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RF-BREAKOUT-MVK

RF-BREAKOUT-MVK

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    ADAPTER DGTL DEBUG RF

  • 数据手册
  • 价格&库存
RF-BREAKOUT-MVK 数据手册
RF-BREAKOUT-MVK MAVRK Module User's Guide Literature Number: SLAU382 December 2011 2 Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Contents 1 .................................................................................................................... 5 ......................................................................................................... 5 1.2 Highlighted Products .................................................................................................... 6 1.3 Block Diagram ........................................................................................................... 6 1.4 EVM Wiki ................................................................................................................. 6 1.5 EVM Landing Page ..................................................................................................... 6 Hardware Description .......................................................................................................... 7 2.1 Power Requirements .................................................................................................... 7 2.2 Getting Started: Configuring the EVM ................................................................................ 7 2.3 EVM Connectors, Fuses, and Switches .............................................................................. 7 2.4 EVM Test Points ......................................................................................................... 8 2.5 EVM LEDs ................................................................................................................ 9 2.6 RF Header Definition and Utilization ................................................................................ 10 2.6.1 RF I2S Header Definition .................................................................................. 10 2.6.2 RF SDIO Header Definition ............................................................................... 11 2.6.3 RF GPIO Header Definition ............................................................................... 12 2.6.4 RF SPI Header Definition ................................................................................. 13 2.6.5 RF UART Header Definition .............................................................................. 14 2.6.6 RF I2C Header Definition ................................................................................. 15 2.6.7 RF Audio Header Definition ............................................................................... 16 Software Description ......................................................................................................... 17 3.1 MAVRK Software Minimum Requirements ......................................................................... 17 3.2 How to get the MAVRK Software .................................................................................... 17 3.3 Where do I find the MAVRK Qt Demo Application? ............................................................... 17 3.4 Where do I find the Demo and Test Code? ........................................................................ 17 Software Project ................................................................................................................ 18 4.1 Getting Started ......................................................................................................... 18 4.2 Setting up the Demo Hardware ...................................................................................... 19 4.3 Accessing RF-Breakout-MVK External Signals .................................................................... 20 4.3.1 GPIO Demo Breakdown ................................................................................... 20 4.3.1.1 GPIO Demo ............................................................................................ 21 4.3.1.2 GPIO APIs .............................................................................................. 21 4.3.2 UART Demo ................................................................................................ 26 4.3.3 SPI Demo ................................................................................................... 27 4.3.4 I2C Demo ................................................................................................... 29 Board Files ....................................................................................................................... 31 5.1 Bill of Materials (BOM) ................................................................................................ 31 5.2 Layout (PDF) ........................................................................................................... 31 5.3 Schematics (PDF) ..................................................................................................... 32 5.4 Fabrication Drawings (PDF) .......................................................................................... 32 5.5 Request Gerber and Schematic files ................................................................................ 32 Application Note ................................................................................................................ 32 EVM Overview 1.1 2 3 4 5 6 EVM Description SLAU382 – December 2011 Submit Documentation Feedback Table of Contents Copyright © 2011, Texas Instruments Incorporated 3 www.ti.com 7 8 4 .................................................................................................................... 33 7.1 I want more info on MAVRK .......................................................................................... 33 7.2 I have MAVRK Questions ............................................................................................. 33 7.3 I want more Technical Info on MAVRK Hardware ................................................................. 33 7.4 I want more Technical Info on MAVRK Software .................................................................. 33 7.5 I want to get a MAVRK board ........................................................................................ 33 Important Notices .............................................................................................................. 34 8.1 ESD Precautions ....................................................................................................... 34 8.2 Certifications ............................................................................................................ 34 8.3 Evaluation Board/Kit/Module (EVM) Additional Terms ............................................................ 34 8.4 United States FCC and Canada IC Regulatory Compliance Information ...................................... 35 8.5 Evaluation Board/Kit/Module (EVM) Warnings, Restrictions, and Disclaimers ................................ 35 8.5.1 Your Sole Responsibility and Risk ....................................................................... 35 8.5.2 Certain Instructions ........................................................................................ 35 8.5.3 Agreement to Defend, Indemnify and Hold Harmless ................................................. 36 8.5.4 Safety-Critical or Life-Critical Applications .............................................................. 36 MAVRK Links Contents Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback User's Guide SLAU382 – December 2011 RF-BREAKOUT-MVK MAVRK Module This document contains general information pertinent to this module. 1 EVM Overview 1.1 EVM Description The RF-Breakout-MVK module is a special module which is intended to create an easy way for a user to debug the signals on the RF bus. The breakout modules implements two ways of debugging: • Visual debugging through the use of the LED arrays • Manual debugging of the electrical signals using oscilloscopes or logic analyzers. Figure 1. RF Breakout Module The main features of the RF-Breakout-MVK board are the expansion headers on the left and the row of LEDs down the middle of the design. SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 5 EVM Overview www.ti.com The RF-Breakout-MVK enables easy debug of the RF bus making all the pins available on standard 100mil pin headers for probing or connecting to an external logic analyzer. Please be aware that the 100mil headers are connected directly to the RF bus and care should be taken when probing it as un-intentional behavior could result. Furthermore there is an array of LEDs connected to the RF bus used for simple visual inspection of the singal levels on the RF bus. This module connects to the Modular and Versatile Reference Kit (MAVRK) Motherboard's RF port. For a full list of RF pinouts with description please see the RF Pinout for MAVRK wiki page. 1.2 Highlighted Products • • • 1.3 10-Ohm SPST Analog Switch Dual-Channel 10-Ohm SPST Analog Switch Octal Transparent D-Type Latches With 3-State Outputs Block Diagram The figure below shows the main functional blocks of the RF-Breakout-MVK. The LED array is located behind an array of logic latches. Therefore the state of the LEDs only changes when the module has been selected. However, by keeping the module select high at all times, it will be possible to see the state of all IO's at all times on the RF bus. Figure 2. A block diagram of the RF-Breakout-MVK 1.4 EVM Wiki RF-BREAKOUT-MVK MAVRK Module wiki page 1.5 EVM Landing Page RF-BREAKOUT-MVK MAVRK Module tool folder 6 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Hardware Description www.ti.com 2 Hardware Description 2.1 Power Requirements 3.3V DC is supplied to the RF-BREAKOUT-MVK through the RF Connector (RF2, pin 9). The RF-TCA8418-MVK module can operate over the voltage range of 1.65V to 3.65V DC with a typical current draw of less than 25mA. 2.2 Getting Started: Configuring the EVM 2.3 EVM Connectors, Fuses, and Switches The RF-BREAKOUT-MVK EVM has two connectors on the back side of the module that connect it to an RF slot on a motherboard like the MB-PRO-MVK. For a full list of RF pinouts with description please see the RF Pinout for MAVRK wiki page. Figure 3. Back side of the RF Breakout Module, showing the RF connectors SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 7 Hardware Description 2.4 www.ti.com EVM Test Points Figure 4. Test points on the RF Breakout Module 8 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Hardware Description www.ti.com 2.5 EVM LEDs Figure 5. LEDs on the RF Breakout Module SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 9 Hardware Description 2.6 www.ti.com RF Header Definition and Utilization For a full list of RF pinouts with description please see the RF Pinout for MAVRK wiki page. The table below describes the mapping of all the IO's coming in the RF-Breakout-MVK from the RF1/RF2 connectors to each of the breakout connectors and various LEDs. 2.6.1 RF I2S Header Definition Figure 6. RF I2S Header Pinout Table 1. RF I2S Header Definition RF BREAKOUT 10 I2S Signal Name Header Pin # LED# / color RF_AUDIO_CLK J3 5 N/A RF_AUDIO_FSYNC J3 3 N/A RF_AUDIO_DIN J3 4 N/A RF_AUDIO_DOUT J3 2 N/A RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Hardware Description www.ti.com 2.6.2 RF SDIO Header Definition Figure 7. RF SDIO Header Pinout Table 2. RF SDIO Header Definition RF BREAKOUT SDIO Signal Name Header Pin # LED# / color RF_SDIO_CLK J2 7 N/A RF_SDIO_CMD J2 6 N/A RF_SDIO_D0 J2 3 N/A RF_SDIO_D1 J2 2 N/A RF_SDIO_D2 J2 5 N/A RF_SDIO_D3 J2 4 N/A SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 11 Hardware Description 2.6.3 www.ti.com RF GPIO Header Definition Figure 8. RF GPIO Header Pinout Table 3. RF GPIO Header Definition RF BREAKOUT 12 I/O Signal Name Header Pin # LED# / color RF_SPI_GDO0 U2 - 573 (Latch) J2-07 Blue RF_SPI_GDO2 U2 - 573 (Latch) J2-08 Blue RF_GPIO2 U3 - 573 (Latch) J2-09 Green RF_GPIO3 U3 - 573 (Latch) J2-10 Green RF_NSHUTDN U3 - 573 (Latch) J2-12 Green RF_RSTN U3 - 573 (Latch) J3-11 Green RF_SLOW_CLK U4 - 573 (Latch) J3-12 Green RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Hardware Description www.ti.com 2.6.4 RF SPI Header Definition Figure 9. RF SPI Header Pinout Table 4. RF SPI Header Definition RF BREAKOUT SPI Signal Name Header Pin # RF_SPI_CLK J4 5 N/A RF_SPI_CS J4 3 LED9, Blue RF_SPI_MOSI J4 2 N/A RF_SPI_MISO J4 4 N/A SLAU382 – December 2011 Submit Documentation Feedback LED# / color RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 13 Hardware Description 2.6.5 www.ti.com RF UART Header Definition Figure 10. RF UART Header Pinout Table 5. RF UART Header Definition RF BREAKOUT 14 UART Signal Name Header Pin # LED# / color RF_UART_RTS U3 - 573 (Latch) J3-03 Orange RF_UART_CTS U3 - 573 (Latch) J3-04 Orange RF_UART_TX U3 - 573 (Latch) J3-05 Orange RF_UART_RX U3 - 573 (Latch) J3-06 Orange RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Hardware Description www.ti.com 2.6.6 RF I2C Header Definition Figure 11. RF I2C Header Pinout Table 6. RF I2C Header Definition RF BREAKOUT I2C Signal Name Header Pin # LED# / color RF_I2C_SCL U4 - 573 (Latch) J3-07 White RF_I2C_SDA U4 - 573 (Latch) J3-08 White SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 15 Hardware Description 2.6.7 www.ti.com RF Audio Header Definition Figure 12. RF Breakout Module Audio Header Pinout Table 7. RF Audio Header Definition RF BREAKOUT 16 Audio RF_AUDIO_DL U-NA J1-11 TP8 RF_AUDIO_DR U-NA J1-12 TP7 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Software Description www.ti.com 3 Software Description 3.1 MAVRK Software Minimum Requirements • • • • 3.2 IAR Embedded Workbench software or TI Code Composer Studio software installed on PC MSP-FET430UIF - MSP430 USB Debugging Interface USB Cable(A to Micro AB) to power the MAVRK Pro motherboard Windows XP SP3 or Windows 7 How to get the MAVRK Software You will need the MAVRK Software repository installed on your PC. This repository will sync the MAVRK firmware to your PC. Please see Software Installation Guide. 3.3 Where do I find the MAVRK Qt Demo Application? An application to visual packet information from the embedded system can be found in the mavrk_qt_tool software repository under the Released Version - QT Demo Application directory. Please see Software Installation Guide for instructions on cloning the QT Tool project. If you desire to create your own Qt demonstration, please reference the following resources: • MAVRK Qt GUI SDK Installation Guide • MAVRK Qt GUI Build Guide 3.4 Where do I find the Demo and Test Code? From the software library, synchronized from the Gerrit server you will find: • Driver code related to the specific part can be found in a folder under the mavrk_embedded\Modular_EVM_Libraries\Components directory. • Projects utilizing this part are located under the mavrk_embedded\Modular_EVM_Projects folder. • Specific related projects for this part are: mavrk_embedded\Modular_EVM_Projects\Component_Demo_Projects\RF_Breakout_Board_De mo_Project SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 17 Software Project 4 Software Project 4.1 Getting Started www.ti.com A software project named RF_Breakout_Demo exists in the mavrk_embedded\Modular_EVM_Projects\Component_Demo_Projects\RF_Breakout_Board_Demo_ Project software repository directory. This project contains demo code for using the UART, SPI, I2C, and GPIO for the RF Breakout board. MAVRK or other EVM boards may be interconnected via the AFE breakout boards using the above mentioned busses. There are actually four different configurations in the RF_Breakout_Board_Demo_Project (one each bus and the GPIO). Using IAR, to select one of the configurations, click on the drop down box in the "workspace" window as shown in the figure below: Figure 13. Changing workspaces in IAR to change what the RF Breakout demo shows Only one configuration can be used at one time. The four choices are: • GPIO_Demo • UART_Demo • SPI_Demo • UART_Demo After selecting one of the configurations, compile it (using "Make" and download it to the board (using "Debug") 18 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Software Project www.ti.com Figure 14. Making the RF Breakout Module project Figure 15. Downloading and debugging the RF Breakout Module project 4.2 Setting up the Demo Hardware The demo expects the RF breakout to be in the MAVRK_RF3 slot. The preferred method of working with this EVM is through the use of the MAVRK Pro motherboard, the motherboard will provide the needed power and digital control for this EVM. In the image below, the RF-Breakout-MVK is shown in the RF Slot3 (upper right hand corner), however it is also possible to insert the RF-Breakout-MVK into any of the four RF slots and retain full functionality. SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 19 Software Project www.ti.com Figure 16. RF Breakout Module on the MAVRK Pro Motherboard 4.3 4.3.1 Accessing RF-Breakout-MVK External Signals GPIO Demo Breakdown The RF Breakout board has LEDs that signal the states of the RF slots GPIOs. These GPIOs are categorized as either shared or exclusive. Shared GPIOs are: • RF Ready to Send (RTS) • RF Clear to Send (CTS) RTS and CTS can either be an input or an output. Exclusive GPIOs are: • RF Shutdown 0 • RF Shutdown 1 • RF GPIO • RF GPIO 2 • RF GPIO 3 • Chip Enable RF GPIO can be either an input for an output. Chip Enable, RF Shutdown 0,1 and RF GPIO 2,3 are outputs. Note on Chip Enable: Chip Enable is a common pin from the MCU slot, but is made exclusive to each slot by a Switch controlled by the RF Module Select lines. 20 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Software Project www.ti.com 4.3.1.1 GPIO Demo The GPIO_Demo when run will strobe through all of the GPIOs to light the LEDs. For a more useful function, refer to the GPIO APIs below. 4.3.1.2 GPIO APIs The GPIO Demo configuration uses API calls to manipulate the GPIOs. Exclusive GPIOs require the target MAVRK slot to be passed, Shared GPIOs do not. • Ready to Send and Clear to Send APIs - These GPIO are shared, so the API does not require passing the Device Slot – 'mvk_Set_RF_RTS' and 'mvk_Set_RF_CTS' require the function of the GPIO ('INPUT' or 'OUTPUT') and if an output the direction ('HIGH (ENABLE)' or 'LOW (DISABLE)') - This is used to control the output level of the GPIO or to set the GPIO as an input (passing 'NULL' for the output direction. – 'mvk_Get_RF_RTS' and 'mvk_Get_RF_CTS' are used to read the input of the RTS or CTS line. The values passed by these APIs are either 'HIGH' or 'LOW' or INVALID_PARAMETER_VALUE if the line is set as an output. The RTS and CTS pins and LEDs are highlighted in the figure below: Figure 17. Locations of RTS and CTS pins on the RF Breakout Module To use the RTS and CTS signals, your circuit will need to use the GND pin which is also highlighted in the figure. Setting the RTS or CTS lines ('ENABLE' or 'HIGH') will light the LEDs. • Shutdown 0 and Shutdown 1 APIs - These GPIO are exclusive, so the API does requires passing the Device Slot SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 21 Software Project www.ti.com – 'mvk_Set_RF_SHUTD_0' and 'mvk_Set_RF_SHUTD_1' require the device slot (MAVRK_RF1 MAVRK_RF4)and the direction ('HIGH (ENABLE)' or 'LOW (DISABLE)') - This is used to control the output level of the Shutdown Pin. 22 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Software Project www.ti.com The Shutdown Pins and LEDs are highlighted in the figure below: Figure 18. Locations of Shutdown pins on the RF Breakout Module To use the Shutdown signals, your circuit will need to use the GND pin which is also highlighted in the figure. Setting the Shutdown lines ('ENABLE' or 'HIGH') will light the LEDs. • RF GPIO APIs - These GPIO are exclusive, so the API does requires passing the Device Slot – 'mvk_Set_RF_GPIO' requires the function of the GPIO ('INPUT' or 'OUTPUT') and if an output the direction ('HIGH (ENABLE)' or 'LOW (DISABLE)') - This is used to control the output level of the GPIO or to set the GPIO as an input (passing 'NULL' for the output direction. – 'mvk_Get_RF_GPIO' is used to read the input of the GPIO line. The values passed by these APIs are either 'HIGH' or 'LOW' or INVALID_PARAMETER_VALUE if the line is set as an output. – 'mvk_Set_RF_GPIO_2' and 'mvk_Set_RF_GPIO_3' require the device slot (MAVRK_RF1 MAVRK_RF4)and the direction ('HIGH (ENABLE)' or 'LOW (DISABLE)') - This is used to control the output level of the Shutdown Pin. SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 23 Software Project www.ti.com The RF GPIO Pins and LEDs are highlighted in the figure below: Figure 19. Locations of GPIO pins on the RF Breakout Module To use the GPIO signals, your circuit will need to use the GND pin which is also highlighted in the figure. Setting the GPIO lines ('ENABLE' or 'HIGH') will light the LEDs. • Chip Enable APIs - These GPIO are exclusive, so the API does requires passing the Device Slot – 'mvk_Set_Chip_Enable' and 'mvk_Clear_Chip_Enable' require the device slot (MAVRK_RF1 MAVRK_RF4)- This is used to control the output level of the Chip Enable. 24 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Software Project www.ti.com The Chip Enable Pin and LED are highlighted in the figure below: Figure 20. Location of Chip Enable pin on the RF Breakout Module To use the Chip Enable, your circuit will need to use the GND pin which is also highlighted in the figure. The Chip Enable is used primarily for the SPI bus(SPI Demo) as a signal to the device it is being communicated to. Clearing the Chip Enable will light the LED. SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 25 Software Project 4.3.2 www.ti.com UART Demo Generally for board to board communications, there would be at least two boards. In this case only one is used. The way that send and receive is verified in this project is by connecting the RX and TX lines on the RF breakout board. What the loopback does is any signal that is transmitted will come back to this device. So when there is a valid receive this proves that the device can transmit and receive successfully. The signals for the UART bus are located on the J4 header on the RF breakout board. The TX signal is located on header J4 on the 7th pin. The RX signal is on the same header on the 9th pin. A standard jumper may be used to interconnect these two signals. Figure 21. Jumper placement for the UART demo The UART is set by default in the mvk_Init_MAVRK_Standard_Settings function to a baud rate of 460K and 8 bits data, no parity and one stop bit. Before writing to the UART a handle has to be created and registered using this function call: UartDebugHandle = mvk_Register_UART_Tx (MAVRK_UART_P1P2, RF_BREAKOUT_BOARD_SLOT, 2, SET, CLEAR); // Priority 2, Fast Print, Do not overwrite This sets the UartDebugHandle to the device which is in RF_BREAKOUT_BOARD_SLOT. This handle is later used to communicate with this device. Then it continually makes this function call mvk_UART_Debug_PrintF_Flush (UartDebugHandle, "Hello from MCU UART", 19); which sends the message out. The demo continually sends a "Hello from UART". To verify that this transfer is sending and receiving correctly, a breakpoint may be placed on the mvk_Receive_UART_Data (RF_BREAKOUT_BOARD_SLOT, (char *)data_in) function call as seen in the figure below: 26 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Software Project www.ti.com Figure 22. Verifying correct UART transmission with a breakpoint in IAR This function is called when there is an incoming UART character. The character that has arrived is given in the data parameter. A watch may be placed on this variable and viewed to determine which character has just arrived. For more information on using the MAVRK UART APIs please refer to MAVRK UART Functions. 4.3.3 SPI Demo The SPI demo continually sends a message through the SPI bus. As in the case with UART, a loopback is used on the MOSI (output) and MISO (input) pins to test the input portion of the SPI bus. The signals for the SPI bus are located on the J4 header on the AFE breakout board. The SPI clock is on pin 5, the chip select in on pin 3, MOSI is on pin 2 and MISO in on pin 4. To set up the loop back of MOSI and MISO jumper pins 2 and 4 as shown in the figure below: SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 27 Software Project www.ti.com Figure 23. Jumper placement for the SPI demo The SPI settings required for the port are set by: SPI_Device_Parameter_type RF3_SPI_device_settings = {LOW_POLARITY, RETARDED_DATA, _4MHZ_MAX_CLOCK, NULL}; To setup the SPI port this function call is used: mvk_Configure_SPI_Device_Working_Settings (MAVRK_RF3, &RF3_SPI_device_settings); Which configures the SPI bus to the RF3 module device settings. The project continually sends "Hello from MCU SPI". This sending and receiving may be verified by placing a breakpoint on the SPI call (mvk_Write_SPI_Payload (MAVRK_RF3, "Hello from MCU SPI", read, 18, 0). After this line is executed the read variable will hold the results of the input (which should be the message). The figure below shows the location to place the break point and the watch variable set up: 28 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Software Project www.ti.com Figure 24. Verifying correct SPI transmission with a breakpoint in IAR For more information on using the MAVRK SPI APIs please refer to MAVRK SPI Functions. 4.3.4 I2C Demo The I2C demo is different from the previous buses demo in that it does not use a loopback. It however writes to an EEPROM chip that is located on the RF breakout board. This EEPROM (16Kx8) is used to store device information for the breakout board. This information is stored on the highest 256 bytes of the memory. This area should not be overwritten. Any other area is free to be used. The project writes to the EEPROM chip an 8-bit value and reads that value back to make sure that it was written properly. The bus that is used to do this transfer is I2C. The actual I2C write call happens deeper in the program but one example is this: mvk_Write_I2C (I2C_slave_address, device_slot, EEPROM24xx128_I2C_write_data, total_number_write_bytes); The first parameter is the I2C slave address to write to, the second is the device slot to use for the write (in this case MAVRK_RF3), then the write data, and the amount of data to write. An example of the I2C read function may be found in the mvk_Read_EEPROM_24xx128 () function which may be found in EEPROM24xx128.c. In the demo, we write 18 bytes of code defined by: data_in [18] = {'H','e','l','l','o',' ','f','r','o','m',' ','M','C','U',' ','I','2','C'}; We define the address in the EEProm we want to write to with: address = 0x1000; Note: Avoid writing to any address at or above 0x3F00. This are is used at device test to store board description information. To initiate an I2C write to the EEPROM: mvk_Write_EEPROM_24xx128 (address,&data_in[0],data_size,device_slot,RF_I2C_device_address); To read back the information on the EEPROM: mvk_Read_EEPROM_24xx128 (address,&data_out[0],data_size,device_slot,RF_I2C_device_address); SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 29 Software Project www.ti.com The demo writes the data_in to the EEPROM starting at address 0x1000 and reads back the data stored in data_out. The program then verifies that data_in is equal to data_out. If the verify fails the code will go into an error trap and the RED LED on the MCU will flash. If the verify passes the code will pass into a while(1) loop and place the MCU in a sleep condition. To see the resulting data_out, set a watch window and a break point as shown in the figure below: Figure 25. Verifying correct I2C transmission with a breakpoint in IAR For more information on using the MAVRK I2C APIs please refer to MAVRK I2C Bus Functions. 30 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Board Files www.ti.com 5 Board Files 5.1 Bill of Materials (BOM) Download a PDF of the bill of materials. Figure 26. RF-BREAKOUT-MVK Bill of Materials 5.2 Layout (PDF) Download a PDF of additional board layers. Figure 27. RF-BREAKOUT-MVK Board Top Silkscreen SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 31 Application Note 5.3 www.ti.com Schematics (PDF) Download a PDF of the schematic. Figure 28. RF-BREAKOUT-MVK Schematic 5.4 Fabrication Drawings (PDF) Download a PDF of the fabrication drawing. Figure 29. RF-BREAKOUT-MVK Fabrication Drawing 5.5 Request Gerber and Schematic files To request Gerber or schematic files for the RF-BREAKOUT-MVK module, please visit the MAVRK Gerber Request webpage. 6 Application Note The I2C and SPI circuits are gated by the MODULE SELECT signal. This means that the breakout will not send through I2C or SPI signals unless the MODULE SELECT line is active. Standard MAVRK software functions that perform I2C and SPI read/writes manage the MODULE SELECT line for the user. If the user is using the breakout module to monitor I2C or SPI bus activity, the system will need to enable the MODULE SELECT line for the device slot that contains the breakout card. In the software, this is done via the mvk_Set_Module_Select() function. 32 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback MAVRK Links www.ti.com 7 MAVRK Links 7.1 I want more info on MAVRK MAVRK Home Page 7.2 I have MAVRK Questions MAVRK Forum (Recommended): 7.3 I want more Technical Info on MAVRK Hardware Table 8. • Hardware Design Guide for MAVRK MCU Modules • Hardware Design Guide for MAVRK Modules • Hardware Design Guide for MAVRK PMU Charger Sub-Modules • Hardware Design Guide for MAVRK PMU DC/DC Sub-Modules 7.4 • Hardware Design Guide for MAVRK PMU Gas Gauge Sub-Modules • Hardware Design Guide for MAVRK PMU High-Power DC/DC Sub-Modules • Hardware Design Guide for MAVRK SCI Modules • Hardware Design Guide for MAVRK SCI Sub-Modules I want more Technical Info on MAVRK Software • How to Convert a Project from IAR to CCS 7.5 • Hardware Design Guide for the uMAVRK Analog Interface • Hardware Design Guide for the uMAVRK Power Interface • Template - Hardware User's Guide • Software - CC11xx, CC25xx, CC430 Radio API Guide I want to get a MAVRK board MAVRK Home Page SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 33 Important Notices 8 Important Notices 8.1 ESD Precautions www.ti.com The following guidelines should be followed in order to avoid ESD damage to the board components: • Any person handling boards must be grounded either with a wrist strap or ESD protective footwear, used in conjunction with a conductive or static-dissipative floor or floor mat. • The work surface where boards are placed for handing, processing, testing, etc., must be made of static-dissipative material and be grounded to ESD ground. • All insulator materials either must be removed from the work area or they must be neutralized with an ionizer. Static-generating clothes should be covered with an ESD-protective smock. • When boards are being stored, transferred between operations or workstations, or shipped, they must be maintained in a Faraday-shield container whose inside surface (touching the boards) is static dissipative. 8.2 Certifications FCC standard EMC test report for the RF-BREAKOUT-MVK MAVRK Module aboard a MAVRK Pro Motherboard ICES standard EMC test report for the RF-BREAKOUT-MVK MAVRK Module aboard a MAVRK Pro Motherboard Eco-Info & Lead-Free Home RoHS Compliant Solutions Statement on Registration, Evaluation, Authorization of Chemicals (REACh) 8.3 Evaluation Board/Kit/Module (EVM) Additional Terms Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/ kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please contact the TI application engineer or visit www.ti.com/esh. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. 34 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback Important Notices www.ti.com 8.4 United States FCC and Canada IC Regulatory Compliance Information This EVM complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada. Les changements ou les modifications pas expressément approuvés par la partie responsible de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. 8.5 8.5.1 Evaluation Board/Kit/Module (EVM) Warnings, Restrictions, and Disclaimers Your Sole Responsibility and Risk You acknowledge, represent and agree that: 1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes. 2. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. 3. Since the EVM is not a completed product, it may not meet all applicable regulatory and safety compliance standards which may normally be associated with similar items. You assume full responsibility to determine and/or assure compliance with any such standards and related certifications as may be applicable. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected. 8.5.2 Certain Instructions It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60° C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs. SLAU382 – December 2011 Submit Documentation Feedback RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated 35 Important Notices 8.5.3 www.ti.com Agreement to Defend, Indemnify and Hold Harmless You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected. 8.5.4 Safety-Critical or Life-Critical Applications If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. 36 RF-BREAKOUT-MVK MAVRK Module Copyright © 2011, Texas Instruments Incorporated SLAU382 – December 2011 Submit Documentation Feedback IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. 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Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated
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