SN54HCT574, SN74HCT574
SCLS177G – MARCH 1984 – REVISED JULY 2022
SNx4HCT574 Octal Edge-Triggered D-Type Flip-Flips With 3-State Outputs
1 Features
2 Description
•
•
These octal edge-triggered D-type flip-flops feature
3-state outputs designed specifically for bus driving.
The ’HCT574 devices are particularly suitable for
implementing buffer registers, I/O ports, bidirectional
bus drivers, and working registers.
•
•
•
•
•
•
Operating voltage range of 4.5 V to 5.5 V
High-current 3-state noninverting outputs drive bus
lines directly or up to 15 LSTTL loads
Low power consumption, 80-μA max ICC
Typical tpd = 22 ns
±6-mA output drive at 5 V
Low input current of 1 μA max
Inputs are TTL-voltage compatible
Bus-structured pinout
Device Information
(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN74HCT574DW
SOIC (20)
12.80 mm × 7.50 mm
SN74HCT574DBR
SSOP (20)
7.20 mm × 5.30 mm
SN74HCT574N
PDIP (20)
25.40 mm × 6.35 mm
SN74HCT574NSR
SO (20)
15.00 mm × 5.30 mm
SN74HCT574PW
TSSOP (20)
6.50 mm × 4.40 mm
(1)
For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN54HCT574, SN74HCT574
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SCLS177G – MARCH 1984 – REVISED JULY 2022
Table of Contents
1 Features............................................................................1
2 Description.......................................................................1
3 Revision History.............................................................. 2
4 Pin Configuration and Functions...................................3
5 Specifications.................................................................. 4
5.1 Absolute Maximum Ratings ....................................... 4
5.2 Recommended Operating Conditions(1) .................... 4
5.3 Thermal Information....................................................4
5.4 Electrical Characteristics.............................................5
5.5 Timing Requirements.................................................. 5
5.6 Switching Characteristics ...........................................5
5.7 Switching Characteristics............................................6
5.8 Operating Characteristics........................................... 6
6 Parameter Measurement Information............................ 7
7 Detailed Description........................................................8
7.1 Overview..................................................................... 8
7.2 Functional Block Diagram........................................... 8
7.3 Device Functional Modes............................................8
8 Power Supply Recommendations..................................9
9 Layout...............................................................................9
9.1 Layout Guidelines....................................................... 9
10 Device and Documentation Support..........................10
10.1 Receiving Notification of Documentation Updates..10
10.2 Support Resources................................................. 10
10.3 Trademarks............................................................. 10
10.4 Electrostatic Discharge Caution..............................10
10.5 Glossary..................................................................10
11 Mechanical, Packaging, and Orderable
Information.................................................................... 10
3 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (January 2022) to Revision G (July 2022)
Page
• Junction-to-ambient thermal resistance values increased. DW was 58 is now 109.1, DB was 70 is now 122.7,
N was 69 is now 84.6, NS was 60 is now 113.4, PW was 83 is now 131.8........................................................ 4
Changes from Revision E (August 2003) to Revision F (January 2022)
Page
• Updated the numbering, formatting, tables, figures, and cross-references throughout the document to reflect
modern data sheet standards............................................................................................................................. 1
2
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SCLS177G – MARCH 1984 – REVISED JULY 2022
4 Pin Configuration and Functions
DB, DW, N, NS, or PW package
20-Pin SSOP, SOIC, PDIP, SO, TSSOP
Top View
FK Package
20-Pin LCCC
Top View
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SCLS177G – MARCH 1984 – REVISED JULY 2022
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VCC
Supply voltage range
current(2)
MIN
MAX
–0.5
7
UNIT
V
IIK
Input clamp
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current(2)
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±35
mA
±70
mA
150
℃
150
℃
Continuous current through VCC or GND
TJ
Junction temperature
Tstg
Storage temperature range
(1)
(2)
–65
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended" operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
5.2 Recommended Operating Conditions(1)
SN54HCT574
SN74HCT574
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
UNIT
VCC
Supply voltage
VIH
High-level input voltage
VCC = 4.5 V to 5.5 V
VIL
Low-level input voltage
VCC = 4.5 V to 5.5 V
0.8
V
VI
Input voltage
0
VCC
0
VCC
V
VO
Output voltage
0
VCC
0
VCC
V
Δt/Δv
Input transition rise/fall time
500
ns
TA
Operating free-air temperature
85
°C
(1)
2
V
2
V
0.8
500
−55
125
−40
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
5.3 Thermal Information
THERMAL METRIC
DB (SSOP)
N (PDIP)
NS (SO)
PW (TSSOP)
20 PINS
20 PINS
20 PINS
20 PINS
20 PINS
UNIT
109.1
122.7
84.6
113.4
131.8
°C/W
76
81.6
72.5
78.6
72.2
°C/W
RθJA
Junction-to-ambient thermal
(1)
resistance
RθJC(top)
Junction-to-case (top) thermal
resistance
RθJB
Junction-to-board thermal
resistance
77.6
77.5
65.3
78.4
82.8
ψJT
Junction-to-top characterization
parameter
51.5
46.1
55.3
47.1
21.5
ψJB
Junction-to-board
characterization parameter
77.1
77.1
65.2
78.1
82.4
RθJC(bot)
Junction-to-case (bottom)
thermal resistance
N/A
N/A
N/A
N/A
N/A
(1)
4
DW (SOIC)
°C/W
°C/W
°C/W
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
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SCLS177G – MARCH 1984 – REVISED JULY 2022
5.4 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
VI = VIH or VIL
VOL
VI = VIH or VIL
II
VI = VCC or 0
IOZ
VO = VCC or 0
ICC
VI = VCC or 0,
IOH = −20 μA
IOH = −6 mA
IOL = 20 μA
IOL = 6 mA
IO = 0
One input at 0.5 V or 2.4 V,
Other inputs at 0 or VCC
ΔICC (1)
Ci
(1)
TA = 25°C
VCC
4.5 V
SN54HCT574
MAX
MIN
SN74HCT574
MIN
TYP
MAX
MIN
4.4
4.499
4.4
4.4
3.98
4.3
3.7
3.84
MAX
UNIT
V
0.001
0.1
0.1
0.1
0.17
0.26
0.4
0.33
5.5 V
±0.1
±100
±1000
±1000
nA
5.5 V
±0.01
±0.5
±10
±5
μA
8
160
80
μA
1.4
2.4
3
2.9
mA
3
10
10
10
pF
4.5 V
5.5 V
5.5 V
4.5 V to 5.5 V
V
This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VC.
5.5 Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted)
TA = 25°C
VCC
fclock
Clock frequency
tw
Pulse duration, CLK high or low
tsu
Setup time, data before CLK↑
th
Hold time, data after CLK↑
MIN
SN54HCT574
MAX
MIN
SN74HCT574
MAX
MIN
MAX
4.5 V
30
20
24
5.5 V
33
22
27
4.5 V
16
24
20
5.5 V
14
22
18
4.5 V
20
30
25
5.5 V
17
27
23
4.5 V
5
5
5
5.5 V
5
5
5
UNIT
MHz
ns
ns
ns
5.6 Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Parameter Measurement
Information)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tpd
CLK
Any Q
ten
OE
Any Q
tdis
OE
Any Q
tt
Any Q
VCC
TA = 25°C
SN54HCT574
MAX
MIN
SN74HCT574
MIN
TYP
MAX
MIN
4.5 V
30
36
20
24
5.5 V
33
40
22
27
MAX
UNIT
MHz
4.5 V
30
36
54
45
5.5 V
25
32
48
41
4.5 V
26
30
45
38
5.5 V
23
27
41
34
4.5 V
23
30
45
38
5.5 V
22
27
41
34
4.5 V
10
12
18
15
5.5 V
9
11
16
14
ns
ns
ns
ns
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SCLS177G – MARCH 1984 – REVISED JULY 2022
5.7 Switching Characteristics
over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Parameter
Measurement Information)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
fmax
tpd
CLK
Any Q
ten
OE
Any Q
tt
Any Q
TA = 25°C
MIN
TYP
SN54HCT574
MAX
MIN
MAX
SN74HCT574
MIN
4.5 V
30
36
20
24
5.5 V
33
40
22
27
MAX
UNIT
MHz
4.5 V
40
53
80
66
5.5 V
35
47
71
60
4.5 V
34
47
71
59
5.5 V
29
39
94
78
4.5 V
18
42
63
53
5.5 V
16
38
57
48
ns
ns
ns
5.8 Operating Characteristics
TA = 25℃
Cpd
6
PARAMETER
TEST CONDITIONS
Power dissipation capacitance per flip-flop
No load
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TYP
93
UNIT
pF
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SCLS177G – MARCH 1984 – REVISED JULY 2022
6 Parameter Measurement Information
A.
B.
C.
D.
E.
F.
G.
H.
CL includes probe and test-fixture capacitance.
Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2
is for an output with internal conditions such that the output is high except when disabled by the output control.
Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
For clock inputs, fmaxis measured when the input duty cycle is 50%.
The outputs are measured one at a time with one input transition per measurement.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
tPLH and tPHL are the same as tpd.
Figure 6-1. Load Circuit and Voltage Waveforms
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SCLS177G – MARCH 1984 – REVISED JULY 2022
7 Detailed Description
7.1 Overview
These octal edge-triggered D-type flip-flops feature 3-state outputs designed specifically for bus driving.
The ’HCT574 devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus
drivers, and working registers.
The eight flip-flops enter data on the low-to-high transition of the clock (CLK) input.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines
without interface or pullup components.
OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
7.2 Functional Block Diagram
7.3 Device Functional Modes
Table 7-1. Function Table
(Each Flip-Flop)
INPUTS
8
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
H or L
X
Q0
H
X
X
Z
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SCLS177G – MARCH 1984 – REVISED JULY 2022
8 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power
disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps
to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The
bypass capacitor should be installed as close to the power terminal as possible for best results.
9 Layout
9.1 Layout Guidelines
When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many
cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a
triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left
unconnected because the undefined voltages at the outside connections result in undefined operational states.
All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the
input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular
unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever
makes more sense for the logic function or is more convenient.
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SCLS177G – MARCH 1984 – REVISED JULY 2022
10 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
10.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
10.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
10.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
10.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
10
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PACKAGE OPTION ADDENDUM
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14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
SN74HCT574DBR
ACTIVE
SSOP
DB
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HT574
Samples
SN74HCT574DW
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HCT574
Samples
SN74HCT574DWG4
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HCT574
Samples
SN74HCT574DWR
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HCT574
Samples
SN74HCT574DWRG4
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HCT574
Samples
SN74HCT574N
ACTIVE
PDIP
N
20
20
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74HCT574N
Samples
SN74HCT574NE4
ACTIVE
PDIP
N
20
20
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74HCT574N
Samples
SN74HCT574NSR
ACTIVE
SO
NS
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HCT574
Samples
SN74HCT574PW
ACTIVE
TSSOP
PW
20
70
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HT574
Samples
SN74HCT574PWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HT574
Samples
SN74HCT574PWT
ACTIVE
TSSOP
PW
20
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HT574
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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