TAS5705
www.ti.com ................................................................................................................................................ SLOS549A – JUNE 2008 – REVISED SEPTEMBER 2009
20-W STEREO DIGITAL AUDIO POWER AMPLIFIER WITH EQ AND DRC
Check for Samples: TAS5705
FEATURES
1
•
23
•
•
Audio Input/Output
– 20-W Into an 8-Ω Load From an 18-V Supply
– Wide Power-Supply Range From (8 V to
23 V)
– Efficient Class-D Operation Eliminates
Need for Heat Sinks
– Requires Only Two Power-Supply Rails
– Two Serial Audio Inputs (Four Audio
Channels)
– Supports 32-kHz–192-kHz Sample Rates
(LJ/RJ/I2S)
– Headphone PWM Outputs
– Subwoofer PWM Outputs
Audio/PWM Processing
– Independent Channel Volume Controls With
24-dB to –100-dB Range
– Soft Mute (50% Duty Cycle)
– Programmable Dynamic Range Control
– 16 Adaptable Biquads for Speaker EQ
– Seven Biquads for Left and Right
Channels
– Two Biquads for Subwoofer Channel
– Adaptive Coefficients for DRC Filters
– Programmable Input and Output Mixers
– DC Blocking Filters
– Loudness Compensation for Subwoofer
– Automatic Sample Rate Detection and
Coefficient Banking for DRC and EQ
General Features
– Serial Control Interface Operational Without
MCLK
– Factory-Trimmed Internal Oscillator
Enables Automatic Detection of Incoming
•
Sample Rates
– Thermal and Short-Circuit Protection
Benefits
– EQ: Speaker Equalization Improves Audio
Performance
– DRC: Dynamic Range Compression.
Enables Power Limiting, Speaker
Protection, Easy Listening, Night-Mode
Listening
– Autobank Switching: Preload Coefficients
for Different Sample Rates. No Need to
Write Any Coefficients to the Part When
Sample Rate Changes.
– Autodetect: Automatically Detects
Sample-Rate Changes. No Need for
External Microprocessor Intervention
DESCRIPTION
The TAS5705 is a 20-W, efficient, digital audio power
amplifier for driving stereo bridge-tied speakers. Two
serial data inputs allow processing of up to four
discrete audio channels and seamless integration to
most digital audio processors and MPEG decoders.
The device accepts a wide range of input data and
clock rates. A fully programmable data path allows
these channels to be routed to the internal speaker
drivers or output via the line-level subwoofer or
headphone PWM outputs.
The TAS5705 is a slave-only device receiving clocks
from external sources. The TAS5705 operates at a
384-kHz switching rate for 32-, 48-, 96-,and 192-kHz
data and 352.8-kHz switching rate for 44.1-, 88.2and 176.4-kHz data. The 8× oversampling combined
with the fourth-order noise shaper provides a flat
noise floor and excellent dynamic range from 20 Hz
to 20 kHz.
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PurePath Digital is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2009, Texas Instruments Incorporated
TAS5705
SLOS549A – JUNE 2008 – REVISED SEPTEMBER 2009 ................................................................................................................................................ www.ti.com
SIMPLIFIED APPLICATION DIAGRAM
3.3 V
DVDD/AVDD
8 V–23 V
PVDD
OUT_A
LRCLK
Digital
Audio
Source
SCLK
BST_A
MCLK
SDIN1
LC
Left
LC
Right
BST_B
SDIN2
OUT_B
2
I C
Control
SDA
OUT_C
SCL
BST_C
BST_D
MUTE
Control
Inputs
HPSEL
OUT_D
RESET
PLL_FLTP
Loop
Filter
PLL_FLTM
8 V–23 V
TAS5102
PDN
SOUT+
SUB_PWM+
SIN+
SUB_PWM–
SIN–
BKND_ERR
FAULT
VALID
RESET
Subwoofer
SOUT–
HPR_PWM
HPL_PWM
RC
Filter
TPA6110A2
(HP Amplifier)
B0264-01
2
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TAS5705
www.ti.com ................................................................................................................................................ SLOS549A – JUNE 2008 – REVISED SEPTEMBER 2009
FUNCTIONAL VIEW
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TAS5705
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FAULT
Undervoltage
Protection
FAULT
Internal Pullup
Resistors to VREG
4
4
VREG
Power
On
Reset
Protection
and
I/O Logic
AGND
Temp.
Sense
GND
VALID
Overcurrent
Protection
Isense
OC_ADJ
BST_D
PVDD_D
PWM Controller
PWM_D
PWM
Rcv
Ctrl
Timing
Gate
Drive
OUT_D
BTL-Configuration
Pulldown Resistor
PGND_CD
GVDD_CD
Regulator
GVDD_CD
BST_C
PVDD_C
PWM_C
PWM
Rcv
Ctrl
Timing
Gate
Drive
OUT_C
BTL-Configuration
Pulldown Resistor
PGND_CD
BST_B
PVDD_B
PWM_B
PWM
Rcv
Ctrl
Timing
Gate
Drive
OUT_B
BTL-Configuration
Pulldown Resistor
GVDD_AB
Regulator
PGND_AB
GVDD_AB
BST_A
PVDD_A
PWM_A
PWM
Rcv
Ctrl
Timing
Gate
Drive
OUT_A
BTL-Configuration
Pulldown Resistor
PGND_AB
B0034-04
Figure 1. Power Stage Functional Block Diagram
4
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TAS5705
www.ti.com ................................................................................................................................................ SLOS549A – JUNE 2008 – REVISED SEPTEMBER 2009
64-PIN, HTQFP PACKAGE (TOP VIEW)
PGND_AB
PGND_AB
OUT_B
OUT_B
PVDD_B
PVDD_B
BST_B
BST_C
PVDD_C
PVDD_C
OUT_C
OUT_C
PGND_CD
PGND_CD
OUT_D
OUT_A
PAP Package
(Top View)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
OUT_A
PVDD_A
PVDD_A
BST_A
GVDD_AB
SSTIMER
TEST1
OC_ADJ
FAULT
AVDD
AVSS
PLL_FLTM
PLL_FLTP
VR_ANA
DVDD
RESET
1
2
3
4
5
6
48
47
46
45
44
43
OUT_D
PVDD_D
PVDD_D
BST_D
7
8
9
10
11
12
13
14
15
16
42
41
40
39
38
37
36
35
34
33
GND
GND
SUB_PWM+
SUB_PWM–
HPR_PWM
HPL_PWM
GVDD_CD
VREG
VALID
BKND_ERR
MCLK
DVDD
SDA
SCL
HPSEL
STEST
TEST2
DVSS
MUTE
LRCLK
SCLK
SDIN2
SDIN1
DVSSO
VR_DIG
PDN
VREG_EN
OSC_RES
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P0071-01
TERMINAL FUNCTIONS
TERMINAL
NAME
TYPE
NO.
(1)
5-V
TOLERANT
TERMINATION
DESCRIPTION
(2)
AVDD
10
P
3.3-V analog power supply. Needs close decoupling capacitor.
AVSS
11
P
Analog 3.3-V supply ground
BKND_ERR
35
DI
BST_A
4
P
High-side bootstrap supply for half-bridge A
BST_B
57
P
High-side bootstrap supply for half-bridge B
BST_C
56
P
High-side bootstrap supply for half-bridge C
BST_D
45
P
High-side bootstrap supply for half-bridge D
(1)
(2)
Pullup
Active-low. A back-end error sequence is generated by applying logic
LOW to this terminal. This pin is connected to an external power
stage. If no external power stage is used, connect this pin directly to
DVDD.
TYPE: A = analog; D = 3.3-V digital; P = power/ground/decoupling; I = input; O = output
All pullups are 20-μA weak pullups and all pulldowns are 20-μA weak pulldowns. The pullups and pulldowns are included to assure
proper input logic levels if the terminals are left unconnected (pullups → logic 1 input; pulldowns → logic 0 input). Devices that drive
inputs with pullups must be able to sink 50 μA while maintaining a logic-0 drive level. Devices that drive inputs with pulldowns must be
able to source 50 μA while maintaining a logic-1 drive level.
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TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
TYPE
NO.
(1)
5-V
TOLERANT
TERMINATION
DESCRIPTION
(2)
DVDD
15, 33
P
3.3-V digital power supply
DVSS
20
P
Digital ground
DVSSO
26
P
FAULT
9
DO
GND
Oscillator ground
Pullup
Overtemperature, overcurrent, and undervoltage fault reporting.
Active-low indicates fault. If high, normal operation.
41, 42
P
Analog ground for power stage
GVDD_AB
5
P
Gate drive internal regulated output for AB channels
GVDD_CD
44
P
Gate drive internal regulated output for CD channels
HPL_PWM
37
DO
HPR_PWM
38
DO
HPSEL
30
DI
5-V
Headphone select, active-high. When a logic high is applied, device
enters headphone mode and speakers are MUTED (HARD MUTE).
When a logic LOW is applied, device is in speaker mode and
headphone outputs become line outputs or are disabled. When in line
out mode, this terminal functionality is disabled (see system control
register 2.
LRCLK
22
DI
5-V
Input serial audio data left/right clock (sampling rate clock)
MCLK
34
DI
5-V
MCLK is the clock master input. The input frequency of this clock can
range from 4.9 MHz to 49.2 MHz.
MUTE
21
DI
5-V
OC_ADJ
8
AO
Analog overcurrent programming. Requires 22-kΩ resistor to ground.
OSC_RES
19
AO
Oscillator trim resistor. Connect an 18.2-kΩ, 1% tolerance resistor to
DVSSO.
OUT_A
1, 64
O
Output, half-bridge A
OUT_B
60, 61
O
Output, half-bridge B
OUT_C
52, 53
O
Output, half-bridge C
OUT_D
48, 49
O
Output, half-bridge D
17
DI
PGND_AB
62, 63
P
Power ground for half-bridges A and B
PGND_CD
50, 51
P
Power ground for half-bridges C and D
PLL_FLTM
12
AO
PLL negative loop filter terminal
PLL_FLTP
13
AI
PLL positive loop filter terminal
PVDD_A
2, 3
P
Power supply input for half-bridge output A (8 V–23 V)
PVDD_B
58, 59
P
Power supply input for half-bridge output B (8 V–23 V)
PVDD_C
54, 55
P
Power supply input for half-bridge output C (8 V–23 V)
PVDD_D
46, 47
P
RESET
16
DI
5-V
SCL
29
DI
5-V
PDN
6
Headphone left-channel PWM output.
Headphone right-channel PWM output.
5-V
Pullup
Pullup
Performs a soft mute of outputs, active-low. A logic low on this pin
sets the outputs equal to 50% duty cycle. A logic high on this pin
allows normal operation. The mute control provides a noiseless
volume ramp to silence. Releasing mute provides a noiseless ramp to
previous volume.
Power down, active-low. PDN powers down all logic, stops all clocks,
and stops output switching whenever a logic low is applied. When
PDN is released, the device powers up all logic, starts all clocks, and
performs a soft start that returns to the previous configuration
determined by register settings.
Power supply input for half-bridge output D (8 V–23 V)
Pullup
Reset, active-low. A system reset is generated by applying a logic
low to this terminal. RESET is an asynchronous control signal that
restores the DAP to its default conditions, sets the VALID outputs
low, and places the PWM in the hard-mute state (stops switching).
Master volume is immediately set to full attenuation. Upon the release
of RESET, if PDN is high, the system performs a 4–5-ms device
initialization and sets the volume at mute.
I2C serial control clock input
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TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
TYPE
(1)
5-V
TOLERANT
NO.
TERMINATION
DESCRIPTION
(2)
SCLK
23
DI
5-V
Serial audio data clock (shift clock). SCLK is the serial audio port
input data bit clock.
SDA
28
DIO
5-V
I2C serial control data interface input/output
SDIN1
25
DI
5-V
Serial audio data 1 input is one of the serial data input ports. SDIN1
supports three discrete (stereo) data formats.
SDIN2
24
DI
5-V
Serial audio data 2 input is one of the serial data input ports. SDIN2
supports three discrete (stereo) data formats.
SSTIMER
6
AI
Controls ramp time of OUT_X for pop-free operation. Leave this pin
floating for BD mode. Requires capacitor of 2.2 nF to GND in AD
mode. The capacitor determines the ramp time of PWM outputs from
0% to 50%. For 2.2 nF, start/stop time is ~10 ms.
STEST
31
DI
Test pin. Connect directly to GND.
SUB_PWM–
39
DO
Subwoofer negative PWM output
SUB_PWM+
40
DO
Subwoofer positive PWM output
TEST1
7
DI
Test pin. Connect directly to GND.
TEST2
32
DI
Test pin. Connect directly to DVDD.
VALID
36
DO
Output indicating validity of ALL PWM channels, active-high. This pin
is connected to an external power stage. If no external power stage is
used, leave this pin floating.
VR_ANA
14
P
Internally regulated 1.8-V analog supply voltage. This terminal must
not be used to power external devices.
VR_DIG
27
P
Internally regulated 1.8V digital supply voltage.This terminal must not
be used to power external devices.
VREG
43
P
3.3 Regulator output. Not to be used as s supply or connected to any
other components other than decoupling caps. Add decoupling
capacitors with pins 42 and 41.
VREG_EN
18
DI
Pulldown
Voltage regulator enable. Connect directly to GND.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
Supply voltage
Input voltage
(1)
VALUE
UNIT
DVDD, AVDD
–0.3 to 3.6
V
PVDD_X
–0.3 to 30
V
OC_ADJ
–0.3 to 4.2
V
–0.5 to DVDD + 0.5
V
3.3-V digital input
5-V tolerant
(2)
–0.5 to DVDD + 2.5
V
OUT_x to PGND_X
digital input
32 (3)
V
BST_x to PGND_X
43 (3)
V
Input clamp current, IIK (VI < 0 or VI > 1.8 V)
±20
mA
Output clamp current, IOK (VO < 0 or VO > 1.8 V)
±20
mA
0 to 85
°C
0 to 150
°C
–40 to 125
°C
Operating free-air temperature
Operating junction temperature range
Storage temperature range, Tstg
(1)
(2)
(3)
Stresses beyond those listed under absolute ratings may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under recommended operation conditions are
not implied. Exposure to absolute-maximum conditions for extended periods may affect device reliability.
5-V tolerant inputs are PDN, RESET, MUTE, SCLK, LRCLK, MCLK, SDIN1, SDIN2, SDA, SCL, and HPSEL.
DC voltage + peak ac waveform measured at the pin should be below the allowed limit for all conditions.
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DISSIPATION RATINGS
PACKAGE
DERATING FACTOR
ABOVE TA = 25°C
TA ≤ 25°C
POWER RATING
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
10-mm × 10-mm QFP
40 mW/°C
5W
3.2 W
2.6 W
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
Digital/analog supply voltage
DVDD, AVDD
3
3.3
3.6
V
Half-bridge supply voltage
PVDD_X
8
23
V
VIH
High-level input voltage
3.3-V TTL, 5-V tolerant
2
5.5
V
VIL
Low-level input voltage
3.3-V TTL, 5-V tolerant
TA
Operating ambient temperature range
0
TJ
Operating junction temperature range
0
RL (BTL)
RL (SE)
LO (BTL)
LO (SE)
Load impedance
Output filter: L = 15 μH, C = 0.68 μF
Output-filter inductance
Minimum output inductance under
short-circuit condition
6
8
3.2
4
UNIT
0.8
V
85
°C
150
°C
Ω
10
μH
10
PWM OPERATION AT RECOMMENDED OPERATING CONDITIONS
PARAMETER
Output sample rate 2×–1×
oversampled
TEST CONDITIONS
MODE
VALUE
UNIT
32–kHz data rate ±2%
12× sample rate
384
kHz
44.1-, 88.2-, 176.4-kHz data rate ±2%
8×, 4×, and 2× sample rates
352.8
kHz
48-, 96-, 192-kHz data rate ±2%
8×, 4×, and 2× sample rates
384
kHz
PLL INPUT PARAMETERS AND EXTERNAL FILTER COMPONENTS
PARAMETER
fMCLKI
TEST CONDITIONS
Frequency, MCLK (1 / tcyc2)
MIN
TYP
4.9
MCLK duty cycle
40%
MCLK minimum high time
8
MCLK minimum low time
8
50%
UNIT
49.2
MHz
60%
ns
ns
LRCLK allowable drift before LRCLK reset
8
MAX
4
MCLKs
External PLL filter capacitor C1
SMD 0603 Y5V
47
nF
External PLL filter capacitor C2
SMD 0603 Y5V
4.7
nF
External PLL filter resistor R
SMD 0603, metal film
470
Ω
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www.ti.com ................................................................................................................................................ SLOS549A – JUNE 2008 – REVISED SEPTEMBER 2009
ELECTRICAL CHARACTERISTICS
DC Characteristics
TA = 25°, PVCC_X = 18 V, DVDD = AVDD = 3.3 V, RL= 8 Ω, BTL mode (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
VOH
High-level output voltage
3.3-V TTL and 5-V tolerant
(1)
IOH = –4 mA
VOL
Low-level output voltage
3.3-V TTL and 5-V tolerant
(1)
IOL = 4 mA
0.5
3.3-V TTL
VI = VIL
±2
5-V tolerant (1)
VI = 0 V, DVDD = 3 V
±2
3.3-V TTL
VI = VIH
5-V tolerant
VI = 5.5 V, DVDD = 3 V
IIL
(2)
IIH
(2)
Low-level input current
High-level input current
2.4
IDD
Digital supply current
IPVDD
Analog supply current
No load (all PVDD inputs)
V
±2
±20
Normal Mode
Digital supply voltage (DVDD,
AVDD)
65
83
Power down (PDN =
low)
8
23
Reset (RESET = low)
23
38.5
IPVDD(PDN)
Power-down current
No load (all PVDD inputs)
Power down (PDN =
low)
IPVDD(RESET)
Reset current
No load (all PVDD inputs)
Reset (RESET = low)
30
60
5
6.3
5
6.3
Drain-to-source resistance,
LS
TJ = 25°C, includes metallization resistance
Drain-to-source resistance,
HS
TJ = 25°C, includes metallization resistance
180
Vuvp
Undervoltage protection limit
PVDD falling
7.2
Vuvp,hyst
Undervoltage protection limit
PVDD rising
OTE (3)
Overtemperature error
rDS(on)
UNIT
V
μA
μA
mA
mA
180
mΩ
I/O Protection
OTEHYST
OLPC
(3)
Extra temperature drop
required to recover from
error
Overload protection counter
fPWM = 384 kHz
IOC
Overcurrent limit protection
Resistor—programmable, max. current,
ROCP = 22 kΩ
IOCT
Overcurrent response time
ROCP
OC programming resistor
range
RPD
Internal pulldown resistor at
Connected when RESET is active to provide bootstrap
the output of each half-bridge capacitor charge.
(1)
(2)
(3)
7.6
V
150
°C
30
°C
0.63
ms
4.5
Resistor tolerance = 5% for typical value; the minimum
resistance should not be less than 20 kΩ. This value is
not adjustable. It must be fixed at 22 kΩ.
20
V
A
150
ns
22
kΩ
3
kΩ
5-V tolerant inputs are PDN, RESET, MUTE, SCLK, LRCLK, MCLK, SDIN1, SDIN2, SDA, SCL, and HPSEL.
IIL or IIH for pins with internal pullup can go up to 50 μA.
Specified by design
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AC Characteristics (BTL)
PVDD_X = 18 V, BTL mode, RL = 8 Ω, ROC = 22 KΩ, CBST = 33 nF, audio frequency = 1 kHz, AES17 filter,
fPWM = 384 kHz, TA = 25°C (unless otherwise noted). All performance is in accordance with recommended operating
conditions, unless otherwise specified.
PARAMETER
PO
TEST CONDITIONS
MIN
PVDD = 18 V,10% THD, 1-kHz input signal
20.0
PVDD = 18 V, 7% THD, 1-kHz input signal
18.6
PVDD = 12 V, 10% THD, 1-kHz input
signal
Power output per channel
Total harmonic distortion + noise
8.3
PVDD = 8 V, 10% THD, 1-kHz input signal
3.9
PVDD = 8 V, 7% THD, 1-kHz input signal
3.7
PVDD = 12 V; PO = 4.5 W (half-power)
PVDD = 8 V; PO = 2 W (half-power)
MAX
9
PVDD = 12 V, 7% THD, 1-kHz input signal
PVDD = 18 V; PO = 10 W (half-power)
THD+N
TYP
UNIT
W
0.12%
0.1%
0.24%
Output integrated noise
A-weighted
50
μV
Crosstalk
PO = 1 W, f = 1kHz
–73
dB
SNR
Signal-to-noise ratio
A-weighted, f = 1 kHz, maximum power at
THD < 0.1%
105
dB
PD
Power dissipation due to idle losses (IPVDD_X)
PO = 0 W, 4 channels switching (2)
0.6
W
Vn
(1)
(2)
(1)
SNR is calculated relative to 0-dBFS input level.
Actual system idle losses are affected by core losses of output inductors.
AC Characteristics (Single-Ended Output)
PVDD_X = 18 V, SE mode, RL = 4 Ω, ROC = 22 kΩ, CBST = 33-nF, audio frequency = 1 kHz, AES17 filter, fPWM = 384 kHz,
ambient temperature = 25°C (unless otherwise noted). All performance is in accordance with recommended operating
conditions, unless otherwise specified.
PARAMETER
PO
Power output per channel
TEST CONDITIONS
MIN
TYP MAX
PVDD = 18 V, 10% THD
10
PVDD = 18 V, 7% THD
9
PVDD = 12 V, 10% THD
4.5
PVDD = 12 V, 7% THD
UNIT
W
4
PVDD = 18V, Po =5 W (half-power)
0.2
PVDD = 12V, Po =2.25 W (half-power)
0.2
THD+
N
Total harmonic distortion + noise
Vn
Output integrated noise
A-weighted
50
μV
SNR
Signal-to-noise ratio (1)
A-weighted
105
dB
DNR
Dynamic range
A-weighted, input level = –60 dBFS using TAS5086 modulator
105
dB
PD
Power dissipation due to idle
losses (IPVDD_X)
0.6
W
(1)
(2)
10
PO = 0 W, 4 channels switching
(2)
%
SNR is calculated relative to 0-dBFS input level.
Actual system idle losses are affected by core losses of output inductors.
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SERIAL AUDIO PORTS SLAVE MODE
over recommended operating conditions (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
CL = 30 pF
MIN
TYP
1.024
MAX
UNIT
12.288
MHz
fSCLKIN
Frequency, SCLK 32 × fS, 48 × fS, 64 × fS
tsu1
Setup time, LRCLK to SCLK rising edge
10
ns
th1
Hold time, LRCLK from SCLK rising edge
10
ns
tsu2
Setup time, SDIN to SCLK rising edge
10
ns
th2
Hold time, SDIN from SCLK rising edge
10
LRCLK frequency
32
48
192
SCLK duty cycle
40%
50%
60%
LRCLK duty cycle
40%
50%
60%
32
64
SCLK
edges
–1/4
1/4
SCLK
period
SCLK rising edges between LRCLK rising edges
t(edge)
LRCLK clock edge with respect to the falling edge of SCLK
ns
kHz
Figure 2. Slave Mode Serial Data Interface Timing
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I2C SERIAL CONTROL PORT OPERATION
Timing characteristics for I2C Interface signals over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
No wait states
MAX
UNIT
400
kHz
fSCL
Frequency, SCL
tw(H)
Pulse duration, SCL high
0.6
tw(L)
Pulse duration, SCL low
1.3
tr
Rise time, SCL and SDA
300
ns
tf
Fall time, SCL and SDA
300
ns
tsu1
Setup time, SDA to SCL
th1
Hold time, SCL to SDA
t(buf)
μs
μs
100
ns
0
ns
Bus free time between stop and start condition
1.3
μs
tsu2
Setup time, SCL to start condition
0.6
μs
th2
Hold time, start condition to SCL
0.6
μs
tsu3
Setup time, SCL to stop condition
0.6
μs
CL
Load capacitance for each bus line
400
tw(H)
tw(L)
pF
tf
tr
SCL
tsu1
th1
SDA
T0027-01
Figure 3. SCL and SDA Timing
SCL
t(buf)
th2
tsu2
tsu3
SDA
Start
Condition
Stop
Condition
T0028-01
Figure 4. Start and Stop Conditions Timing
12
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RESET TIMING (RESET)
Control signal parameters over recommended operating conditions (unless otherwise noted)
PARAMETER
MIN
td(VALID_LOW)
Time to assert VALID (reset to power stage) low
tw(RESET)
Pulse duration, RESET active
td(I2C_ready)
Time to enable I2C
td(run)
Device start-up time (after start-up command via I2C)
TYP
MAX
UNIT
100
100
ns
200
ns
3.5
ms
10
RESET
ms
Earliest time
that hard mute
could be exited
tw(RESET)
VALID
td(I2C_ready)
td(run)
td(VALID_LOW)
System initialization.
Start system
2
Enable via I C.
T0029-05
NOTE: On power up, it is recommended that the TAS5705 RESET be held LOW for at least 100 μs after DVDD has reached
3.0 V. RESET assertion is ignored if applied while part is powered down
Figure 5. Reset Timing
POWER-DOWN (PDN) TIMING
Control signal parameters over recommended operating conditions (unless otherwise noted)
PARAMETER
td(VALID_LOW)
Time to assert VALID (reset to power stage) low
td(STARTUP)
Device startup time
tw
Minimum pulse duration required
MIN
TYP
MAX
UNIT
μs
725
μs
650
μs
1
PDN
tw
VALID
td(STARTUP)
td(VALID_LOW)
T0030-04
NOTE: PDNZ assertion is ignored if applied when part is in RESET
Figure 6. Power-Down Timing
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DVDD
PVDD
T0317-01
Figure 7. Power Up and Power Down of Power Supplies
DVDD
> 100 ms
RESET
tpower_down
PDN
T0318-01
NOTE: tpower_down = time to wait before powering down the supplies after PDN assertion = 725 μs + power-stage stop time
defined by register 0x1A
Figure 8. Terminal Control and DVDD
14
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BACK-END ERROR (BKND_ERR)
Control signal parameters over recommended operating conditions (unless otherwise noted)
PARAMETER
MIN
TYP
tw(ER)
Minimum pulse duration, BKND_ERR active (active-low)
tp(valid_high)
Programmable. Time to stay in the VALID (reset to the power stage) low state. After
tp(valid_high), the TAS5705 attempts to bring the system out of the VALID low state if
BKND_ERR is high.
300
Time TAS5705 takes to bring VALID (reset to the power stage) low after BKND_ERR
assertion.
400
tp(valid_low)
MAX
UNIT
350
ns
ms
ns
tw(ER)
BKND_ERR
VALID
Normal
Operation
Normal
Operation
tp(valid_high)
tp(valid_low)
T0031-04
Figure 9. Error Recovery Timing
MUTE TIMING (MUTE)
Control signal parameters over recommended operating conditions (unless otherwise noted)
PARAMETER
td(VOL)
MIN
Volume ramp time (= number of steps × step size). Number of steps is defined by volume
configuration register 0x0E (see Volume Configuration Register ). Step size = 4 LRCLKs if
fS ≤ 48 kHz; else 8 LRCLKs if fS ≤ 96 kHz ; else 16 LRCLKs
TYP
MAX
1024
UNIT
steps
MUTE
VOLUME
Normal
Operation
Normal
Operation
td(VOL)
td(VOL)
50-50
Duty Cycle
T0032-03
Figure 10. Mute Timing
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HEADPHONE SELECT (HPSEL)
PARAMETER
MIN
tw(MUTE)
Pulse duration, HPSEL active
td(VOL)
Soft volume update time
t(SW)
Switch-over time (controlled by start/stop period register, 0x1A)
(1)
MAX
UNIT
350
ns
(1)
ms
0.2
ms
See
Defined by the volume slew rate setting (see the volume configuration register, 0x0E).
Figure 11 and Figure 12 show functionality when bit 4 in the HP configuration register is set to DISABLE (not in line-out mode). See
register 0x05 for details. If bit 4 is not set, than the HP PWM outputs are not disabled when HPSEL is brought low.
HPSEL
Spkr Volume
td(VOL)
HP Volume
td(VOL)
t(SW)
VALID
T0267-01
Figure 11. HPSEL Timing for Headphone Insertion
HPSEL
HP Volume
td(VOL)
Spkr Volume
td(VOL)
t(SW)
VALID
T0268-01
Figure 12. HPSEL Timing for Headphone Extraction
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TYPICAL CHARACTERISTICS, BTL CONFIGURATION
TOTAL HARMONIC DISTORTION + NOISE (BTL)
vs
FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE (BTL)
vs
FREQUENCY
10
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
10
PVDD = 18 V
RL = 8 Ω
1
P=5W
0.1
0.01
0.001
20
P=1W
P = 10 W
100
1k
PVDD = 12 V
RL = 8 Ω
1
P = 2.5 W
0.1
P=5W
0.01
0.001
20
10k 20k
P = 0.5 W
100
1k
f − Frequency − Hz
10k 20k
f − Frequency − Hz
G003
G002
Figure 13.
Figure 14.
TOTAL HARMONIC DISTORTION + NOISE (BTL)
vs
FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE (BTL)
vs
OUTPUT POWER
10
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
10
PVDD = 8 V
RL = 8 Ω
1
P = 0.5 W
0.1
P=1W
P = 2.5 W
0.01
0.001
20
100
1k
10k 20k
PVDD = 18 V
RL = 8 Ω
1
f = 1 kHz
0.1
f = 20 Hz
0.01
f = 10 kHz
0.001
0.01
f − Frequency − Hz
G001
Figure 15.
0.1
1
10
PO − Output Power − W
40
G006
Figure 16.
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TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued)
TOTAL HARMONIC DISTORTION + NOISE (BTL)
vs
OUTPUT POWER
TOTAL HARMONIC DISTORTION + NOISE (BTL)
vs
OUTPUT POWER
10
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
10
PVDD = 12 V
RL = 8 Ω
1
f = 1 kHz
0.1
f = 20 Hz
0.01
f = 10 kHz
0.001
0.01
0.1
1
PO − Output Power − W
1
f = 1 kHz
0.1
f = 20 Hz
0.01
f = 10 kHz
0.001
0.01
40
10
PVDD = 8 V
RL = 8 Ω
0.1
1
10
40
PO − Output Power − W
G005
Figure 17.
Figure 18.
EFFICIENCY
vs
OUTPUT POWER
SUPPLY CURRENT
vs
TOTAL OUTPUT POWER
G004
3.0
100
RL = 8 Ω
90
2.5
80
Efficiency − %
PVDD = 18 V
IDD − Supply Current − A
PVDD = 12 V
70
PVDD = 8 V
60
50
40
30
2.0
1.5
PVDD = 18 V
1.0
PVDD = 12 V
20
0.5
10
PVDD = 8 V
RL = 8 Ω
0.0
0
0
2
4
6
8
10
12
14
16
PO − Output Power (Per Channel) − W
18
20
0
10
15
20
25
30
PO − Total Output Power − W
G007
Figure 19.
18
5
35
40
G008
Figure 20.
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TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued)
OUTPUT POWER
vs
SUPPLY VOLTAGE
CROSSTALK
vs
FREQUENCY
25
−60
RL = 8 Ω
−65
20
PO = 1 W
PVDD = 18 V
RL = 8 Ω
Crosstalk − dB
PO − Output Power − W
−70
15
THD+N = 10%
10
−75
Right to Left
−80
Left to Right
−85
THD+N = 1%
−90
5
−95
0
6
8
10
12
14
16
18
20
−100
20
PVDD − Supply Voltage − V
G009
Figure 21.
100
1k
10k 20k
f − Frequency − Hz
G012
Figure 22.
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TYPICAL CHARACTERISTICS, SE CONFIGURATION
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
10
VCC = 18 V
RL = 4 Ω (SE)
Gain = 3 dB
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
10
1
PO = 5 W
0.1
PO = 2.5 W
PO = 0.5 W
0.01
0.001
20
100
1k
VCC = 18 V
RL = 4 Ω (SE)
Gain = 3 dB
1
PO = 5 W
0.1
PO = 2.5 W
PO = 0.5 W
0.01
0.001
20
10k 20k
100
1k
f − Frequency − Hz
10k 20k
f − Frequency − Hz
G012
G012
Figure 23.
Figure 24.
TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT POWER
OUTPUT POWER
vs
SUPPLY VOLTAGE
18
f = 1 kHz
RL = 4 Ω (SE)
Gain = 3 dB
f = 1 kHz
RL = 4 Ω (SE)
Gain = 3 dB
15
1
PO − Output Power − W
THD+N − Total Harmonic Distortion + Noise − %
10
0.1
VCC = 18 V
VCC = 12 V
12
THD+N = 10%
9
6
THD+N = 1%
0.01
3
0.001
0.01
0
0.1
1
PO − Output Power − W
10
40
5
15
20
VCC − Supply Voltage − V
G013
Figure 25.
20
10
25
G014
Figure 26.
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DETAILED DESCRIPTION
POWER SUPPLY
To facilitate system design, the TAS5705 needs only a 3.3-V digital supply in addition to the (typical) 18-V
power-stage supply. An internal voltage regulator provides suitable voltage levels for the gate drive circuitry.
Additionally, all circuitry requiring a floating voltage supply, e.g., the high-side gate drive, is accommodated by
built-in bootstrap circuitry requiring only a few external capacitors.
In order to provide good electrical and acoustical characteristics, the PWM signal path for the output stage is
designed as identical, independent half-bridges. For this reason, each half-bridge has separate bootstrap pins
(BST_X), and power-stage supply pins (PVDD_X). The gate drive voltages (GVDD_AB and GVDD_CD) are
derived from the PVDD voltage. Separate, internal voltage regulators reduce and regulate the PVDD voltage to a
voltage appropriate for efficient gave drive operation. Special attention should be paid to placing all decoupling
capacitors as close to their associated pins as possible. In general, inductance between the power-supply pins
and decoupling capacitors must be avoided.
For a properly functioning bootstrap circuit, a small ceramic capacitor must be connected from each bootstrap pin
(BST_X) to the power-stage output pin (OUT_X). When the power-stage output is low, the bootstrap capacitor is
charged through an internal diode connected between the gate-drive power-supply pin (GVDD_X) and the
bootstrap pin. When the power-stage output is high, the bootstrap capacitor potential is shifted above the output
potential and thus provides a suitable voltage supply for the high-side gate driver. In an application with PWM
switching frequencies in the range from 352 kHz to 384 kHz, it is recommended to use 33-nF ceramic capacitors,
size 0603 or 0805, for the bootstrap supply. These 33-nF capacitors ensure sufficient energy storage, even
during minimal PWM duty cycles, to keep the high-side power stage FET (LDMOS) fully turned on during the
remaining part of the PWM cycle.
Special attention should be paid to the power-stage power supply; this includes component selection, PCB
placement, and routing. As indicated, each half-bridge has independent power-stage supply pins (PVDD_X). For
optimal electrical performance, EMI compliance, and system reliability, it is important that each PVDD_X pin is
decoupled with a 100-nF ceramic capacitor placed as close as possible to each supply pin.
The TAS5705 is fully protected against erroneous power-stage turnon due to parasitic gate charging.
SYSTEM POWER-UP/POWER-DOWN SEQUENCE
Powering Up
The outputs of the H-bridges remain in a low-impedance state until the internal gate-drive supply voltage
(GVDD_XY) and external VREG voltages are above the undervoltage protection (UVP) voltage threshold (see
the DC Characteristics section of this data sheet). It is recommended to hold PVDD_X low until DVDD (3.3 V) is
powered up while powering up the device. This allows an internal circuit to charge the external bootstrap
capacitors by enabling a weak pulldown of the half-bridge output. The output impedance is approximately 3 kΩ.
This means that the TAS5705 should be held in reset for at least 100 μs to ensure that the bootstrap capacitors
are charged. This also assumes that the recommended 0.033-μF bootstrap capacitors are used. Changes to
bootstrap capacitor values change the bootstrap capacitor charge time. See Figure 7 and Figure 8.
Powering Down
Apply PDN (assert low). Wait for the power stage to shut down. Power down PVDD. Then power down DVDD.
Then de-assert PDN. See Figure 8 for recommended timing.
ERROR REPORTING
The FAULT pin is an active-low, open-drain output. Its function is for protection-mode signaling to a
system-control device.
Any fault resulting in device shutdown is signaled by the FAULT pin going low (see Table 1).
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Table 1. FAULT Output States
FAULT
DESCRIPTION
0
Overcurrent (OC) or undervoltage (UVP) warning or overtemperature error (OTE)
1
Junction temperature lower than 150°C and no faults (normal operation)
Note that asserting RESET low forces the FAULT signal high, independent of faults being present.
To reduce external component count, an internal pullup resistor to 3.3 V is provided on the FAULT output. Level
compliance for 5-V logic can be obtained by adding external pullup resistors to 5 V (see the Electrical
Characteristics section of this data sheet for further specifications).
DEVICE PROTECTION SYSTEM
The TAS5705 contains advanced protection circuitry carefully designed to facilitate system integration and ease
of use, as well as to safeguard the device from permanent failure due to a wide range of fault conditions such as
short circuits, overtemperature, and undervoltage. The TAS5705 responds to a fault by immediately setting the
power stage in a high-impedance (Hi-Z) state and asserting the FAULT pin low. The device automatically
recovers when the fault condition has been removed.
Overcurrent (OC) Protection With Current Limiting
The device has independent, fast-reacting current detectors on all high-side and low-side power-stage FETs. The
detector outputs are closely monitored by two protection systems. The first protection system controls the power
stage in order to prevent the output current further increasing, i.e., it performs a cycle-by-cycle current-limiting
function, rather than prematurely shutting down during combinations of high-level music transients and extreme
speaker load impedance drops. If the high-current condition situation persists, i.e., the power stage is being
overloaded, a second protection system triggers a latching shutdown, resulting in the power stage being set in
the high-impedance (Hi-Z) state. The device returns to normal operation once the fault condition (i.e., a short
circuit on the output) is removed. Current limiting and overcurrent protection are not independent for half-bridges
A and B and, respectively, C and D. That is, if the bridge-tied load between half-bridges A and B causes an
overcurrent fault, half-bridges A, B, C, and D are shut down.
The overcurrent protection threshold is set by a resistor to ground from the OC_ADJ pin. A value of 22 kΩ will
result in an overcurrent threshold of 4.5 A. This resistor value should not be changed.
Overtemperature Protection
The TAS5705 has a two-level temperature-protection system that asserts an active-high warning signal (OTW)
when the device junction temperature exceeds 125°C (nominal) and, if the device junction temperature exceeds
150°C (nominal), the device is put into thermal shutdown, resulting in all half-bridge outputs being set in the
high-impedance (Hi-Z) state and FAULT being asserted low. OTE is latched in this case. To clear the OTE latch,
RESET must be asserted. Thereafter, the device resumes normal operation.
Undervoltage Protection (UVP) and Power-On
Reset (POR)
The UVP and POR circuits of the TAS5705 fully protect the device in any power-up/down and brownout situation.
While powering up, the POR circuit resets the overload circuit (OLP) and ensures that all circuits are fully
operational when the GVDD_XY and VREG supply voltages reach 5.7 V (typical) and 2.7 V, respectively.
Although GVDD_XY and VREG are independently monitored, a supply voltage drop below the UVP threshold on
VREG or either GVDD_XY pin results in all half-bridge outputs immediately being set in the high-impedance
(Hi-Z) state and FAULT being asserted low. The device automatically resumes operation when all supply
voltages have increased above the UVP threshold.
DEVICE RESET
One reset pin is provided for control of half-bridges A/B/C/D. When RESET is asserted low, all four power-stage
FETs in half-bridges A, B, C, and D are forced into a high-impedance (Hi-Z) state.
22
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In BTL modes, to accommodate bootstrap charging prior to switching start, asserting the reset input low enables
weak pulldown of the half-bridge outputs. In the SE mode, the weak pulldowns are not enabled, and it is
therefore recommended to ensure bootstrap capacitor charging by providing a low pulse on the PWM inputs
when reset is asserted high.
Asserting the reset input low removes any fault information to be signaled on the FAULT output, i.e., FAULT is
forced high.
A rising-edge transition on the reset input allows the device to resume operation after an overcurrent fault.
SSTIMER FUNCTIONALITY
The SSTIMER pin uses a capacitor connected between this pin and ground to control the output duty cycle when
a transition occurs on the RESET pin. The capacitor on the SSTIMER pin is slowly charged through an internal
current source, and the charge time determines the rate at which the output transitions from a near zero duty
cycle to the duty cycle that is present on the inputs. This allows for a smooth transition with no audible pop or
click noises when the RESET pin transitions from high-to-low or low-to-high.
For a high-to-low transition of the RESET pin (shutdown case), it is important for the modulator to remain
switching for a period of at least 10 ms (if using a 2.2 nF capacitor). Larger capacitors will increase the
start-up/shutdown time, while capacitors smaller than 2.2 nF will decrease the start-up/shutdown time. The inputs
MUST remain switching on the shutdown transition to allow the outputs to slowly ramp down the duty cycle to
near zero before completely shutting off. The SSTIMER pin should be left floating for BD modulation and also for
SE (single-ended) mode.
CLOCK, AUTODETECTION, AND PLL
The TAS5705 DAP is a slave device. It accepts MCLK, SCLK, and LRCLK. The digital audio processor (DAP)
supports all the sample rates and MCLK rates that are defined in the clock control register .
The TAS5705 checks to verify that SCLK is a specific value of 32 fS, 48 fS, or 64 fS. The DAP only supports a 1 ×
fS LRCLK. The timing relationship of these clocks to SDIN1/2 is shown in subsequent sections. The clock section
uses MCLK or the internal oscillator clock (when MCLK is unstable or absent) to produce the internal clock.
The DAP can autodetect and set the internal clock-control logic to the appropriate settings for the frequencies of
32 kHz, normal speed (44.1 or 48 kHz), double speed (88.2 kHz or 96 kHz), and quad speed (176.4 kHz or
192 kHz). The automatic sample-rate detection can be disabled and the values set via I2C in the clock control
register.
The DAP also supports an AM interference-avoidance mode during which the clock rate is adjusted, in concert
with the PWM sample rate converter, to produce a PWM output at 7 × fS, 8 × fS, or 6 × fS.
The sample rate must be set manually during AM interference avoidance and when de-emphasis is enabled.
SERIAL DATA INTERFACE
Serial data is input on SDIN1/2. The PWM outputs are derived from SDIN1/2. The TAS5705 DAP accepts 32-,
44.1-, 48-, 88.2-, 96-, 176.4-, and 192-kHz serial data in 16-, 18-, 20-, or 24-bit data in left-justified, right-justified,
and I2S serial data formats.
PWM Section
The TAS5705 DAP device uses noise-shaping and sophisticated error-correction algorithms to achieve high
power efficiency and high-performance digital audio reproduction. The DAP uses a fourth-order noise shaper that
has >100-dB SNR performance from 20 Hz to 20 kHz. The PWM section accepts 24-bit PCM data from the DAP
and outputs four PWM audio output channels. The TAS5705 PWM SECTION supports bridge-tied loads.
The PWM section has individual-channel dc-blocking filters that can be enabled and disabled. The filter cutoff
frequency is less than 1 Hz. Individual-channel de-emphasis filters for 32-, 44.1-, and 48-kHz are included and
can be enabled and disabled.
Finally, the PWM section has an adjustable maximum modulation limit of 93.8% to 99.2%.
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I2C-COMPATIBLE SERIAL CONTROL INTERFACE
The TAS5705 DAP has an I2C serial control slave interface to receive commands from a system controller. The
serial control interface supports both normal-speed (100-kHz) and high-speed (400-kHz) operations without wait
states. As an added feature, this interface operates even if MCLK is absent.
The serial control interface supports both single-byte and multibyte read and write operations for status registers
and the general control registers associated with the PWM.
The I2C interface supports a special mode which permits I2C write operations to be broken up into multiple
data-write operations that are multiples of 4 data bytes. These are 6-, 10-, 14-, 18-, ... etc., -byte write operations
that are composed of a device address, read/write bit, subaddress, and any multiple of 4 bytes of data. This
permits the system to write large register values incrementally without blocking other I2C transactions.
24
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SDIN2
SDIN1
SDI
0x04
SDIN1L
SDIN1R
SDIN2L
SDIN2R
6
4
3
2
1
0x20
R'
Down Mix
0x21
L'
SUB
2
BQ
7
BQ
7
BQ
0x21
(L'+R')/2
0x21
Bass
Management
RS
LS
RF
LF
0x21
Vol6
0x0D
Vol 4
0x0B
Vol 3
0x0A
Vol 2
0x09
Vol1
0x08
DRC2
drc2_ coeff
Drc2_en
drc1_ coeff
Drc1_en
Drc2_dis
drc1_ coeff
Drc1_en
drc1_ coeff
Drc1_en
DRC1
drc1_ coeff
Drc1_en
Drc1_dis
LF+
Noise
Shaper
AD/BD
B
T
L
PWM3
0x13
0x20
PWM2
0x12
PWM1
0x11
Sub+
B
T
L
0x20
Sub–
B
T
L
PWM6
0x16
PWM5
0x15
PWM4
0x14
0x20
RF–
RF+
LF–
0x20
Noise
Shaper
AD
Noise
Shaper
AD
Noise
Shaper
AD/BD
0x20
Noise
Shaper
AD/BD
0x20
6
6
6
6
6
6
6
6
0x25
B0263-01
HPR
HPL
Sub+
Sub–
Out_D
Out_C
Out_B
Out_A
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BQ (0x24)
Loudness (0x23)
Master Volume 0x07
Figure 27. TAS5705 DAP Data Flow Diagram With I2C Registers
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SERIAL INTERFACE CONTROL AND TIMING
I2S Timing
I2S timing uses LRCLK to define when the data being transmitted is for the left channel and when it is for the
right channel. LRCLK is low for the left channel and high for the right channel. A bit clock running at 32, 48, or 64
× fS is used to clock in the data. There is a delay of one bit clock from the time the LRCLK signal changes state
to the first bit of data on the data lines. The data is written MSB first and is valid on the rising edge of bit clock.
The DAP masks unused trailing data-bit positions.
2
2-Channel I S (Philips Format) Stereo Input
32 Clks
LRCLK (Note Reversed Phase)
32 Clks
Right Channel
Left Channel
SCLK
SCLK
MSB
24-Bit Mode
23 22
LSB
9
8
5
4
5
4
1
0
1
0
1
0
MSB
LSB
23 22
9
8
5
4
19 18
5
4
1
0
15 14
1
0
1
0
20-Bit Mode
19 18
16-Bit Mode
15 14
T0034-01
NOTE: All data presented in 2s-complement form with MSB first.
Figure 28. I2S 64-fS Format
26
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2
2-Channel I S (Philips Format) Stereo Input/Output (24-Bit Transfer Word Size)
LRCLK
24 Clks
24 Clks
Left Channel
Right Channel
SCLK
SCLK
MSB
24-Bit Mode
23 22
MSB
LSB
17 16
9
8
5
4
13 12
5
4
1
0
9
1
0
3
2
1
0
LSB
23 22
17 16
9
8
5
4
19 18
13 12
5
4
1
0
15 14
9
1
0
3
2
1
20-Bit Mode
19 18
16-Bit Mode
15 14
8
8
T0092-01
NOTE: All data presented in 2s-complement form with MSB first.
Figure 29. I2S 48-fS Format
2
2-Channel I S (Philips Format) Stereo Input
LRCLK
16 Clks
16 Clks
Left Channel
Right Channel
SCLK
SCLK
MSB
16-Bit Mode
15 14 13 12
MSB
LSB
11 10
9
8
5
4
3
2
1
0
15 14 13 12
LSB
11 10
9
8
5
4
3
2
1
T0266-01
NOTE: All data presented in 2s-complement form with MSB first.
Figure 30. I2S 32-fS Format
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Left-Justified
Left-justified (LJ) timing uses LRCLK to define when the data being transmitted is for the left channel and when it
is for the right channel. LRCLK is high for the left channel and low for the right channel. A bit clock running at 32,
48, or 64 × fS is used to clock in the data. The first bit of data appears on the data lines at the same time LRCLK
toggles. The data is written MSB first and is valid on the rising edge of the bit clock. The DAP masks unused
trailing data-bit positions.
2-Channel Left-Justified Stereo Input
32 Clks
32 Clks
Left Channel
Right Channel
LRCLK
SCLK
SCLK
MSB
24-Bit Mode
23 22
LSB
9
8
5
4
5
4
1
0
1
0
1
0
MSB
LSB
23 22
9
8
5
4
19 18
5
4
1
0
15 14
1
0
1
0
20-Bit Mode
19 18
16-Bit Mode
15 14
T0034-02
NOTE: All data presented in 2s-complement form with MSB first.
Figure 31. Left-Justified 64-fS Format
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2-Channel Left-Justified Stereo Input (24-Bit Transfer Word Size)
24 Clks
24 Clks
Left Channel
Right Channel
LRCLK
SCLK
SCLK
MSB
24-Bit Mode
23 22
21
LSB
17 16
9
8
5
4
13 12
5
4
1
0
9
1
0
1
0
MSB
LSB
21
17 16
9
8
5
4
19 18 17
13 12
5
4
1
0
15 14 13
9
1
0
23 22
1
0
20-Bit Mode
19 18 17
16-Bit Mode
15 14 13
8
8
T0092-02
NOTE: All data presented in 2s-complement form with MSB first.
Figure 32. Left-Justified 48-fS Format
2-Channel Left-Justified Stereo Input
16 Clks
16 Clks
Left Channel
Right Channel
LRCLK
SCLK
SCLK
MSB
16-Bit Mode
15 14 13 12
LSB
11 10
9
8
5
4
3
2
1
0
MSB
15 14 13 12
LSB
11 10
9
8
5
4
3
2
1
0
T0266-02
NOTE: All data presented in 2s-complement form with MSB first.
Figure 33. Left-Justified 32-fS Format
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Right-Justified
Right-justified (RJ) timing uses LRCLK to define when the data being transmitted is for the left channel and when
it is for the right channel. LRCLK is high for the left channel and low for the right channel. A bit clock running at
32, 48, or 64 × fS is used to clock in the data. The first bit of data appears on the data line 8 bit-clock periods (for
24-bit data) after LRCLK toggles. In RJ mode, the LSB of data is always clocked by the last bit clock before
LRCLK transitions. The data is written MSB first and is valid on the rising edge of bit clock. The DAP masks
unused leading data bit positions.
2-Channel Right-Justified (Sony Format) Stereo Input
32 Clks
32 Clks
Left Channel
Right Channel
LRCLK
SCLK
SCLK
MSB
24-Bit Mode
LSB
23 22
19 18
15 14
1
0
19 18
15 14
1
0
15 14
1
0
MSB
LSB
23 22
19 18
15 14
1
0
19 18
15 14
1
0
15 14
1
0
20-Bit Mode
16-Bit Mode
T0034-03
Figure 34. Right-Justified 64-fS Format
30
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2-Channel Right-Justified Stereo Input (24-Bit Transfer Word Size)
24 Clks
24 Clks
Left Channel
Right Channel
LRCLK
SCLK
SCLK
MSB
24-Bit Mode
23 22
LSB
19 18
15 14
6
5
2
1
0
19 18
15 14
6
5
2
1
0
15 14
6
5
2
1
0
LSB
MSB
23 22
19 18
15 14
6
5
2
1
0
19 18
15 14
6
5
2
1
0
15 14
6
5
2
1
0
20-Bit Mode
16-Bit Mode
T0092-03
Figure 35. Right-Justified 48-fS Format
2-Channel Right-Justified Stereo Input (24-Bit Transfer Word Size)
24 Clks
24 Clks
Left Channel
Right Channel
LRCLK
SCLK
SCLK
MSB
24-Bit Mode
23 22
LSB
19 18
15 14
6
5
2
1
0
19 18
15 14
6
5
2
1
0
15 14
6
5
2
1
0
LSB
MSB
23 22
19 18
15 14
6
5
2
1
0
19 18
15 14
6
5
2
1
0
15 14
6
5
2
1
0
20-Bit Mode
16-Bit Mode
T0092-03
Figure 36. Right-Justified 32-fS Format
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I2C SERIAL CONTROL INTERFACE
The TAS5705 DAP has a bidirectional I2C interface that is compatible with the I2C (Inter IC) bus protocol and
supports both 100-kHz and 400-kHz data transfer rates for single- and multiple-byte write and read operations.
This is a slave-only device that does not support a multimaster bus environment or wait-state insertion. The
control interface is used to program the registers of the device and to read device status.
The DAP supports standard-mode I2C bus operation (100 kHz maximum) and fast I2C bus operation (400 kHz
maximum). The DAP performs all I2C operations without I2C wait cycles.
General I2C Operation
The I2C bus employs two signals, SDA (data) and SCL (clock), to communicate between integrated circuits in a
system. Data is transferred on the bus serially, one bit at a time. The address and data can be transferred in byte
(8-bit) format, with the most significant bit (MSB) transferred first. In addition, each byte transferred on the bus is
acknowledged by the receiving device with an acknowledge bit. Each transfer operation begins with the master
device driving a start condition on the bus and ends with the master device driving a stop condition on the bus.
The bus uses transitions on the data terminal (SDA) while the clock is high to indicate start and stop conditions.
A high-to-low transition on SDA indicates a start, and a low-to-high transition indicates a stop. Normal data-bit
transitions must occur within the low time of the clock period. These conditions are shown in Figure 37. The
master generates the 7-bit slave address and the read/write (R/W) bit to open communication with another
device and then waits for an acknowledge condition. The TAS5705 holds SDA low during the acknowledge clock
period to indicate an acknowledgment. When this occurs, the master transmits the next byte of the sequence.
Each device is addressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible devices share the
same signals via a bidirectional bus using a wired-AND connection. External pullup resistors must be used to set
the high level for the SDA and SCL signals.
SDA
R/
A
W
7-Bit Slave Address
7
6
5
4
3
2
1
0
8-Bit Register Address (N)
7
6
5
4
3
2
1
0
8-Bit Register Data For
Address (N)
A
7
6
5
4
3
2
1
8-Bit Register Data For
Address (N)
A
0
7
6
5
4
3
2
1
A
0
SCL
Start
Stop
T0035-01
2
Figure 37. Typical I C Sequence
There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the last
word transfers, the master generates a stop condition to release the bus. A generic data transfer sequence is
shown in Figure 37.
The 7-bit address for TAS5705 is 0011 011 (0x36).
Single- and Multiple-Byte Transfers
The serial control interface supports both single-byte and multiple-byte read/write operations for status registers
and the general control registers associated with the PWM. However, for the DAP data processing registers, the
serial control interface supports only multiple-byte (4-byte) read/write operations.
During multiple-byte read operations, the DAP responds with data, a byte at a time, starting at the subaddress
assigned, as long as the master device continues to respond with acknowledges. If a particular subaddress does
not contain 32 bits, the unused bits are read as logic 0.
During multiple-byte write operations, the DAP compares the number of bytes transmitted to the number of bytes
that are required for each specific subaddress. If a write command is received for a biquad subaddress, the DAP
expects to receive five 32-bit words. If fewer than five 32-bit data words have been received when a stop
command (or another start command) is received, the data received is discarded. Similarly, if a write command is
received for a mixer coefficient, the DAP expects to receive one 32-bit word.
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Supplying a subaddress for each subaddress transaction is referred to as random I2C addressing. The TAS5705
also supports sequential I2C addressing. For write transactions, if a subaddress is issued followed by data for
that subaddress and the 15 subaddresses that follow, a sequential I2C write transaction has taken place, and the
data for all 16 subaddresses is successfully received by the TAS5705. For sequential I2C write transactions, the
subaddress then serves as the start address, and the amount of data subsequently transmitted, before a stop or
start is transmitted, determines how many subaddresses are written. As was true for random addressing,
sequential addressing requires that a complete set of data be transmitted. If only a partial set of data is written to
the last subaddress, the data for the last subaddress is discarded. However, all other data written is accepted;
only the incomplete data is discarded.
Single-Byte Write
As shown in Figure 38, a single-byte data write transfer begins with the master device transmitting a start
condition followed by the I2C device address and the read/write bit. The read/write bit determines the direction of
the data transfer. For a write data transfer, the read/write bit is a 0. After receiving the correct I2C device address
and the read/write bit, the DAP responds with an acknowledge bit. Next, the master transmits the address byte or
bytes corresponding to the TAS5705 internal memory address being accessed. After receiving the address byte,
the TAS5705 again responds with an acknowledge bit. Next, the master device transmits to the memory address
being accessed the data byte to be written. After receiving the data byte, the TAS5705 again responds with an
acknowledge bit. Finally, the master device transmits a stop condition to complete the single-byte data write
transfer.
Start
Condition
Acknowledge
A6
A5
A4
A3
A2
A1
A0
Acknowledge
R/W ACK A7
A6
A5
2
A4
A3
A2
A1
Acknowledge
A0 ACK D7
D6
Subaddress
I C Device Address and
Read/Write Bit
D5
D4
D3
D2
D1
D0 ACK
Stop
Condition
Data Byte
T0036-01
Figure 38. Single-Byte Write Transfer
Multiple-Byte Write
A multiple-byte data write transfer is identical to a single-byte data write transfer except that multiple data bytes
are transmitted by the master device to the DAP as shown in Figure 39. After receiving each data byte, the
TAS5705 responds with an acknowledge bit.
Start
Condition
Acknowledge
A6
A5
A1
A0 R/W ACK A7
A6
A5
2
A4
A3
Subaddress
I C Device Address and
Read/Write Bit
A1
Acknowledge
Acknowledge
Acknowledge
Acknowledge
A0 ACK D7
D0 ACK D7
D0 ACK D7
D0 ACK
First Data Byte
Other Data Bytes
Last Data Byte
Stop
Condition
T0036-02
Figure 39. Multiple-Byte Write Transfer
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Single-Byte Read
As shown in Figure 40, a single-byte data-read transfer begins with the master device transmitting a start
condition followed by the I2C device address and the read/write bit. For the data-read transfer, both a write
followed by a read are actually done. Initially, a write is done to transfer the address byte or bytes of the internal
memory address to be read. As a result, the read/write bit becomes a 0. After receiving the TAS5705 address
and the read/write bit, TAS5705 responds with an acknowledge bit. In addition, after sending the internal memory
address byte or bytes, the master device transmits another start condition followed by the TAS5705 address and
the read/write bit again. This time the read/write bit becomes a 1, indicating a read transfer. After receiving the
address and the read/write bit, the TAS5705 again responds with an acknowledge bit. Next, the TAS5705
transmits the data byte from the memory address being read. After receiving the data byte, the master device
transmits a not-acknowledge followed by a stop condition to complete the single-byte data-read transfer.
Repeat Start
Condition
Start
Condition
Acknowledge
A6
A5
A1
A0 R/W ACK A7
Acknowledge
A6
2
A5
A4
A0 ACK
A6
A5
A1
A0 R/W ACK D7
D6
2
I C Device Address and
Read/Write Bit
Subaddress
I C Device Address and
Read/Write Bit
Not
Acknowledge
Acknowledge
D1
D0 ACK
Stop
Condition
Data Byte
T0036-03
Figure 40. Single-Byte Read Transfer
Multiple-Byte Read
A multiple-byte data-read transfer is identical to a single-byte data read transfer except that multiple data bytes
are transmitted by the TAS5705 to the master device as shown in Figure 41. Except for the last data byte, the
master device responds with an acknowledge bit after receiving each data byte.
Repeat Start
Condition
Start
Condition
Acknowledge
A6
2
A0 R/W ACK A7
I C Device Address and
Read/Write Bit
Acknowledge
A6
A6
A0 ACK
A5
Subaddress
2
Acknowledge
Acknowledge
Acknowledge
Not
Acknowledge
A0 R/W ACK D7
D0 ACK D7
D0 ACK D7
D0 ACK
I C Device Address and
Read/Write Bit
First Data Byte
Other Data Bytes
Last Data Byte
Stop
Condition
T0036-04
Figure 41. Multiple-Byte Read Transfer
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Dynamic Range Control (DRC)
DRC-Compensated Output
The DRC input/output diagram is shown in Figure 42.
k
1:1 Transfer Function
Implemented Transfer Function
T
DRC Input Level
M0091-01
Figure 42. Dynamic Range Control
The TAS5705 has single-threshold dynamic range compressors (one for all satellites and one for the subwoofer).
There are two distinct DRC blocks. DRC1 controls the satellite channels. DRC2 controls the subwoofer channel.
The DRC provides compression capabilities above the threshold region of audio signal levels. A programmable
threshold level sets the boundaries of the two regions. The offset (boost or cut) can be defined by a
programmable offset coefficient. The DRC implements the composite transfer function by computing a
3.23-format gain coefficient from each sample output of an RMS estimator. This gain coefficient is then applied to
a mixer element, whose other input is the audio data channel. The mixer output is the DRC-adjusted audio data.
The audio is the signal level following the volume control, as specified by the user. The estimates are then
compared on a sample-by-sample basis, and the largest is used to compute the compression gain coefficient.
The gain coefficient is then applied to the audio of the satellite group.
The control parameters for the dynamic range controls are programmable via the I2C interface.
The DRC control for each channel is performed by two control bits. The encoding is shown in Table 2.
Table 2. DRC Control Inputs
0x46 Bit 1
0x46 Bit 0
Description
X
0
Disable DRC1
X
1
Enable DRC1
0
X
Disable DRC2
1
X
Enable DRC2
The DRC scheme has a single threshold, offset, and slope (all programmable). There is one ganged DRC for the
left/right channels and one DRC for the subwoofer channel.
•
•
•
Thresholds T1 and T2 define the thresholds for DRC1 and DRC2, respectively.
Offsets O1 and O2 define the gain coefficients for DRC1 and DRC2, respectively.
The magnitudes of slopes k1 and k2 define the degree of compression to be performed above the threshold
for DRC1 and DRC2, respectively.
The three sets of parameters are all defined in logarithmic space, and adhere to the following rules.
• The maximum input sample into the DRC is referenced at 0 dB. All values below this maximum value then
have negative values in logarithmic (dB) space.
• Thresholds T1 and T2 define, in dB, the boundaries of the regions of the DRC, as referenced to the RMS
value of the data into the DRC. 0-dB threshold settings reference the maximum-valued RMS input into the
DRC, and negative-valued thresholds reference all other RMS input levels. Positive-valued thresholds have
no physical meaning and are not allowed. In addition, zero-valued threshold settings are not allowed.
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The threshold settings must be programmed as 32-bit (9.23 format) numbers.
Zero-valued and positive-valued threshold settings are not allowed, and cause unpredictable behavior if used.
•
•
Offsets O1 and O2 define, in dB, the attenuation (cut) or gain (boost) applied by the DRC-derived gain
coefficient at the threshold points T1 and T2, respectively. Positive offsets are defined as cuts, and thus boost
or gain selections are negative numbers.
Slopes k1 and k2 define the compression is to be performed within a given region, and the degree of
compression to be applied. Slopes are programmed as 26-bit (3.23 format) numbers.
DRC Implementation
Figure 4.13.1-1 shows the three elements comprising the DRC: (1) an RMS estimator, (2) a compression
coefficient computation engine, and (3) an attack/decay controller.
• RMS Estimator—This DRC element derives an estimate of the rms value of the audio data stream into the
DRC. For the DRC block shared by Ch1 though Ch4 , the individual channel estimates are computed. The
outputs of the estimators are then compared, sample-by-sample, and the largest-valued sample is forwarded
to the compression/expansion coefficient-computation engine. Two programmable parameters, ae and (1 –
ae), set the effective time window over which the RMS estimate is made. For the DRC block shared by Ch1
though Ch4, the programmable parameters apply to both RMS estimators. The time window over which the
RMS estimation is computed can be determined by
1
t window =
fS ln (1 - ae )
•
•
Compression Coefficient Computation—This DRC element converts the output of the rms estimator to a
logarithmic number, determines the region where the input resides, and then computes and outputs the
appropriate coefficient to the attack/decay element. The programmable parameters, T1, T2, O1, O2, K1, and
K2, define the compression regions for both DRCs implemented by this element.
Attack/Decay Control—This DRC element controls the transition time of changes in the coefficient computed
in the compression/expansion coefficient computation element. Four programmable parameters define the
operation of this element. Parameters ad and (1 – ad) set the decay or release time constant to be used for
signal amplitude boost (expansion). Parameters aa and (1 – aa) set the attack time constant to be used for
signal amplitude cuts. The transition-time constants can be determined by
1
ta =
fS ln (1 - aa )
ta =
Audio Input
CH 1
1
fS ln (1 - aa )
32
RMS Voltage
Estimator
Audio Input
CH 3
Audio Input
CH 4
32
32
32
RMS Voltage
Estimator
RMS Voltage
Estimator
Comparator
Compression/Offset
Audio Input
CH 2
Cut
Attack/Decay Control
K1
O1{
DRC-Derived
Gain Coefficient
Audio Out
Volume
td
T1
ta
Audio In
RMS Voltage
Estimator
B0309-01
Figure 43. DRC Block Diagram
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Threshold Parameter Computation
For thresholds,
Tdb = –6.0206 TINPUT = –6.0206 TSUB_ADDRESS_ENTRY
If, for example, it is desired to set T1 = –64 dB, then the subaddress entry required to set T1 to –64 dB is
-64
Τ1SUB_ADDRESS_ENTRY =
= 10.63
-6.0206
T1 is entered as a 32-bit number in 9.23 format. Therefore,
T1 = 10.63 = 0 1010.1010 0001 0100 0111 1010 111 = 0x0550 A3D7 in 9.23 format
Slope Parameter Computation
In developing the equations used to determine the subaddress input value required to realize a given
compression or expansion within a given region of the DRC, the following convention has been adopted.
DRC Transfer = Input Increase : Output Increase
If the DRC realizes an output increase of n dB for every dB increase in the rms value of the audio into the DRC,
a 1:n expansion is being performed. If the DRC realizes a 1-dB increase in output level for every n dB increase in
the rms value of the audio into the DRC, an n:1 compression is being performed.
For a 1:n expansion, the slope k can be found by
k=n–1
For an n:1 compression, the slope k can be found by
1
k=
-1
n
(1)
In compression (n:1), n is implied to be greater than 1. For compression, Equation 1 means –1 < k < 0 for n > 1.
Thus k must always lie in the range k > –1.
1
1
Compression equation: k = - 4 = - 1 ® n = - ® -0.3333:1 compression
n
3
With k = –4 then, the output decreases 3 dB for every 1-dB increase in the rms value of the audio into the DRC.
As the input increases in signal amplitude, the output decreases in signal amplitude.
DRC Offset Calculation
The DRC offset is calculated by
Goffset =
10(gd /20)
15.5
where gd = desired gain (in dB) and 15.5 is the the fixed antilog normalization factor. A value of gd = 0 indicates
no offset.
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Energy
Filter
Compression
Control
Attack
and
Decay
Filters
a, w
T, K, O
aa, wa / ad, wd
DRC1
0x3A
0x40, 0x41, 0x42
0x3B / 0x3C
DRC2
0x3D
0x43, 0x44, 0x45
0x3E / 0x3F
Audio Input
DRC Coefficient
Alpha Filter Structure
S
a
w
–1
Z
NOTE:
a=a
w=1–a
B0265-01
Figure 44. DRC Structure
AM Tuner Interference Management
Digital amplifiers produce AM interference by radio energy emissions near the digital amplifier switching rate and
the harmonics of that switching rate. The digital amplifier emits an interference spectrum in the AM band that is
centered on the second though sixth harmonics of the digital amplifier switching frequency. Because the digital
amplifier switching rate is a multiple of the input data sample rate, the interference frequencies can be changed
by changing the sample rate.
Anatomy of a Receiver
AM receivers are composed of six sections as shown in Figure
The radio-frequency (RF) section has a variable tuner that preselects the frequencies to be received. The RF
section provides only enough filtering to significantly attenuate signals that are significantly above or below the
desired tuned frequency. The RF-section gain is controlled by the AGC to compensate for variations in the signal
strength.
The mixer, variable-frequency oscillator (VFO), and intermediate frequency (IF) sections perform the bulk of the
receiver tuning. In home receivers, the variable oscillator is adjusted so that it is a constant 455 kHz higher than
the desired tuned frequency. The output of the mixer consists of four frequencies, RF, VFO, RF + VFO and RF –
VFO. These signals are then passed into the IF section, where sharp discriminating filters to accept only the
constant 455-kHz (RF – VFO) signal. The resulting signal is amplified and then passed to the detector section,
where it is transformed into an audio signal.
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AGC
Mixer
RF
IF
Detector
AUDIO
VFO
B0310-01
Figure 45. AM Receiver Architecture
Radio-frequency interference at either the tuned frequency or the 455-kHz IF frequency adversely affects the AM
radio reception.
However, there is another frequency that this receiver architecture also receives. This is a signal at the VFO +
tuned frequency (RF + 2 × IF).
For example, to tune a receiver at 540 kHz, an oscillator of 995 kHz is used to produce a difference frequency of
455 kHz. However, the receiver can also receive a frequency at the oscillator frequency 995 kHz plus the IF
frequency of 455 kHz (= 1450 kHz). This frequency is called the IF image frequency. This is because the 1450 –
955 produces a difference frequency of 455 kHz. It is the role of the RF section to provide sufficient selectivity to
attenuate frequencies that are several hundred kHz from the tuned frequency. However, this is often a weakness
of low-cost receivers. Therefore, the AM interference avoidance approach includes this frequency in its
interference avoidance algorithms.
AM Interference Avoidance
As a result, during AM interference avoidance, a the system select a switching rate such that the radiated
emissions avoid
• The IF (455 kHz)
• The tuned frequency
• IF image frequency (tuned frequency + 2 × 455 kHz)
During AM interference avoidance, the TAS5705 receives the sample rate (38, 44.1, or 48 kHz) and the tuned
frequency (typically 540 kHz to 1840 kHz) from the system controller. The TAS5705 uses these two values to
determine what switching rate to use. The TAS5705 has a sample-rate converter (SRC) that permits the PWM
switching rate to be increased or decreased by a fractional amount. The SRC produces a PWM switching rate
that is 6, 7, or 8 times the data sample rate.
This is done by specifying the order in which the switching rates are tested. The TAS5705 provides four
selectable sequences. The evaluation selects the first rate from the sequence and applies the three tests. If the
switching rate is found to be GOOD in all three tests, then that rate is used. If that switching rate is found to be
BAD in any of the tests, then the next rate in the sequence is taken for evaluation.
The sequences are as follows: (see Register 0x22, bits 19–18)
1. 8 × sample rate, 7 × sample rate, 6 × sample rate
2. 8 × sample rate, 6 × sample rate, 7 × sample rate
3. 7 × sample rate, 8 × sample rate, 6 × sample rate
4. 7 × sample rate, 6 × sample rate, 8 × sample rate
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AM Controls
There are three controls for the AM section.
• AM Mode Enable—This control enables and disables sample rate conversion for 38, 44.1 and 48 kHz.
• AM Search Sequence—The sequence the device will search for switching frequency that avoids interference
• AM Tuned Frequency—The AM tuned frequency is encoded as four binary-encoded decimal digits, held in
two registers, representing the tuned frequency in kHz. The range of valid values is from 1999 kHz to 0500
KHz.
When the TAS5705 receives a change to any of these inputs, it
1. Performs a fast (128-step) mute
2. Performs the requested AM interference avoidance operation
(a) If requested, enables/disables the AM mode
(b) If requested, selects the requested AM search sequence
(c) Selects and sets the appropriate SRC rate
3. Performs a fast (128 step) unmute
Loudness Function
The TAS5705 provides a direct form I biquad for loudness on the subwoofer channel. The first biquad is
contained in a gain-compensation circuit that maintains the overall system gain at 1 or less to prevent clipping at
loud volume settings. This gain compensation is shown in Figure 46.
1 if Vol £ 1/G
0 if Vol ³ 1/G + 1/Scale
1 - Scale (Vol - 1/G) otherwise
From
Input
Mux
To
Output
Mux
Loudness
Biquad (0x23)
Gain = G
Volume
Scale = 1/(1 - 1/G)
Biquad (0x24)
0 if Vol £ 1/G
1 if Vol ³ 1/G + 1/Scale
Scale (Vol - 1/G) otherwise
B0273-01
Figure 46. Biquad Gain Control Structure
Table 3. Loudness Table Example for Gain = 4, 1/G = 0.25, Scale = 1.33
Volume
0.125
0.25
0.375
0.5
0.625
0.75
0.875
1
1.125
1.25
1.375
1.5
1.625
1.75
1.875
2
Biquad path
1
1
0.833
0.666
0.5
0.333
0.166
0
0
0
0
0
0
0
0
0
Direct path
0
0
0.166
0.333
0.5
0.666
0.833
1
1
1
1
1
1
1
1
1
Total gain
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
40
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The biquads are implemented in a direct form-I architecture. The direct form-I structure provides a separate delay
element and mixer (gain coefficient) for each node in the biquad filter.
The five 26-bit (3.23) coefficients for the biquad are programmable via the I2C interface.
The following steps are invovled in using a loudness biquad with the volume comprensation feature:
1. Program the biquad with a loudness filter.
2. Program 0x26 (1/G) and 0x28 (scale).
3. Enable volume compensation in register 0x0E.
b0
x(n)
S
b1
z
a1
–1
z
b2
z
y(n)
Magnitude
Truncation
–1
a2
–1
z
–1
M0012-02
Figure 47. Biquad Filter
Subchannel Preprocessing
A subchannel has three input multiplexers that can select from the bass management output, the downmix
output, or the channel-6 input multiplexer output.
Register 0x21, bits (9:8) determine the submultiplexer selection, defined in Table 4.
Table 4. Submultiplexer Selection
Bits
Submultiplexer
00
Pass through channel-6 input multiplexer output
01
Select bass management block output for submultiplexer
10
Select downmix ouput for submultiplexer
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The Bass Management function is explained in Figure 48.
Lf (Ch 1)
Rf (Ch 2)
Ls (Ch 3)
Rs (Ch 4)
Sub (Ch 6)
A
B
C
D
F
10 dB
Bass Management Output
+
Bass Management Output = BS_Out (linear) = Ch 6 = F ´ 3.121 + (A + B + C + D)
BS_Out (log) = 20 ´ log (BS_Out)
B0291-01
NOTE: Selection of A, B, C, D, or F is determined by the input multiplexer selection register (0x20).
Figure 48. Bass Management Block Diagram
Downmix is defined by I2C register 0x21, bits (3:0), as listed in Table 5.
Table 5. Downmix Definitions
Bits 3:0
Definition
X0X0
L' = (0.000 × Ls + 0.000 × L) / 1.000
X0X1
L' = (0.000 × Ls + 1.000 × L) / 1.000
X1X0
L' = (1.000 × Ls + 0.000 × L) / 1.000
X1X1
L' = (0.707 × Ls + 1.000 × L) / 1.707
0X0X
R' = (0.000 × Rs + 0.000 × R) / 1.000
0X1X
R' = (0.000 × Rs + 1.000 × R) / 1.000
1X0X
R' = (1.000 × Rs + 0.000 × R) / 1.000
1X1X
R' = (0.707 × Rs + 1.000 × R) / 1.707
BANK SWITCHING
The TAS5705 uses an approach called bank switching together with automatic sample-rate detection. All
processing features that must be changed for different sample rates are stored internally in the TAS5705. The
TAS5705 has three full banks storing information, one for 32 kHz, one for 44.1/48 kHz, and one for all other data
rates. Combined with the clock-rate autodetection feature, bank switching allows the TAS5705 to detect
automatically a change in the input sample rate and switch to the appropriate bank without any MCU
intervention.
The TAS5705 supports three banks of coefficients to be updated during the initialization. One bank is for 32 kHz,
a second bank is for 44.1/48 kHz, and a third bank is for all other sample rates. An external controller updates
the three banks (see the I2C register mapping table for bankable locations) during the initialization sequence.
If the autobank switch is enabled (register 0x50, bits 2:0) , then the TAS5705 automatically swaps the
coefficients for subsequent sample rate changes, avoiding the need for any external controller intervention for a
sample rate change.
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By default, bits 2:0 have the value 000; that means the bank switch is disabled. In that state, any update to
locations 0x29–0x3F go into the DAP. A write to register 0x50 with bits 2:0 being 001, 010, or 011 brings the
system into the coefficient-bank-update state update bank1, update bank2, or update bank3, respectively. Any
subsequent write to locations 0x29–0x3F updates the coefficient banks stored outside the DAP. After updating all
the three banks, the system controller should issue a write to register 0x50 with bits 2:0 being 100; this changes
the system state to automatic bank update. In automatic bank update, the TAS5705 automatically swaps banks
based on the sample rate.
In the headphone mode, speaker equalization and DRC are disabled, and they are restored on returning to the
speaker mode.
Command sequences for initialization can be summarized as follows:
1. Enable factory trim for internal oscillator: Write to register 0x1B with a value 0x00.
2. Update coefficients: Coefficients can be loaded into DAP RAM using the manual bank mode.
OR
Use automatic bank mode.
(a) Enable bank-1 mode: Write to register 0x50 with 0x01. Load the 32-kHz coefficients. TI ALE
can generate coefficients.
(b) Enable bank-2 mode: Write to register 0x50 with 0x02. Load the 48-kHz coefficients.
(c) Enable bank-3 mode: Write to register 0x50 with 0x03. Load the other coefficients.
(d) Enable automatic bank switching by writing to register 0x50 with 0x04.
3. Bring the system out of all-channel shutdown: Write 0 to bit 6 of register 0x05.
4. Issue master volume: Write to register 0x07 with the volume value (0 db = 0x30).
Interchannel Delay (ICD) Settings
Table 6. Recommended ICD Settings
Mode
Description
BD
2 BTL channels, internal
power stage only, BD
mode
A(L+) = –18
(0xB8)
ICD1
C(R+) = 24 =
(0x60)
ICD2
B(L–) = –24 =
(0xA0)
ICD3
D(R–) = 18 =
(0x48)
ICD4
SM(S–) = –3 = SP(S+) = 3 =
(0xF4)
(0x0C)
ICD5
ICD6
AD
2 internal BTL channels,
1 external BTL channel
using PBTL TAS5102,
AD mode
A(L+) = –21 =
(0xAC)
C(R+) = 21
(0x54)
B(L–) = –21 =
(0xAC)
D(R–) = 21 =
(0x54)
SM(S–) = 0 =
(0x00)
SP(S+) = 0 =
(0x00)
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I2C SERIAL CONTROL COMMAND CHARACTERISTICS
The DAP has two groups of I2C commands. One set is commands that are designed specifically to be operated
while audio is streaming and that have built-in mechanisms to prevent noise, clicks, and pops. The other set
does not have this built-in protection.
Commands that are designed to be adjusted while audio is streaming:
• Master volume
• Master mute
• Individual channel volume
• Individual channel mute
Commands that are normally issued as part of initialization:
• Serial data interface format
• De-emphasis
• Sample-rate conversion
• Input multiplexer
• Output multiplexer
• Biquads
• Down mix
• Channel delay
• Enable/disable dc blocking
• Hard/soft unmute from clock error
• Enable/disable headphone outputs
Start-up sequence for correct device operation
This sequence must be followed to ensure proper operation.
1. Hold ALL logic inputs low. Power up AVDD/DVDD and wait for the inputs to settle in the allowed range.
2. Drive PDN = 1, MUTE = 1, and drive other logic inputs to the desired state.
3. Provide a stable MCLK, LRCLK, and SCLK (clock errors must be avoided during the initialization sequence) .
4. After completing step 3, wait 100 μs, then drive RESET = 1, and wait 13.5 ms after RESET goes high.
5. Trim the internal oscillator (write 0x00 to register 0x1B).
6. Wait 50 ms while the part acquires lock.
7. Configure the DAP via I2C, e.g.:
– Downmix control (0x21)
– Biquads (0x23–0x24 and 0x29–0x38)
– DRC parameters and controls (0x3A–0x46)
– Bank select (0x50)
NOTE: User may not issue any I2C reads or writes to the above registers after this step is complete.
8. Configure remaining I2C registers, e.g.:
– Shutdown group
– De-emphasis
– Input multiplexers
– Output multiplexers
– Channel delays
– DC blocking
– Hard/soft unmute from clock error
– Serial data interface format
– Clock register (manual clock mode only)
NOTE: The BKND_ERR register (0x1C) can only be written once with a value that is not reserved (00
and 01 are reserved values).
9. Exit all-channel shutdown (write 0 to bit 6 of register 0x05).
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10. This completes the initialization sequence. From this step on, no further constraints are imposed on PDN,
MUTE, and clocks.
11. During normal operation the user may do the following:
(a) Write to the master or individual-channel volume registers.
(b) Write to the soft-mute register.
(c) Write to the clock and serial data interface format registers (in manual clock mode only).
(d) Write to bit 6 of register 0x05 to enter/exit all-channel shutdown. No other bits of register 0x05 may be
altered. After issuing the all-channel shutdown command, no further I2C transactions that address this
device are allowed for a period of at least: 1 ms + 1.3 × (period specified in start/stop register 0x1A) .
(e) PDN may be asserted (low) at any time. Once PDN is asserted, no I2C transactions that address this
device may be issued until PDN has been deasserted and the part has returned to active mode.
NOTE: When the device is in a powered down state (initiated via PDN), the part is not reset if RESET
is asserted.
NOTE: Once RESET is asserted, and as long as the part is in a reset state, the part does not power
down if PDN is asserted. For powering the part down, a negative edge on PDN must be issued when
RESET is high and the part is not in a reset state.
NOTE: No registers besides those explicitly listed in Steps a.–d. should be altered during normal
operation (i.e., after exiting all-channel shutdown).
NOTE: No registers should be read during normal operation (i.e., after exiting all-channel shutdown) .
12. To reconfigure registers:
(a) Return to all-channel shutdown (observe the shutdown wait time as specified in Step 11.d.).
(b) Drive PDN = 1, and hold MUTE stable.
(c) Provide a stable MCLK, LRCLK, and SCLK.
(d) Repeat configuration starting from step (6).
Table 7. Serial Control Interface Register Summary
SUBADDRESS
REGISTER NAME
NO. OF
BYTES
(1)
INITIALIZATION
VALUE
CONTENTS
A u indicates unused bits.
0x00
Clock control register
1
Description shown in subsequent section
0x6C
0x01
Device ID register
1
Description shown in subsequent section
0x23
0x02
Error status register
1
Description shown in subsequent section
0x00
0x03
System control register 1
1
Description shown in subsequent section
0xA0
0x04
Serial data interface
register
1
Description shown in subsequent section
0x05
0x05
System control register 2
1
Description shown in subsequent section
0x40
0x06
Soft mute register
1
Description shown in subsequent section
0x00
0x07
Master volume
1
Description shown in subsequent section
0xFF (mute)
0x08
Channel 1 vol
1
Description shown in subsequent section
0x30 (0 dB)
0x09
Channel 2 vol
1
Description shown in subsequent section
0x30 (0 dB)
0x0A
Channel 3 vol
1
Description shown in subsequent section
0x30 (0 dB)
0x0B
Channel 4 vol
1
Description shown in subsequent section
0x30 (0 dB)
0x0C
HP volume
1
Description shown in subsequent section
0x30 (0 dB)
0x0D
Channel 6 vol
1
Description shown in subsequent section
0x30 (0 dB)
0x0E
Volume configuration
register
1
Description shown in subsequent section
0x91
1
Reserved (2)
0x0F
(1)
(2)
0x10
Modulation limit register
1
Description shown in subsequent section
0x02
0x11
IC delay channel 1
1
Description shown in subsequent section
0xB8
Biquad definition is given in Figure 47 .
Reserved registers should not be accessed.
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Table 7. Serial Control Interface Register Summary
SUBADDRESS
REGISTER NAME
NO. OF
BYTES
CONTENTS
INITIALIZATION
VALUE
IC delay channel 2
1
Description shown in subsequent section
0x60
0x13
IC delay channel 3
1
Description shown in subsequent section
0xA0
0x14
IC delay channel 4
1
Description shown in subsequent section
0x48
0x15
IC delay channel 5
1
Description shown in subsequent section
0xF4
0x16
IC delay channel 6
1
Description shown in subsequent section
0x0C
0x17
Offset register
1
Reserved
0x00
1
Reserved (2)
0x19
PWM shutdown group
register
1
0x30
0x1A
Start/stop period register
1
0x0A
0x1B
Oscillator trim register
1
0x82
0x1C
BKND_ERR register
1
0x1D–0x1F
0x02
Reserved
(2)
0x20
Input Mux register
4
Description shown in subsequent section
0x0089 777A
0x21
Downmix input Mux register
4
Description shown in subsequent section
0x0000 4203
0x22
AM tuned frequency
4
Description shown in subsequent section
0x0000 0000
0x23
ch6_bq[2] (Loudness BQ)
20
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
0x24
ch6_bq[3] (post volume
BQ)
0x25
PWM Mux register
0x26
1/G register
0x27
20
Description shown in subsequent section
0x0102 1345
4
u[31:26], x[25:0]
0x0080 0000
1
Reserved (3)
0x28
Scale register
4
u[31:26], x[25:0]
0x0080 0000
0x29
ch1_bq[0]
20
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
0x2A
0x2B
46
(continued)
0x12
0x18
(3)
(1)
ch1_bq[1]
ch1_bq[2]
20
20
Reserved registers should not be accessed.
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Table 7. Serial Control Interface Register Summary
SUBADDRESS
0x2C
0x2D
0x2E
0x2F
0x30
0x31
0x32
0x33
0x34
REGISTER NAME
ch1_bq[3]
ch1_bq[4]
ch1_bq[5]
ch1_bq[6]
ch2_bq[0]
ch2_bq[1]
ch2_bq[2]
ch2_bq[3]
ch2_bq[4]
NO. OF
BYTES
20
20
20
20
20
20
20
20
20
CONTENTS
(1)
(continued)
INITIALIZATION
VALUE
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
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TAS5705
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Table 7. Serial Control Interface Register Summary
SUBADDRESS
0x35
0x36
0x37
0x38
REGISTER NAME
ch2_bq[5]
ch2_bq[6]
ch6_bq[0]
ch6_bq[1]
0x39
0x3A
DRC1 ae
NO. OF
BYTES
20
20
20
20
DRC1 aa
DRC1 ad
DRC2 ae
DRC2 aa
DRC2 ad
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
0x0000 0000
u[31:26], aa[25:0]
0x0080 0000
u[31:26], (1 – aa)[25:0]
0x0000 0000
u[31:26], ad[25:0]
0x0080 0000
u[31:26], (1 – ad)[25:0]
0x0000 0000
u[31:26], ae[25:0]
0x0080 0000
u[31:26], (1 – ae)[25:0]
0x0000 0000
u[31:26], aa[25:0]
0x0080 0000
u[31:26], (1 – aa)[25:0]
0x0000 0000
u[31:26], ad[25:0]
0x0080 0000
8
8
8
8
u[31:26], (1 – ad)[25:0]
0x0000 0000
0x40
DRC1-T
4
T1[31:0]
0xFDA2 1490
0x41
DRC1-K
4
u[31:26], k1[25:0]
0x0384 2109
0x42
DRC1-O
4
u[31:26], O1[25:0]
0x0008 4210
0x43
DRC2-T
4
T2[31:0]
0xFDA2 1490
0x44
DRC2-K
4
u[31:26], k2[25:0]
0x0384 2109
0x45
DRC2-O
4
u[31:26], O2[25:0]
0x0008 4210
0x46
DRC control
4
u[31:2], ch6_enable, ch1_5_enable
0x0000 0000
0x47–0x49
4
Reserved (4)
0x0000 0000
0x50
4
Bank update command register
0x0000 0000
0x51–0xFF
48
u[31:26], b2[25:0]
u[31:26], (1 – ae)[25:0]
8
DRC2 (1 – ad)
(4)
0x0000 0000
0x0080 0000
DRC2 (1 – aa)
0x3F
0x0080 0000
u[31:26], b1[25:0]
u[31:26], ae[25:0]
DRC 2 (1 – ae)
0x3E
u[31:26], b0[25:0]
8
DRC1 (1 – ad)
0x3D
INITIALIZATION
VALUE
Reserved (4)
DRC1 (1 – aa)
0x3C
(continued)
4
DRC1 (1 – ae)
0x3B
CONTENTS
(1)
4
Reserved
(4)
0x0000 0000
Reserved registers should not be accessed.
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TAS5705
www.ti.com ................................................................................................................................................ SLOS549A – JUNE 2008 – REVISED SEPTEMBER 2009
CLOCK CONTROL REGISTER (0x00)
In the manual mode, the clock control register provides a way for the system microprocessor to update the data
and clock rates based on the sample rate and associated clock frequencies. In the autodetect mode, the clocks
are automatically determined by the TAS5705. In this case, the clock control register contains the autodetected
FS and MCLK status as automatically detected (D7–D2). Bits D7–D5 select the sample rate. Bits D4–D2 select
the MCLK frequency. Bit D0 is used in manual mode only. In this mode, when the clocks are updated a 1 must
be written to D0 to inform the DAP that the written clocks are valid.
Table 8. Clock Control Register (0x00)
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
–
–
–
–
–
fS = 32-kHz sample rate
FUNCTION
0
0
1
–
–
–
–
–
fS = 38-kHz sample rate
0
1
0
–
–
–
–
–
fS = 44.1-kHz sample rate
0
1
1
–
–
–
–
–
fS = 48-kHz sample rate
1
0
0
–
–
–
–
–
fS = 88.2-kHz sample rate
1
0
1
–
–
–
–
–
fS = 96-kHz sample rate
1
1
0
–
–
–
–
–
fS = 176.4-kHz sample rate
1
1
1
–
–
–
–
–
fS = 192-kHz sample rate
–
–
–
0
0
0
–
–
MCLK frequency = 64 × fS
–
–
–
0
0
1
–
–
MCLK frequency = 128 × fS
–
–
–
0
1
0
–
–
MCLK frequency = 192 × fS
–
–
–
0
1
1
–
–
MCLK frequency = 256 × fS
–
–
–
1
0
0
–
–
MCLK frequency = 384 × fS
–
–
–
1
0
1
–
–
MCLK frequency = 512 × fS
–
–
–
1
1
X
–
–
Reserved
–
–
–
–
–
–
0
–
Bit clock (SCLK) frequency = 64 × fS or 32 × fS (selected in register 0x04)
(5)
(1)
(2)
(3)
(1)
(4)
–
–
–
–
–
–
1
–
Bit clock (SCLK) frequency = 48 × fS
–
–
–
–
–
–
–
0
Clock not valid (in manual mode only)
–
–
–
–
1
Clock valid (in manual mode only)
(1)
(2)
(3)
(4)
(5)
(1)
(1)
Default values are in bold.
Rate not available for 32-, 44.1-, and 48-kHz data rates
Rate not available for 32-kHz data rate
Rate not available for 176.4-kHz and 192-kHz data rates
Rate only available for 192-fS and 384-fS MCLK frequencies
DEVICE ID REGISTER (0x01)
The device ID register contains the ID code for the firmware revision.
Table 9. Device ID Register (0x01)
D7
D6
D5
D4
D3
D2
D1
D0
0
–
–
–
–
–
–
–
Default
–
0
1
0
0
0
1
1
Identification code
(1)
FUNCTION
(1)
Default values are in bold.
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SLOS549A – JUNE 2008 – REVISED SEPTEMBER 2009 ................................................................................................................................................ www.ti.com
ERROR STATUS REGISTER (0x02)
Note that the error bits are sticky bits that are not cleared by the hardware. This means that the software must
clear the register (write zeroes) and then read them to determine if there are any persistent errors.
Table 10. Error Status Register (0x02)
D7
D6
D5
D4
D3
D2
D1
D0
–
1
–
–
–
–
–
–
PLL autolock error
–
–
1
–
–
–
–
–
SCLK error
–
–
–
1
–
–
–
–
LRCLK error
–
–
–
–
1
–
–
–
Frame slip
0
0
0
0
0
0
0
0
No errors
(1)
FUNCTION
(1)
Default values are in bold.
SYSTEM CONTROL REGISTER 1 (0x03)
System control register 1 has several functions:
Bit D7:
If 0, the dc-blocking filter for each channel is disabled.
If 1, the dc-blocking filter (–3 dB cutoff
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