SN74AUC07
HEX BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
www.ti.com
SCES472 – AUGUST 2003 – REVISED NOVEMBER 2005
FEATURES
•
VCC
1
14
2
13 6A
3
12 6Y
4
11 5A
5
6
10 5Y
9 4A
7
8
4Y
•
•
•
•
•
1Y
2A
2Y
3A
3Y
1A
•
RGY PACKAGE
(TOP VIEW)
Optimized for 1.8-V Operation and Is 3.6-V
I/O Tolerant to Support Mixed-Mode Signal
Operation
Ioff Supports Partial-Power-Down Mode
Operation
Sub-1-V Operable
Max tpd of 2.2 ns at 1.8 V
Low Power Consumption, 10-µA Max ICC
±8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
GND
•
DESCRIPTION/ORDERING INFORMATION
This hex buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC
operation.
The outputs of the SN74AUC07 are open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
QFN – RGY
ORDERABLE PART NUMBER
Tape and reel
SN74AUC07RGYR
TOP-SIDE MARKING
MS07
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(EACH BUFFER/DRIVER)
INPUT
A
OUTPUT
Y
H
H
L
L
LOGIC DIAGRAM, EACH BUFFER/DRIVER
(POSITIVE LOGIC)
A
Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2005, Texas Instruments Incorporated
SN74AUC07
HEX BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
www.ti.com
SCES472 – AUGUST 2003 – REVISED NOVEMBER 2005
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
3.6
V
VI
Input voltage range (2)
–0.5
3.6
V
range (2)
–0.5
UNIT
VO
Output voltage
3.6
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±20
mA
±100
Continuous current through VCC or GND
θJA
Package thermal impedance (3)
Tstg
Storage temperature range
(1)
(2)
(3)
–65
mA
47
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-5.
Recommended Operating Conditions (1)
VCC
Supply voltage
VCC = 0.8 V
VIH
High-level input voltage
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
MIN
MAX
0.8
2.7
Low-level input voltage
V
VCC
0.65 × VCC
V
1.7
VCC = 0.8 V
VIL
UNIT
0
0.35 × VCC
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
V
0.7
VI
Input voltage
0
3.6
V
VO
Output voltage
0
3.6
V
IOL
Low-level output current
VCC = 0.8 V
0.7
VCC = 1.1 V
3
VCC = 1.4 V
5
VCC = 1.65 V
8
VCC = 2.3 V
9
∆t/∆v Input transition rise or fall rate
TA
(1)
2
Operating free-air temperature
mA
–40
20
ns/V
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74AUC07
HEX BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
www.ti.com
SCES472 – AUGUST 2003 – REVISED NOVEMBER 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOL
MIN TYP (1) MAX
VCC
IOL = 100 µA
0.8 V to 2.7 V
IOL = 0.7 mA
0.8 V
IOL = 3 mA
1.1 V
0.3
IOL = 5 mA
1.4 V
0.4
IOL = 8 mA
1.65 V
0.45
2.3 V
0.6
IOL = 9 mA
UNIT
0.2
0.25
V
VI = VCC or GND
0 to 2.7 V
±5
µA
Ioff
VI or VO = 2.7 V
0
±10
µA
ICC
VI = VCC or GND,
10
µA
Ci
VI = VCC or GND
II
(1)
A inputs
IO = 0
0.8 V to 2.7 V
2.5 V
2.5
pF
All typical values are at TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 0.8 V
A
Y
4.5
tpd
TYP
VCC = 1.2 V
± 0.1 V
VCC = 1.5 V
± 0.1 V
MIN MAX
MIN MAX
0.9
3.5
0.7
VCC = 1.8 V
± 0.15 V
2.8
VCC = 2.5 V
± 0.2 V
MIN
TYP
MAX
0.6
1.4
2.8
UNIT
MIN MAX
0.6
2.3
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
Y
tpd
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
MIN
TYP
MAX
MIN
MAX
0.8
1.4
2.3
0.2
1.3
UNIT
ns
Operating Oharacteristics
TA = 25°C
PARAMETER
Cpd
Power dissipation
capacitance
TEST
CONDITIONS
VCC = 0.8 V
VCC = 1.2 V
VCC = 1.5 V
VCC = 1.8 V
VCC = 2.5 V
TYP
TYP
TYP
TYP
TYP
f = 10 MHz
2
2
2
3
3
UNIT
pF
3
SN74AUC07
HEX BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
www.ti.com
SCES472 – AUGUST 2003 – REVISED NOVEMBER 2005
PARAMETER MEASUREMENT INFORMATION
(Open Drain)
VLOAD
S1
RL
From Output
Under Test
Open
TEST
GND
RL
CL
(see Note A)
S1
tPZL (see Notes E and F)
VLOAD
tPLZ (see Notes E and G)
VLOAD
tPHZ/tPZH
VLOAD
LOAD CIRCUIT
INPUT
VCC
VI
0.8 V
1.2 V ± 0.1 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
tr/tf
≤ 2 ns
≤ 2 ns
≤ 2 ns
≤ 2 ns
≤ 2 ns
≤ 2 ns
≤ 2 ns
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VI
VM
Input
VM
0V
2 × VCC
2 × VCC
2 × VCC
2 × VCC
2 × VCC
2 × VCC
2 × VCC
VM
VM
VOL
tPHL
V∆
15 pF
15 pF
15 pF
15 pF
15 pF
30 pF
30 pF
2 kΩ
2 kΩ
2 kΩ
2 kΩ
2 kΩ
1 kΩ
500 Ω
0.1 V
0.1 V
0.1 V
0.15 V
0.15 V
0.15 V
0.15 V
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLZ
VLOAD/2
VM
tPZH
VOH
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
RL
VI
Output
Control
tPLH
VM
CL
tPZL
VOH
Output
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VLOAD
tPHL
tPLH
Output
VM
Output
Waveform 2
S1 at VLOAD
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VLOAD/2 − V∆
VLOAD/2
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VM.
G. tPLZ is measured at VOL + V∆.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
4
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN74AUC07RGYR
ACTIVE
VQFN
RGY
14
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
MS07
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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