OPA454AIDDAG4

Sample & Buy Product Folder Technical Documents Support & Community Tools & Software Reference Design OPA454 SBOS391B – DECEMBER 2007 – REVISED MARCH 2016 OPA454 High-Voltage (100-V), High-Current (50-mA) Operational Amplifiers, G = 1 Stable 1 Features 3 Description • The OPA454 device is a low-cost operational amplifier with high voltage (100 V) and relatively high current drive (50 mA). It is unity-gain stable and has a gain-bandwidth product of 2.5 MHz. 1 • • • • • Wide Power-Supply Range: ±5 V (10 V) to ±50 V (100 V) High-Output Load Drive: IO > ±50 mA Wide Output Voltage Swing: 1 V to Rails Independent Output Disable or Shutdown Wide Temperature Range: –40°C to +85°C 8-Pin SO Package 2 Applications • • • • • • • • Test Equipment Avalanche Photodiode: High-V Current Sense Piezoelectric Cells Transducer Drivers Servo Drivers Audio Amplifiers High-Voltage Compliance Current Sources General High-Voltage Regulators and Power Simplified Pin Description The OPA454 is internally protected against overtemperature conditions and current overloads. It is fully specified to perform over a wide power-supply range of ±5 V to ±50 V or on a single supply of 10 V to 100 V. The status flag is an open-drain output that allows it to be easily referenced to standard lowvoltage logic circuitry. This high-voltage operational amplifier provides excellent accuracy, wide output swing, and is free from phase inversion problems that are often found in similar amplifiers. The output can be independently disabled using the Enable or Disable Pin that has its own common return pin to allow easy interface to low-voltage logic circuitry. This disable is accomplished without disturbing the input signal path, not only saving power but also protecting the load. Featured in a small exposed metal pad package, the OPA454 is easy to heatsink over the extended industrial temperature range, –40°C to +85°C. Status Flag Device Information(1) V+ PART NUMBER Enable/Disable (E/D) -IN OPA454 VO OPA454 PACKAGE SO PowerPAD™ (8) BODY SIZE (NOM) 4.89 mm × 3.90 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. +IN Enable/Disable Common (E/D Com) V- 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. OPA454 SBOS391B – DECEMBER 2007 – REVISED MARCH 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 9 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 4 7.1 7.2 7.3 7.4 7.5 7.6 4 4 4 4 5 7 Absolute Maximum Ratings ...................................... ESD Ratings ............................................................ Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: VS = ±50 V....................... Typical Characteristics .............................................. Parameter Measurement Information ................ 16 Detailed Description ............................................ 17 9.1 9.2 9.3 9.4 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 17 17 18 21 10 Application and Implementation........................ 22 10.1 Applications Information........................................ 22 10.2 Typical Application ................................................ 24 10.3 System Examples ................................................. 27 11 Power Supply Recommendations ..................... 33 12 Layout................................................................... 33 12.1 12.2 12.3 12.4 12.5 Layout Guidelines ................................................. Layout Example .................................................... Thermal Protection................................................ Power Dissipation ................................................. Heatsinking ........................................................... 33 35 36 36 37 13 Device and Documentation Support ................. 38 13.1 13.2 13.3 13.4 13.5 13.6 Device Support .................................................... Documentation Support ....................................... Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 38 38 39 39 39 39 14 Mechanical, Packaging, and Orderable Information ........................................................... 39 4 Revision History Changes from Revision A (December 2008) to Revision B Page • Added Pin Functions table, ESD Ratings table, Recommended Operating Conditions table, Thermal Information table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 1 • Changed OPA454 Related Products table to Device Comparison table ............................................................................... 3 • Deleted Ordering Information table ........................................................................................................................................ 3 • Corrected symbol error in Absolute Maximum Ratings table; changed operating temperature specification from TJ to TA ........................................................................................................................................................................................... 4 • Changed Figure 29 title from THD+N vs Temperature to THD+N vs Frequency ................................................................ 10 • Changed Figure 30 title from THD+N vs Temperature to THD+N vs Frequency ................................................................ 10 Changes from Original (December 2007) to Revision A Page • Deleted DDA Package from title of Figure 13 ........................................................................................................................ 9 • Deleted DDA Package from title of Figure 14 ........................................................................................................................ 9 • Corrected mislabeled y-axis in Figure 42 ............................................................................................................................. 12 • Corrected mislabeled y-axis in Figure 43 ............................................................................................................................. 13 • Corrected mislabeled y-axis in Figure 44 ............................................................................................................................. 13 • Changed statement about thermal shutdown cycling qualification studies from 400 hours to 1000 hours in Current Limit section.......................................................................................................................................................................... 21 • Deleted Top-Side PowerPAD Package section.................................................................................................................... 33 • Added alternate units (.013 in, or 0.3302 mm) for measurement of recommended through-hole diameter to PowerPAD Layout Guidelines description............................................................................................................................ 34 2 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: OPA454 OPA454 www.ti.com SBOS391B – DECEMBER 2007 – REVISED MARCH 2016 5 Device Comparison Table PRODUCT OPA445 (1) DESCRIPTION (1) 80 V, 15 mA OPA452 80 V, 50 mA OPA547 60 V, 750 mA OPA548 60 V, 3 A OPA549 60 V, 9 A OPA551 60 V, 200 mA OPA567 5 V, 2 A OPA569 5 V, 2.4 A The OPA445 is pin-compatible with the OPA454, except in applications using the offset trim, and NC pins other than open. 6 Pin Configuration and Functions DDA PACKAGE 8-Pin SO PowerPAD Top View E/D Com (Enable/Disable Common) 1 8 E/D (Enable/Disable) 7 V+ 6 OUT 5 Status Flag (1) (1) -IN 2 +IN 3 V- 4 PowerPAD Heat Sink (Located on bottom side) PowerPAD is internally connected to V–. Soldering the PowerPAD to the printed-circuit board (PCB) is always required, even with applications that have low power dissipation. Pin Functions PIN NAME NO. I/O DESCRIPTION E/D (Enable/Disable) 8 I Enable/Disable E/D Com 1 I Enable/Disable common –IN 2 I Inverting input +IN 3 I Noninverting input OUT 6 O Output Status Flag 5 O The Status Flag is an open-drain active-low output referenced to E/D Com. This pin goes active for either an overcurrent or overtemperature condition. V– 4 — Negative (lowest) power supply V+ 7 — Positive (highest) power supply Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: OPA454 3 OPA454 SBOS391B – DECEMBER 2007 – REVISED MARCH 2016 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT 120 V (V+) + 0.3 V Supply voltage, VS = (V+) – (V–) Voltage Signal input pin Current (2) (V–) – 0.3 E/D to E/D Com 5.5 V Signal input pin (2) ±10 mA Output short circuit (3) Continuous Operating, TA Temperature –55 Junction, TJ Storage, Tstg (1) (2) (3) –55 125 °C 150 °C 125 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails must be current-limited to 10 mA or less. Short-circuit to ground. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±4000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±500 Machine model (MM) ±150 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN Supply voltage, VS = (V+) – (V–) TA Operating temperature NOM MAX UNIT 10 (±5) 100 (±50) V –55 125 °C 7.4 Thermal Information OPA454 THERMAL METRIC (1) DDA (SO) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance RθJC(top) Junction-to-case (top) thermal resistance RθJB Junction-to-board thermal resistance ψJT Junction-to-top characterization parameter 5.6 °C/W ψJB Junction-to-board characterization parameter 20.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.5 °C/W (1) 4 40.6 °C/W 46 °C/W 20.7 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: OPA454 OPA454 www.ti.com SBOS391B – DECEMBER 2007 – REVISED MARCH 2016 7.5 Electrical Characteristics: VS = ±50 V At TP (1) = 25°C, RL = 4.8 kΩ to mid-supply, VCM = VOUT = mid-supply, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE VOS Input offset voltage IO = 0 mA ±0.2 ±4 mV dVOS/dT Input offset voltage vs temperature At TA = –40°C to +85°C ±1.6 ±10 µV/°C PSRR Input offset voltage vs power supply VS = ±4 V to ±60 V, VCM = 0 V 25 100 µV/V ±1.4 ±100 pA ±100 pA INPUT BIAS CURRENT At TP = 25°C IB Input bias current IOS Input offset current At TA = –40°C to +85°C See Typical Characteristics ±0.2 NOISE en Input voltage noise density in f = 10 Hz 300 nV/√Hz nV/√Hz f = 10 kHz 35 Input voltage noise f = 0.01 Hz to 10 Hz 15 µVPP Current noise density f = 1 kHz 40 fA/√Hz INPUT VOLTAGE RANGE VCM Common-mode voltage range CMRR Common-mode rejection Linear operation (V–) + 2.5 See Note (2) (V+) – 2.5 V VS = ±50 V, –25 V ≤ VCM ≤ 25 V 100 146 dB VS = ±50 V, –45 V ≤ VCM ≤ 45 V 100 147 dB At TA = –40°C to +85°C, VS = ±50 V, –25 V ≤ VCM ≤ 25 V 80 88 dB At TA = –40°C to +85°C, VS = ±50 V, –45 V ≤ VCM ≤ 45 V 72 82 dB INPUT IMPEDANCE 1013 || 10 Ω || pF 13 || 9 Ω || pF 130 dB 112 dB 115 dB 106 dB 102 dB At TA = –40°C to +85°C 84 dB Gain-bandwidth product Small-signal 2.5 MHz Slew rate G = ±1, VO = 80-V step, RL = 3.27 kΩ 13 V/µs 35 kHz 3 µs 10 µs Differential Common-mode 10 OPEN-LOOP GAIN (V–) + 1 V < VO < (V+) – 1 V, RL = 49 kΩ, IO = ±1 mA Open-loop voltage gain (3) AOL (V–) + 1 V < VO < (V+) – 2 V, RL = 4.8 kΩ, IO = ±10 mA (V–) + 2 V < VO < (V+) – 3 V, RL = 1880 Ω, IO = ±25 mA 100 At TA = –40°C to +85°C 100 At TA = –40°C to +85°C 80 FREQUENCY RESPONSE (4) GBW SR Full-power bandwidth (5) To ±0.1%, G = ±1, VO = 20-V step tS Settling time (6) To ±0.01%, G = ±5 or ±10, VO = 80-V step THD+N Total harmonic distortion + noise (7) VS = +40.6 V/–39.6 V, G = ±1, f = 1 kHz, VO = 77.2 VPP (1) (2) (3) (4) (5) (6) (7) 0.0008% TP is the temperature of the leadframe die pad (exposed thermal pad) of the PowerPAD package. Typical range is (V–) + 1.5 V to (V+) – 1.5 V. Measured using low-frequency (