SN74CBTLV3251DGVR

       SCDS054I − MARCH 1998 − REVISED OCTOBER 2003 D 5-Ω Switch Connection Between Two Ports D Rail-to-Rail Switching on Data I/O Ports D Ioff Supports Partial-Power-Down Mode D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II Operation D, DBQ, DGV, OR PW PACKAGE (TOP VIEW) 15 3 14 4 13 5 12 6 11 7 10 8 9 B3 B2 B1 A NC OE NC − No internal connection VCC 2 VCC B5 B6 B7 B8 S0 S1 S2 1 16 15 B5 14 B6 2 3 13 B7 12 B8 4 5 11 S0 10 S1 6 7 8 9 S2 16 B4 1 GND B4 B3 B2 B1 A NC OE GND RGY PACKAGE (TOP VIEW) NC − No internal connection description/ordering information The SN74CBTLV3251 device is a 1-of-8 high-speed FET multiplexer/demultiplexer. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The select inputs (S0, S1, S2) control the data flow. The FET multiplexers/demultiplexers are disabled when the output-enable (OE) input is high. This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION QFN − RGY TOP-SIDE MARKING Tape and reel SN74CBTLV3251RGYR Tube SN74CBTLV3251D Tape and reel SN74CBTLV3251DR SSOP (QSOP) − DBQ Tape and reel SN74CBTLV3251DBQR CL251 TSSOP − PW Tape and reel SN74CBTLV3251PWR CL251 TVSOP − DGV Tape and reel SN74CBTLV3251DGVR CL251 SOIC − D −40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA CL251 CBTLV3251 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2003, Texas Instruments Incorporated   !"#$%&" ' ()##*& %' "! +),-(%&" .%&*/ #".)(&' ("!"#$ &" '+*(!(%&"' +*# &0* &*#$' "! *1%' '&#)$*&' '&%.%#. 2%##%&3/ #".)(&" +#"(*''4 ."*' "& *(*''%#-3 (-).* &*'&4 "! %-- +%#%$*&*#'/ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 
       SCDS054I − MARCH 1998 − REVISED OCTOBER 2003 FUNCTION TABLE INPUTS S1 S0 FUNCTION OE S2 L L L L A port = B1 port L L L H A port = B2 port L L H L A port = B3 port L L H H A port = B4 port L H L L A port = B5 port L H L H A port = B6 port L H H L A port = B7 port L H H H A port = B8 port H X X X Disconnect logic diagram (positive logic) A 5 4 SW 3 SW B1 B2 2 SW B3 1 B4 SW 15 SW B5 14 SW B6 13 B7 SW 12 SW 11 S0 10 S1 9 S2 OE 2 7 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 B8 
       SCDS054I − MARCH 1998 − REVISED OCTOBER 2003 simplified schematic, each FET switch A B (OE) absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W (see Note 2): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W (see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W (see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W (see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 3. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 4) VCC Supply voltage VIH High-level control input voltage VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VIL Low-level control input voltage VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V MIN MAX 2.3 3.6 UNIT V 1.7 V 2 0.7 0.8 V TA Operating free-air temperature −40 85 °C NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 
       SCDS054I − MARCH 1998 − REVISED OCTOBER 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT −1.2 V VIK II VCC = 3 V, VCC = 3.6 V, II = −18 mA VI = VCC or GND Ioff ICC VCC = 0, VCC = 3.6 V, VI or VO = 0 to 3.6 V IO = 0, VI = VCC or GND VCC = 3.6 V, VI = 3 V or 0 One input at 3 V, VO = 3 V or 0, OE = VCC VI = 0 II = 64 mA II = 24 mA 5 VCC = 2.3 V, TYP at VCC = 2.5 V 5 8 VI = 1.7 V, II = 15 mA 27 40 5 7 VI = 0 II = 64 mA II = 24 mA 5 7 ∆ICC‡ Control inputs Ci Control inputs Other inputs at VCC or GND B port µA µA 10 µA 300 µA 3 A port Cio(OFF) ±1 20 pF 40.5 ron§ VCC = 3 V pF 6 8 Ω VI = 2.4 V, II = 15 mA 10 15 † All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. ‡ This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND. § Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 2.5 V ± 0.2 V MIN MAX VCC = 3.3 V ± 0.3 V MIN UNIT MAX A or B¶ B or A tpd S A 1 6.1 1 5.3 ten S B 1 4.1 1 3.6 ns tdis S B 1 3.5 1 3.3 ns ten OE A or B 1 5.2 1 4.5 ns tdis OE A or B 1 6.7 1 7.2 ns 0.15 0.25 ns ¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
       SCDS054I − MARCH 1998 − REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION 2 × VCC RL From Output Under Test S1 Open GND CL (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND RL LOAD CIRCUIT VCC CL RL V∆ 2.5 V ±0.2 V 3.3 V ±0.3 V 30 pF 50 pF 500 Ω 500 Ω 0.15 V 0.3 V VCC Timing Input VCC/2 0V tw tsu VCC VCC/2 Input VCC/2 th VCC VCC/2 Data Input VCC/2 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC VCC/2 Input VCC/2 0V tPHL tPLH VOH VCC/2 Output VCC/2 VOL VOH Output Output Waveform 1 S1 at 2 × VCC (see Note B) tPLH tPHL VCC/2 VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VCC Output Control Output Waveform 2 S1 at GND (see Note B) VCC/2 VCC/2 0V tPLZ tPZL VCC VCC/2 VOL + V∆ VOL tPHZ tPZH VCC/2 VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) 74CBTLV3251DBQRG4 ACTIVE SSOP DBQ 16 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 CL251 SN74CBTLV3251D ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CBTLV3251 SN74CBTLV3251DBQR ACTIVE SSOP DBQ 16 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 CL251 SN74CBTLV3251DGVR ACTIVE TVSOP DGV 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CL251 SN74CBTLV3251DR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CBTLV3251 SN74CBTLV3251PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CL251 SN74CBTLV3251RGYR ACTIVE VQFN RGY 16 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 CL251 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of