SN74LVC1G32DBVR

Product Folder Sample & Buy Technical Documents Support & Community Tools & Software SN74LVC1G32 SCES219V – APRIL 1999 – REVISED AUGUST 2015 SN74LVC1G32 Single 2-Input Positive-OR Gate 1 Features • 1 • • • • • • • • • 3 Description 2 Available in the Ultra-Small 0.64 mm Package (DPW) with 0.5-mm Pitch Supports 5-V VCC Operation Inputs Accept Voltages to 5.5-V Supports Down Translation to VCC Max tpd of 3.6 ns at 3.3-V Low Power Consumption, 10-µA Max ICC ±24-mA Output Drive at 3.3-V Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) This single 2-input positive-OR gate is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G32 device performs the Boolean function Y = A + B or Y = A • B in positive logic. The CMOS device has high output drive while maintaining low static power dissipation over a broad VCC operating range. The SN74LVC1G32 device is available in a variety of packages, including the ultra-small DPW package with a body size of 0.8 × 0.8 mm. Device Information(1) DEVICE NAME PACKAGE (PINS) BODY SIZE SN74LVC1G32DBV SOT-23 (5) 2.90 mm × 2.80 mm SN74LVC1G32DCK SC70 (5) 2.00mm × 2.10 mm SN74LVC1G32DRY SON (6) 1.45 mm × 1.00 mm SN74LVC1G32DSF SON (6) 1.00 mm × 1.00 mm SN74LVC1G32DPW X2SON (4) 0.80 mm × 0.80 mm 2 Applications SN74LVC1G32DRL SOT (5) 1.60 mm × 1.60 mm • • • • • • • • • • • • • • • SN74LVC1G32YZP DSBGA (5) 1.38 mm × 0.88 mm • • • • AV Receiver Blu-ray Player and Home Theater Digital Picture Frame (DPF) Embedded PC IP Phone: Wireless High-Speed Data Acquisition and Generation Motor Control: High-Voltage Optical Networking: Video Over Fiber and EPON Personal Navigation Device (GPS) Portable Media Player Private Branch Exchange (PBX) Server PSU SSD: Internal and External TV: LCD/Digital and High-Definition (HDTV) Telecom Shelter: Power Distribution Unit (PDU), Power Monitoring Unit (PMU), Wireless Battery Monitoring, Remote Electrical Tilt Unit (RET), Remote Radio Unit (RRU), Tower Mounted Amplifier (TMA) Video Conferencing: IP-Based HD Vector Signal Analyzer and Generator WiMAX and Wireless Infrastructure Equipment Wireless Headset, Keyboard, Mouse, and Repeater (1) For all available packages, see the orderable addendum at the end of the data sheet. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN74LVC1G32 SCES219V – APRIL 1999 – REVISED AUGUST 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 4 5 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 5 5 6 6 7 7 7 8 8 8 Absolute Maximum Ratings ..................................... ESD Ratings.............................................................. Recommended Operating Conditions ...................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics, CL = 15 pF ...................... Switching Characteristics, 1.8 V and 2.5V................ Switching Characteristics, 3.3 V and 5 V.................. Operating Characteristics.......................................... Typical Characteristics ............................................ Parameter Measurement Information .................. 9 Detailed Description ............................................ 11 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 11 11 11 11 Application and Implementation ........................ 12 9.1 Application Information............................................ 12 9.2 Typical Application ................................................. 12 10 Power Supply Recommendations ..................... 13 11 Layout................................................................... 13 11.1 Layout Guidelines ................................................. 13 11.2 Layout Example .................................................... 13 12 Device and Documentation Support ................. 14 12.1 12.2 12.3 12.4 Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 14 14 14 14 13 Mechanical, Packaging, and Orderable Information ........................................................... 14 13.1 Package Option Addendum .................................. 18 4 Revision History Changes from Revision U (April 2014) to Revision V • Page Added TJ junction temp spec to Abs Max Ratings ................................................................................................................. 5 Changes from Revision T (March 2014) to Revision U Page • Updated Features, Description, and Device Information table............................................................................................... 1 • Added Pin Functions table. .................................................................................................................................................... 4 • Added Thermal Information table. ......................................................................................................................................... 6 • Added Detailed Description section. .................................................................................................................................... 11 • Added Application and Implementation section. ................................................................................................................. 12 • Added Layout section. ......................................................................................................................................................... 13 Changes from Revision S (July 2013) to Revision T Page • Updated Features. .................................................................................................................................................................. 1 • Added Applications. ................................................................................................................................................................ 1 • Added Device Information table. ............................................................................................................................................ 1 • Added DPW Package. ........................................................................................................................................................... 4 • Moved Tstg to Handling Ratings table. .................................................................................................................................... 5 Changes from Revision R (June 2013) to Revision S • 2 Page Added parameter values for –40 to 125°C temperature ratings............................................................................................. 7 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 SN74LVC1G32 www.ti.com SCES219V – APRIL 1999 – REVISED AUGUST 2015 Changes from Revision Q (November 2012) to Revision R • Page Deleted Ordering Information table. ....................................................................................................................................... 1 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 3 SN74LVC1G32 SCES219V – APRIL 1999 – REVISED AUGUST 2015 www.ti.com 5 Pin Configuration and Functions DBV PACKAGE (TOP VIEW) A 1 B 2 GND 3 DRL PACKAGE (TOP VIEW) DCK PACKAGE (TOP VIEW) A 1 B 2 GND 3 VCC 5 5 VCC A 1 B 2 GND 4 VCC 5 3 Y 4 DSF PACKAGE (TOP VIEW) 6 VCC 2 5 3 4 NC Y A 1 B GND Y Y 4 DPW PACKAGE (TOP VIEW) GND B A 1 5 3 4 2 VCC Y NC – No internal connection YZP PACKAGE (BOTTOM VIEW) GND 3 4 B 2 A 1 5 See mechanical drawings for dimensions. Y VCC DRY PACKAGE (TOP VIEW) A 1 6 VCC B 2 5 NC GND 3 4 Y Pin Functions PIN 4 DESCRIPTION NAME DBV, DCK, DRL, YZP DRY, DSF DPW A 1 1 2 Input B 2 2 1 Input GND 3 3 3 Ground Y 4 4 4 Output VCC 5 6 5 Power pin NC – 5 – Not connected Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 SN74LVC1G32 www.ti.com SCES219V – APRIL 1999 – REVISED AUGUST 2015 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) VCC MIN MAX Supply voltage range –0.5 6.5 UNIT V (2) VI Input voltage range –0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 6.5 V VO Voltage range applied to any output in the high or low state (2) (3) –0.5 VCC + 0.5 V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA TJ Continuous current through VCC or GND Junction temperature –65 150 °C Tstg Storage temperature –65 150 °C (1) (2) (3) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the Recommended Operating Conditions table. 6.2 ESD Ratings PARAMETER V(ESD) (1) (2) Electrostatic discharge DEFINITION VAUE Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) UNIT ±2000 ±1000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 5 SN74LVC1G32 SCES219V – APRIL 1999 – REVISED AUGUST 2015 www.ti.com 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) VCC Operating Supply voltage MAX 1.65 5.5 Data retention only 1.5 VCC = 1.65 V to 1.95 V VIH MIN 1.7 VCC = 3 V to 3.6 V 0.7 × VCC VCC = 1.65 V to 1.95 V Low-level input voltage V 2 VCC = 4.5 V to 5.5 V VIL V 0.65 × VCC VCC = 2.3 V to 2.7 V High-level input voltage UNIT 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 VCC = 4.5 V to 5.5 V V 0.3 × VCC VI Input voltage 0 5.5 V VO Output voltage 0 VCC V IOH High-level output current VCC = 1.65 V –4 VCC = 2.3 V –8 –16 VCC = 3 V VCC = 4.5 V –32 VCC = 1.65 V 4 VCC = 2.3 V IOL Low-level output current Δt/Δv 8 16 VCC = 3 V Input transition rise or fall rate (1) Operating free-air temperature mA 24 VCC = 4.5 V 32 VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 VCC = 3.3 V ± 0.3 V 10 VCC = 5 V ± 0.5 V TA mA –24 ns/V 5 DSBGA package –40 85 °C All other packages -40 125 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 6.4 Thermal Information SN74LVC1G32 THERMAL METRIC (1) DBV DCK DRL DRY YZP DPW 5 PINS 5 PINS 5 PINS 6 PINS 5 PINS 4 PINS RθJA Junction-to-ambient thermal resistance 229 278 243 439 130 340 RθJCtop Junction-to-case (top) thermal resistance 164 93 78 277 54 215 RθJB Junction-to-board thermal resistance 62 65 78 271 51 294 ψJT Junction-to-top characterization parameter 44 2 10 84 1 41 ψJB Junction-to-board characterization parameter 62 64 77 271 50 294 RθJCbot Junction-to-case (bottom) thermal resistance – – – – – 250 (1) 6 UNIT °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953). Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 SN74LVC1G32 www.ti.com SCES219V – APRIL 1999 – REVISED AUGUST 2015 6.5 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS TYP (1) MIN IOH = –100 µA VOH 1.65 V to 5.5 V VCC – 0.1 VCC – 0.1 1.2 1.2 IOH = –8 mA 2.3 V 1.9 1.9 2.4 2.4 2.3 2.3 3V 3.8 TYP UNIT MAX V IOH = –32 mA 4.5 V IOL = 100 µA 1.65 V to 5.5 V 0.1 0.1 IOL = 4 mA 1.65 V 0.45 0.45 IOL = 8 mA 2.3 V 0.3 0.4 0.4 0.5 0.55 0.65 0.55 0.65 IOL = 16 mA 3.8 3V IOL = 24 mA IOL = 32 mA A or B inputs MIN 1.65 V IOH = –24 mA II MAX IOH = –4 mA IOH = –16 mA VOL –40°C to 125°C RECOMMENDED –40°C to 85°C VCC 4.5 V VI = 5.5 V or GND Ioff VI or VO = 5.5 V ICC VI = 5.5 V or GND, ΔICC One input at VCC – 0.6 V, Other inputs at VCC or GND Ci VI = VCC or GND (1) All typical values are at VCC = 3.3 V, TA = 25°C. IO = 0 V 0 to 5.5 V ±5 ±5 µA 0 ±10 ±25 µA 1.65 V to 5.5 V 10 10 µA 3 V to 5.5 V 500 500 µA 3.3 V 4 4 pF 6.6 Switching Characteristics, CL = 15 pF over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3) –40°C to 85°C PARAMETER FROM (INPUT) TO (OUTPUT) tpd A or B Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX 1.9 7.2 0.8 4.4 0.9 3.6 0.8 3.4 ns 6.7 Switching Characteristics, 1.8 V and 2.5V over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (1) (see Figure 4) PARAMETER tpd (1) FROM (INPUT) A or B TO (OUTPUT) Y –40°C to 85°C –40°C to 125°C RECOMMENDED –40°C to 85°C –40°C to 125°C RECOMMENDED VCC = 1.8 V ± 0.15 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 2.5 V ± 0.2 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX 2.8 8 2.8 9 1.2 5.5 1.2 6 ns On products compliant to MIL-PRF-38535, this parameter is not production tested. Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 7 SN74LVC1G32 SCES219V – APRIL 1999 – REVISED AUGUST 2015 www.ti.com 6.8 Switching Characteristics, 3.3 V and 5 V over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (1) (see Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) tpd A or B Y (1) –40°C to 85°C –40°C to 125°C RECOMMENDED –40°C to 85°C –40°C to 125°C RECOMMENDED VCC = 3.3 V ± 0.3 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V VCC = 5 V ± 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX 1.1 4.5 1 4 1 4 1 4.5 ns On products compliant to MIL-PRF-38535, this parameter is not production tested 6.9 Operating Characteristics TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V TYP TYP TYP TYP f = 10 MHz 20 20 21 22 UNIT pF 6.10 Typical Characteristics 8 6 TPD 7 5 6 TPD - ns TPD - ns 4 3 5 4 3 2 2 1 1 TPD 0 -100 0 -50 0 50 Temperature - °C 100 150 0 1 D001 Figure 1. TPD Across Temperature at 3.3 V VCC 8 Submit Documentation Feedback 2 3 Vcc - V 4 5 6 D002 Figure 2. TPD Across VCC at 25°C Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 SN74LVC1G32 www.ti.com SCES219V – APRIL 1999 – REVISED AUGUST 2015 7 Parameter Measurement Information VLOAD S1 RL From Output Under Test Open TEST GND CL (see Note A) S1 Open VLOAD tPLH/tPHL tPLZ/tPZL tPHZ/tPZH RL GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC £2 ns £2 ns £2.5 ns £2.5 ns VM VLOAD CL RL VD VCC/2 VCC/2 1.5 V VCC/2 2 × VCC 2 × VCC 6V 2 × VCC 15 pF 15 pF 15 pF 15 pF 1 MW 1 MW 1 MW 1 MW 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tW tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VOH Output VM VOL tPHL VM VM 0V tPLZ Output Waveform 1 S1 at VLOAD (see Note B) tPLH VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VM VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + VD VOL tPHZ VM VOH – VD VOH »0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 9 SN74LVC1G32 SCES219V – APRIL 1999 – REVISED AUGUST 2015 www.ti.com Parameter Measurement Information (continued) VLOAD S1 RL From Output Under Test Open TEST GND CL (see Note A) S1 Open VLOAD tPLH/tPHL tPLZ/tPZL tPHZ/tPZH RL GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC £2 ns £2 ns £2.5 ns £2.5 ns VM VLOAD CL RL VD VCC/2 VCC/2 1.5 V VCC/2 2 × VCC 2 × VCC 6V 2 × VCC 30 pF 30 pF 50 pF 50 pF 1 kW 500 W 500 W 500 W 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tW tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VOH Output VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VM VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + VD VOL tPHZ VM VOH – VD VOH »0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 4. Load Circuit and Voltage Waveforms 10 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 SN74LVC1G32 www.ti.com SCES219V – APRIL 1999 – REVISED AUGUST 2015 8 Detailed Description 8.1 Overview The SN74LVC1G32 device contains one 2-input positive OR gate device and performs the Boolean function Y = A + B or Y = A • B . This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The DPW package technology is a major breakthrough in IC packaging. Its tiny 0.64 mm square footprint saves significant board space over other package options while still retaining the traditional manufacturing friendly lead pitch of 0.5 mm. 8.2 Functional Block Diagram 8.3 Feature Description • • • • Wide operating voltage range. – Operates from 1.65 V to 5.5 V. Allows down voltage translation. Inputs accept voltages to 5.5 V. Ioff feature allows voltages on the inputs and outputs, when VCC is 0 V. 8.4 Device Functional Modes Function Table INPUTS B OUTPUT Y H X H X H H L L L A Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 11 SN74LVC1G32 SCES219V – APRIL 1999 – REVISED AUGUST 2015 www.ti.com 9 Application and Implementation 9.1 Application Information The SN74LVC1G32 device is a high drive CMOS device that can be used for implementing OR logic with a high output drive, such as an LED application. It can produce 24 mA of drive current at 3.3 V making it Ideal for driving multiple outputs and good for high speed applications up to 100 MHz. The inputs are 5.5-V tolerant allowing translation down to VCC. 9.2 Typical Application Basic LED Driver OR Logic Function VCC VCC uC or Logic uC or Logic uC or Logic LVC1G32 uC or Logic LVC1G32 uC or Logic 9.2.1 Design Requirements This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus contention because it can drive currents that would exceed maximum limits. The high drive will also create fast edges into light loads, so routing and load conditions should be considered to prevent ringing. 9.2.2 Detailed Design Procedure 1. Recommended Input Conditions: – Rise time and fall time specs. See (Δt/ΔV) in the Recommended Operating Conditions table. – Specified high and low levels. See (VIH and VIL) in the Recommended Operating Conditions table. – Inputs are overvoltage tolerant allowing them to go as high as (VI max) in the Recommended Operating Conditions table at any valid VCC. 2. Recommend Output Conditions: – Load currents should not exceed (IO max) per output and should not exceed total current (continuous current through VCC or GND) for the part. These limits are located in the Absolute Maximum Ratings table. – Outputs should not be pulled above VCC. 12 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 SN74LVC1G32 www.ti.com SCES219V – APRIL 1999 – REVISED AUGUST 2015 Typical Application (continued) 9.2.3 Application Curves 10 8 Icc Icc Icc Icc 1.8V 2.5V 3.3V 5V Icc - mA 6 4 2 0 -2 -20 0 20 40 Frequency - MHz 60 80 D003 Figure 5. ICC vs Frequency 10 Power Supply Recommendations The power supply can be any voltage between the min and max supply voltage rating located in the Recommended Operating Conditions table. Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single supply, a 0.1-μF capacitor is recommended. If there are multiple VCC pins, then a 0.01-μF or 0.022-μF capacitor is recommended for each power pin. It is ok to parallel multiple bypass capacitors to reject different frequencies of noise. A 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possible for best results. 11 Layout 11.1 Layout Guidelines When using multiple bit logic devices inputs should not ever float. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used, or only 3 of the 4 buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Specified in Layout Example are the rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or VCC, whichever make more sense or is more convenient. 11.2 Layout Example VCC Unused Input Input Output Unused Input Output Input Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 13 SN74LVC1G32 SCES219V – APRIL 1999 – REVISED AUGUST 2015 www.ti.com 12 Device and Documentation Support 12.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.2 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 14 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC1G32 PACKAGE OPTION ADDENDUM www.ti.com 4-Apr-2019 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) SN74LVC1G32DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (C325, C32F, C32J, C32K, C32R) (C32H, C32P, C32S) SN74LVC1G32DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C32F SN74LVC1G32DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C32F SN74LVC1G32DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (C325, C32F, C32J, C32K, C32R) (C32H, C32P, C32S) SN74LVC1G32DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C32F SN74LVC1G32DCK3 ACTIVE SC70 DCK 5 3000 Pb-Free (RoHS) CU SNBI Level-1-260C-UNLIM -40 to 125 (CGF, CGZ) SN74LVC1G32DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (CG5, CGF, CGJ, CG K, CGR) (CGH, CGP, CGS) SN74LVC1G32DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CG5 CGS SN74LVC1G32DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CG5 CGS SN74LVC1G32DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (CG5, CGF, CGJ, CG K, CGR) (CGH, CGP, CGS) SN74LVC1G32DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CG5 CGS SN74LVC1G32DPWR ACTIVE X2SON DPW 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 N4 SN74LVC1G32DRLR ACTIVE SOT-5X3 DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 (CG7, CGR) SN74LVC1G32DRLRG4 ACTIVE SOT-5X3 DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CG7, CGR) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 4-Apr-2019 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) SN74LVC1G32DRY2 ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CG SN74LVC1G32DRYR ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CG SN74LVC1G32DSF2 ACTIVE SON DSF 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CG SN74LVC1G32DSFR ACTIVE SON DSF 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 CG SN74LVC1G32YZPR ACTIVE DSBGA YZP 5 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 (CG, CG7) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of