SN74CBT3253C
DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS123B – JULY 2003 – REVISED JANUARY 2007
FEATURES
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SN74CBT3253C Functionally Identical to
Industry-Standard ’3253 Function
Undershoot Protection for Off-Isolation on A
and B Ports up to –2 V
Bidirectional Data Flow, With Near-Zero
Propagation Delay
Low ON-State Resistance (ron) Characteristics
(ron = 3 Ω Typical)
Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 5.5 pF Typical)
Data and Control Inputs Provide Undershoot
Clamp Diodes
Low Power Consumption (ICC = 3 µA Max)
VCC Operating Range From 4 V to 5.5 V
Data I/Os Support 0 to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
Supports I2C Bus Expansion
Supports Both Digital and Analog
Applications: USB Interface, Bus Isolation,
Low-Distortion Signal Gating
DESCRIPTION/ORDERING INFORMATION
The SN74CBT3253C is a high-speed TTL-compatible FET multiplexer/demultiplexer with low ON-state
resistance (ron), allowing for minimal propagation delay. Active Undershoot-Protection Circuitry on the A and B
ports of the SN74CBT3253C provides protection for undershoot up to –2 V by sensing an undershoot event and
ensuring that the switch remains in the proper OFF state.
The SN74CBT3253C is organized as two 1-of-4 multiplexer/demultiplexers with separate output-enable (1OE,
2OE) inputs. The select (S0, S1) inputs control the data path of each multiplexer/demultiplexer. When OE is low,
the associated multiplexer/demultiplexer is enabled, and the A port is connected to the B port, allowing
bidirectional data flow between ports. When OE is high, the associated multiplexer/demultiplexer is disabled, and
a high-impedance state exists between the A and B ports.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2007, Texas Instruments Incorporated
SN74CBT3253C
DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS123B – JULY 2003 – REVISED JANUARY 2007
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging
current will not backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
PACKAGE (1)
TA
QFN – RGY
SOIC – D
–40°C to 85°C
SSOP – DB
SSOP (QSOP) – DBQ
TSSOP – PW
(1)
ORDERABLE PART NUMBER
Reel of 1000
SN74CBT3253CRGYR
Tube of 40
SN74CBT3253CD
Reel of 2500
SN74CBT3253CDR
Tube of 80
SN74CBT3253CDB
Reel of 2000
SN74CBT3253CDBR
Reel of 2500
SN74CBT3253CDBQR
Tube of 90
SN74CBT3253CPW
Reel of 2000
SN74CBT3253CPWR
CU253C
CBT3253C
CU253C
CU253C
CU253C
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(each multiplexer/demultiplexer)
INPUTS
2
TOP-SIDE MARKING
S0
INPUT/OUTPUT
A
FUNCTION
L
L
B1
A port = B1 port
L
H
B2
A port = B2 port
L
H
L
B3
A port = B3 port
L
H
H
B4
A port = B4 port
H
X
X
X
Disconnect
OE
S1
L
L
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SN74CBT3253C
DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS123B – JULY 2003 – REVISED JANUARY 2007
LOGIC DIAGRAM (POSITIVE LOGIC)
7
1A
6
1B1
SW
5
1B2
SW
4
1B3
SW
3
1B4
SW
10
9
2A
2B1
SW
11
2B2
SW
12
2B3
SW
13
SW
2B4
14
S0
2
S1
1
1OE
15
2OE
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
(1)
EN
(1)
EN is the internal enable signal applied to the switch.
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SN74CBT3253C
DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS123B – JULY 2003 – REVISED JANUARY 2007
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage
–0.5
7
V
VIN
Control input voltage range (2) (3)
–0.5
7
V
VI/O
Switch I/O voltage
range (2) (3) (4)
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
±128
mA
±100
mA
II/O
ON-state switch
–0.5
current (5)
Continuous current through VCC or GND terminals
θJA
Tstg
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Package thermal impedance
7
D package (6)
73
DB package (6)
82
DBQ package (6)
90
PW package (6)
108
RGY package (7)
39
Storage temperature range
–65
150
UNIT
V
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
VI and VO are used to denote specific conditions for VI/O.
II and IO are used to denote specific conditions for II/O.
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-5.
Recommended Operating Conditions (1)
MIN
MAX
VCC
Supply voltage
4
5.5
V
VIH
High-level control input voltage
2
5.5
V
VIL
Low-level control input voltage
0
0.8
V
VI/O
Data input/output voltage
0
5.5
V
TA
Operating free-air temperature
–40
85
°C
(1)
4
UNIT
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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SN74CBT3253C
DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS123B – JULY 2003 – REVISED JANUARY 2007
Electrical Characteristics
(1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
Control inputs
MIN TYP (2)
TEST CONDITIONS
VCC = 4.5 V,
IIN = –18 mA
VIKU
Data inputs
VCC = 5 V,
0 mA > II ≥ –50 mA,
VIN = VCC or GND,
IIN
Control inputs
VCC = 5.5 V,
VIN = VCC or GND
IOZ (3)
VCC = 5.5 V,
VO = 0 to 5.5 V,
VI = 0,
Switch OFF,
VIN = VCC or GND
Ioff
VCC = 0,
VO = 0 to 5.5 V,
VI = 0
VCC = 5.5 V,
II/O = 0,
VIN = VCC or GND,
Switch ON or OFF
One input at 3.4 V,
Other inputs at VCC or GND
ICC
∆ICC (4)
Control inputs
VCC = 5.5 V,
Cin
Control inputs
VIN = 3 V or 0
Cio(OFF)
A port
B port
Cio(ON)
Switch OFF
UNIT
–1.8
V
–2
V
±1
µA
±10
µA
10
µA
3
µA
2.5
mA
3.5
pF
14
VI/O = 3 V or 0,
Switch OFF,
VIN = VCC or GND
VI/O = 3 V or 0,
Switch ON,
VIN = VCC or GND
VCC = 4 V,
TYP at VCC = 4 V
VI = 2.4 V,
IO = –15 mA
8
12
IO = 64 mA
3
6
IO = 30 mA
3
6
IO = –15 mA
5
10
ron (5)
VI = 0
VCC = 4.5 V
VI = 2.4 V,
(1)
(2)
(3)
(4)
(5)
MAX
pF
5.5
22
pF
Ω
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 3)
VCC = 5 V
± 0.5 V
MIN
MIN
TO
(OUTPUT)
tpd (1)
A or B
B or A
0.24
0.15
ns
tpd(s)
S
A
5.9
1.5
5.4
ns
S
B
6.2
1.5
5.8
OE
A or B
5.7
1.5
5.3
S
B
6.2
1.5
5.8
OE
A or B
5.7
1.5
5.3
ten
tdis
(1)
VCC = 4 V
FROM
(INPUT)
PARAMETER
MAX
UNIT
MAX
ns
ns
The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
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SN74CBT3253C
DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS123B – JULY 2003 – REVISED JANUARY 2007
Undershoot Characteristics
See Figure 1 and Figure 2
PARAMETER
VOUTU
(1)
TEST CONDITIONS
VCC = 5.5 V,
Switch OFF,
VIN = VCC or GND
MIN
TYP (1)
2
VOH – 0.3
MAX
All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
100 kΩ
50 Ω
100 kΩ
Figure 1. Device Test Setup
6
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Figure 2. Transient Input Voltage (VI) and
Output Voltage (VOUTU) Waveforms
(Switch OFF)
UNIT
V
SN74CBT3253C
DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS123B – JULY 2003 – REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
VCC
Input Generator
VIN
50 Ω
50 Ω
VG1
TEST CIRCUIT
DUT
7V
Input Generator
S1
RL
VO
VI
50 Ω
50 Ω
VG2
CL
(see Note A)
RL
TEST
VCC
S1
RL
VI
CL
tpd(s)
5 V ± 0.5 V
4V
Open
Open
500 Ω
500 Ω
VCC or GND
VCC or GND
50 pF
50 pF
tPLZ/tPZL
5 V ± 0.5 V
4V
7V
7V
500 Ω
500 Ω
GND
GND
50 pF
50 pF
0.3 V
0.3 V
tPHZ/tPZH
5 V ± 0.5 V
4V
Open
Open
500 Ω
500 Ω
VCC
VCC
50 pF
50 pF
0.3 V
0.3 V
V∆
3V
Output
Control
(VIN)
1.5 V
3V
1.5 V
1.5 V
0V
tPLH
VOH
Output
1.5 V
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLZ
3.5 V
1.5 V
1.5 V
VOL
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (tpd(s))
VOL + V∆
VOL
tPZH
tPHL
1.5 V
0V
tPZL
Output
Control
(VIN)
Open
GND
tPHZ
VOH
1.5 V
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance
of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Test Circuit and Voltage Waveforms
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN74CBT3253CD
ACTIVE
SOIC
D
16
40
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBT3253C
SN74CBT3253CDBQR
ACTIVE
SSOP
DBQ
16
2500
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CU253C
SN74CBT3253CDBR
ACTIVE
SSOP
DB
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CU253C
SN74CBT3253CDR
ACTIVE
SOIC
D
16
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBT3253C
SN74CBT3253CDRE4
ACTIVE
SOIC
D
16
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBT3253C
SN74CBT3253CDRG4
ACTIVE
SOIC
D
16
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBT3253C
SN74CBT3253CPW
ACTIVE
TSSOP
PW
16
90
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CU253C
SN74CBT3253CPWR
ACTIVE
TSSOP
PW
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CU253C
SN74CBT3253CRGYR
ACTIVE
VQFN
RGY
16
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CU253C
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of