Output (Inverted on Scope) 5V 1V/div 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 Common-Mode Voltage (V) 0V FIGURE 2. Behavior of Typical Transition Region at Room Temperature. 20µs/div RAIL-TO-RAIL INPUT The input common-mode range extends from (V–) – 0.2V to (V+) + 0.2V. For normal operation, inputs should be limited to this range. The absolute maximum input voltage is 500mV beyond the supplies. Inputs greater than the input commonmode range but less than the maximum input voltage, while not valid, will not cause any damage to the op amp. Unlike some other op amps, if input current is limited the inputs may go beyond the power supplies without phase inversion, as shown in Figure 3. FIGURE 1. The OPA348 Features Rail-to-Rail Input/Output. OPERATING VOLTAGE OPA348 series op amps are fully specified and tested from +2.5V to +5.5V. However, supply voltage may range from +2.1V to +5.5V. Parameters are tested over the specified supply range—a unique feature of the OPA348 series. In addition, all temperature specifications apply from –40°C to +125°C. Most behavior remains virtually unchanged throughout the full operating voltage range. Parameters that vary significantly with operating voltages or temperature are shown in the Typical Characteristics. COMMON-MODE VOLTAGE RANGE The input common-mode voltage range of the OPA348 series extends 200mV beyond the supply rails. This is achieved with a complementary input stage—an N-channel input differential pair in parallel with a P-channel differential pair. The N-channel pair is active for input voltages close to the positive rail, typically (V+) – 1.2V to 300mV above the positive supply, while the P-channel pair is on for inputs from 300mV below the negative supply to approximately (V+) – 1.4V. There is a small transition region, typically (V+) – 1.4V to (V+) – 1.2V, in which both pairs are on. This 200mV transition region, shown in Figure 2, can vary ±300mV with process variation. Thus, the transition region (both stages on) can range from (V+) – 1.7V to (V+) – 1.5V on the low end, up to (V+) – 1.1V to (V+) – 0.9V VIN 5V VOUT G = +1V/V, VS = +5V 1V/div 0V 10µs/div FIGURE 3. OPA348—No Phase Inversion with Inputs Greater than the Power-Supply Voltage. OPA348, 2348, 4348 SBOS213C www.ti.com 7 Normally, input currents are 0.5pA. However, large inputs (greater than 500mV beyond the supply rails) can cause excessive current to flow in or out of the input pins. Therefore, as well as keeping the input voltage below the maximum rating, it is also important to limit the input current to less than 10mA. This is easily accomplished with an input voltage resistor, as shown in Figure 4. +5V IOVERLOAD 10mA max VIN 5kΩ OPA348 VOUT In unity-gain inverter configuration, phase margin can be reduced by the reaction between the capacitance at the op amp input, and the gain setting resistors, thus degrading capacitive load drive. Best performance is achieved by using small valued resistors. For example, when driving a 500pF load, reducing the resistor values from 100kΩ to 5kΩ decreases overshoot from 55% to 13% (see the typical characteristic “Small-Signal Overshoot vs. Load Capacitance”). However, when large valued resistors cannot be avoided, a small (4pF to 6pF) capacitor, CFB, can be inserted in the feedback, as shown in Figure 6. This significantly reduces overshoot by compensating the effect of capacitance, CIN, which includes the amplifier's input capacitance and PC board parasitic capacitance. FIGURE 4. Input Current Protection for Voltages Exceeding the Supply Voltage. RAIL-TO-RAIL OUTPUT A class AB output stage with common-source transistors is used to achieve rail-to-rail output. This output stage is capable of driving 5kΩ loads connected to any potential between V+ and ground. For light resistive loads (> 100kΩ), the output voltage can typically swing to within 18mV from supply rail. With moderate resistive loads (10kΩ to 50kΩ), the output voltage can typically swing to within 100mV of the supply rails while maintaining high open-loop gain (see the typical characteristic “Output Voltage Swing vs Output Current”). CAPACITIVE LOAD AND STABILITY The OPA348 in a unity-gain configuration can directly drive up to 250pF pure capacitive load. Increasing the gain enhances the amplifier’s ability to drive greater capacitive loads (see the typical characteristic “Small-Signal Overshoot vs Capacitive Load”). In unity-gain configurations, capacitive load drive can be improved by inserting a small (10Ω to 20Ω) resistor, RS, in series with the output, as shown in Figure 5. This significantly reduces ringing while maintaining DC performance for purely capacitive loads. However, if there is a resistive load in parallel with the capacitive load, a voltage divider is created, introducing a Direct Current (DC) error at the output and slightly reducing the output swing. The error introduced is proportional to the ratio RS /RL, and is generally negligible. RI VIN CFB RF OPA348 CIN CL VOUT FIGURE 6. Improving Capacitive Load Drive. DRIVING A/D CONVERTERS The OPA348 series op amps are optimized for driving medium-speed sampling Analog-to-Digital Converters (ADCs). The OPA348 op amps buffer the ADCs input capacitance and resulting charge injection while providing signal gain. The OPA348 in a basic noninverting configuration driving the ADS7822, see Figure 7. The ADS7822 is a 12-bit, microPOWER sampling converter in the MSOP-8 package. When used with the low-power, miniature packages of the OPA348, the combination is ideal for space-limited, lowpower applications. In this configuration, an RC network at the ADC’s input can be used to provide for anti-aliasing filter and charge injection current. The OPA348 in noninverting configuration driving ADS7822 limited, low-power applications. In this configuration, an RC network at the ADC’s input can be used to provide for antialiasing filter and charge injection current. See Figure 8 for the OPA2348 driving an ADS7822 in a speech bandpass filtered data acquisition system. This small, low-cost solution provides the necessary amplification and signal conditioning to interface directly with an electret microphone. This circuit will operate with VS = 2.7V to 5V with less than 250µA typical quiescent current. V+ RS OPA348 VIN 10Ω to 20Ω RL CL VOUT FIGURE 5. Series Resistor in Unity-Gain Buffer Configuration Improves Capacitive Load Drive. 8 OPA348, 2348, 4348 www.ti.com SBOS213C +5V 0.1µF 0.1µF 8 V+ 500Ω OPA348 VIN 3300pF VIN = 0V to 5V for 0V to 5V output. +In 2 –In 3 GND 4 ADS7822 12-Bit A/D 1 VREF DCLOCK DOUT CS/SHDN 7 6 5 Serial Interface NOTE: A/D Input = 0 to VREF RC network filters high frequency noise. FIGURE 7. OPA348 in Noninverting Configuration Driving ADS7822. V+ = +2.7V to 5V Passband 300Hz to 3kHz R9 510kΩ R1 1.5kΩ C1 1000pF R2 1MΩ R4 20kΩ R7 51kΩ R8 150kΩ C3 33pF VREF 1 1/2 OPA2348 +IN 2 –IN 3 4 8 V+ 7 ADS7822 6 12-Bit A/D 5 DCLOCK DOUT CS/SHDN Serial Interface 1/2 OPA2348 Electret Microphone(1) R3 1MΩ R6 100kΩ C2 1000pF NOTE: (1) Electret microphone powered by R1. R5 20kΩ G = 100 GND FIGURE 8. OPA2348 as a Speech Bandpass Filtered Data Acquisition System. OPA348, 2348, 4348 SBOS213C www.ti.com 9 PACKAGE DRAWINGS MPDS018E – FEBRUARY 1996 – REVISED FEBRUARY 2002 DBV (R-PDSO-G5) PLASTIC SMALL-OUTLINE 0,95 5 4 0,50 0,30 0,20 M 1,70 1,50 3,00 2,60 0,15 NOM 1 3,00 2,80 3 Gage Plane 0,25 0° – 8° 0,55 0,35 Seating Plane 1,45 0,95 0,05 MIN 0,10 4073253-4/G 01/02 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-178 10 OPA348, 2348, 4348 www.ti.com SBOS213C PACKAGE DRAWINGS (Cont.) D (R-PDSO-G**) 8 PINS SHOWN 0.050 (1,27) 8 5 0.020 (0,51) 0.014 (0,35) 0.010 (0,25) MSOI002B – JANUARY 1995 – REVISED SEPTEMBER 2001 PLASTIC SMALL-OUTLINE PACKAGE 0.244 (6,20) 0.228 (5,80) 0.157 (4,00) 0.150 (3,81) 0.008 (0,20) NOM Gage Plane 1 A 4 0°– 8° 0.044 (1,12) 0.016 (0,40) 0.010 (0,25) Seating Plane 0.069 (1,75) MAX 0.010 (0,25) 0.004 (0,10) 0.004 (0,10) PINS ** DIM A MAX A MIN 8 0.197 (5,00) 0.189 (4,80) 14 0.344 (8,75) 0.337 (8,55) 16 0.394 (10,00) 0.386 (9,80) 4040047/E 09/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15). Falls within JEDEC MS-012 OPA348, 2348, 4348 SBOS213C www.ti.com 11 PACKAGE DRAWINGS (Cont.) MPDS025A – FEBRUARY 1997 – REVISED JUNE 1999 DCK (R-PDSO-G5) PLASTIC SMALL-OUTLINE 0,65 5 4 0,30 0,15 0,10 M 1,40 1,10 2,30 1,90 0,13 NOM 1 2,15 1,85 3 Gage Plane 0,15 0°–8° 0,46 0,26 Seating Plane 1,10 0,80 0,10 0,00 0,10 4093553/B 06/99 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-203 12 OPA348, 2348, 4348 www.ti.com SBOS213C PACKAGE DRAWINGS (Cont.) DCN (R-PDSO-G8) MPDS099 – MARCH 2001 PLASTIC SMALL-OUTLINE 0,45 0,28 0,65 1,75 3,00 1,50 2,60 Index Area 1,95 REF 3,00 2,80 1,45 0,90 0°–10° –A – 1,30 0,90 0,15 0,00 0,20 0,09 C 0,60 0,10 4202106/A 03/01 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Foot length measured reference to flat foot surface parallel to Datum A. D. Package outline exclusive of mold flash, metal burr and dambar protrusion/intrusion. E. Package outline inclusive of solder plating. F. A visual index feature must be located within the cross-hatched area. OPA348, 2348, 4348 SBOS213C www.ti.com 13 PACKAGE DRAWINGS (Cont.) PW (R-PDSO-G**) 14 PINS SHOWN MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PLASTIC SMALL-OUTLINE PACKAGE 0,65 14 8 0,30 0,19 0,10 M 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 A 7 0°– 8° 0,75 0,50 Seating Plane 1,20 MAX 0,15 0,05 0,10 PINS ** DIM A MAX 8 14 16 20 24 28 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 14 OPA348, 2348, 4348 www.ti.com SBOS213C PACKAGE OPTION ADDENDUM www.ti.com 24-Apr-2008 PACKAGING INFORMATION Orderable Device OPA2348AID OPA2348AIDCNR OPA2348AIDCNRG4 OPA2348AIDCNT OPA2348AIDCNTG4 OPA2348AIDG4 OPA2348AIDR OPA2348AIDRG4 OPA348AID OPA348AIDBVR OPA348AIDBVRG4 OPA348AIDBVT OPA348AIDBVTG4 OPA348AIDCKR OPA348AIDCKRG4 OPA348AIDCKT OPA348AIDCKTG4 OPA348AIDG4 OPA348AIDR OPA348AIDRG4 OPA4348AID OPA4348AIDG4 OPA4348AIDR OPA4348AIDRG4 OPA4348AIPWR Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SOIC SOT-23 SOT-23 SOT-23 SOT-23 SOIC SOIC SOIC SOIC SOT-23 SOT-23 SOT-23 SOT-23 SC70 SC70 SC70 SC70 SOIC SOIC SOIC SOIC SOIC SOIC SOIC TSSOP Package Drawing D DCN DCN DCN DCN D D D D DBV DBV DBV DBV DCK DCK DCK DCK D D D D D D D PW Pins Package Eco Plan (2) Qty 8 8 8 8 8 8 8 8 8 5 5 5 5 5 5 5 5 8 8 8 14 14 14 14 14 100 Green (RoHS & no Sb/Br) Lead/Ball Finish Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI Call TI Call TI Call TI Call TI Call TI CU NIPDAU MSL Peak Temp (3) Level-2-260C-1 YEAR Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 100 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 100 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 100 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 58 58 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 24-Apr-2008 Orderable Device OPA4348AIPWRG4 OPA4348AIPWT OPA4348AIPWTG4 (1) Status (1) ACTIVE ACTIVE ACTIVE Package Type TSSOP TSSOP TSSOP Package Drawing PW PW PW Pins Package Eco Plan (2) Qty 14 14 14 2500 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Apr-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SOT-23 SOT-23 SOIC SOT-23 SOT-23 SOIC SOIC TSSOP TSSOP DCN DCN D DBV DBV D D PW PW 8 8 8 5 5 8 14 14 14 SPQ Reel Reel Diameter Width (mm) W1 (mm) 180.0 180.0 330.0 180.0 179.0 330.0 330.0 330.0 180.0 8.4 8.4 12.4 8.4 8.4 12.4 16.4 12.4 12.4 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 4.0 4.0 8.0 4.0 4.0 8.0 8.0 8.0 8.0 W Pin1 (mm) Quadrant 8.0 8.0 12.0 8.0 8.0 12.0 16.0 12.0 12.0 Q3 Q3 Q1 Q3 Q3 Q1 Q1 Q1 Q1 OPA2348AIDCNR OPA2348AIDCNT OPA2348AIDR OPA348AIDBVR OPA348AIDBVT OPA348AIDR OPA4348AIDR OPA4348AIPWR OPA4348AIPWT 3000 250 2500 3000 250 2500 2500 2500 250 3.2 3.2 6.4 3.2 3.2 6.4 6.5 7.0 7.0 3.1 3.1 5.2 3.1 3.2 5.2 9.0 5.6 5.6 1.39 1.39 2.1 1.39 1.4 2.1 2.1 1.6 1.6 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Apr-2008 *All dimensions are nominal Device OPA2348AIDCNR OPA2348AIDCNT OPA2348AIDR OPA348AIDBVR OPA348AIDBVT OPA348AIDR OPA4348AIDR OPA4348AIPWR OPA4348AIPWT Package Type SOT-23 SOT-23 SOIC SOT-23 SOT-23 SOIC SOIC TSSOP TSSOP Package Drawing DCN DCN D DBV DBV D D PW PW Pins 8 8 8 5 5 8 14 14 14 SPQ 3000 250 2500 3000 250 2500 2500 2500 250 Length (mm) 190.5 190.5 346.0 190.5 195.0 346.0 346.0 346.0 184.0 Width (mm) 212.7 212.7 346.0 212.7 200.0 346.0 346.0 346.0 184.0 Height (mm) 31.8 31.8 29.0 31.8 45.0 29.0 33.0 29.0 50.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated
OPA348AIDCKT 价格&库存

很抱歉,暂时无法提供与“OPA348AIDCKT”相匹配的价格&库存,您可以联系我们找货

免费人工找货