SN74CBTD16211
24-BIT FET BUS SWITCH
WITH LEVEL SHIFTING
SCDS048H – MARCH 1998 – REVISED JULY 2002
D
D
D
D
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Member of Texas Instruments Widebus
Family
5-Ω Switch Connection Between Two Ports
TTL-Compatible Input Levels
Designed to Be Used in Level-Shifting
Applications
NC
1A1
1A2
1A3
1A4
1A5
1A6
GND
1A7
1A8
1A9
1A10
1A11
1A12
2A1
2A2
VCC
2A3
GND
2A4
2A5
2A6
2A7
2A8
2A9
2A10
2A11
2A12
description/ordering information
The SN74CBTD16211 provides 24 bits of
high-speed TTL-compatible bus switching. The
low on-state resistance of the switch allows
connections to be made with minimal propagation
delay. A diode to VCC is integrated in the circuit to
allow for level shifting from 5-V signals at the
device inputs to 3.3-V signals at the device
outputs.
The device is organized as a dual 12-bit bus
switch with separate output-enable (OE) inputs. It
can be used as two 12-bit bus switches or as one
24-bit bus switch. When OE is low, the associated
12-bit bus switch is on, and port A is connected to
port B. When OE is high, the switch is open, and
the high-impedance state exists between the
ports.
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
1OE
2OE
1B1
1B2
1B3
1B4
1B5
GND
1B6
1B7
1B8
1B9
1B10
1B11
1B12
2B1
2B2
2B3
GND
2B4
2B5
2B6
2B7
2B8
2B9
2B10
2B11
2B12
NC – No internal connection
ORDERING INFORMATION
PACKAGE†
ORDERABLE
PART NUMBER
Tube
SN74CBTD16211DL
Tape and reel
SN74CBTD16211DLR
TSSOP – DGG
Tape and reel
SN74CBTD16211DGGR
CBTD16211
TVSOP – DGV
Tape and reel
SN74CBTD16211DGVR
CYD211
TA
SSOP – DL
–40°C
40°C to 85°C
TOP-SIDE
MARKING
CBTD16211
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74CBTD16211
24-BIT FET BUS SWITCH
WITH LEVEL SHIFTING
SCDS048H – MARCH 1998 – REVISED JULY 2002
FUNCTION TABLE
(each 12-bit bus switch)
INPUT
OE
FUNCTION
L
A port = B port
H
Disconnect
logic diagram (positive logic)
2
54
1A1
1A12
1B1
14
42
1B12
56
1OE
15
41
2A1
2B1
28
29
2A12
2B12
55
2OE
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74CBTD16211
24-BIT FET BUS SWITCH
WITH LEVEL SHIFTING
SCDS048H – MARCH 1998 – REVISED JULY 2002
recommended operating conditions (see Note 3)
VCC
VIH
Supply voltage
VIL
TA
Low-level control input voltage
High-level control input voltage
MIN
MAX
4.5
5.5
2
Operating free-air temperature
–40
UNIT
V
V
0.8
V
85
°C
In applications with fast edge rates, multiple outputs switching, and operating at high frequencies, the output may have little or no level-shifting
effect.
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
VOH
VCC = 4.5 V,
See Figure 2
II = –18 mA
II
ICC
VCC = 5.5 V,
VCC = 5.5 V,
VI = 5.5 V or GND
IO = 0,
VCC = 5.5 V,
VI = 3 V or 0
One input at 3.4 V,
Cio(OFF)
VO = 3 V or 0,
OE = VCC
ron§
VCC = 4.5 V
∆ICC‡
Ci
Control inputs
Control inputs
VI = 0
MIN
TYP†
VI = VCC or GND
Other inputs at VCC or GND
II = 64 mA
II = 30 mA
MAX
UNIT
–1.2
V
±1
µA
1.5
mA
2.5
mA
3
pF
5.5
pF
5
7
5
7
Ω
VI = 2.4 V,
II = 15 mA
35
50
† All typical values are at VCC = 5 V, TA = 25°C.
‡ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
§ Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lowest voltage of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
tpd¶
ten
FROM
(INPUT)
TO
(OUTPUT)
A or B
B or A
OE
A or B
MIN
1.5
MAX
UNIT
0.25
ns
9.8
ns
tdis
OE
A or B
1.5
8.9
ns
¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN74CBTD16211
24-BIT FET BUS SWITCH
WITH LEVEL SHIFTING
SCDS048H – MARCH 1998 – REVISED JULY 2002
PARAMETER MEASUREMENT INFORMATION
7V
500 Ω
From Output
Under Test
S1
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
Output
Control
LOAD CIRCUIT
1.5 V
1.5 V
0V
tPLZ
tPZL
3V
Input
1.5 V
1.5 V
0V
tPLH
1.5 V
3.5 V
1.5 V
1.5 V
VOL
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOL + 0.3 V
VOL
tPHZ
tPZH
tPHL
VOH
Output
Output
Waveform 1
S1 at 7 V
(see Note B)
1.5 V
VOH
VOH – 0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74CBTD16211
24-BIT FET BUS SWITCH
WITH LEVEL SHIFTING
SCDS048H – MARCH 1998 – REVISED JULY 2002
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
4
4
–100 µA
TA = 85°C
3.75
TA = 25°C
VOH – Output Voltage High – V
–6 mA
–12 mA
–24 mA
3.5
3.25
3
2.75
2.5
2.25
2
1.75
3.75
–100 µA
3.5
–6 mA
–12 mA
–24 mA
3.25
3
2.75
2.5
2.25
2
1.75
1.5
1.5
4.5
4.75
5
5.5
5.25
4.75
4.5
5.75
VCC – Supply Voltage – V
5
5.25
5.5
5.75
VCC – Supply Voltage – V
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
4
TA = 0°C
3.75
–100 µA
3.5
VOH – Output Voltage High – V
VOH – Output Voltage High – V
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
–6 mA
–12 mA
–24 mA
3.25
3
2.75
2.5
2.25
2
1.75
1.5
4.5
4.75
5
5.25
5.5
5.75
VCC – Supply Voltage – V
Figure 2. VOH Values
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74CBTD16211DGGRE4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTD16211DGGRG4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTD16211DGVRE4
ACTIVE
TVSOP
DGV
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTD16211DGVRG4
ACTIVE
TVSOP
DGV
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTD16211DLRG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTD16211DGGR
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTD16211DGVR
ACTIVE
TVSOP
DGV
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTD16211DL
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTD16211DLG4
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTD16211DLR
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.6
15.6
1.8
12.0
24.0
Q1
SN74CBTD16211DGGR
TSSOP
DGG
56
2000
330.0
24.4
SN74CBTD16211DGVR
TVSOP
DGV
56
2000
330.0
24.4
6.8
11.7
1.6
12.0
24.0
Q1
SN74CBTD16211DLR
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74CBTD16211DGGR
TSSOP
DGG
56
2000
346.0
346.0
41.0
SN74CBTD16211DGVR
TVSOP
DGV
56
2000
346.0
346.0
41.0
SN74CBTD16211DLR
SSOP
DL
56
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
SN74CBTD16211DGGR
ACTIVE
TSSOP
DGG
56
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBTD16211
Samples
SN74CBTD16211DGVR
ACTIVE
TVSOP
DGV
56
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CYD211
Samples
SN74CBTD16211DL
ACTIVE
SSOP
DL
56
20
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBTD16211
Samples
SN74CBTD16211DLR
ACTIVE
SSOP
DL
56
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBTD16211
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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