SDAS023C − DECEMBER 1982 − REVISED JANUARY 1995
SN54ALS805A, SN54AS805B . . . J PACKAGE
SN74ALS805A, SN74AS805B . . . DW OR N PACKAGE
(TOP VIEW)
High Capacitive-Drive Capability
′ALS805A Has Typical Delay Time of 4.2 ns
(CL = 50 pF) and Typical Power Dissipation
of 4.2 mW Per Gate
′AS805B Has Typical Delay Time of 2.6 ns
(CL = 50 pF) and Typical Power Dissipation
of 12 mW Per Gate
Package Options Include Plastic
Small-Outline (DW) Packages, Ceramic
Chip Carriers (FK), and Standard Plastic (N)
and Ceramic (J) 300-mil DIPs
•
•
1A
1B
1Y
2A
2B
2Y
3A
3B
3Y
GND
description
These devices contain six independent 2-input
NOR drivers. They perform the Boolean functions
Y = A + B or Y = A • B in positive logic.
OUTPUT
Y
H
X
L
X
H
L
L
L
H
logic symbol†
1A
1B
2A
2B
3A
3B
4A
4B
5A
5B
6A
6B
1
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
6B
6A
6Y
5B
5A
5Y
4B
4A
4Y
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
6A
6Y
5B
5A
5Y
3Y
GND
4Y
4A
4B
B
2
1Y
1B
1A
VCC
2A
2B
2Y
3A
3B
FUNCTION TABLE
(each driver)
INPUTS
20
SN54ALS805A, SN54AS805B . . . FK PACKAGE
(TOP VIEW)
The SN54ALS805A and SN54AS805B are
characterized for operation over the full military
temperature range of − 55°C to 125°C. The
SN74ALS805A
and
SN74AS805B
are
characterized for operation from 0°C to 70°C.
A
1
6B
•
•
logic diagram (positive logic)
≥1
3
4
6
5
1A
1Y
1B
2A
2Y
2B
7
9
8
3A
3Y
3B
12
11
13
4A
4Y
4B
15
14
16
5A
5Y
5B
18
17
19
6Y
6A
6B
1
2
3
1Y
4
5
6
2Y
7
8
9
3Y
12
13
11
4Y
15
16
14
5Y
18
19
17
6Y
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
Copyright 1995, Texas Instruments Incorporated
!"#$ % &'!!($ #% )'*+$ ,#$(!,'&$% &!" $ %)(&$% )(! $.( $(!"% (/#% %$!'"($%
%$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',(
$(%$2 #++ )#!#"($(!%-
• DALLAS, TEXAS 75265
• HOUSTON, TEXAS 77251−1443
POST OFFICE BOX 655303
POST OFFICE BOX 1443
1
SDAS023C − DECEMBER 1982 − REVISED JANUARY 1995
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Operating free-air temperature range, TA: SN54ALS805A . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
SN74ALS805A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions
SN54ALS805A
SN74ALS805A
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
0.7
0.8
V
High-level output current
−12
−15
mA
IOL
TA
Low-level output current
24
mA
70
°C
High-level input voltage
2
2
V
12
Operating free-air temperature
−55
125
V
0
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
SN54ALS805A
TYP‡
MAX
TEST CONDITIONS
MIN
VCC = 4.5 V,
VCC = 4.5 V to 5.5 V,
II = −18 mA
IOH = − 0.4 mA
VCC = 4.5 V
IOH = − 3 mA
IOH = − 12 mA
VOL
VCC = 4.5 V
II
IIH
VCC = 5.5 V,
VCC = 5.5 V,
IIL
IO§
VCC = 5.5 V,
VCC = 5.5 V,
ICCH
ICCL
VCC = 5.5 V,
VCC = 5.5 V,
SN74ALS805A
TYP‡
MAX
MIN
−1.2
VCC − 2
2.4
−1.2
VCC − 2
2.4
3.2
V
3.2
V
2
IOH = − 15 mA
IOL = 12 mA
UNIT
2
0.25
IOL = 24 mA
VI = 7 V
0.4
0.25
0.4
0.35
0.5
0.1
VI = 2.7 V
VI = 0.4 V
VO = 2.25 V
VI = 0
−20
mA
20
20
µA
−0.1
−0.1
mA
−112
mA
mA
−112
−30
2
4
2
4
8
14
8
14
mA
‡ All typical values are at VCC = 5 V, TA = 25°C.
§ The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS.
2
VI = 4.5 V
0.1
V
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
SDAS023C − DECEMBER 1982 − REVISED JANUARY 1995
switching characteristics (see Figure 1)
PARAMETER
FROM
(INPUT)
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500 Ω,
TA = MIN to MAX†
TO
(OUTPUT)
SN54ALS805A
tPLH
tPHL
A or B
UNIT
SN74ALS805A
MIN
MAX
MIN
MAX
1
12
2
7
1
9
2
8
Y
ns
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Operating free-air temperature range, TA: SN54AS805B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
SN74AS805B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions§
SN54AS805B
SN74AS805B
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
0.8
0.8
V
High-level output current
−40
−48
mA
40
48
mA
70
°C
High-level input voltage
2
IOL
Low-level output current
TA
Operating free-air temperature
−55
§ These high sink- or source-current devices are not recommended for use above 40 MHz.
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
2
125
0
V
V
3
SDAS023C − DECEMBER 1982 − REVISED JANUARY 1995
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
SN54AS805B
TYP†
MAX
TEST CONDITIONS
MIN
VCC = 4.5 V,
VCC = 4.5 V to 5.5 V,
II = −18 mA
IOH = − 2 mA
VCC = 4.5 V
IOH = − 3 mA
IOH = − 40 mA
VOL
VCC = 4.5 V
II
IIH
VCC = 5.5 V,
VCC = 5.5 V,
IIL
IO‡
VCC = 5.5 V,
VCC = 5.5 V,
ICCH
ICCL
VCC = 5.5 V,
VCC = 5.5 V,
SN74AS805B
TYP†
MAX
MIN
−1.2
VCC − 2
2.4
−1.2
VCC − 2
2.4
3.2
V
3.2
V
2
IOH = − 48 mA
IOL = 40 mA
UNIT
2
0.25
IOL = 48 mA
VI = 7 V
0.5
0.35
0.5
0.1
VI = 2.7 V
VI = 0.4 V
VO = 2.25 V
VI = 0
−50
0.1
mA
20
20
µA
−0.5
−0.5
mA
−200
mA
mA
−200
−50
6.5
10
6.5
10
20
32
20
32
VI = 4.5 V
V
mA
† All typical values are at VCC = 5 V, TA = 25°C.
‡ The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS.
switching characteristics (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500 Ω,
TA = MIN to MAX§
SN54AS805B
tPLH
tPHL
A or B
Y
SN74AS805B
MIN
MAX
MIN
MAX
1
4.8
1
4.3
1
4.8
1
4.3
§ For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
4
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
UNIT
ns
SDAS023C − DECEMBER 1982 − REVISED JANUARY 1995
PARAMETER MEASUREMENT INFORMATION
SERIES 54ALS/74ALS AND 54AS/74AS DEVICES
7V
RL = R1 = R2
VCC
S1
RL
R1
Test
Point
From Output
Under Test
CL
(see Note A)
From Output
Under Test
RL
Test
Point
CL
(see Note A)
CL
(see Note A)
LOAD CIRCUIT FOR
BI-STATE
TOTEM-POLE OUTPUTS
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
3.5 V
Timing
Input
Test
Point
From Output
Under Test
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
3.5 V
High-Level
Pulse
1.3 V
R2
1.3 V
1.3 V
0.3 V
0.3 V
tsu
Data
Input
tw
th
3.5 V
1.3 V
3.5 V
Low-Level
Pulse
1.3 V
0.3 V
1.3 V
0.3 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3.5 V
Output
Control
(low-level
enabling)
1.3 V
1.3 V
0.3 V
tPZL
Waveform 1
S1 Closed
(see Note B)
tPLZ
3.5 V
Input
tPZH
1.3 V
0.3 V
tPHL
tPLH
VOH
In-Phase
Output
VOL
0.3 V
1.3 V
1.3 V
VOL
tPLH
tPHL
VOH
1.3 V
1.3 V
[3.5 V
1.3 V
tPHZ
Waveform 2
S1 Open
(see Note B)
1.3 V
VOH
Out-of-Phase
Output
(see Note C)
0.3 V
[0 V
1.3 V
1.3 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. When measuring propagation delay items of 3-state outputs, switch S1 is open.
D. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%.
E. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
5
PACKAGE OPTION ADDENDUM
www.ti.com
25-Oct-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
5962-87794012A
ACTIVE
5962-8869401SA
SN54ALS805AJ
Package Type Package Pins Package
Drawing
Qty
1
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
Device Marking
(4/5)
LCCC
FK
20
OBSOLETE
CFP
W
20
TBD
Call TI
Call TI
-55 to 125
OBSOLETE
CDIP
J
20
TBD
Call TI
Call TI
-55 to 125
596287794012A
SNJ54AS
805BFK
SN74ALS805ADWR
OBSOLETE
SOIC
DW
20
TBD
Call TI
Call TI
0 to 70
SN74ALS805ADWRE4
OBSOLETE
SOIC
DW
20
TBD
Call TI
Call TI
0 to 70
SN74ALS805ADWRG4
OBSOLETE
SOIC
DW
20
TBD
Call TI
Call TI
0 to 70
SN74ALS805AN3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
0 to 70
SN74AS805BDW
OBSOLETE
SOIC
DW
20
TBD
Call TI
Call TI
0 to 70
AS805B
SN74AS805BN
SN74AS805BN
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
0 to 70
SNJ54ALS805AFK
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
SNJ54ALS805AJ
OBSOLETE
CDIP
J
20
TBD
Call TI
Call TI
-55 to 125
SNJ54AS805BFK
ACTIVE
LCCC
FK
20
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
1
596287794012A
SNJ54AS
805BFK
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Oct-2016
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54ALS805A, SN54AS805B, SN74ALS805A, SN74AS805B :
• Catalog: SN74ALS805A, SN74AS805B
• Military: SN54ALS805A, SN54AS805B
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
PACKAGE OUTLINE
DW0020A
SOIC - 2.65 mm max height
SCALE 1.200
SOIC
C
10.63
TYP
9.97
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
20
1
13.0
12.6
NOTE 3
18X 1.27
2X
11.43
10
11
B
7.6
7.4
NOTE 4
20X
0.51
0.31
0.25
C A B
2.65 MAX
0.33
TYP
0.10
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.3
0.1
1.27
0.40
DETAIL A
TYPICAL
4220724/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
www.ti.com
EXAMPLE BOARD LAYOUT
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
(R0.05)
TYP
10
11
(9.3)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4220724/A 05/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
11
10
(9.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4220724/A 05/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
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www.ti.com/audio
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www.ti.com/automotive
Amplifiers
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www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
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Clocks and Timers
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Interface
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Medical
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Logic
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Security
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Power Mgmt
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Microcontrollers
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Video and Imaging
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RFID
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OMAP Applications Processors
www.ti.com/omap
TI E2E Community
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Wireless Connectivity
www.ti.com/wirelessconnectivity
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