SCLS529C − AUGUST 2003 − REVISED APRIL 2008
D Qualified for Automotive Applications
D ESD Protection Exceeds 1000 V Per
D
D
DW OR PW PACKAGE
(TOP VIEW)
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
EPIC (Enhanced-Performance Implanted
CMOS) Process
Inputs Are TTL-Voltage Compatible
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
description/ordering information
This octal buffer/driver is designed specifically to
improve both the performance and density of 3-state
memory-address drivers, clock drivers, and
bus-oriented receivers and transmitters.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
The SN74AHCT244 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs.
When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are
in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE shall be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION{
−40°C to 85°C
−40°C to 125°C
ORDERABLE
PART NUMBER
PACKAGE‡
TA
TOP-SIDE
MARKING
TSSOP − PW
Tape and reel
SN74AHCT244IPWRQ1
AHCT244I
SOIC − DW
Tape and reel
SN74AHCT244QDWRQ1
AHCT244Q
TSSOP − PW
Tape and reel
SN74AHCT244QPWRQ1
AHCT244Q
† For the most current package and ordering information, see the Package Option Addendum at the end of
this document, or see the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
FUNCTION TABLE
(each 4-bit buffer/driver)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments.
Copyright 2008, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#',
+&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$
$#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+'
#'$#1 "** (""!'#'$,
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1
SCLS529C − AUGUST 2003 − REVISED APRIL 2008
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA
Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7
recommended operating conditions (see Note 3)
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
VO
IOH
Output voltage
High-level input voltage
MIN
MAX
4.5
5.5
2
UNIT
V
V
0.8
V
0
5.5
V
0
High-level output current
VCC
−8
mA
IOL
Low-level output current
8
mA
TA
Operating free-air temperature
I-suffix device
−40
85
Q-suffix device
−40
125
V
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
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SCLS529C − AUGUST 2003 − REVISED APRIL 2008
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VOH
IOH = −50 mA
IOH = −8 mA
4.5 V
VOL
IOL = 50 mA
IOL = 8 mA
4.5 V
IOZ
II
VO = VCC or GND
VI = 5.5 V or GND
ICC
VI = VCC or GND,
One input at 3.4 V,
Other inputs at VCC or GND
∆ICC†
Ci
MIN
TA = 25°C
TYP
MAX
4.4
IO = 0
VI = VCC or GND
VO = VCC or GND
MIN
4.5
MAX
UNIT
4.4
3.94
V
3.8
0.1
0.1
0.36
0.44
5.5 V
±0.25
±2.5
mA
0 V to 5.5 V
V
±0.1
±1
mA
5.5 V
4
40
mA
5.5 V
1.35
1.5
mA
5V
2.5
10
pF
Co
5V
3
† This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.
pF
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A
Y
CL = 15 pF
tPZH
tPZL
OE
Y
CL = 15 pF
tPHZ
tPLZ
OE
Y
CL = 15 pF
tPLH
tPHL
A
Y
CL = 50 pF
tPZH
tPZL
OE
Y
CL = 50 pF
tPHZ
tPLZ
OE
Y
CL = 50 pF
PARAMETER
tsk(o)
MIN
TA = 25°C
TYP
MAX
MIN
MAX
5.4
7.4
1
8.5
5.4
7.4
1
8.5
7.7
10.4
1
12
7.7
10.4
1
12
5
9.4
1
10
5
9.4
1
10
5.9
8.4
1
9.5
5.9
8.4
1
9.5
8.2
11.4
1
13
8.2
11.4
1
13
8.8
11.4
1
13
8.8
11.4
1
13
CL = 50 pF
1
UNIT
ns
ns
ns
ns
ns
ns
ns
noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4)
PARAMETER
VOH(V)
VIH(D)
MIN
Quiet output, minimum dynamic VOH
TYP
MAX
4.1
High-level dynamic input voltage
V
2
VIL(D)
Low-level dynamic input voltage
NOTE 4: Characteristics are for surface-mount packages only.
UNIT
V
0.8
V
TYP
UNIT
8.2
pF
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
No load,
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f = 1 MHz
3
SCLS529C − AUGUST 2003 − REVISED APRIL 2008
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.5 V
Timing Input
0V
tw
3V
1.5 V
Input
1.5 V
th
tsu
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
1.5 V
tPLZ
≈VCC
50% VCC
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPZL
tPZH
tPLH
50% VCC
3V
Output
Control
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CAHCT244IPWRG4Q1
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AHCT244I
CAHCT244QDWRG4Q1
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHCT244Q
CAHCT244QPWRG4Q1
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHCT244Q
SN74AHCT244IPWRQ1
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AHCT244I
SN74AHCT244QDWRQ1
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHCT244Q
SN74AHCT244QPWRQ1
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHCT244Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of