TL7726
HEX CLAMPING CIRCUITS
SLAS078C – SEPTEMBER 1993 – REVISED JULY 1999
D
D
D
D
D
D
D OR P PACKAGE
(TOP VIEW)
Protects Against Latch-Up
25-mA Current Sink in Active State
Less Than 1-mW Dissipation in Standby
Condition
Ideal for Applications in Environments
Where Large Transient Spikes Occur
Stable Operation for All Values of
Capacitive Load
No Output Overshoot
GND
CLAMP
CLAMP
CLAMP
1
8
2
7
3
6
4
5
REF
CLAMP
CLAMP
CLAMP
description
The TL7726 consists of six identical clamping circuits that monitor an input voltage with respect to a reference
value, REF. For an input voltage (VI) in the range of GND to < REF, the clamping circuits present a very high
impedance to ground, drawing current of less than 10 µA. The clamping circuits are active for VI < GND or
VI > REF when they have a very low impedance and can sink up to 25 mA.
These characteristics make the TL7726 ideal as protection devices for CMOS semiconductor devices in
environments where there are large positive or negative transients to protect analog-to-digital converters in
automotive or industrial systems. The use of clamping circuits provides a safeguard against potential latch-up.
The TL7726C is characterized for operation over the temperature range of 0°C to 70°C. The TL7726I is
characterized for operation over the temperature range of – 40°C to 85°C. The TL7726Q is characterized for
operation over the temperature range of – 40°C to 125°C.
AVAILABLE OPTIONS
SOIC (D)
PLASTIC DIP (P)
TA
0°C to 70°C
TL7726CD
TL7726CP
– 40°C to 85°C
TL7726ID
TL7726IP
– 40°C to 125°C
TL7726QD
TL7726QP
The D package is available taped and reeled. Add the suffix R to the
device type (i.e., TL7726CDR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
TL7726
HEX CLAMPING CIRCUITS
SLAS078C – SEPTEMBER 1993 – REVISED JULY 1999
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Reference voltage, Vref . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Clamping current, IIK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA
Junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Package thermal impedance, θJA (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
recommended operating conditions
MIN
MAX
4.5
5.5
Reference voltage, Vref
VI ≥ Vref
VI ≤ GND
Input clamping current
current, IIK
25
– 25
TL7726C
Operating free-air temperature range, TA
0
70
TL7726I
– 40
85
TL7726Q
– 40
125
UNIT
V
mA
°C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK +
VIK –
Positive clamp voltage
IZ
Reference current
II
TEST CONDITIONS
II = 20 mA
II = 20 mA
Negative clamp voltage
MIN
TYP‡
Vref
– 200
Vref = 5 V
Vref – 50 mV ≤ VI ≤ Vref
GND ≤ VI ≤ 50 mV
Input current
50 mV ≤ VI ≤ Vref – 50 mV
MAX
UNIT
Vref + 200
0
mV
60
µA
25
mV
10
µA
– 10
–1
1
‡ All typical values are at TA = 25°C.
switching characteristics specified at TA = 25°C
PARAMETER
ts
2
Settling time
TEST CONDITIONS
VI(system) = ±13 V,,
Measured at 10% to 90%,
POST OFFICE BOX 655303
RI = 600 Ω,,
See Figure 1
• DALLAS, TEXAS 75265
MIN
tt < 1 µs,
µ ,
MAX
30
UNIT
µs
TL7726
HEX CLAMPING CIRCUITS
SLAS078C – SEPTEMBER 1993 – REVISED JULY 1999
PARAMETER MEASUREMENT INFORMATION
VCC = 5 V
REF
600 Ω
VI(system)
CLAMP
TL7726
GND
TEST CIRCUIT
90%
13 V
VIK
0V
VI(system)
VIK +
95%
5%
VIK –
10%
– 13 V
ts
tt
tt
INPUT WAVEFORM
ts
CLAMP WAVEFORM
Figure 1. Switching Characteristics
100 mA
25 mA
10 mA
1 mA
II
100 µA
10 µA
1 µA
VIK–
Vref – 50 mV
– VI
VI
50 mV
VIK+
– 1 µA
– 10 µA
II
– 100 µA
– 1 mA
– 10 mA
– 25 mA
– 100 mA
GND
Vref
Figure 2. Tolerance Band for Clamping Circuit
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
TL7726
HEX CLAMPING CIRCUITS
SLAS078C – SEPTEMBER 1993 – REVISED JULY 1999
APPLICATION INFORMATION
VCC = 5 V
VI(system)
(input signal)
10 kΩ
II(system)
VI
II
Device to Be
Protected, e.g.,
A/D Converter,
Microprocessor, etc.
IZ
1/6
TL7726
Vref
Example: If II >> II(system), i.e., VI(system) > Vref + 200 mV
where:
II(system) = Input current to the device being protected
VI(system) = Input voltage to the device being protected
then the maximum input voltage
VI(system)max = Vref + IImax(10kΩ)
= 5 V + 25 mA(10kΩ)
= 5 V + 250 V
= 255 V
Figure 3. Typical Application
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TL7726CD
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
7726C
Samples
TL7726CDR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
7726C
Samples
TL7726CP
ACTIVE
PDIP
P
8
50
RoHS & Green
NIPDAU
N / A for Pkg Type
0 to 70
TL7726CP
Samples
TL7726ID
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
7726I
Samples
TL7726IDR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
7726I
Samples
TL7726IP
ACTIVE
PDIP
P
8
50
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
TL7726IP
Samples
TL7726IPE4
ACTIVE
PDIP
P
8
50
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
TL7726IP
Samples
TL7726QD
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
7726Q
Samples
TL7726QDG4
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
7726Q
Samples
TL7726QDR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
7726Q
Samples
TL7726QDRG4
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
7726Q
Samples
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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