SN65ELT20DR

SN65ELT20 www.ti.com SLLS922A – DECEMBER 2008 – REVISED MARCH 2012 5-V TTL-to-Differential PECL Translator Check for Samples: SN65ELT20 FEATURES 1 • • • • • 1.25-ns Maximum Propagation Delay Operating Range: VCC = 4.2 V to 5.7 V With GND = 0 V Flow-Through Pinout Enables Easy Layout Built-In Temperature Compensation Drop-In Compatible With MC10ELT20, MC100ELT20 PINOUT ASSIGNMENT D-8, DGK-8 Package (Top View) NC 1 Q 2 8 VCC 7 D TTL APPLICATIONS • • Data and Clock Transmission Over Backplane Signaling Level Conversion for Clock or Data PECL Q 3 6 NC NC 4 5 GND DESCRIPTION The SN65ELT20 is a TTL-to-differential PECL translator. It operates on a 5-V supply and ground only. The output is undetermined when the inputs are left floating. The low output skew makes the device an ideal solution for clock or data signal translation. P0065-04 The SN65ELT20 is housed in an industry-standard SOIC-8 package and is also available in a TSSOP-8 package. Table 1. Pin Description PIN FUNCTION D TTL input Q,Q PECL outputs VCC Positive supply GND Ground ORDERING INFORMATION (1) (1) PART NUMBER PART MARKING PACKAGE LEAD FINISH SN65ELT20D SN65ELT20 SOIC NiPdAu SN65ELT20DGK SN65ELT20 SOIC-TSSOP NiPdAu Leaded device options not initially available; contact a sales representative for further details. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2012, Texas Instruments Incorporated SN65ELT20 SLLS922A – DECEMBER 2008 – REVISED MARCH 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT Absolute PECL-mode supply voltage PARAMETER VCC (GND = 0 V) CONDITIONS 6 V VIN input voltage GND = 0 V; VI ≤ VCC 6 V Continuous 50 mA Surge 100 mA Operating temperature range –40 to 85 °C Storage temperature range –65 to 150 °C Output current (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. POWER DISSIPATION RATINGS PACKAGE CIRCUIT-BOARD MODEL POWER RATING TA < 25°C (mW) THERMAL RESISTANCE, JUNCTION-TO-AMBIENT, NO AIRFLOW DERATING FACTOR TA > 25°C (mW/°C) POWER RATING TA = 85°C (mW) SOIC SOIC-TSSOP Low-K 719 139 7 288 High-K 840 119 8 336 Low-K 469 213 5 188 High-K 527 189 5 211 THERMAL CHARACTERISTICS PARAMETER θJB Junction-to-board thermal resistance θJC Junction-to-case thermal resistance PACKAGE VALUE SOIC 79 SOIC-TSSOP 120 SOIC 98 SOIC-TSSOP 74 UNIT °C/W °C/W KEY ATTRIBUTES CHARACTERISTIC Moisture sensitivity level Flammability rating (oxygen index: 28 to 34) VALUE SO-8: Level 1 TSSOP-8: Level 3 UL 94 V-0 at 0.125 in ESD—human body model >4 kV ESD—machine model 200 V ESD—charged-device model 2 kV Meets or exceeds JEDEC Spec EIA/JESD78 latchup test 2 Copyright © 2008–2012, Texas Instruments Incorporated SN65ELT20 www.ti.com SLLS922A – DECEMBER 2008 – REVISED MARCH 2012 PECL DC CHARACTERISTICS (1) (VCC = 5 V; GND = 0 V) (2) PARAMETER –40°C MIN 25°C TYP MAX 16 TYP MAX 10.7 UNIT Power-supply current 16 mA Output HIGH voltage (3) 3915 3958 4120 3915 3963 4120 3915 3967 4120 mV VOL (3) 3170 3247 3380 3170 3244 3380 3170 3244 3380 mV (2) (3) 10.1 MIN VOH (1) 16 85°C TYP MAX ICC Output LOW voltage 9.6 MIN The device meets these specifications after thermal equilibrium has been established when mounted in a test socket or printed-circuit board with maintained transverse airflow greater than 500 lfpm (2.54 m/s). Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and are not valid simultaneously. Output parameters vary 1:1 with Vcc. Outputs are terminated through a 50-Ω resistor to VCC – 2 V. TTL INPUT DC CHARACTERISTICS (1) (VCC = 4.2 V to 5.7 V; TA = –40°C to 85°C) PARAMETER IIH Input HIGH current IIH TEST CONDITIONS MIN TYP MAX VIN = 2.7 V 20 VIN = VCC 20 UNIT μA IIL Input LOW current VIN = 0.5 V –0.6 mA VIK Input clamp diode voltage IIN = –18 mA –1.2 V VIH Input HIGH voltage VIL Input LOW voltage (1) 2 V 0.8 V The device meets these specifications after thermal equilibrium has been established when mounted in a test socket or printed-circuit board with maintained transverse airflow greater than 500 lfpm (2.54 m/s). Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and are not valid simultaneously. AC CHARACTERISTICS (1) (VCC = 4.2 V to 5.7 V; GND = 0 V) PARAMETER –40°C MIN 25°C TYP MAX MIN 85°C TYP MAX MIN TYP MAX UNIT fMAX Maximum switching frequency (2) (See Figure 4.) tPLH Propagation delay, 1.5 V to 50% (see Figure 2) 0.9 1.25 0.9 1.25 0.9 1.25 ns tPHL Propagation delay, 1.5 V to 50% (see Figure 2) 0.7 1.2 0.7 1.2 0.7 1.2 ns tJITTER Random clock jitter (RMS) tr/tf Q-output rise/fall times (20%–80%) (see Figure 3) 1.5 1 1.5 1 (1) (2) 400 430 0.5 1 430 0.5 MHz 0.5 ps 1.5 ns The device meets these specifications after thermal equilibrium has been established when mounted in a test socket or printed-circuit board with maintained transverse airflow greater than 500 lfpm (2.54 m/s). Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and are not valid simultaneously. Maximum switching frequency is measured at an output amplitude of 300 mVPP. Copyright © 2008–2012, Texas Instruments Incorporated 3 SN65ELT20 SLLS922A – DECEMBER 2008 – REVISED MARCH 2012 www.ti.com Typical Termination for Output Driver ZO = 50 W P P Driver Receiver ZO = 50 W N N 50 W 50 W VTT VTT = VCC – 2 V S0078-02 Figure 1. Typical Termination for Output Driver 1.5 V 1.5 V IN OUT OUT tPLH tPHL T0405-01 Figure 2. Output Propagation Delay 80% 20% tr tf T0402-01 Figure 3. Output Rise and Fall Times 4 Copyright © 2008–2012, Texas Instruments Incorporated SN65ELT20 www.ti.com SLLS922A – DECEMBER 2008 – REVISED MARCH 2012 OUTPUT AMPLITUDE vs FREQUENCY 1000 900 Output Amplitude − mV 800 700 TA = 25°C 600 TA = 85°C 500 400 300 TA = −40°C 200 VCC = 4.2 V GND = 0 V Vswing = 0.8 V−2 V 100 0 0 100 200 300 400 500 f − Frequency − MHz G001 Figure 4. Spacer REVISION HISTORY Changes from Original (December 2008) to Revision A • Page Changed the ORDERING INFORMATION Table Part Number From: SN65ELT206D To: SN65ELT20D .......................... 1 Copyright © 2008–2012, Texas Instruments Incorporated 5 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) SN65ELT20D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ELT20 SN65ELT20DGK ACTIVE VSSOP DGK 8 80 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 SISI SN65ELT20DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ELT20 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of