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RI-I11-114A-S1

RI-I11-114A-S1

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    RFIDN

  • 描述:

    RFID TRANSP SQ IN-LAY 13.56MHZ

  • 数据手册
  • 价格&库存
RI-I11-114A-S1 数据手册
Tag-it™ HF-I Pro Transponder Inlays Reference Guide Literature Number: SCBU009B December 2005 – Revised September 2011 2 SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Contents ....................................................................................................................................... 7 Introduction ........................................................................................................................ 9 1.1 General ..................................................................................................................... 10 1.2 System Description ........................................................................................................ 10 1.3 Product Description ....................................................................................................... 11 1.4 Functional Description .................................................................................................... 11 1.5 Memory Organization ..................................................................................................... 12 1.6 Command Set .............................................................................................................. 12 1.7 Inlay Formats and Part Numbers ........................................................................................ 13 Specification ..................................................................................................................... 15 2.1 Material Composition ...................................................................................................... 16 2.2 Specification Summary ................................................................................................... 17 2.3 Mechanical Drawings ..................................................................................................... 19 Shipping, Packing, and Further Handling ............................................................................. 23 3.1 General ..................................................................................................................... 24 3.2 Packing ..................................................................................................................... 24 3.3 Barcode Label .............................................................................................................. 25 3.4 Unwind From Transport Reel ............................................................................................ 25 3.5 Chipless Leader and Trailer .............................................................................................. 26 3.6 Marking of Inlays .......................................................................................................... 26 3.7 Static Pressure ............................................................................................................. 28 3.8 Tape Tension and Bending .............................................................................................. 29 Regulatory, Safety, and Warranty Notices ............................................................................ 31 4.1 Regulatory, Safety, and Warranty Notices ............................................................................. 32 4.2 Warranty and Liability ..................................................................................................... 32 4.3 Hazards From Electrostatic Discharge (ESD) ......................................................................... 32 4.4 Danger of Cutting Injuries ................................................................................................ 33 4.5 Thermal Effects ............................................................................................................ 33 4.6 Handling .................................................................................................................... 33 Terms and Abbreviations ................................................................................................... 35 Preface 1 2 3 4 A SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Contents 3 www.ti.com List of Figures 1-1. RFID System With Reader, Antenna, and Tag-it™ HF-I Transponder ............................................. 10 1-2. Schematic Structure of Tag-it HF-I Pro Transponders ............................................................... 11 1-3. Memory Organization of the Tag-it HF-I Pro Transponder ........................................................... 12 1-4. Tag-it HF-I Pro Transponder Inlay Square ............................................................................. 13 1-5. Tag-it HF-I Pro Transponder Inlay Rectangle – Large 1-6. 1-7. 1-8. 2-1. 2-2. 2-3. 2-4. 2-5. 2-6. 3-1. 3-2. 3-3. 3-4. 3-5. 3-6. 3-7. 4 ............................................................... Tag-it HF-I Pro Transponder Inlay Rectangle – Miniature ........................................................... Tag-it HF-I Pro Transponder Inlay – 24.2 mm Circular ............................................................... Tag-it HF-I Pro Transponder Inlay – CD (32.5 mm Circular) ........................................................ Cross-Section Area of Tag-it HF-I Pro Transponder Inlay ........................................................... Dimensions of Tag-it HF-I Pro Transponder Inlay Square(RI-I11-114A-S1, RI-I11-114B-S1) .................. Dimensions of Tag-it HF-I Pro Transponder Inlay Rectangle – Large(RI-I02-114A-S1, RI-I02-114B-S1) ..... Dimensions of Tag-it HF-I Pro Transponder Inlay Rectangle – Miniature(RI-I03-114A-S1) ..................... Dimensions of Tag-it HF-I Pro Transponder Inlay – 24.2 mm Circular(RI-I16-114A-S1) ........................ Dimensions of Tag-it HF-I Pro Transponder Inlay – CD (32.5 mm Circular)(RI-I17-114A-S1) .................. Packing ..................................................................................................................... Barcode Label.............................................................................................................. Transport (Unwind) Direction ............................................................................................ Leader and Trailer Configuration on the Reel ......................................................................... Positioning, Function, and Indication Marks ........................................................................... Marking View ............................................................................................................... Tape Tension and Bending .............................................................................................. List of Figures 13 13 14 14 16 19 19 20 20 21 24 25 26 26 27 27 29 SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated www.ti.com List of Tables 1-1. Command Set For Tag-it HF-I Pro Transponder ...................................................................... 12 2-1. General Specification ..................................................................................................... 17 2-2. Specification for RI-I11-114A-S1, RI-I11-114B-S1 .................................................................... 17 2-3. Specification for RI-I02-114A-S1, RI-I02-114B-S1 .................................................................... 18 2-4. Specification for RI-I03-114A-S1 ........................................................................................ 18 2-5. Specification for RI-I16-114A-S1 ........................................................................................ 18 2-6. Specification for RI-I17-114A-S1 ........................................................................................ 18 3-1. Static Pressure on the Chip Area 28 3-2. Tape Tension and Bending 29 ....................................................................................... .............................................................................................. SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated List of Tables 5 6 List of Tables SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Preface SCBU009B – December 2005 – Revised September 2011 Read This First Edition Two – September 2011 This is the second edition of this reference guide. It contains a description of the Tag-it™ HF-I Pro Transponder Inlays, their specifications, dimensions, and instructions for further handling. About This Guide This reference guide for the Tag-it HF-I Pro Transponder Inlays is designed for use by TI partners who are engineers experienced with radio frequency identification devices (RFID). Regulatory, safety, and warranty notices that must be followed are given in Chapter 4. Conventions WARNING A warning is used where care must be taken or a certain procedure must be followed, in order to prevent injury or harm to your health. CAUTION This indicates information on conditions that must be met or a procedure that must be followed, which if not heeded, could cause permanent damage to the equipment or software. NOTE: Indicates conditions that must be met or procedures that must be followed, to ensure proper functioning of any equipment or software. Information: Indicates information that makes usage of the equipment or software easier. SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Read This First 7 If You Need Assistance www.ti.com If You Need Assistance For more information, please contact the sales office or distributor nearest you. This contact information can be found on our web site at http://www.ti-rfid.com Trademarks TIRIS™, TI-RFid™, and Tag-it™ are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 8 Read This First SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Chapter 1 SCBU009B – December 2005 – Revised September 2011 Introduction This chapter introduces you to the Tag-it™ HF-I Pro Transponder Inlays. Topic 1.1 1.2 1.3 1.4 1.5 1.6 1.7 ........................................................................................................................... General ............................................................................................................ System Description ........................................................................................... Product Description ........................................................................................... Functional Description ....................................................................................... Memory Organization ......................................................................................... Command Set ................................................................................................... Inlay Formats and Part Numbers ......................................................................... SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Introduction Page 10 10 11 11 12 12 13 9 General 1.1 www.ti.com General The Tag-it HF-I Pro Transponder Inlays are part of TI’s 13.56-MHz product family based on the ISO/IEC 15693 standard for contactless integrated circuit cards (vicinity cards) and the ISO/IEC 18000-3 standard for item management. The Tag-it HF-I Pro Transponder Inlays, available in various inlay shapes, also form the basis of consumable smart labels for use in markets requiring quick and accurate identification of items, such as: • Asset tagging • Electronic ticketing • Anti-counterfeit prevention • Building access badges The passive (no battery) transponder inlays are thin and flexible, offer a general-purpose read/write capability, and are designed to be easily converted into paper or plastic labels. The inlay is supplied on a polymer tape substrate, one web wide and delivered on reels. This allows an easy integration into existing label manufacturing processes to produce disposable labels. User data is written to and read from memory blocks using a nonvolatile EEPROM silicon technology. Each block is separately programmable by the user and can be locked to protect data from modification. Once the data has been locked, it can only be changed by the password-protected Write command. For example, information about delivery checkpoints and timing, place of origin/destination, pallet assignments, inventory numbers, and even transportation routes can be coded into the transponder. Multiple Tag-it HF-I Pro Transponder Inlays, which appear in the Reader RF field, can be identified, read from, and written to by using the unique identifier (UID), which is programmed and locked at the factory and cannot be changed. 1.2 System Description For operation, a reader with antenna is required to send a command to the transponder and to receive its response (see Figure 1-1). The command of the Reader can be either in addressed or non-addressed mode. The Transponder does not transmit data until the Reader sends a request (Reader talks first principle). Antenna Reader Tag-It HF-I Transponder Figure 1-1. RFID System With Reader, Antenna, and Tag-it™ HF-I Transponder 10 Introduction SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Product Description www.ti.com 1.3 Product Description The Tag-it HF-I Pro Transponder is compliant to the ISO/IEC 15693-2,-3 and ISO/IEC 180000-3 standards. It consists of a resonance circuit assembled on a PET foil with a flip-chip mounted microchip. An aluminum antenna is used as inductor, and two layers of aluminum on the top and bottom side of the foil function as a capacitor. The two layers are contacted with through contacts (see Figure 1-2). TI uses this capacitor to individually tune each device to a target resonance frequency. This compensates for any material and process tolerances and, therefore, ensures optimal performance of every single transponder inlay. The trim target includes frequency offset to compensate detuning that occurs after further integration into different materials, such as paper or PVC. Capacitor (Laser Trimmed) Through Contacts Chip Coil (Antenna) Figure 1-2. Schematic Structure of Tag-it HF-I Pro Transponders 1.4 Functional Description The Tag-it HF-I Pro Transponder is a low-power, full-duplex transponder for use with passive contactless identification transponder systems. The Transponder is designed to operate with a 13.56-MHz carrier frequency. The ISO standards define, for some communication parameters, several modes in order to meet different international radio regulations and different application requirements. Therefore, communication between the Reader and the Transponder (Down-Link communication) takes place using an ASK modulation index between 10% and 30% or 100% and data coding (pulse position modulation), 1 out of 4 or 1 out of 256. According to ISO/IEC 15693-2 and ISO/IEC18000-3, Up-Link communication (Transponder to Reader) can be accomplished with one subcarrier (ASK modulation) or with two subcarriers (FSK modulation). Both modes (ASK and FSK) can operate with either high or low data rate. The Transponder will answer in the mode it was interrogated from the Reader and supports all communication parameter combinations. Up- and Down-Link are frame synchronized and CRC checksum secured. Each Tag-it HF-I Pro Transponder has a unique address (UID) stored in two blocks that are factory programmed and 64 bits long (=264 different addresses). This can be used for addressing each transponder uniquely and individually for a one-to-one exchange between the Reader and the Transponder. A mechanism to resolve collisions of a multiplicity of transponders (Anticollision) is also implemented. This special feature allows multiple transponders to be read simultaneously and offers the capability to inventory in a very short time a large number of transponders by their unique address, provided they are within the reader operating range. Also, the application family identifier (AFI), which is optional in the ISO/IEC 15693, is supported by the Tag-it HF-I Pro Transponder. For more details about the communication between Reader and Transponder, see ISO/IEC 15693 and the Tag-it HF-I Pro Extended Command Specification. SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Introduction 11 Memory Organization 1.5 www.ti.com Memory Organization User data is read and stored in a 256-bit nonvolatile user memory that is organized in eight blocks. Each block with 32 bits is user programmable and can be locked individually to protect data from modification. Once set, the lock bit cannot be reset. The user memory is field programmable per block. User-locked blocks can be reprogrammed by use of the password-protected write command. 32 bits Lock Bits Block Addr U = User Lock U 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 User data (256 bits) 0x08 0x09 UID Number (64 bits) 0x0A AFI 0x0B Password Figure 1-3. Memory Organization of the Tag-it HF-I Pro Transponder 1.6 Command Set Table 1-1. Command Set For Tag-it HF-I Pro Transponder Request Mode REQUEST REQUEST CODE INVENTORY (1) ADDRESSED NONADDRESSED AFI OPT FLAG ISO 15693 Mandatory and Optional Commands Inventory 0x01 ✓ – – ✓ 0 Stay Quiet 0x02 – ✓ – – 0 Read_Single_Block 0x20 – ✓ ✓ – 1 Write_Single_Block 0x21 – ✓ ✓ – 1 Lock_Block 0x22 – ✓ ✓ – 1 0xA4 – ✓ – – 1 0xA5 – ✓ – – 1 TI Custom Commands Kill WriteSingleBlockPwd (1) ✓: Implemented –: Not applicable 0/1: Option flag needed NOTE: The Option flag (bit 7) of the ISO 15693 defined Request flags must be set to 1 for all Write and Lock commands to respond properly. For reliable programming, we recommend a programming time ≥10 ms before the Reader sends the end of frame (EOF) to request the response from the Transponder. 12 Introduction SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Inlay Formats and Part Numbers www.ti.com 1.7 Inlay Formats and Part Numbers To cover the specific requirements of different applications, the Tag-it HF-I Pro Transponder Inlays are offered in different shapes, with frequency offset options for further integration into paper or PVC lamination. Part number: RI-I11-114A-S1 (frequency offset for further integration into paper) Part number: RI-I11-114B-S1 (frequency offset for PVC lamination) Figure 1-4. Tag-it HF-I Pro Transponder Inlay Square Part number: RI-I02-114A-S1 (frequency offset for further integration into paper) Part number: RI-I02-114B-S1 (frequency offset for PVC lamination) Figure 1-5. Tag-it HF-I Pro Transponder Inlay Rectangle – Large Part number: RI-I03-114A-S1 (frequency offset for further integration into paper or PVC lamination) Figure 1-6. Tag-it HF-I Pro Transponder Inlay Rectangle – Miniature SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Introduction 13 Inlay Formats and Part Numbers www.ti.com Part number: RI-I16-114A-S1 (frequency offset for further integration into paper or PVC lamination) Figure 1-7. Tag-it HF-I Pro Transponder Inlay – 24.2 mm Circular Part number: RI-I17-114A-S1 (frequency offset for further integration into paper or PVC lamination Figure 1-8. Tag-it HF-I Pro Transponder Inlay – CD (32.5 mm Circular) 14 Introduction SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Chapter 2 SCBU009B – December 2005 – Revised September 2011 Specification This chapter provides the electrical and mechanical specifications of the Tag-it HF-I Pro Transponder Inlays. Topic 2.1 2.2 2.3 ........................................................................................................................... Page Material Composition ......................................................................................... 16 Specification Summary ...................................................................................... 17 Mechanical Drawings ......................................................................................... 19 SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Specification 15 Material Composition 2.1 www.ti.com Material Composition The coil tracks, chip pads, and upper capacitor plate are etched from the top-layer aluminum. The bridge and the bottom capacitor plate are etched from the bottom-layer aluminum. • The surface of the foil is free of contamination by oil or grease (no fingerprints). However, there could be residuals of silicon-dust gravure resist on the substrate and dried residuals of PGMEA (propylene-glycol-monomethyl-ether-acetate). • The wetability (surface energy) of the foil substrate is typically 42 mN/m. 1a Cross-section area 1b 2 3 4 5 6 Gravure-resist ink (Vinyl-Acryl) Top layer (Aluminum) Glue layer (Polyurethane) Basic foil [Polyester (PET)] Bottom layer (Aluminum) Figure 2-1. Cross-Section Area of Tag-it HF-I Pro Transponder Inlay 16 Specification SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Specification Summary www.ti.com 2.2 Specification Summary The following table applies to all Tag-it HF-I Pro Transponder Inlay types. Table 2-1. General Specification Recommended operating frequency 13.56 MHz Factory programmed read-only number 64 bits Memory (user programmable) 2k bits organized in 64-bit × 32-bit blocks Typical programming cycles (at 25°C) 100,000 Data retention time (at 55°C) >10 years Simultaneous identification of tags Up to 50 tags per second (reader/antenna dependant) Foil width 48 mm ± 0.5 mm (1.89 in ± 0.02 in) Thickness Chip area: 0.34 mm ±0.02 Antenna area (Al both sides): 0.085 mm ±0.01 Antenna area (Al one side): 0.075 mm ±0.008 Base material Substrate: PET (Polyethylenetherephtalate) Antenna: aluminum Smallest bending radius allowed 18 mm (~0.71 in) Tape tension (F), linear Maximum 10 N Operating temperature –25°C to 70°C Storage temperature (single inlay) –40°C to 85°C (warpage may occur with increasing temperature) Storage temperature (on reel) –40°C to 40°C ESD immunity Minimum 3.5 kV (Human-Body Model) Minimum 200 V (Machine Model) Delivery Single-row tape wound on cardboard reel with 500-mm diameter Reel outer width: approximately 60 mm (~2.36 in) Reel inner width: approximately 50 mm (~1.97 in) Hub diameter: 76.2 mm (3 in) Typical quantity of good units per reel 5,000 NOTE: For highest possible read-out coverage, operate Readers at a modulation depth of 20% or higher. The following tables consist of device-specific parameters: Table 2-2. Specification for RI-I11-114A-S1, RI-I11-114B-S1 PART NUMBER RI-I11-114A-S1 RI-I11-114B-S1 13.86 MHz ± 200 kHz (includes frequency offset to compensate further integration into paper) 14.4 MHz ± 200 kHz (includes frequency offset to compensate PVC lamination) Typical required activation field strength read (at 25°C) 98 dBµA/m (1) 98 dBµA/m (2) Maximum required activation field strength read (at 25°C) 101 dBµA/m (1) 101 dBµA/m (2) (1) 101 dBµA/m (2) Passive resonance frequency (at 25°C) Typical required activation field strength write (at 25°C) 101 dBµA/m Antenna size 45 mm × 45 mm (~1.77 in × ~1.77 in) Foil pitch 48 mm + 0.1 mm / – 0.4 mm (~1.89 in) (1) (2) After integration into paper After PVC lamination SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Specification 17 Specification Summary www.ti.com Table 2-3. Specification for RI-I02-114A-S1, RI-I02-114B-S1 PART NUMBER RI-I02-114A-S1 RI-I02-114B-S1 13.86 MHz ± 200 kHz (includes frequency offset to compensate further integration into paper) 14.4 MHz ± 200 kHz (includes frequency offset to compensate PVC lamination) 94 dBµA/m (1) 94 dBµA/m (2) Maximum required activation field strength read (at 25°C) 97 dBµA/m (1) 97 dBµA/m (2) Typical required activation field strength write (at 25°C) 97 dBµA/m (1) 97 dBµA/m (2) Passive resonance frequency (at 25°C) Typical required activation field strength read (at 25°C) Antenna size 45 mm × 76 mm (~1.77 in × ~2.99 in) Foil pitch 96 mm + 0.1 mm / – 0.4 mm (~3.78 in) (1) (2) After integration into paper After PVC lamination Table 2-4. Specification for RI-I03-114A-S1 PART NUMBER RI-I03-114A-S1 Passive resonance frequency (at 25°C) 13.86 MHz ± 200 kHz (includes frequency offset to compensate further integration into paper or PVC lamination) Typical required activation field strength read (at 25°C) 107 dBµA/m (1) Maximum required activation field strength read (at 25°C) 109 dBµA/m (1) Typical required activation field strength write (at 25°C) 111 dBµA/m (1) Antenna size 22.5 mm × 38 mm (~0.89 in × ~1.5 in) Foil pitch 48 mm + 0.1 mm / – 0.4 mm (~1.89 in) (1) After integration into paper or PVC lamination Table 2-5. Specification for RI-I16-114A-S1 PART NUMBER RI-I16-114A-S1 Passive resonance frequency (at 25°C) 13.70 MHz ± 400 kHz (includes frequency offset to compensate further integration into paper or PVC lamination) Typical required activation field strength read (at 25°C) 113 dBµA/m (1) Maximum required activation field strength read (at 25°C) 116 dBµA/m (1) Typical required activation field strength write (at 25°C) 116 dBµA/m (1) Antenna size ∅ 24.2 mm + 0.1 mm / – 0.2 mm (~0.95 in) Foil pitch 50.8 mm + 0.1 mm / – 0.3 mm (2 in) (1) After integration into paper or PVC lamination Table 2-6. Specification for RI-I17-114A-S1 PART NUMBER RI-I17-114A-S1 Passive resonance frequency (at 25°C) 13.80 MHz ± 400 kHz (includes frequency offset to compensate further integration into paper or PVC lamination) Typical required activation field strength read (at 25°C) 110 dBµA/m (1) Maximum required activation field strength read (at 25°C) 113 dBµA/m (1) Typical required activation field strength write (at 25°C) 113 dBµA/m (1) Antenna size Outer diameter: ∅ 32.5 mm + 0.1 mm / – 0.2 mm (~1.28 in) Inner diameter: min. ∅ 18 mm (~0.7 in) Foil pitch 50.8 mm + 0.1 mm / – 0.3 mm (2 in) (1) 18 After integration into paper or PVC lamination Specification SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Mechanical Drawings www.ti.com 2.3 Mechanical Drawings Figure 2-2. Dimensions of Tag-it HF-I Pro Transponder Inlay Square (RI-I11-114A-S1, RI-I11-114B-S1) Figure 2-3. Dimensions of Tag-it HF-I Pro Transponder Inlay Rectangle – Large (RI-I02-114A-S1, RI-I02-114B-S1) SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Specification 19 Mechanical Drawings www.ti.com Figure 2-4. Dimensions of Tag-it HF-I Pro Transponder Inlay Rectangle – Miniature (RI-I03-114A-S1) Figure 2-5. Dimensions of Tag-it HF-I Pro Transponder Inlay – 24.2 mm Circular (RI-I16-114A-S1) 20 Specification SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Mechanical Drawings www.ti.com Figure 2-6. Dimensions of Tag-it HF-I Pro Transponder Inlay – CD (32.5 mm Circular) (RI-I17-114A-S1) SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Specification 21 22 Specification SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Chapter 3 SCBU009B – December 2005 – Revised September 2011 Shipping, Packing, and Further Handling Topic 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 ........................................................................................................................... General ............................................................................................................ Packing ............................................................................................................ Barcode Label ................................................................................................... Unwind From Transport Reel .............................................................................. Chipless Leader and Trailer ................................................................................ Marking of Inlays ............................................................................................... Static Pressure ................................................................................................. Tape Tension and Bending ................................................................................. SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Shipping, Packing, and Further Handling Copyright © 2005–2011, Texas Instruments Incorporated Page 24 24 25 25 26 26 28 29 23 General 3.1 www.ti.com General The Tag-it HF-I Pro Transponder Inlays are delivered as single-row tape wound on cardboard reels. Each is packed separately in a packing box. NOTE: Delivery may contain nonfunctional inlays. These inlays are marked as described in Chapter 3.5. 3.2 Packing 3 1 Cardboard Reel Æ: 500 mm (19.7 in) 2. Cardboard Packing Box (bottom part) 3 Cardboard Packing Box (upper part) ±580 mm ´ 95 mm/±20.8 in ´ 3.74 in 4. Barcode Labels (see Chapter 3.3) 4 1 2 4 Figure 3-1. Packing 24 Shipping, Packing, and Further Handling SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Barcode Label www.ti.com 3.3 Barcode Label Figure 3-2 shows the barcode label that is placed on the top side of the reel and on the front side of the upper part of its packing box. NOTE: The following data is an example and should only be viewed as guide values. A packlist will be enclosed with the delivery, which identifies the exact shipping details. Malaysia RI-I02-114A-S1 PRI-I02-114A-S1 PN Part Number QTY Quantity of functional inlays per reel total quantity (including nonfunctional units) may exceed this number DC LTC Datecode; Lot Number Figure 3-2. Barcode Label 3.4 Unwind From Transport Reel The reel is wound up with a tension of 3 N. Each tape has a chipless leader and a trailer that is approximately 3 m long. NOTE: Pull strength during unwind needs to be controlled. SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Shipping, Packing, and Further Handling Copyright © 2005–2011, Texas Instruments Incorporated 25 Chipless Leader and Trailer www.ti.com 1 2 3 4 1 Reel Transport (unwind) Chip orientation Antenna 4 3 2 Figure 3-3. Transport (Unwind) Direction Figure 3-3 shows the transport reel and the leader of the Tag-it HF-I Plus Transponder Inlays being pulled off the reel. CAUTION A high current density of an electrostatic discharge from the foil can damage the chip (IC). Therefore, it is recommended to use ionizer or antistatic rollers in the manufacturing process. Any conductive parts in touch with Tag-it HF-I Pro Inlays should have a high-impedance discharge to ground. We recommend approximately 1 MΩ to avoid ESD damage. 3.5 Chipless Leader and Trailer 1 Chipless Leader 4 First functional Transponder Inlay 2 Transponder Inlays 5 Last functional Transponder Inlay 3 Chipless Trailer (Inlay not tested) 6 Transport direction Figure 3-4. Leader and Trailer Configuration on the Reel 3.6 Marking of Inlays • • 26 The foil inlay has positioning marks for optical detection by a singulating or handling tool. Nonfunctional foil inlays are marked with a rectangular black mark near the center of the foil inlay. Shipping, Packing, and Further Handling SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Marking of Inlays www.ti.com 2 1 Positioning Marks 2 Indication and Function Marks X Marking View (see Figure 3-6) 1.8mm Figure 3-5. Positioning, Function, and Indication Marks 1 Indication mark (start section and end section) 2 Function mark (functional or nonfunctional) Figure 3-6. Marking View In tested area (not trailer/leader section), the following combination for indication and function marks is possible: Case 1: Functional Inlay (except first or last functional inlay on reel) Case 2: Functional Inlay (first or last functional inlay on reel) Case 3: Nonfunctional Inlay (except first or last tested inlay) Case 4: Nonfunctional Inlay (if last inlay) SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Shipping, Packing, and Further Handling Copyright © 2005–2011, Texas Instruments Incorporated 27 Static Pressure 3.7 www.ti.com Static Pressure Table 3-1. Static Pressure on the Chip Area Static pressure on the chip area Maximum 4 N/mm2 CAUTION Higher pressure than that specified may result in chip cracks. 28 Shipping, Packing, and Further Handling SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Tape Tension and Bending www.ti.com 3.8 Tape Tension and Bending Table 3-2. Tape Tension and Bending NOTE: 1 Tape tension (F), linear MAX: 10 N 2 Bending radius (chip heading away from the center of the radius at 7.5-N foil tape tension) MIN: 18 mm 3 Bending radius (chip heading towards the center of the radius at 7.5-N foil tape tension) MIN: 18 mm The Tag-it HF-I Pro Transponder Inlay shall not be folded. Pull strength during unwind needs to be controlled. 1. Tape tension (F), linear 1 2 Bending Radius (chip heading away from the center of the radius) 3 Bending Radius (chip heading towards the center of the radius 2 1 3 Figure 3-7. Tape Tension and Bending SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Shipping, Packing, and Further Handling Copyright © 2005–2011, Texas Instruments Incorporated 29 30 Shipping, Packing, and Further Handling SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Chapter 4 SCBU009B – December 2005 – Revised September 2011 Regulatory, Safety, and Warranty Notices This chapter describes important safety precautions and safety regulations. Topic 4.1 4.2 4.3 4.4 4.5 4.6 ........................................................................................................................... Regulatory, Safety, and Warranty Notices ............................................................ Warranty and Liability ........................................................................................ Hazards From Electrostatic Discharge (ESD) ........................................................ Danger of Cutting Injuries .................................................................................. Thermal Effects ................................................................................................. Handling ........................................................................................................... SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Regulatory, Safety, and Warranty Notices Copyright © 2005–2011, Texas Instruments Incorporated Page 32 32 32 33 33 33 31 Regulatory, Safety, and Warranty Notices 4.1 www.ti.com Regulatory, Safety, and Warranty Notices An RFID system comprises an RF transmission device and is, therefore, subject to national and international regulations. A system reading from or writing to these transponders may be operated only under an experimental license or final approval issued by the relevant approval authority. Before any such device or system can be marketed, an equipment authorization must be obtained form the relevant approval authority. The Tag-it HF-I Pro Transponder Inlay has been manufactured using state-of-the-art technology and in accordance with the recognized safety rules. Observe precautions in operating instructions • Condition for the safe processing, handling, and fault-free operation of the Tag-it HF-I Pro Transponder Inlay is the knowledge of the basic safety regulations. • All persons who operate the Tag-it HF-I Pro Transponder Inlay must observe the guidelines and particularly the safety precautions outlined in this document. • In addition, basic rules and regulations for accident prevention applicable to the operating site must also be considered. 4.2 Warranty and Liability The "General Conditions of Sale and Delivery" of Texas Instruments Incorporated or a TI subsidiary apply. Warranty and liability claims for defect products, injuries to persons and property damages are void if they are the result of one or more of the following causes: • Improper use of the transponders • Unauthorized assembly, operation, and maintenance of the transponders • Operation of the transponders with defective and/or nonfunctioning safety and protective equipment • Failure to observe the instructions given in this document during transport, storage, assembly, operation, maintenance, and setting up of the transponders • Unauthorized changes to the transponders • Insufficient monitoring of the transponders' operation or environmental conditions • Repairs • Catastrophes caused by foreign bodies and natural disasters. CAUTION Tag-it HF-I Pro Transponder Inlays are 100% thoroughly tested. It is the responsibility of TI's customer to evaluate their packaging process for compatibility with the Tag-it HF-I Pro Transponder Inlay properties and to ensure through appropriate process controls that determined machine and material parameter are met on an ongoing basis. TI does not accept warranty claims for material that has already undergone packaging or conversion process. 4.3 Hazards From Electrostatic Discharge (ESD) During unwinding, the foil and the separator tape are charged electrostatically (depending on the unwinding speed and the tensile stress). For the proper operation of the machine, it is necessary to deionize the foil to remove the electrostatic charge. WARNING Electronic devices can also be destroyed by electrostatic energy. 32 Regulatory, Safety, and Warranty Notices SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Danger of Cutting Injuries www.ti.com 4.4 Danger of Cutting Injuries WARNING Take care when unwinding the foil. The greater the unwinding speed and the tensile stress, the greater the risk of receiving a cut when the edge of the foil is touched. 4.5 Thermal Effects Temperatures >85°C on the foil inlay during the packaging process may result in a significant and permanent material deformation and a possible change of color of the foil inlays, as well as a change in the electrical characteristics. 4.6 Handling The settings for foil unwinding and for the attendant forces must be in accordance to the information in Section 3.8. SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Regulatory, Safety, and Warranty Notices Copyright © 2005–2011, Texas Instruments Incorporated 33 34 Regulatory, Safety, and Warranty Notices SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Appendix A SCBU009B – December 2005 – Revised September 2011 Terms and Abbreviations A list of the abbreviations and terms used in various TI-RFid™ manuals can be found in a separate manual: TI-RFid™ Product Manual Terms & Abbreviations (SCBU014) (11-03-21-002) SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Terms and Abbreviations 35 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connctivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated
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