SN74LVC541AQDWRQ1

SN74LVC541A-Q1 www.ti.com ............................................................................................................................................... SCAS713B – SEPTEMBER 2003 – REVISED APRIL 2008 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS FEATURES 1 • • • • • • • • • DW OR PW PACKAGE (TOP VIEW) Qualified for Automotive Applications ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Operates From 2 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 5.1 ns at 3.3 V Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC) Ioff Supports Partial-Power-Down Mode Operation OE1 A1 A2 A3 A4 A5 A6 A7 A8 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OE2 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 DESCRIPTION/ORDERING INFORMATION The SN74LVC541A octal buffer/driver is designed for 2.7-V to 3.6-V VCC operation. The device is ideal for driving bus lines or buffering memory address registers. This device features inputs and outputs on opposite sides of the package to facilitate printed circuit board layout. The 3-state control gate is a 2-input AND gate with active-low inputs so that, if either output enable (OE1 or OE2) input is high, all eight outputs are in the high-impedance state. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 125°C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING SOIC – DW Reel of 2000 SN74LVC541AQDWRQ1 L541AQ1 TSSOP – PW Reel of 2000 SN74LVC541AQPWRQ1 L541AQ1 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2008, Texas Instruments Incorporated SN74LVC541A-Q1 SCAS713B – SEPTEMBER 2003 – REVISED APRIL 2008 ............................................................................................................................................... www.ti.com FUNCTION TABLE INPUTS OE1 OE2 A OUTPUT Y L L L L L L H H H X X Z X H X Z LOGIC DIAGRAM (POSITIVE LOGIC) OE1 OE2 A1 1 19 2 18 Y1 To Seven Other Channels Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC MIN MAX Supply voltage range –0.5 6.5 UNIT V (2) VI Input voltage range –0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 6.5 V VO Voltage range applied to any output in the high or low state (2) (3) –0.5 VCC + 0.5 V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) 2 DW package 58 PW package 83 –65 150 °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2003–2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC541A-Q1 SN74LVC541A-Q1 www.ti.com ............................................................................................................................................... SCAS713B – SEPTEMBER 2003 – REVISED APRIL 2008 Recommended Operating Conditions (1) Operating VCC Supply voltage VIH High-level input voltage VCC = 2.7 V to 3.6 V VIL Low-level input voltage VCC = 2.7 V to 3.6 V VI Input voltage VO Output voltage IOH High-level output current IOL Low-level output current TA Operating free-air temperature (1) Data retention only MIN MAX 2 3.6 1.5 2 UNIT V V 0.8 V 0 5.5 V High or low state 0 VCC 3-state 0 5.5 VCC = 2.7 V –12 VCC = 3 V –24 VCC = 2.7 V 12 VCC = 3 V 24 –40 125 V mA mA °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 µA VOH VOL 2.7 V to 3.6 V 2.2 3V 2.4 IOH = –24 mA 3V 2.2 IOL = 100 µA 2.7 V to 3.6 V 0.2 IOL = 12 mA 2.7 V 0.4 3V 0.55 IOH = –12 mA UNIT VCC – 0.2 2.7 V IOL = 24 mA V V II VI = 0 to 5.5 V 3.6 V ±5 µA IOZ VO = 0 to 5.5 V 3.6 V ±15 µA ICC ΔICC (1) (2) MIN TYP (1) MAX VCC VI = VCC or GND IO = 0 3.6 V ≤ VI ≤ 5.5 V (2) One input at VCC – 0.6 V, Other inputs at VCC or GND 10 3.6 V 10 2.7 V to 3.6 V 500 µA µA Ci VI = VCC or GND 3.3 V 4 pF Co VO = VCC or GND 3.3 V 5.5 pF All typical values are at VCC = 3.3 V, TA = 25°C. This applies in the disabled state only. Copyright © 2003–2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC541A-Q1 Submit Documentation Feedback 3 SN74LVC541A-Q1 SCAS713B – SEPTEMBER 2003 – REVISED APRIL 2008 ............................................................................................................................................... www.ti.com Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd A ten OE tdis OE PARAMETER VCC = 2.7 V MIN VCC = 3.3 V ± 0.3 V UNIT MAX MIN MAX Y 5.6 1 5.1 ns Y 7.5 1 7 ns Y 7.7 1 7 ns Operating Characteristics TA = 25°C TEST CONDITIONS PARAMETER Cpd 4 Power dissipation capacitance per buffer/driver Submit Documentation Feedback Outputs enabled Outputs disabled f = 10 MHz VCC = 2.5 V VCC = 3.3 V TYP TYP 58 33 2 2 UNIT pF Copyright © 2003–2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC541A-Q1 SN74LVC541A-Q1 www.ti.com ............................................................................................................................................... SCAS713B – SEPTEMBER 2003 – REVISED APRIL 2008 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 2.7 V 3.3 V ± 0.3 V VI tr/tf 2.7 V 2.7 V ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ 1.5 V 1.5 V 6V 6V 50 pF 50 pF 500 Ω 500 Ω 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V tPLZ Output Waveform 1 S1 at VLOAD (see Note B) tPLH VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + V∆ VOL tPHZ Output Waveform 2 S1 at GND (see Note B) VM VOH - V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms Copyright © 2003–2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC541A-Q1 Submit Documentation Feedback 5 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) CLVC541AQDWRG4Q1 ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L541AQ1 CLVC541AQPWRG4Q1 ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L541AQ1 SN74LVC541AQDWRQ1 ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L541AQ1 SN74LVC541AQPWRQ1 ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L541AQ1 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of