SN74HC251DT

SN54HC251, SN74HC251 SCLS132F – DECEMBER 1982 – REVISED FEBRUARY 2022 SNx4HC251 Data Selectors/Multiplexers With 3-State Outputs 1 Features 2 Description • • • The SNx4HC251 is a data selector/multiplexer containing full binary decoding to select 1of-8 data sources and features strobe-controlled complementary 3-state outputs. • • • • • • 3-state version of ’HC151 Wide operating voltage range of 2 V to 6 V High-current 3-state outputs interface directly with system bus or can drive up to 15 LSTTL loads Low power consumption, 80-μA max ICC Typical tpd = 9 ns ±6-mA output drive at 5 V Low input current of 1 μA max Perform parallel-to-serial conversion Complementary outputs provide true and inverted data Device Information (1) PART NUMBER PACKAGE BODY SIZE (NOM) SN74HC251D SOIC (16) 9.90 mm × 3.90 mm SN74HC251DB SSOP (16) 6.20 mm × 5.30 mm SN74HC251N PDIP (16) 19.31 mm × 6.35 mm SN74HC251NS SO (16) 6.20 mm × 5.30 mm SN74HC251PW TSSOP (16) 5.00 mm × 4.40 mm SN54HC251J CDIP (16) 24.38 mm × 6.92 mm SNJ54HC251FK LCCC (20) 8.89 mm × 8.45 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. Functional Block Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN54HC251, SN74HC251 www.ti.com SCLS132F – DECEMBER 1982 – REVISED FEBRUARY 2022 Table of Contents 1 Features............................................................................1 2 Description.......................................................................1 3 Revision History.............................................................. 2 4 Pin Configuration and Functions...................................3 5 Specifications.................................................................. 4 5.1 Absolute Maximum Ratings........................................ 4 5.2 Recommended Operating Conditions(1) .................... 4 5.3 Thermal Information....................................................4 5.4 Electrical Characteristics.............................................5 5.5 Switching Characteristics ...........................................5 5.6 Switching Characteristics ...........................................6 5.7 Operating Characteristics........................................... 6 6 Parameter Measurement Information............................ 7 7 Detailed Description........................................................8 7.1 Overview..................................................................... 8 7.2 Functional Block Diagram........................................... 8 7.3 Device Functional Modes............................................9 8 Power Supply Recommendations................................10 9 Layout.............................................................................10 9.1 Layout Guidelines..................................................... 10 10 Device and Documentation Support..........................11 10.1 Receiving Notification of Documentation Updates.. 11 10.2 Support Resources................................................. 11 10.3 Trademarks............................................................. 11 10.4 Electrostatic Discharge Caution.............................. 11 10.5 Glossary.................................................................. 11 11 Mechanical, Packaging, and Orderable Information.................................................................... 11 3 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (September 2003) to Revision F (February 2022) Page • Updated the numbering, formatting, tables, figures, and cross-refrences throughout the document to reflect modern data sheet standards............................................................................................................................. 1 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC251 SN74HC251 SN54HC251, SN74HC251 www.ti.com SCLS132F – DECEMBER 1982 – REVISED FEBRUARY 2022 4 Pin Configuration and Functions J, D, DB, N, NS, or PW Package 16-Pin CDIP, SOIC, SSOP, PDIP, SO, or TSSOP Top View NC - No internal connection FK Package 20-Pin LCCC Top View Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC251 SN74HC251 3 SN54HC251, SN74HC251 www.ti.com SCLS132F – DECEMBER 1982 – REVISED FEBRUARY 2022 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) VCC Supply voltage range current(2) MIN MAX –0.5 7 UNIT V IIK Input clamp VI < 0 or VI > VCC ±20 mA IOK Output clamp current(2) VO < 0 or VO > VCC ±20 mA IO Continuous output current VO = 0 to VCC ±35 mA ±70 mA 150 °C 150 °C Continuous current through VCC or GND TJ Junction temperature Tstg Storage temperature (1) (2) –65 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 5.2 Recommended Operating Conditions(1) SN54HC251 VCC Supply voltage VCC = 2 V VIH High-level input voltage VCC = 4.5 V VCC = 6 V SN74HC251 MIN NOM MAX 2 5 6 Low-level input voltage VI Input voltage VO Output voltage 5 6 3.15 4.2 4.2 VCC = 4.5 V 0 Input transition rise/fall time VCC = 4.5 V Operating free-air temperature −55 0.5 0.5 1.35 1.35 V V 1.8 VCC 0 VCC 0 VCC V VCC V 1000 1000 500 500 400 400 125 UNIT V 1.8 0 VCC = 6 V (1) 2 3.15 VCC = 2 V TA MAX 1.5 VCC = 6 V Δt/Δv NOM 1.5 VCC = 2 V VIL MIN −40 85 ns °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 5.3 Thermal Information THERMAL R θJA (1) 4 METRIC(1) Junction-to-ambient thermal resistance D (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS UNIT 73 82 67 64 108 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC251 SN74HC251 SN54HC251, SN74HC251 www.ti.com SCLS132F – DECEMBER 1982 – REVISED FEBRUARY 2022 5.4 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST (1) CONDITIONS IOH = −20 μA IOH = −6 mA SN54HC251 TYP 2 1.9 1.998 1.9 1.9 4.5 4.4 4.499 4.4 4.4 6 5.9 5.999 5.9 5.9 4.5 3.98 4.3 3.7 3.84 6 5.48 5.8 5.2 5.34 IOH = −7.8 mA MAX MIN SN74HC251 MIN VOH MAX MIN MAX UNIT V 2 0.002 0.1 0.1 0.1 IOL = 20 μA 4.5 0.001 0.1 0.1 0.1 6 0.001 0.1 0.1 0.1 IOL = 6 mA 4.5 0.17 0.26 0.4 0.33 IOL = 7.8 mA 6 0.15 0.26 0.4 0.33 VOL V II VI = VCC or 0 6 ±0.1 ±100 ±1000 ±1000 nA IOZ Vo = VCC or 0 6 ±0.01 ±0.5 ±10 ±5 μA ICC VI = VCC or 0, IO = 0 6 8 160 80 μA 10 10 10 pF Ci (1) TA = 25°C VCC (V) 2 to 6 3 VI = VIH or VIL, unless otherwise noted. 5.5 Switching Characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 6-1) PARAMETER FROM (INPUT) TO (OUTPUT) VCC (V) A, B, or C W or Y tpd Any D ten tdis tt OE OE W or Y W or Y W or Y W or Y TA = 25°C MIN SN54HC251 MIN SN74HC251 TYP MAX MAX MIN MAX 2 58 205 300 256 4.5 21 41 60 51 6 19 35 51 44 2 44 195 283 244 4.5 17 39 57 49 6 15 33 48 41 2 30 145 210 181 4.5 10 29 42 36 6 9 25 36 31 2 25 195 283 244 4.5 15 39 57 49 6 14 33 48 41 2 20 75 110 95 4.5 8 15 22 19 6 6 13 19 16 UNIT ns ns ns ns Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC251 SN74HC251 5 SN54HC251, SN74HC251 www.ti.com SCLS132F – DECEMBER 1982 – REVISED FEBRUARY 2022 5.6 Switching Characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 6-1) PARAMETER FROM (INPUT) TO (OUTPUT) A, B, or C W or Y tpd Any D ten OE W or Y W or Y tt W or Y VCC (V) TA = 25°C MIN SN54HC251 MIN SN74HC251 MAX MIN UNIT TYP MAX MAX 2 72 300 450 375 4.5 25 60 90 75 6 22 52 77 65 2 59 300 450 375 4.5 21 60 90 75 6 18 52 77 65 2 50 230 340 285 4.5 17 46 68 57 6 15 40 58 50 2 45 210 315 265 4.5 17 42 63 53 6 13 36 53 45 ns ns ns 5.7 Operating Characteristics TA = 25℃ PARAMETER Cpd 6 TEST CONDITIONS Power dissipation capacitance No load Submit Document Feedback TYP 70 UNIT pF Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC251 SN74HC251 SN54HC251, SN74HC251 www.ti.com SCLS132F – DECEMBER 1982 – REVISED FEBRUARY 2022 6 Parameter Measurement Information Figure 6-1. Load Circuit and Voltage Waveforms Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC251 SN74HC251 7 SN54HC251, SN74HC251 SCLS132F – DECEMBER 1982 – REVISED FEBRUARY 2022 www.ti.com 7 Detailed Description 7.1 Overview These data selectors/multiplexers contain full binary decoding to select 1-of-8 data sources and feature strobecontrolled complementary 3-state outputs. The 3-state outputs can interface with and drive data lines of bus-organized systems. With all but one of the common outputs disabled (in the high-impedance state), the low impedance of the single enabled output drives the bus line to a high or low logic level. Both outputs are controlled by the output-enable (OE) input. The outputs are disabled when OE is high. 7.2 Functional Block Diagram Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. 8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC251 SN74HC251 SN54HC251, SN74HC251 www.ti.com SCLS132F – DECEMBER 1982 – REVISED FEBRUARY 2022 7.3 Device Functional Modes Table 7-1. Function Table(1) INPUTS OUTPUTS SELECT (1) OE Y W C B A X X X H Z Z L L L L D0 D0 L L H L D1 D1 L H L L D2 D2 L H H L D3 D3 H L L L D4 D4 H L H L D5 D5 H H L L D6 D6 H H H L D7 D7 D0, D1 . . . D7 = the level of the respective D input. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC251 SN74HC251 9 SN54HC251, SN74HC251 SCLS132F – DECEMBER 1982 – REVISED FEBRUARY 2022 www.ti.com 8 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results. 9 Layout 9.1 Layout Guidelines When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient. 10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC251 SN74HC251 SN54HC251, SN74HC251 www.ti.com SCLS132F – DECEMBER 1982 – REVISED FEBRUARY 2022 10 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 10.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 10.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 10.3 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 10.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 10.5 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 11 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC251 SN74HC251 11 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) (1) 85125012A ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 85125012A SNJ54HC 251FK 8512501EA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8512501EA SNJ54HC251J Samples SN54HC251J ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SN54HC251J Samples SN74HC251D ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC251 Samples SN74HC251DBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC251 Samples SN74HC251DE4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC251 Samples SN74HC251DG4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC251 Samples SN74HC251DR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC251 Samples SN74HC251DT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC251 Samples SN74HC251N ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HC251N Samples SN74HC251NSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC251 Samples SN74HC251PW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC251 Samples SN74HC251PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC251 Samples SN74HC251PWRG4 ACTIVE TSSOP PW 16 2000 TBD Call TI Call TI -40 to 85 SN74HC251PWT ACTIVE TSSOP PW 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC251 SNJ54HC251FK ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 85125012A SNJ54HC 251FK SNJ54HC251J ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8512501EA SNJ54HC251J The marketing status values are defined as follows: Addendum-Page 1 Samples Samples Samples Samples Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2022 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of