SN74CBTK6800PW

SN74CBTK6800 10-BIT FET BUS SWITCH WITH PRECHARGED OUTPUTS AND ACTIVE-CLAMP UNDERSHOOT-PROTECTION CIRCUIT SCDS107B – APRIL 2000 – REVISED OCTOBER 2000 D D D D D D D DBQ, DGV, DW, OR PW PACKAGE (TOP VIEW) 5-Ω Switch Connection Between Two Ports TTL-Compatible Input Levels Power Off Disables Outputs, Permitting Live Insertion Outputs Are Precharged by Bias Voltage to Minimize Signal Distortion During Live Insertion Active-Clamp Undershoot-Protection Circuit on the I/Os Clamps Undershoots Down to –2 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) ON A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 GND 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 BIASV description The SN74CBTK6800 device provides ten bits of high-speed TTL-compatible bus switching. The low on-state resistance of the switch allows bidirectional connections to be made while adding near-zero propagation delay. The device also precharges the B port to a user-selectable bias voltage (BIASV) to minimize live-insertion noise. The A and B ports have an active-clamp undershoot-protection circuit. When there is an undershoot, the active-clamp circuit is enabled and current from VCC is supplied to clamp the output, preventing the pass transistor from turning on. The SN74CBTK6800 is organized as one 10-bit switch with a single enable (ON) input. When ON is low, the switch is on, and port A is connected to port B. When ON is high, the switch between port A and port B is open. When ON is high or VCC is 0 V, B port is precharged to BIASV through the equivalent of a 10-kΩ resistor. ORDERING INFORMATION TOP-SIDE MARKING Tube SN74CBTK6800DW Tape and reel SN74CBTK6800DWR SSOP (QSOP) – DBQ Tape and reel SN74CBTK6800DBQR CBTK6800 TSSOP – PW Tape and reel SN74CBTK6800PWR BK6800 SOIC – DW –40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA CBTK6800 TVSOP – DGV Tape and reel SN74CBTK6800DGVR BK6800 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUT ON FUNCTION L A port = B port H A port = Z B port = BIASV Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74CBTK6800 10-BIT FET BUS SWITCH WITH PRECHARGED OUTPUTS AND ACTIVE-CLAMP UNDERSHOOT-PROTECTION CIRCUIT SCDS107B – APRIL 2000 – REVISED OCTOBER 2000 logic diagram (positive logic) 13 BIASV VCC VCC UC† UC† 2 23 A1 B1 VCC VCC UC† UC† 11 14 A10 B10 1 ON † Undershoot clamp absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Bias voltage range, BIASV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN MAX UNIT VCC BIASV Supply voltage 4 5.5 V Supply voltage 1.3 VCC V VIH VIL High-level control input voltage 2 Low-level control input voltage V 0.8 V TA Operating free-air temperature –40 85 °C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74CBTK6800 10-BIT FET BUS SWITCH WITH PRECHARGED OUTPUTS AND ACTIVE-CLAMP UNDERSHOOT-PROTECTION CIRCUIT SCDS107B – APRIL 2000 – REVISED OCTOBER 2000 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT –1.2 V VIK VIKU VCC = 4.5 V, VCC = 5.5 V, II = –18 mA 0 mA ≥ II ≥ –50 mA, II Ioff VCC = 5.5 V, VCC = 0, VI = 5.5 V or GND VI or VO = 0 to 5.5 V, IO ICC VCC = 4.5 V, VCC = 5.5 V, VO= 0, VI = VCC or GND, VCC = 5.5 V, VI = 3 V or 0 One input at 3.4 V, VO = 3 V or 0, Switch off VCC = 4 V, TYP at VCC = 4 V VI = 2.4 V, II = 15 mA 11 20 VI = 0 II = 64 mA II = 30 mA 3 7 3 7 ∆ICC‡ Control inputs Ci Control inputs Co(OFF) ron§ VCC = 4.5 V OE = 5.5 V BIASV = Open BIASV = 2.4 V –2 V ±5 µA 20 µA 0.25 mA IO = 0 Other inputs at VCC or GND 20 µA 2.5 mA 3 pF 8.5 pF Ω VI = 2.4 V, II = 15 mA 6 15 † All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. ‡ This is the increase in supply current for each input that is at the specified TTL-voltage level rather than VCC or GND. § Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) PARAMETER tpd¶ tPZH tPZL tPHZ tPLZ FROM (INPUT) TO (OUTPUT) A or B B or A ON A or B ON A or B TEST CONDITIONS VCC = 4 V VCC = 5 V ± 0.5 V MIN MIN MAX 0.35 UNIT MAX 0.25 BIASV = GND 6 2 5.1 BIASV = 3 V 6 2 5.6 BIASV = GND 5.5 1 5 BIASV = 3 V 5.5 2 5.9 ns ns ns ¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN74CBTK6800 10-BIT FET BUS SWITCH WITH PRECHARGED OUTPUTS AND ACTIVE-CLAMP UNDERSHOOT-PROTECTION CIRCUIT SCDS107B – APRIL 2000 – REVISED OCTOBER 2000 undershoot characteristics PARAMETER TEST CONDITIONS VOUTU See Figures 1 and 2, and Table 1 † All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. VCC MIN TYP† 2 VOH–0.3 MAX UNIT V VTR R1 50 Ω DUT VIN R2 10 pF 5.5 V 0V –2 V Figure 1. Device Test Setup Figure 2. Transient Input Voltage Waveform Table 1. Device Test Conditions PARAMETER VALUE B port under test‡ UNIT See Figure 1 VIN tw See Figure 2 V 20 ns tr tf 2 ns 2 ns R1 = R2 100 kΩ VTR VCC 11 V 5.5 V BIASV Open ‡ Other B-port outputs are open. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74CBTK6800 10-BIT FET BUS SWITCH WITH PRECHARGED OUTPUTS AND ACTIVE-CLAMP UNDERSHOOT-PROTECTION CIRCUIT SCDS107B – APRIL 2000 – REVISED OCTOBER 2000 PARAMETER MEASUREMENT INFORMATION 7V 500 Ω From Output Under Test S1 Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V Output Control LOAD CIRCUIT 1.5 V 1.5 V 0V tPLZ tPZL 3V Input 1.5 V 1.5 V 0V tPLH 1.5 V 3.5 V 1.5 V 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOL + 0.3 V VOL tPHZ tPZH tPHL VOH Output Output Waveform 1 S1 at 7 V (see Note B) 1.5 V VOH VOH – 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 3. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) SN74CBTK6800DBQR ACTIVE SSOP DBQ 24 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 CBTK6800 SN74CBTK6800PWR ACTIVE TSSOP PW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 BK6800 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of