SN65ELT22D

SN65ELT22 www.ti.com............................................................................................................................................................................................ SLLS924 – DECEMBER 2008 5-V Dual TTL-to-Differential PECL Translator FEATURES 1 • • • • • 1.1-ns (max) Propagation Delay Operating Range: VCC = 4.2V to 5.7V with GND = 0 V < 50-ps (typ) Output-to-Output Skew Built-In Temperature Compensation Drop-In Compatible to the MC10ELT22, MC100ELT22 PIN ASSIGNMENT D or DGK PACKAGE (TOP VIEW) Q0 1 8 VCC Q0 2 7 D0 Q1 3 6 D1 Q1 4 5 GND APPLICATIONS • • Data and Clock Transmission Over Backplane Signaling Level Conversion for Clock or Data DESCRIPTION The SN65ELT22 is a dual TTL-to-differential PECL translator. It operates on +5-V supply and ground only. The output is undetermined when the inputs are left floating. The low output skew makes the device an ideal solution for clock or data signal translation. The SN65ELT22 is housed in an industry standard SOIC-8 package and is also available in an optional TSSOP-8 package. Table 1. Pin Descriptions PIN FUNCTION D0, D1 TTL inputs Q0, Q0, Q1, Q1 PECL outputs VCC Positive supply GND Ground ORDERING INFORMATION (1) (1) PART NUMBER PART MARKING PACKAGE LEAD FINISH SN65ELT22D SN65ELT22 SOIC NiPdAu SN65ELT22DGK SN65ELT22 SOIC-TSSOP NiPdAu Leaded device options are not initially available; contact a sales representative for further details 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated SN65ELT22 SLLS924 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT Absolute PECL mode supply voltage, VCC PARAMETER GND = 0 V CONDITIONS 6 V Input voltage, VIN GND = 0 V GND + 0.025 < VIN < VCC – 0.025 V Output current Continuous 50 Surge 100 mA Operating temperature range –40 to 85 °C Storage temperature range –65 to 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. POWER DISSIPATION RATINGS PACKAGE CIRCUIT BOARD MODEL POWER RATING TA < 25°C (mW) THERMAL RESISTANCE, JUNCTION-TO-AMBIENT NO AIRFLOW DERATING FACTOR TA > 25°C (mW/°C) POWER RATING TA = 85°C (mW) Low-K 719 139 7 288 High-K 840 119 8 336 Low-K 469 213 5 188 High-K 527 189 5 211 SOIC SOIC-TSSOP THERMAL CHARACTERISTICS PARAMETER θJB Junction-to-board thermal resistance θJC Junction-to-case thermal resistance SOIC SOIC-TSSOP MIN TYP MAX 79 120 SOIC 98 SOIC-TSSOP 74 UNIT °C/W °C/W KEY ATTRIBUTES CHARACTERISTICS VALUE Moisture sensitivity level Level 1 Flammability rating (oxygen index: 28 to 34) UL 94 V-0 at 0.125 in Human body model Electrostatic discharge Charge device model Machine model 4 kV 2 kV 200 V Meets or exceeds JEDEC Spec EIA/JESD78 latchup test 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65ELT22 SN65ELT22 www.ti.com............................................................................................................................................................................................ SLLS924 – DECEMBER 2008 PECL DC CHARACTERISTICS At VCC = 5.0 V, GND = 0.0 V (unless otherwise noted) (1) (2) PARAMETER ICC High-level output voltage See VOL Low-level output voltage See (3) TA = 25°C TYP MAX 17.3 VOH (2) (3) MIN Power supply current (3) (1) TA = –40°C TEST CONDITIONS MIN 20 TA = 85°C TYP MAX 18.2 MIN 20 TYP MAX 19.4 UNIT 22 mA 3915 3954 4120 3915 3958 4120 3915 3961 4120 mV 3170 3236 3380 3170 3231 3380 3170 3229 3380 mV The device meets the specifications after thermal balance has been established when mounted in a socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Input and output parameters vary 1:1 with VCC. VCC can vary +0.7 V /–0.8 V. Outputs are terminated through a 50-Ω resistor to VCC – 2.0 V. TTL DC CHARACTERISTICS At VCC = 4.2 V to 5.7 V, TA = –40°C to 85°C (unless otherwise noted) (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IIH High-level input current VIN = 2.7 V, VIN = (VCC – 0.025) V 20 µA IIHH High-level input current VIN = VCC 20 µA IIL Low-level input current VIN = 0.5 V, VIN = (GND + 0.025) V –200 µA VIK Input clamp diode voltage IIN = –18 mA –1.2 V VIH High-level input voltage 2.0 Vcc– 0.025 V VIL Low-level input voltage GND + 0.025 0.8 V (1) The device meets the specifications after thermal balance has been established when mounted in a socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously AC CHARACTERISTICS At VCC = 4.2 V to 5.7 V, GND = 0.0 V (unless otherwise noted) (1) PARAMETER fMAX tPLH tPHL tSKEW 1.5 V to 50% Within device skew See (3) Device-to-device skew See tr/tf Output rise/fall times TYP TA = 25°C MAX MIN 500 Propagation delay time Random clock jitter (RMS) (2) (3) (4) TA = –40°C MIN Max switching frequency (2), see Figure 5 tJITTER (1) TEST CONDITIONS 0.6 0.83 0.5 (4) 0.7 MIN 490 1.1 0.6 0.9 0.5 0.84 TYP MAX 470 1.1 0.6 0.9 0.5 0.85 1.1 0.9 90 25 90 25 90 25 100 25 100 25 100 1.1 0.5 0.7 1.1 0.7 UNIT MHz 25 0.5 Q (20%–80%) TA = 85°C TYP MAX ns ps 0.5 ps 1.1 ns The device meets the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Maximum switching frequency measured at output amplitude of 300 mVpp. Measured between outputs under the identical transitions and conditions on any one device. Device-to-device skew for identical transitions at identical VCC levels. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65ELT22 3 SN65ELT22 SLLS924 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com Typical Termination for Output Driver ZO = 50 W P P Driver Receiver N N ZO = 50 W 50 W 50 W VTT VTT = VCC - 2 V Figure 1. Typical Termination for Driver 1.5 V 1.5 V IN OUT OUT tPLH tPHL Figure 2. Output Propagation Delay 80% 20% tr tf Figure 3. Output Rise and Fall Times 4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65ELT22 SN65ELT22 www.ti.com............................................................................................................................................................................................ SLLS924 – DECEMBER 2008 1.5V 1.5V IN QO QO tPLH0 tPHL0 Q1 Q1 tPLH1 tPHL1 Device Skew = Higher [(tPLH1 - tPLH0), (tPLH1 - tPLH0)] Figure 4. Device Skew 1000 VCC = 4.2 V GND = 0 V Vswing = 0.8 V–2 V 900 Output Amplitude – mV 800 TA = 85°C 700 600 TA = 25°C 500 400 300 TA = –40°C 200 100 0 0 100 200 300 400 f – Frequency – MHz 500 600 Figure 5. Output Amplitude vs. Frequency Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65ELT22 5 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) SN65ELT22D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ELT22 SN65ELT22DGK ACTIVE VSSOP DGK 8 80 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 SIPI SN65ELT22DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 SIPI SN65ELT22DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ELT22 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of