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SN74AHC132RGYR

SN74AHC132RGYR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VQFN14_EP

  • 描述:

    IC GATE NAND 4CH 2-INP 14VQFN

  • 数据手册
  • 价格&库存
SN74AHC132RGYR 数据手册
Product Folder Sample & Buy Technical Documents Support & Community Tools & Software SN74AHC132 SCLS365H – MAY 1996 – REVISED OCTOBER 2014 SN74AHC132 Quadruple Positive-NAND Gates with Schmitt-Trigger Inputs 1 Features 3 Description • • • • • • The SN7AHC132 device is a quadruple positiveNAND gate designed for 2-V to 5.5-V VCC operation. This device performs the Boolean function Y = A × B or Y = A + B in positive logic. 1 • Operating Range 2-V to 5.5-V VCC Operation From Very Slow Input Transitions Temperature-Compensated Threshold Levels High Noise Immunity Same Pinouts as SNx4AHC00 Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model – 200-V Machine Model – 1000-V Charged-Device Model Device Information(1) PART NUMBER SNx4AHC132 PACKAGE BODY SIZE (NOM) SOIC (14) 8.65 mm × 3.91 mm SSOP (14) 6.20 mm x 5.30 mm TVSOP (14) 3.60 mm x 4.40 mm TSSOP (14) 5.00 mm x 4.40 mm VQFN (14) 3.50 mm x 3.50 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 2 Applications • • • • Electronic Points of Sale Telecom Infrastructure Network Switches Tests and Measurements 4 Simplified Schematic A Y B A Y B A Y B A Y B 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN74AHC132 SCLS365H – MAY 1996 – REVISED OCTOBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Simplified Schematic............................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 1 2 3 3 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 3 4 4 4 4 5 5 5 6 6 Absolute Maximum Ratings ...................................... Handling Ratings....................................................... Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics, VCC = 3.3 V ± 0.3 V ........ Switching Characteristics, VCC = 5 V ± 0.5 V ........... Noise Characteristics ................................................ Operating Characteristics.......................................... Typical Characteristics ............................................ Parameter Measurement Information .................. 7 9 Detailed Description .............................................. 8 9.1 9.2 9.3 9.4 Overview ................................................................... Functional Block Diagram ......................................... Feature Description................................................... Device Functional Modes.......................................... 8 8 8 8 10 Application and Implementation.......................... 9 10.1 Application Information............................................ 9 10.2 Typical Application ................................................. 9 11 Power Supply Recommendations ..................... 10 12 Layout................................................................... 10 12.1 Layout Guidelines ................................................. 10 12.2 Layout Example .................................................... 10 13 Device and Documentation Support ................. 11 13.1 Trademarks ........................................................... 11 13.2 Electrostatic Discharge Caution ............................ 11 13.3 Glossary ................................................................ 11 14 Mechanical, Packaging, and Orderable Information ........................................................... 11 5 Revision History Changes from Revision G (September 2002) to Revision H Page • Updated document to new TI data sheet format. ................................................................................................................... 1 • Deleted Ordering Information table. ....................................................................................................................................... 1 • Deleted SN54AHC132 device from data sheet. .................................................................................................................... 1 • Added Applications. ................................................................................................................................................................ 1 • Added Pin Functions table...................................................................................................................................................... 3 • Added Handling Ratings table. ............................................................................................................................................... 4 • Changed MAX operating temperature to 125°C in Recommended Operating Conditions table. ......................................... 4 • Added Thermal Information table. .......................................................................................................................................... 4 • Added –40°C to 125°C range for SN74AHC132 in Electrical Characteristics table............................................................... 4 • Added TA = –40°C to 125°C for SN74AHC132 in both Switching Characteristics tables. ..................................................... 5 • Added Typical Characteristics. ............................................................................................................................................... 6 • Added Detailed Description section........................................................................................................................................ 8 • Added Application and Implementation section...................................................................................................................... 9 • Added Power Supply Recommendations and Layout sections............................................................................................ 10 2 Submit Documentation Feedback Copyright © 1996–2014, Texas Instruments Incorporated Product Folder Links: SN74AHC132 SN74AHC132 www.ti.com SCLS365H – MAY 1996 – REVISED OCTOBER 2014 6 Pin Configuration and Functions SN74AHC132 . . . D, DB, DGV, N, NS, OR PW PACKAGE (TOP VIEW) 3 12 4 11 5 10 6 9 7 8 VCC 4B 4A 4Y 3B 3A 3Y 1B 1Y 2A 2B 2Y VCC 13 1 14 2 13 4B 3 12 4A 4Y 4 11 5 10 3B 9 3A 6 7 8 3Y 14 2 1A 1 GND 1A 1B 1Y 2A 2B 2Y GND SN74AHC132 . . . RGY PACKAGE (TOP VIEW) Pin Functions PIN SN74AHC132 NAME I/O DESCRIPTION D, DB, DGV, N, NS, PW, RGY 1A 1 I 1A Input 1B 2 I 1B Input 1Y 3 O 1Y Output 2A 4 I 2A Input 2B 5 I 2B Input 2Y 6 O 2Y Output 3Y 8 O 3Y Output 3A 9 I 3A Input 3B 10 I 3B Input 4Y 11 O 4Y Output 4A 12 I 4A Input 4B 13 I 4B Input GND 7 — Ground Pin VCC 14 — Power Pin 7 Specifications 7.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VI Input voltage range (2) –0.5 7 V –0.5 VCC + 0.5 (2) UNIT VO Output voltage range IIK Input clamp current VI < 0 –20 mA IOK Output clamp current VO < 0 or VO > VCC ±20 mA IO Continuous output current VO = 0 to VCC ±25 mA ±50 mA Continuous current through VCC or GND (1) (2) V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. Submit Documentation Feedback Copyright © 1996–2014, Texas Instruments Incorporated Product Folder Links: SN74AHC132 3 SN74AHC132 SCLS365H – MAY 1996 – REVISED OCTOBER 2014 www.ti.com 7.2 Handling Ratings Tstg V(ESD) (1) (2) MIN MAX UNIT –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) 0 2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) 0 1000 Storage temperature range Electrostatic discharge V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) SN74AHC132 MIN MAX UNIT VCC Supply voltage 2 5.5 V VI Input voltage 0 5.5 V VO Output voltage 0 VCC V –50 µA IOH High-level output current VCC = 2 V IOL Low-level output current TA VCC = 3.3 V ± 0.3 V –4 VCC = 5 V ± 0.5 V –8 VCC = 2 V 50 VCC = 3.3 V ± 0.3 V 4 VCC = 5 V ± 0.5 V 8 Operating free-air temperature (1) –40 mA µA mA 125 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). 7.4 Thermal Information SN74AHC132 THERMAL METRIC (1) D DB DR N NS PW RGY UNIT 14 PINS RθJA Junction-to-ambient thermal resistance 90.6 107.1 90.6 57.4 90.7 122.6 57.5 RθJC(top) Junction-to-case (top) thermal resistance 50.9 59.6 50.9 44.9 48.3 51.4 57.5 RθJB Junction-to-board thermal resistance 44.8 54.4 44.8 37.2 49.4 64.4 33.6 ψJT Junction-to-top characterization parameter 14.7 20.5 14.7 30.1 14.6 6.7 3.4 ψJB Junction-to-board characterization parameter 44.5 53.8 44.5 37.1 49.1 63.8 33.7 RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — — — 13.9 (1) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). 7.5 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS TA = 25°C VCC MIN VT+ Positive-going input threshold voltage 4 TYP –40°C to 125°C SN74AHC132 SN74AHC132 MAX MIN MAX MIN UNIT MAX 3V 1.2 2.2 1.2 2.2 1.2 2.2 4.5 V 1.75 3.15 1.75 3.15 1.75 3.15 5.5 V 2.15 3.85 2.15 3.85 2.15 3.85 Submit Documentation Feedback V Copyright © 1996–2014, Texas Instruments Incorporated Product Folder Links: SN74AHC132 SN74AHC132 www.ti.com SCLS365H – MAY 1996 – REVISED OCTOBER 2014 Electrical Characteristics (continued) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS TA = 25°C VCC MIN TYP –40°C to 125°C SN74AHC132 SN74AHC132 MAX MIN MAX MIN UNIT MAX VT– Negative-going input threshold voltage 3V 0.9 1.9 0.9 1.9 0.9 1.9 4.5 V 1.35 2.75 1.35 2.75 1.35 2.75 5.5 V 1.65 3.35 1.65 3.35 1.65 3.35 ΔVT Hysteresis (VT+ – VT–) 3V 0.3 1.2 0.3 1.2 0.3 1.2 4.5 V 0.4 1.4 0.4 1.4 0.4 1.4 5.5 V 0.5 1.6 0.5 1.6 0.5 1.6 2V 1.9 IOH = –50 µA 2 1.9 1.9 2.9 3V 2.9 3 2.9 4.5 V 4.4 4.5 4.4 4.4 IOH = –4 mA 3V 2.58 2.48 2.48 IOH = –8 mA 4.5 V 3.94 VOH 3.8 V V V 3.8 2V 0.1 0.1 0.1 3V 0.1 0.1 0.1 4.5 V 0.1 0.1 0.1 3V 0.36 0.44 0.44 IOL = 8 mA 4.5 V 0.36 0.44 0.44 II VI = 5.5 V or GND 0 V to 5.5 V ±0.1 ±1 ±1 µA ICC VI = VCC or GND IO = 0 5.5 V 2 20 20 µA Ci VI = VCC or GND 5V 10 10 10 pF IOL = 50 µA VOL IOL = 4 mA 1.9 V 7.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) PARAMETER FROM (INPUT) TO (OUTPUT) TA = 25°C LOAD CAPACITANCE MIN tPLH A or B Y tPHL tPLH A or B Y tPHL (1) CL = 15 pF TA = –40°C to 125°C SN74AHC132 SN74AHC132 TYP MAX MIN MAX MIN MAX 5.6 (1) 11.9 (1) 1 14 1 15 5.6 (1) 11.9 (1) 1 14 1 15 7.6 15.4 1 17.5 1 19 7.6 15.4 1 17.5 1 19 CL = 50 pF UNIT ns ns On products compliant to MIL-PRF-38535, this parameter is not production tested. 7.7 Switching Characteristics, VCC = 5 V ± 0.5 V over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) PARAMETER FROM (INPUT) TO (OUTPUT) TA = 25°C LOAD CAPACITANCE MIN tPLH A or B Y tPHL tPLH A or B Y tPHL (1) CL = 15 pF CL = 50 pF TA = –40°C to 125°C SN74AHC132 SN74AHC132 UNIT TYP MAX MIN MAX MIN MAX 3.9 (1) 7.7 (1) 1 9 1 10 (1) 7.7 (1) 1 9 1 10 5.3 9.7 1 11 1 12 5.3 9.7 1 11 1 12 3.9 ns ns On products compliant to MIL-PRF-38535, this parameter is not production tested. 7.8 Noise Characteristics VCC = 5 V, CL = 50 pF, TA = 25°C (1) (1) Characteristics are for surface-mount packages only. Submit Documentation Feedback Copyright © 1996–2014, Texas Instruments Incorporated Product Folder Links: SN74AHC132 5 SN74AHC132 SCLS365H – MAY 1996 – REVISED OCTOBER 2014 www.ti.com Noise Characteristics (continued) VCC = 5 V, CL = 50 pF, TA = 25°C(1) SN74AHC132 PARAMETER MIN TYP MAX UNIT VOL(P) Quiet output, maximum dynamic VOL 0.45 0.8 V VOL(V) Quiet output, minimum dynamic VOL –0.35 –0.8 V VOH(V) Quiet output, minimum dynamic VOH VIH(D) High-level dynamic input voltage VIL(D) Low-level dynamic input voltage 4.8 V 3.5 V 1.5 V 7.9 Operating Characteristics VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load, TYP f = 1 MHz 11 UNIT pF 7.10 Typical Characteristics 7 8 6 7 TPD in ns 6 TPD (ns) TPD (ns) 5 4 3 5 4 3 2 2 1 1 TPD in ns 0 -100 0 -50 0 50 Temperature (qC) 100 150 0 D001 Figure 1. TPD vs Temperature 6 Submit Documentation Feedback 1 2 3 VCC (V) 4 5 6 D002 Figure 2. TPD vs VCC Copyright © 1996–2014, Texas Instruments Incorporated Product Folder Links: SN74AHC132 SN74AHC132 www.ti.com SCLS365H – MAY 1996 – REVISED OCTOBER 2014 8 Parameter Measurement Information From Output Under Test Test Point From Output Under Test RL = 1 kΩ S1 VCC Open TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input tw tsu VCC Input 50% VCC 50% VCC 0V th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VCC 50% VCC Input 50% VCC 0V tPLH In-Phase Output tPHL 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) VOH 50% VCC VOL 50% VCC tPLZ tPZL ≈VCC 50% VCC VOL + 0.3 V VOL tPHZ Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 50% VCC 0V tPZH tPLH 50% VCC VCC Output Control 50% VCC VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 1996–2014, Texas Instruments Incorporated Product Folder Links: SN74AHC132 7 SN74AHC132 SCLS365H – MAY 1996 – REVISED OCTOBER 2014 www.ti.com 9 Detailed Description 9.1 Overview The SN74AHC132 is a quadruple 2-input positive-NAND gate with low drive that produces slow rise and fall times. This reduces ringing on the output signal. Each circuit functions as a NAND gate, but because of the Schmitt action, it has different input threshold levels for positive- and negative-going signals. These circuits are temperature compensated and can be triggered from the slowest of input ramps and still give clean, jitter-free output signals. 9.2 Functional Block Diagram A Y B Figure 4. Logic Diagram, Each Gate (Positive Logic) 9.3 Feature Description • • Wide operating voltage range – Operates from 2 V to 5.5 V Allows down voltage translation – Inputs accept voltages to 5.5 V 9.4 Device Functional Modes Table 1. Function Table (Each Gate) INPUTS 8 OUTPUT Y A B H H L L X H X L H Submit Documentation Feedback Copyright © 1996–2014, Texas Instruments Incorporated Product Folder Links: SN74AHC132 SN74AHC132 www.ti.com SCLS365H – MAY 1996 – REVISED OCTOBER 2014 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information The SN74AHC132 is a low-drive CMOS device that can be used for a multitude of bus interface type applications where output ringing is a concern. The low drive and slow edge rates will minimize overshoot and undershoot on the outputs. The inputs can accept voltages to 5.5 V at any valid VCC, thus making the device ideal for down translation. 10.2 Typical Application 3.3- or 5-V Accessory 5-V Regulated 0.1 µF Figure 5. Typical Application Schematic 10.2.1 Design Requirements This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus contention because it can drive currents that would exceed maximum limits. The high drive will also create fast edges into light loads, so routing and load conditions should be considered to prevent ringing. 10.2.2 Detailed Design Procedure 1. Recommended Input Conditions: – For rise time and fall time specifications, see Δt/ΔV in the Recommended Operating Conditions table. – For specified high and low levels, see VIH and VIL in the Recommended Operating Conditions table. – Inputs are overvoltage tolerant allowing them to go as high as 5.5 V at any valid VCC. 2. Recommend Output Conditions: – Load currents should not exceed 25 mA per output and 50 mA total for the part. – Outputs should not be pulled above VCC. Submit Documentation Feedback Copyright © 1996–2014, Texas Instruments Incorporated Product Folder Links: SN74AHC132 9 SN74AHC132 SCLS365H – MAY 1996 – REVISED OCTOBER 2014 www.ti.com Typical Application (continued) 10.2.3 Application Curves AC132 HC132 AHC132 Figure 6. Switching Characteristics Comparison 11 Power Supply Recommendations The power supply can be any voltage between the MIN and MAX supply-voltage rating located in the Recommended Operating Conditions table. Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single supply, 0.1μF is recommended. If there are multiple VCC pins then a 0.01 μF or a 0.022 μF is recommended for each power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μF and a 1 μF are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possible for best results. 12 Layout 12.1 Layout Guidelines When using multiple bit logic devices, inputs should not float. In many cases, functions or parts of functions of digital logic devices are unused. Some examples are when only two inputs of a triple-input AND gate are used, or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Specified in the Figure 7 are rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or VCC, whichever makes more sense or is more convenient. It is acceptable to float outputs unless the part is a transceiver. If the transceiver has an output enable pin, it will disable the outputs section of the part when asserted. This will not disable the input section of the I/Os so they also cannot float when disabled. 12.2 Layout Example Vcc Unused Input Input Output Unused Input Output Input Figure 7. Layout Diagram 10 Submit Documentation Feedback Copyright © 1996–2014, Texas Instruments Incorporated Product Folder Links: SN74AHC132 SN74AHC132 www.ti.com SCLS365H – MAY 1996 – REVISED OCTOBER 2014 13 Device and Documentation Support 13.1 Trademarks All trademarks are the property of their respective owners. 13.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 13.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 1996–2014, Texas Instruments Incorporated Product Folder Links: SN74AHC132 11 PACKAGE OPTION ADDENDUM www.ti.com 13-Aug-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) SN74AHC132D ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AHC132 SN74AHC132DBR ACTIVE SSOP DB 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HA132 SN74AHC132DGVR ACTIVE TVSOP DGV 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HA132 SN74AHC132DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AHC132 SN74AHC132DRE4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AHC132 SN74AHC132N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 SN74AHC132N SN74AHC132NSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AHC132 SN74AHC132PW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HA132 SN74AHC132PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HA132 SN74AHC132PWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HA132 SN74AHC132RGYR ACTIVE VQFN RGY 14 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 HA132 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
SN74AHC132RGYR 价格&库存

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SN74AHC132RGYR
  •  国内价格 香港价格
  • 3000+2.044643000+0.24826
  • 6000+1.903646000+0.23114
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  • 30000+1.7626430000+0.21402

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