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SN74LV07A
SCES337K – MAY 2000 – REVISED OCTOBER 2014
SN74LV07A Hex Buffers/Drivers With Open-Drain Outputs
1 Features
2 Applications
•
•
•
•
•
1
•
•
•
•
•
2-V to 5.5-V VCC Operation
Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
> 2.3 V at VCC = 3.3 V, TA = 25°C
Outputs are Disabled During Power Up
and Power Down With Inputs Tied to VCC
Support Mixed-Mode Voltage Operation
on All Ports
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model
– 200-V Machine Model
– 1000-V Charged-Device Model
Servers
Telecom Infrastructures
TV Set-Top Boxes
3 Description
These hex buffers/drivers are designed for 2-V to
5.5-V VCC operation.
The SN74LV07A device performs the Boolean
function Y = A in positive logic.
Device Information(1)
PART NUMBER
PACKAGE
SN74LV07A
BODY SIZE (NOM)
TVSOP (14)
3.60 mm x 4.40 mm
SOIC (14)
8.65 mm × 3.91 mm
SOP (14)
10.30 mm x 5.30 mm
SSOP (14)
6.20 mm x 5.30 mm
TSSOP (14)
5.00 mm x 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Simplified Schematic
A
Y
A
Y
A
Y
A
Y
A
Y
A
Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74LV07A
SCES337K – MAY 2000 – REVISED OCTOBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
4
4
4
5
5
5
5
6
6
6
6
Absolute Maximum Ratings ......................................
Handling Ratings.......................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics, VCC = 2.5 V ± 0.2 V ........
Switching Characteristics, VCC = 3.3 V ± 0.3 V ........
Switching Characteristics, VCC = 5 V ± 0.5 V ...........
Noise Characteristics ................................................
Operating Characteristics........................................
Typical Characteristics ............................................
Parameter Measurement Information .................. 7
9
Detailed Description .............................................. 7
9.1
9.2
9.3
9.4
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
7
7
7
7
10 Application and Implementation.......................... 8
10.1 Application Information............................................ 8
10.2 Typical Application ................................................. 8
11 Power Supply Recommendations ....................... 9
12 Layout..................................................................... 9
12.1 Layout Guidelines ................................................... 9
12.2 Layout Example ...................................................... 9
13 Device and Documentation Support ................. 10
13.1
13.2
13.3
13.4
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
10
10
10
10
14 Mechanical, Packaging, and Orderable
Information ........................................................... 10
5 Revision History
Changes from Revision J (October 2010) to Revision K
Page
•
Updated document to new TI data sheet format. ................................................................................................................... 1
•
Deleted Ordering Information table. ....................................................................................................................................... 1
•
Added Handling Ratings table. ............................................................................................................................................... 4
•
Changed MAX operating temperature to 125°C in Recommended Operating Conditions table. ......................................... 4
•
Added Thermal Information table. .......................................................................................................................................... 5
•
Added Typical Characteristics. ............................................................................................................................................... 6
•
Added Detailed Description section........................................................................................................................................ 7
•
Added Application and Implementation section...................................................................................................................... 8
•
Added Power Supply Recommendations and Layout sections.............................................................................................. 9
2
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SCES337K – MAY 2000 – REVISED OCTOBER 2014
6 Pin Configuration and Functions
SN74LV07A . . . D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
1A
1Y
2A
2Y
3A
3Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
6A
6Y
5A
5Y
4A
4Y
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
1A
1
I
1A Input
1Y
2
O
1Y Output
2A
3
I
2A Input
2Y
4
O
2Y Output
3A
5
I
3A Input
3Y
6
O
3Y Output
4A
9
I
4A Input
4Y
8
O
4Y Output
5A
11
I
5A Input
5Y
10
O
5Y Output
6A
13
I
6A Input
6Y
12
O
6Y Output
GND
7
—
Ground Pin
VCC
14
—
Power Pin
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SCES337K – MAY 2000 – REVISED OCTOBER 2014
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7 Specifications
7.1 Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCC
MIN
MAX
Supply voltage range
–0.5
7
UNIT
V
(2)
–0.5
7
V
–0.5
7
VI
Input voltage range
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
IIK
Input clamp current
VI < 0
–20
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
VO = 0 to VCC
–35
mA
±50
mA
Continuous current through VCC or GND
(1)
(2)
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
7.2 Handling Ratings
Tstg
Storage temperature range
V(ESD)
(1)
(2)
Electrostatic discharge
MIN
MAX
UNIT
°C
–65
150
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (1)
0
2000
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins (2)
0
1000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
VCC
Supply voltage
VCC = 2 V
VIH
High level input voltage
MIN
MAX
2
5.5
Low level input voltage
V
1.5
VCC = 2.3 V to 2.7 V
VCC × 0.7
VCC = 3 V to 3.6 V
VCC × 0.7
VCC = 4.5 V to 5.5 V
VCC × 0.7
VCC = 2 V
VIL
UNIT
V
0.5
VCC = 2.3 V to 2.7 V
VCC × 0.3
VCC = 3 V to 3.6 V
VCC × 0.3
VCC = 4.5 V to 5.5 V
VCC × 0.3
V
VI
Input voltage
0
5.5
VO
Output voltage
0
5.5
V
50
µA
VCC = 2 V
IOL
Low level output current
Δt/Δv
Input transition rise and fall rate
VCC = 2.3 V to 2.7 V
2
VCC = 3 V to 3.6 V
8
VCC = 4.5 V to 5.5 V
16
VCC = 2.3 V to 2.7 V
200
VCC = 3 V to 3.6 V
100
VCC = 4.5 V to 5.5 V
TA
(1)
4
Operating free-air temperature
V
mA
ns/V
20
–40
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs (SCBA004).
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7.4 Thermal Information
SN74LV07A
THERMAL METRIC (1)
D
DB
DGV
NS
PW
14 PINS
14 PINS
14 PINS
14 PINS
14 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
100.6
112.5
135.2
95.4
128.7
RθJC(top)
Junction-to-case (top) thermal resistance
51.8
65.0
57.9
52.9
57.2
RθJB
Junction-to-board thermal resistance
54.9
59.9
68.3
51.2
70.7
ψJT
Junction-to-top characterization parameter
25.0
25.0
9.2
17.9
9.3
ψJB
Junction-to-board characterization parameter
54.7
59.3
67.6
53.8
70.0
(1)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
7.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VOL
II
–40°C to 125°C
SN74LV07A
SN74LV07A
VCC
TYP
MAX
MIN
TYP
UNIT
MAX
IOL = 50 µA
2 V to 5.5 V
0.1
IOL = 2 mA
2.3 V
0.4
0.4
IOL = 8 mA
3V
0.44
0.44
IOL = 16 mA
4.5 V
0.55
0.55
VI = 5.5 V or GND
0 to 5.5 V
0.1
V
±1
±1
µA
IOH
VI = VIH,
VOH = VCC
5.5 V
±2.5
±2.5
µA
ICC
VI = VCC or GND,
IO = 0
5.5 V
20
20
µA
Ioff
VI or VO = 0 to 5.5 V
0
5
5
µA
Ci
VI = VCC or GND
3.3 V
1.6
1.6
pF
7.6 Switching Characteristics, VCC = 2.5 V ± 0.2 V
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
A
Y
tPHL
A
Y
tPLH
A
Y
tPHL
A
Y
PARAMETER
(1)
LOAD
CAPACITANCE
TA = 25°C
MIN
CL = 15 pF
CL = 50 pF
–40°C to 125°C
SN74LV07A
SN74LV07A
UNIT
TYP
MAX
MIN
MAX
MIN
MAX
6.6 (1)
10.4 (1)
1
13
1
14
7.5 (1)
10.4 (1)
1
13
1
14
11.1
15.2
1
18
1
19
9.6
15.2
1
18
1
19
ns
ns
On products compliant to MIL-PRF-38535, this parameter is not production tested.
7.7 Switching Characteristics, VCC = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER
tPLH
(1)
FROM
(INPUT)
TO
(OUTPUT)
A
Y
tPHL
A
Y
tPLH
A
Y
tPHL
A
Y
LOAD
CAPACITANCE
CL = 15 pF
CL = 50 pF
TA = 25°C
MIN
SN74LV07A
–40°C to 125°C
SN74LV07A
UNIT
TYP
MAX
MIN
MAX
MIN
MAX
5 (1)
7.1 (1)
1
8.5
1
9.5
(1)
(1)
1
8.5
1
9.5
8.2
10.6
1
12
1
13
6.6
10.6
1
12
1
13
5
7.1
ns
ns
On products compliant to MIL-PRF-38535, this parameter is not production tested.
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7.8 Switching Characteristics, VCC = 5 V ± 0.5 V
operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER
tPLH
(1)
FROM
(INPUT)
TO
(OUTPUT)
A
Y
tPHL
A
Y
tPLH
A
Y
tPHL
A
Y
LOAD
CAPACITANCE
TA = 25°C
MIN
CL = 15 pF
UNIT
TYP
MAX
MIN
MAX
MIN
MAX
3.8
5.5 (1)
1
6.5
1
7.2
(1)
5.5 (1)
1
6.5
1
7.2
5.7
7.5
1
8.5
1
9.2
4.5
7.5
1
8.5
1
9.2
3.4
CL = 50 pF
–40°C to 125°C
SN74LV07A
SN74LV07A
ns
ns
On products compliant to MIL-PRF-38535, this parameter is not production tested.
7.9 Noise Characteristics (1)
VCC = 3.3 V, CL = 50 pF, TA = 25°C
TYP
MAX
VOL(P)
Quiet output, maximum dynamic VOL
PARAMETER
0.4
0.8
V
VOL(V)
Quiet output, minimum dynamic VOL
–0.1
–0.8
V
VOH(V)
Quiet output, minimum dynamic VOH
3.2
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
(1)
MIN
UNIT
V
2.31
V
0.99
V
VCC
TYP
UNIT
3.3 V
2.9
5V
5.3
Characteristics are for surface-mount packages only.
7.10 Operating Characteristics
TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
CL = 50 pF,
f = 10 MHz
pF
7.11 Typical Characteristics
7
5.4
6
5.3
5
5.2
TPD (ns)
TPD (ns)
TPD in ns
4
3
5.1
5
2
4.9
1
4.8
0
4.7
-100
TPD in ns
0
1
2
3
VCC
4
5
6
D001
Figure 1. TPD vs VCC
6
-50
0
50
Temperature (qC)
100
150
D001
Figure 2. TPD vs Temperature at 3.3 V
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8 Parameter Measurement Information
VCC
VCC
RL = 1 kΩ
From Output
Under Test
50% VCC
Input
Test
Point
50% VCC
tPHL
CL
(see Note A)
0V
tPLH
≈VCC
50% VCC
Output
VOL + 0.3 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
LOAD CIRCUIT FOR
OPEN-DRAIN OUTPUTS
A.
CL includes probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns,
tf ≤ 3 ns.
C.
The outputs are measured one at a time, with one input transition per measurement.
Figure 3. Load Circuit and Voltage Waveforms
9 Detailed Description
9.1 Overview
The outputs of the SN74LV07A device are open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 16 mA at
5-V VCC. Inputs can be driven from 2.5-V, 3.3-V, or 5-V (CMOS) devices. This feature allows the use of the
SN74LV07A device as a translator in a mixed-system environment. This device is fully specified for partial
power-down applications using Ioff. The Ioff circuitry disables the outputs, thus preventing a damaging current
backflow through the device when it is powered down.
9.2 Functional Block Diagram
A
Y
Figure 4. Logic Diagram, Each Buffer/Driver (Positive Logic)
9.3 Feature Description
•
•
•
Wide operating voltage range
– Operates from 2 V to 5.5 V
Allows up or down voltage translation
– Inputs and outputs accept voltages to 5.5 V
Ioff feature
– Allows voltages on the inputs and outputs when VCC is 0 V
9.4 Device Functional Modes
Table 1. Function Table
(Each Buffer/Driver)
INPUT
A
OUTPUT
Y
H
H
L
L
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The SN74LV07A device is a low drive, open-drain CMOS device that can be used for a multitude of buffer type
functions. The inputs are 5.5-V tolerant. The outputs are open drain and 5.5-V tolerant; thus, allowing the device
to translate up to 5.5 V or down to any other voltage between GND and 5.5 V.
10.2 Typical Application
Buffer Function
Basic LED Driver
VPU
VPU
Wired OR
uC or Logic
uC or Logic
LV07A
uC or Logic
LV07A
uC or Logic
LV07A
Figure 5. Typical Application Schematic
10.2.1 Design Requirements
This device uses CMOS technology and is open drain, so it has low output drive only. Care should be taken to
avoid bus contention, because it can drive currents that would exceed maximum limits. Parallel output drive can
create fast edges into light loads, so routing and load conditions should be considered to prevent ringing.
10.2.2 Detailed Design Procedure
1. Recommended Input Conditions:
– For rise time and fall time specifications, see Δt/ΔV in the Recommended Operating Conditions table.
– For specified high and low levels, see VIH and VIL in the Recommended Operating Conditions table.
– Inputs are overvoltage tolerant allowing them to go as high as 5.5 V at any valid VCC.
2. Recommended Output Conditions:
– Load currents should not exceed 35 mA per output and 50 mA total for the part.
8
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Typical Application (continued)
10.2.3 Application Curves
3.5
3
2.5
VOUT (V)
2
VOUT input high
1.5
VOUT input low
1
0.5
0
0
1
2
3
4
-0.5
VCC (V)
Figure 6. Output During Power Up with 4 k Pullup at 3.3 V
11 Power Supply Recommendations
The power supply can be any voltage between the MIN and MAX supply voltage rating located in the
Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power
disturbance. For devices with a single supply, 0.1 μF is recommended. If there are multiple VCC terminals then
0.01 μF or 0.022 μF is recommended for each power terminal. It is acceptable to parallel multiple bypass caps to
reject different frequencies of noise. A 0.1 μF and 1 μF are commonly used in parallel. The bypass capacitor
should be installed as close to the power terminal as possible for best results.
12 Layout
12.1 Layout Guidelines
When using multiple bit logic devices, inputs should not float. In many cases, functions or parts of functions of
digital logic devices are unused. Some examples are when only two inputs of a triple-input AND gate are used,
or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected because the
undefined voltages at the outside connections result in undefined operational states.
Specified in Figure 7 are rules that must be observed under all circumstances. All unused inputs of digital logic
devices must be connected to a high or low bias to prevent them from floating. The logic level that should be
applied to any particular unused input depends on the function of the device. Generally they will be tied to GND
or VCC, whichever makes more sense or is more convenient. It is acceptable to float outputs unless the part is a
transceiver.
12.2 Layout Example
Vcc
Unused Input
Input
Output
Unused Input
Output
Input
Figure 7. Layout Diagram
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13 Device and Documentation Support
13.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
SN74LV07A
Click here
Click here
Click here
Click here
Click here
13.2 Trademarks
All trademarks are the property of their respective owners.
13.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
10
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PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
SN74LV07AD
ACTIVE
SOIC
D
14
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV07A
Samples
SN74LV07ADBR
ACTIVE
SSOP
DB
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV07A
Samples
SN74LV07ADGVR
ACTIVE
TVSOP
DGV
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV07A
Samples
SN74LV07ADR
ACTIVE
SOIC
D
14
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV07A
Samples
SN74LV07ADRG4
ACTIVE
SOIC
D
14
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV07A
Samples
SN74LV07ANS
ACTIVE
SO
NS
14
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
74LV07A
Samples
SN74LV07ANSR
ACTIVE
SO
NS
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
74LV07A
Samples
SN74LV07APW
ACTIVE
TSSOP
PW
14
90
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV07A
Samples
SN74LV07APWG4
ACTIVE
TSSOP
PW
14
90
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV07A
Samples
SN74LV07APWR
ACTIVE
TSSOP
PW
14
2000
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 125
LV07A
Samples
SN74LV07APWRG3
ACTIVE
TSSOP
PW
14
2000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
LV07A
Samples
SN74LV07APWRG4
ACTIVE
TSSOP
PW
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV07A
Samples
SN74LV07APWT
ACTIVE
TSSOP
PW
14
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV07A
Samples
SN74LV07APWTG4
ACTIVE
TSSOP
PW
14
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV07A
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of