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TLK1102ERGET

TLK1102ERGET

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VQFN-24_4X4MM-EP

  • 描述:

    TLK1102E 11.3-GBPS DUAL CHANNEL

  • 数据手册
  • 价格&库存
TLK1102ERGET 数据手册
TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 11.3-Gbps Dual-Channel Cable and PC Board Equalizer • FEATURES 1 • Dual-Channel Multi-Rate Operation up to 11.3Gbps • Two-Wire Serial Interface (with 8 Selectable Device Addresses) or Device Pin Control • Compensates for up to 30dB Loss on the Receive Side and up to 7dB Loss on the Transmit Side at 5.65GHz • Adjustable Input Equalization Level • Adjustable Output De-Emphasis: 0 - 7dB • Adjustable Input Bandwidth: 4.5 - 11GHz • Adjustable CML Output Swing: 225 1200mVp-p • Loss of Signal (LOS) Detection • Output Disable with Selectable Auto-Squelch Function • Output Polarity Switch • Excellent High Frequency Input and Output Return Loss 23 AC Coupling APPLICATIONS • • • High-Speed Links In Communication and Data Systems Backplane, Daughtercard, and Cable Interconnects for 10GE, 8GFC, 10GFC, 10G SONET, SAS, SATA, and InfiniBand QSFP, SFP+, XFP, SAS, SATA, and InfiniBand Active Cable Assemblies Up to 20-meter 100 W Cable or Equivalent Backplane Link 100 W Differential PCB Interconnect Up to 11.3 Gbps Differential Input Signal • • Surface Mount Small Footprint 4-mm × 4-mm 24-Pin QFN Package Single 3.3V Supply -40°C to 100°C Operation (Lead Temperature) TLK1102E 100 W Differential PCB Interconnect AC Coupling Up to 20-meter 100 W Cable or Equivalent Backplane Link 100 W Differential PCB Interconnect TLK1102E 100W Differential PCB Interconnect DESCRIPTION The TLK1102E is a versatile and flexible high-speed dual-channel equalizer for applications in digital high-speed links with data rates up to 11.3Gbps. The TLK1102E can be configured in many ways through its two-wire serial interface, available through the SDA and the SCL pins, to optimize its performance. The configurable parameters include the output de-emphasis settable from 0 to 7dB, the output differential voltage swing settable from 225 to 1200mVp-p, the input equalization level settable for 0 to 20 meters of 24-AWG twinaxial cable, 0 to 40 inches of FR-4 PCB interconnect, or equivalent interconnect (see Table 1), the input filter bandwidth settable from 4.5 to 11GHz, and the LOS (loss of signal) assert voltage level. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Spectra-Strip, SKEWCLEAR, XCede are registered trademarks of Amphenol Corporation. SI is a trademark of Park Electrochemical Corporation. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated TLK1102E SLLS958 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION (CONTINUED) Alternatively, the TLK1102E can be configured using its configuration pins in two modes selectable using the MODE pin. In Pin Control Mode 1 (see Figure 2b), a common setting can be set for the two channels for the output de-emphasis level and the interconnect length using the DE pin and LN0, LN1 pins respectively. In Pin Control Mode 2 (see Figure 2c), those parameters can be set individually for the two channels using DEA, DEB, LNA, and LNB pins. In both modes only a common setting is available for the output voltage swing using the SWG pin. For Pin Control Mode 2 the typical LOS assert and de-assert voltage levels are fixed at 90mVp-p and 150mVp-p respectively with 4.0dB hysteresis. The outputs can be disabled using the DISA and DISB pins. The DISA/DISB pins and the LOSA/LOSB pins can be connected together to implement an external output squelch function. The TLK1102E implements an internal output squelch function that can be enabled using the two-wire serial interface. In addition, a special fast auto-squelch function can be selected through the two-wire serial interface when needed to support SAS and SATA out-of-band (OOB) signals. The POLA and POLB pins can be used to reverse the polarity of the OUTA+/OUTA- and OUTB+/OUTB– pins respectively. The high input signal dynamic range ensures low jitter output signals even when overdriven with input signal swings as high as 1600mVp-p differential. The low-frequency cut-off is low enough to support low-frequency control signals such as SAS and SATA OOB signals. The loss-of-signal detection and output disable functions are carefully designed to meet SAS/SATA OOB signal timing constraints. Table 1. Equalization Level Settings CABLE LENGTH (meters) (1.8dB/m loss at 5 GHz) 2 PIN MODE 1 PIN MODE 2 TWO-WIRE SERIAL I/F MODE (registers 3 and 6) LN1 LN0 LNA / LNB EQ3 EQ2 EQ1 EQ0 0–2 GND GND GND 1 1 1 1 2–6 GND VCC GND 0 1 1 1 6 – 11 VCC GND 1.8 MΩ to GND 0 1 0 1 11 – 15 VCC VCC VCC 0 0 0 0 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 BLOCK DIAGRAM A simplified block diagram of the TLK1102E is shown in Figure 1 for the two-wire serial interface control mode. This compact, low power, 11.3-Gbps dual-channel equalizer consists of a high-speed data path with an offset cancellation block combined with an analog input threshold selection circuitry, a loss of signal detection block, a two-wire interface with a control-logic block, a bandgap voltage reference, and a bias current generation block. VCC GND Offset Cancellation VCC VCC 50 W 50 W Input Buffer with Selectable Bandwidth Output Driver Equalizer Stage Output Buffer 50 W 50 W IN[B:A]+ OUT[B:A]+ IN[B:A]– OUT[B:A]– LOS[B:A] Loss of Signal Detection SDA SDA SCL SCL DISA DISA DISB MODE CS 4-Bit 2 ´ 7-Bit General Settings Control Settings 2 ´ 4-Bit De-emphasis 2 ´ 4-Bit Output Swing 2 ´ 4-Bit Input Bandwidth 2 ´ 4-Bit Equalization Level DISB MODE CS RST RST ADD0 ADD0 ADD1 ADD1 ADD2 ADD2 2 ´ 7-Bit LOS Assert Level 2 ´ 1-Bit Fast LOS Control 2 ´ 1-Bit LOS Status Bandgap Voltage Reference and Bias Current Generation Power-On Reset 2-Wire Interface and Control Logic Figure 1. Simplified Block Diagram of the TLK1102E Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E 3 TLK1102E SLLS958 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com PACKAGE 18 INA+ Top View Exposed Thermal Pad must be soldered to GND INB+ EP INB- INA- VCC GND VCC GND OUTB+ INB+ OUTB- INB- 13 6 LOSA DISA OUTAVCC Exposed Thermal Pad must be soldered to GND VCC OUTB+ EP 12 7 DE LOSA DISA SWG POLA (b) Pin Control Mode 1 LNA LNB OUTB13 6 LOSB DISB MODE SCL SDA CS SWG Top View (a) Two-Wire Serial Interface Control Mode 1 POLA OUTA+ 12 7 18 LOSB GND OUTA- 19 DISB GND OUTA+ INA+ 24 MODE INA- 1 POLB 19 LN1 LN0 LOSA DISA ADD2 ADD1 24 LOSL 1 ADD0 RST For the TLK1102E a small footprint 4-mm × 4-mm 24-pin QFN package is used, with a lead pitch of 0.5mm. Three pin-outs are available for this device as shown in Figure 2. The pin-out in Figure 2a is applicable for the case where the device is setup to be controlled through the two-wire serial interface. The pin-outs in Figure 2b and Figure 2c are applicable for the cases where the device is setup to be controlled through the device configuration pins. The MODE pin controls the pinout as described in the TERMINAL FUNCTIONS tables. 24 19 18 INA+ OUTA+ Top View INAGND OUTAVCC Exposed Thermal Pad must be soldered to GND GND VCC OUTB+ INB+ EP INB- OUTB13 6 12 LOSB DISB MODE POLB DEB DEA 7 (c) Pin Control Mode 2 Figure 2. Pin-Out of the TLK1102E in a 4-mm × 4-mm 24-Pin QFN Package 4 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 TERMINAL FUNCTIONS - TWO-WIRE SERIAL INTERFACE CONTROL MODE Pin descriptions for the TLK1102E in a 4-mm x 4-mm 24-pin QFN package when the device is set to be controlled using the two-wire serial interface. This mode is selected through setting the MODE pin (pin 10) to high level. PIN SYMBOL TYPE DESCRIPTION 1, 2 INA+, INA- analog-in First pair of differential data inputs. Each pin is on-chip 50Ω terminated to VCC. 3, 4 GND supply Circuit ground. 5, 6 INB+, INB- analog-in Second pair of differential data inputs. Each pin is on-chip 50Ω terminated to VCC. 7 CS digital-in Chip Select pin. Disables the two-wire serial interface when set to low level. Internally pulled up. 8 SDA digital-in/out Bidirectional serial data pin for the two-wire serial interface. Open drain. Connect to a 10kΩ pull-up resistor if used. Leave open if unused. 9 SCL digital-in Serial clock pin for the two-wire serial interface. Connect to a 10kΩ pull-up resistor if used. Leave open if unused. Internally pulled up to VCC with a 500kΩ resistor. 10 MODE three-state Device control mode select. Pull up to VCC for the two-wire serial interface control mode. 11 DISB digital-in Disables CML output stage for OUTB+ and OUTB- when set to high level. Internally pulled down. 12 LOSB digital-out High level indicates that the input signal amplitude on INB+/INB- is below the programmed threshold level. Open drain. Requires an external 10kΩ pull-up resistor to VCC for proper operation. 13, 14 OUTB-, OUTB+ analog-out Second pair of differential data outputs. Each pin is on-chip 50Ω terminated to VCC. 15, 16 VCC supply 3.3V ± 10% supply voltage. 17, 18 OUTA-, OUTA+ analog-out First pair of differential data outputs. Each pin is on-chip 50Ω terminated to VCC. 19 LOSA digital-out High level indicates that the input signal amplitude on INA+/INA- is below the programmed threshold level. Open drain. Requires an external 10kΩ pull-up resistor to VCC for proper operation. 20 DISA digital-in Disables CML output stage for OUTA+ and OUTA- when set to high level. Internally pulled down. ADD2, ADD1, ADD0 digital-in Configurable least significant bits (ADD[2:0]) of the two-wire serial interface device address. The fixed most significant bits (ADD[6:3]) of the 7-bit device address are 0101. The default address is 0101100. These pins are internally pulled up. Pull down externally to invert the associated bits. 24 RST digital-in Reset pin. Resets all the device digital circuits when set to high level. Internally pulled down. EP EP 21, 22, 23 Exposed die pad (EP) must be grounded. TERMINAL FUNCTIONS - PIN CONTROL MODE 1 Pin descriptions for the TLK1102E in a 4-mm x 4-mm 24-pin QFN package when the device is set for Pin Control Mode 1. This mode is selected through setting the MODE pin (pin 10) to low level. PIN SYMBOL TYPE DESCRIPTION 1, 2 INA+, INA- analog-in First pair of differential data inputs. Each pin is on-chip 50Ω terminated to VCC. 3, 4 GND supply Circuit ground. 5, 6 INB+, INB- analog-in Second pair of differential data inputs. Each pin is on-chip 50Ω terminated to VCC. 7 DE analog-in Output signal de-emphasis control. A 0 to 1.2-V controlling voltage on this pin adjusts output de-emphasis on OUTA and OUTB pins from 0 to 7dB. 8 LOSL analog-in LOS threshold control. A 0 to 0.7-V controlling voltage on this pin adjusts the LOS assert and de-assert levels on INA and INB pins. 9 POLB digital-in Output data signal polarity select for OUTB+/OUTB- pins. Internally pulled up. Set to high level or leave open for normal polarity. Set to low level for inverted polarity. 10 MODE three-state Device control mode select. Tie to GND for pin control mode 1. 11 DISB digital-in Disables CML output stage for OUTB+ and OUTB- when set to high level. Internally pulled down. 12 LOSB digital-out High level indicates that the input signal amplitude on INB+/INB- is below the programmed threshold level. Open drain. Requires an external 10kΩ pull-up resistor to VCC for proper operation. 13, 14 OUTB-, OUTB+ analog-out Second pair of differential data outputs. Each pin is on-chip 50Ω terminated to VCC. 15, 16 VCC supply 3.3V ± 10% supply voltage. 17, 18 OUTA-, OUTA+ analog-out First pair of differential data outputs. Each pin is on-chip 50Ω terminated to VCC. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E 5 TLK1102E SLLS958 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com PIN SYMBOL TYPE DESCRIPTION 19 LOSA digital-out High level indicates that the input signal amplitude on INA+/INA- is below the programmed threshold level. Open drain. Requires an external 10kΩ pull-up resistor to VCC for proper operation. 20 DISA digital-in Disables CML output stage for OUTA+ and OUTA- when set to high level. Internally pulled down. 21 SWG three-state OUTA, OUTB swing control. Tie to VCC for 1200mVp-p swing, tie to GND for 225mVp-p swing, or pull down with a 1.8MΩ resistor for 600mVp-p swing. 22 POLA digital-in Output data signal polarity select for OUTB+/OUTB- pins. Internally pulled up. Set to high level or leave open for normal polarity. Set to low level for inverted polarity. LN1, LN0 digital-in Equalization level setting. Internally pulled up. Each pin supports two logic levels: high and low – four settings in the following low to high equalization order: LN1=LN0=0; LN1=0 LN0=1; LN1=1 LN0=0; LN1=LN0=1 23, 24 EP EP Exposed die pad (EP) must be grounded. TERMINAL FUNCTIONS - PIN CONTROL MODE 2 Pin descriptions for the TLK1102E in a 4-mm x 4-mm 24-pin QFN package when the device is set for Pin Control Mode 2. This mode is selected through pulling down the MODE pin (pin 10) with a 1.8-MΩ resistor. PIN 6 SYMBOL TYPE DESCRIPTION 1, 2 INA+, INA- analog-in First pair of differential data inputs. Each pin is on-chip 50Ω terminated to VCC. 3, 4 GND supply Circuit ground. 5, 6 INB+, INB- analog-in Second pair of differential data inputs. Each pin is on-chip 50Ω terminated to VCC. 7 DEA analog-in Output signal de-emphasis control for OUTA. A 0 to 1.2-V controlling voltage on this pin adjusts output de-emphasis on OUTA+/OUTA- pins from 0 to 7dB. 8 DEB analog-in Output signal de-emphasis control for OUTB. A 0 to 1.2-V controlling voltage on this pin adjusts output de-emphasis on OUTB+/OUTB- pins from 0 to 7dB. 9 POLB digital-in Output data signal polarity select for OUTB+/OUTB- pins. Internally pulled up. Set to high level or leave open for normal polarity. Set to low level for inverted polarity. 10 MODE three-state Device control mode select. Pull down with a 1.8MΩ resistor for pin control mode 2. 11 DISB digital-in Disables CML output stage for OUTB+ and OUTB- when set to high level. Internally pulled down. 12 LOSB digital-out High level indicates that the input signal amplitude on INB+/INB- is below the programmed threshold level. Open drain. Requires an external 10kΩ pull-up resistor to VCC for proper operation. 13, 14 OUTB-, OUTB+ analog-out Second pair of differential data outputs. Each pin is on-chip 50Ω terminated to VCC. 15, 16 VCC supply 3.3V ± 10% supply voltage. 17, 18 OUTA-, OUTA+ analog-out First pair of differential data outputs. Each pin is on-chip 50Ω terminated to VCC. 19 LOSA digital-out High level indicates that the input signal amplitude on INA+/INA- is below the programmed threshold level. Open drain. Requires an external 10kΩ pull-up resistor to VCC for proper operation. 20 DISA digital-in Disables CML output stage for OUTA+ and OUTA- when set to high level. Internally pulled down. 21 SWG three-state OUTA, OUTB swing control. Tie to VCC for 1200mVp-p swing, tie to GND for 225mVp-p swing, or pull down with a 1.8MΩ resistor for 600mVp-p swing. 22 POLA digital-in Output data signal polarity select for OUTB+/OUTB- pins. Internally pulled up. Set to high level or leave open for normal polarity. Set to low level for inverted polarity. 23 LNA three-state Equalization level setting. Supports three equalization settings. Tie to VCC for high setting, tie to GND for low setting, or pull down with 1.8MΩ resistor for medium setting. Internally tied to VCC/2. 24 LNB three-state Equalization level setting. Supports three equalization settings. Tie to VCC for high setting, tie to GND for low setting, or pull down with 1.8MΩ resistor for medium setting. Internally tied to VCC/2. EP EP Exposed die pad (EP) must be grounded. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT VCC Supply voltage (2) -0.3 to 4.0 V VIN+, VIN- Voltage at INA+, INA-, INB+, INB- (2) 0.5 to 4.0 V -0.3 to 4.0 V (2) VIO Voltage at pin 7 to 11 and pin 20 to 24 VIN,DIFF Differential voltage between INA+ and INA-, and between INB+ and INB- IIN+, IIN- ±2.5 V Continuous current at data inputs -25 to 25 mA IOUT+, IOUT- Continuous current at data outputs -35 to 35 mA ILOS Sink current at LOSA and LOSB outputs 25 mA ESD ESD rating at all pins 2.5 kV (HBM) TJ,max Maximum junction temperature 125 °C (1) (2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX 2.95 3.3 3.6 V 100 °C VCC Supply voltage TA Operating lead temperature -40 VIH CMOS input high voltage 2.1 VIL CMOS input low voltage UNIT V 0.7 V DC ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER VCC Supply voltage ICC Supply current TEST CONDITIONS MIN TYP MAX 2.95 3.3 3.6 600mVp-p SWG setting (CML output current included) 170 230 1200mVp-p SWG setting (CML output current included) 225 290 LOS high voltage ISOURCE = 50µA; 10kΩ Pull-up to VCC on LOSA or LOSB pin 2.4 LOS low voltage ISINK = 10mA; 10kΩ Pull-up to VCC on LOSA or LOSB pin UNIT V mA V 0.4 V AC ELECTRICAL CHARACTERISTICS Typical operating condition is at VCC = 3.3V and TA = 25°C. Over recommended operating conditions (unless otherwise noted) PARAMETER VIN,MIN VIN,MAX TEST CONDITIONS Low frequency -3dB bandwidth With 0.1µF input AC-coupling capacitors Data input sensitivity BER < 10-12 , K28.5 pattern at 11.3Gbps over a 10m 28AWG cable including two SMA connectors (27dB loss at 5.65GHz), SWG = 600mVp-p setting, no de-emphasis, maximum interconnect length setting. Voltage measured at the input of the cable. Data input overload BER < 10–12 , K28.5 pattern at 11.3Gbps, K28.5 pattern at 11.3Gbps over a 15m 24AWG cable including two SMA connectors (29dB loss at 5.65GHz), SWG = 600mVp-p setting, no de-emphasis, maximum interconnect length setting. Voltage measured at the input of the cable. MIN TYP MAX UNIT 30 50 kHz 250 mVp-p 1600 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E mVp-p 7 TLK1102E SLLS958 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com AC ELECTRICAL CHARACTERISTICS (continued) Typical operating condition is at VCC = 3.3V and TA = 25°C. Over recommended operating conditions (unless otherwise noted) PARAMETER VOD VCM,OUT Differential data output voltage swing Data output common-mode voltage MIN TYP MAX DIS = Low, SWG = Low, VIN = 400mVp-p, no de-emphasis, no interconnect loss. TEST CONDITIONS 150 225 350 DIS = Low, SWG = 600mVp-p setting, VIN = 400mVp-p, no de-emphasis, no interconnect loss. 400 600 800 DIS = Low, SWG = High, VIN = 400mVp-p, no de-emphasis, no interconnect loss. 800 1200 1600 DIS = Low, SWG = Low, VIN = 400mVp-p, no de-emphasis, no interconnect loss, 50Ω to VCC output termination. VCC-0.12 VCC-0.08 VCC-0.04 DIS = Low, SWG = 600mVp-p setting, VIN = 400mVp-p, no de-emphasis, no interconnect loss, 50Ω to VCC output termination. VCC-0.29 VCC-0.205 VCC-0.12 DIS = Low, SWG = High, VIN = 400mVp-p, no de-emphasis, no interconnect loss, 50Ω to VCC output termination. VCC-0.65 VCC-0.45 VCC-0.25 UNIT mVp-p V VCM,RIP Common-mode output ripple DIS = Low, SWG = 600mVp-p setting, K28.5 pattern at 11.3Gbps, no interconnect loss, 600mV on DE pin, VIN = 1600mVp-p. 2 5 mVRMS VOD,RIP Differential output ripple DIS = High, K28.5 pattern at 11.3Gbps, no interconnect loss, VIN = 1600mVp-p. 15 20 mVp-p DE DJ RJ Output de-emphasis Deterministic jitter Random jitter K28.5 pattern at 11.3Gbps on both channels, no interconnect loss, VIN = 400mVp-p, SWG = 600mVp-p setting, no de-emphasis. 0 K28.5 pattern at 11.3Gbps on both channels, no interconnect loss, VIN = 400mVp-p, SWG = 600mVp-p setting, maximum de-emphasis level. 7 K28.5 pattern at 11.3Gbps on both channels, 10m 28AWG cable (27dB loss at 5.65GHz), VIN = 400mVp-p, SWG = 600mVp-p setting, 600mV on DE pin, maximum interconnect length setting. 8 K28.5 pattern at 11.3Gbps on both channels, 15m 24AWG cable (29dB loss at 5.65GHz), VIN = 400mVp-p, SWG = 600mVp-p setting, 600mV on DE pin, maximum interconnect length setting. 12 K28.5 pattern at 11.3Gbps on both channels, 10m 28AWG cable (27dB loss at 5.65GHz), VIN = 400mVp-p, SWG = 600mVp-p setting, 600mV on DE pin, maximum interconnect length setting. 1.2 K28.5 pattern at 11.3Gbps on both channels, 15m 24AWG cable (29dB loss at 5.65GHz), VIN = 400mVp-p, SWG = 600mVp-p setting, 600mV on DE pin, maximum interconnect length setting. 1.4 dB psp-p psRMS JPXT Crosstalk jitter penalty Channel A: K28.5 pattern at 11.3Gbps, 15m 24AWG cable (29dB loss at 5.65GHz), VIN = 600mVp-p, Register 2 = 10h (offset cancellation OFF), Register 3 = 01h (equalizer filter 1 OFF), Register 4 = 66h (680mVpp output swing, 3.3dB output de-emphasis); Channel B: Repeated 1010 pattern at 11.3Gbps, no interconnect line loss, VIN = 600mVp-p, Register 6 = 10h (offset cancellation OFF), Register 7 = 0Fh (all equalizer filters OFF), Register 8 = F6h (680mVpp output swing, 7dB output de-emphasis); tR Output rise time 20% to 80%, No interconnect line, VIN = 400mVp-p, SWG = 600mVp-p setting, no de-emphasis 28 tF Output fall time 20% to 80%, no interconnect loss, VIN = 400mVp-p, SWG = 600mVp-p setting, no de-emphasis 28 8 Submit Documentation Feedback 3 psp-p ps Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 AC ELECTRICAL CHARACTERISTICS (continued) Typical operating condition is at VCC = 3.3V and TA = 25°C. Over recommended operating conditions (unless otherwise noted) PARAMETER SDD11 Differential input return loss SDD22 Differential output return loss SCC22 Common-mode output return loss VAS LOS assert threshold voltage VDAS LOS de-assert threshold voltage LOS hysteresis TAS/DAS TEST CONDITIONS MIN TYP 0.01GHz < f < 4.1GHz See (1) 4.1GHz < f < 12.1GHz See (2) 0.01GHz < f < 4.1GHz See (1) 4.1GHz < f < 12.1GHz See (2) 0.01GHz < f < 7.5GHz See (3) 7.5GHz < f < 12.1GHz See (4) K28.5 Pattern at 11.3Gbps, no interconnect loss, LOSL = Open (also applies to Pin Control Mode 2) 45 90 K28.5 Pattern at 11.3Gbps, no interconnect loss, V(LOSL) = 0.7V 70 140 MAX dB dB dB mVp-p K28.5 Pattern at 11.3Gbps, no interconnect loss, LOSL = Open (also applies to Pin Control Mode 2) 150 300 K28.5 Pattern at 11.3Gbps, no interconnect, V(LOSL) = 0.7V 235 500 20log(VDAS / VAS) LOS assert/De-assert time UNIT mVp-p 2.5 4.0 1/10 2/20 dB 4/30 µs VFAS Fast LOS assert threshold voltage K28.5 Pattern at 11.3Gbps, no interconnect loss, Reg 5/9 = 10111111b VFDAS Fast LOS de-assert threshold voltage K28.5 Pattern at 11.3Gbps, no interconnect loss, Reg 5/9 = 10111111b 220 mVp-p Fast LOS hysteresis 20log(VFDAS / VFAS) 3.3 dB 5 ns 2 ns 2 ps 165 ps TSQUELCH Squelch time Fast auto-squelch mode, no interconnect loss, 600mVp-p input swing, K28.5 pattern, 1.5Gbps, SWG = 600mVp-p setting. Time from input off to output voltage < 120mVp-p TDIS Disable response time TSKEW Channel-to-channel skew OUTB+/ OUTB– relative to OUTA+/OUTA– Latency from IN[B:A]+/ IN[B:A]– to OUT[B:A]+/OUT[B:A]– (1) (2) (3) (4) 150 mVp-p Differential return loss given by SDD11, SDD22 = 12.3 - 13 log10(f/5.5), f in GHz Differential return loss given by SDD11, SDD22 = 18 - 2 √f, f in GHz Common-mode output return loss given by SCC22 = 12 - 2.8f, f in GHz Common-mode output return loss given by SCC22 = 5.2 - 0.08f, f in GHz Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E 9 TLK1102E SLLS958 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com TWO-WIRE SERIAL INTERFACE AND CONTROL LOGIC FUNCTIONAL DESCRIPTION The TLK1102E uses a two-wire serial interface for digital control. The two circuit inputs, SDA and SCL, are driven respectively by the serial data and serial clock from a microcontroller, for example. Both inputs require 10kΩ pull-up resistors to VCC when used. For driving these inputs, an open-drain output is recommended. The two-wire interface allows write access to the internal memory map to modify control registers and read access to read out control and status signals. The TLK1102E is a slave device only which means that it cannot initiate a transmission itself; it always relies on the availability of the clock (SCL) signal for the duration of the transmission. The master device provides the clock signal as well as the START and STOP commands. The protocol for a data transmission is as follows: 1. START command 2. 7-bit slave address (0101A2A1A0) followed by an eighth bit which is the data direction bit (R/W). A zero indicates a WRITE and a 1 indicates a READ. The default slave address is 0101100. The A2,A1, and A0 address bits change with the status of the ADD2, ADD1, and ADD0 device pins, respectively. Those pins are internally pulled up. Pulling down the ADD[2:0] pins changes the address to 0101011. Table 2 summarizes the slave address settings: 3. 8-bit register address 4. 8-bit register data word 5. STOP command Table 2. Slave Address Settings ADD2 ADDR1 ADDR0 SLAVE ADDRESS 0 0 0 0101011 0 0 1 0101010 0 1 0 0101001 0 1 1 0101000 1 0 0 0101111 1 0 1 0101110 1 1 0 0101101 1 1 1 0101100 Regarding timing, the TLK1102E is I2C-compatible. The typical timing is shown in Figure 3 and a complete data transfer is shown in Figure 4. Parameters for Figure 3 are defined in Table 3. Bus Idle: Both SDA and SCL lines remain HIGH Start Data Transfer: A change in the state of the SDA line, from HIGH to LOW, while the SCL line is HIGH, defines a START condition (S). Each data transfer is initiated with a START condition. Stop Data Transfer: A change in the state of the SDA line from LOW to HIGH while the SCL line is HIGH defines a STOP condition (P). Each data transfer is terminated with a STOP condition; however, if the master still wishes to communicate on the bus, it can generate a repeated START condition and address another slave without first generating a STOP condition. Data Transfer: The number of data bytes transferred between a START and a STOP condition is not limited and is determined by the master device. The receiver acknowledges the transfer of data. 10 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge bit. The transmitter releases the SDA line and a device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable LOW during the HIGH period of the acknowledge clock pulse. Setup and hold times must be taken into account. When a slave-receiver does not acknowledge the slave address, the data line must be left HIGH by the slave. The master can then generate a STOP condition to abort the transfer. If the slave-receiver does acknowledge the slave address but some time later in the transfer cannot receive any more data bytes, the master must abort the transfer. This is indicated by the slave generating the not acknowledge on the first byte to follow. The slave leaves the data line HIGH and the master generates the STOP condition. SDA tBUF tLOW tr tf tHIGH tHDSTA SCL P S S tHDDAT tHDSTA P tSUDAT tSUSTA tSUSTO Figure 3. Two-Wire Serial Interface Timing Diagram. Table 3. Two-Wire Serial Interface Timing Diagram Definitions SYMBOL PARAMETER MIN MAX UNIT 400 kHz fSCL SCL Clock frequency tBUF Bus free time between START and STOP conditions 1.3 µs tHDSTA Hold time after repeated START condition. After this period, the first clock pulse is generated 0.6 µs tLOW Low period of the SCL clock 1.3 µs tHIGH High period of the SCL clock 0.6 µs tSUSTA Setup time for a repeated START condition 0.6 µs tHDDAT Data HOLD time 0 µs tSUDAT Data setup time tR Rise time of both SDA and SCL signals tF Fall time of both SDA and SCL signals tSUSTO Setup time for STOP condition 100 ns 300 ns 300 ns µs 0.6 SDA SCL 1-7 S SLAVE ADDRESS 8 R/W 9 ACK 1-7 8 REGISTER ADDRESS 9 ACK 8 1-7 REGISTER FUNCTION 9 ACK P Figure 4. Two-Wire Serial Interface Data Transfer Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E 11 TLK1102E SLLS958 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com REGISTER MAPPING The register mapping for read/write register addresses 0 (0x00) through 15 (0x0F) are shown in Table 4 to Table 19. Table 20 describes the circuit functionality based on the register settings. Table 4. Register 0x00 - General Device Settings REGISTER ADDRESS 0x00 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 RESET PWRDOWN Reserved Reserved Reserved Reserved LOSRNG CHA_TRACK Table 5. Register 0x01 – Reserved REGISTER ADDRESS 0x01 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Table 6. Register 0x02 – Control A Control Settings REGISTER ADDRESS 0x02 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 INOFF OUTOFF LOSOFF OCOFF Reserved SQUELCH POL DISABLE Table 7. Register 0x03 – Control A Input Settings REGISTER ADDRESS 0x03 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 BW3 BW2 BW1 BW0 EQ3 EQ2 EQ1 EQ0 Table 8. Register 0x04 – Channel A Output Settings REGISTER ADDRESS 0x04 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 DEEM3 DEEM2 DEEM1 DEEM0 AMP3 AMP2 AMP1 AMP0 Table 9. Register 0x05 – Channel A LOS Settings REGISTER ADDRESS 0x05 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 FAST LOSLVL6 LOSLVL5 LOSLVL4 LOSLVL3 LOSLVL2 LOSLVL1 LOSLVL0 Table 10. Register 0x06 – Channel B Control Settings REGISTER ADDRESS 0x06 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 INOFF OUTOFF LOSOFF OCOFF Reserved SQUELCH POL DISABLE Table 11. Register 0x07 – Channel B Input Settings REGISTER ADDRESS 0x07 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 BW3 BW2 BW1 BW0 EQ3 EQ2 EQ1 EQ0 Table 12. Register 0x08 – Channel B Output Settings REGISTER ADDRESS 0x08 12 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 DEEM3 DEEM2 DEEM1 DEEM0 AMP3 AMP2 AMP1 AMP0 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 Table 13. Register 0x09 – Channel B LOS Settings REGISTER ADDRESS 0x09 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 FAST LOSLVL6 LOSLVL5 LOSLVL4 LOSLVL3 LOSLVL2 LOSLVL1 LOSLVL0 Table 14. Register 0x0A – Reserved REGISTER ADDRESS 0x0A BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Table 15. Register 0x0B – Reserved REGISTER ADDRESS 0x0B BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Table 16. Register 0x0C – Reserved REGISTER ADDRESS 0x0C BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Table 17. Register 0x0D – Reserved REGISTER ADDRESS 0x0D BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Table 18. Register 0x0E – Device Status REGISTER ADDRESS 0x0E BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Reserved Reserved Reserved Reserved Reserved Reserved LOS_CHB LOS_CHA Table 19. Register 0x0F – Reserved REGISTER ADDRESS 0x0F BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E 13 TLK1102E SLLS958 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com Table 20. Register Functionality REGISTER BIT(s) 0 7 RESET Software Reset Resets all registers 6 PWRDOWN Powerdown Set high to power down the device. In powerdown mode the the current consumption about 2.5mA 1 2 3 14 NAME DESCRIPTION FUNCTION DEFAULT 00000000 5-2 Reserved 1 LOSRNG LOS Range Select Set to high to increase LOS detection sensitivity 0 CHA_TRACK Channel A Tracking Mode All settings from channel A will be used for both channels, A and B 7 Reserved 6 Reserved 5 Reserved 4 Reserved 3 Reserved 2 Reserved 1 Reserved 0 Reserved 7 INOFF Channel A Input Off Set high to power down channel A input stages 6 OUTOFF Channel A Output Off Set high to power down channel A output driver and buffer 5 LOSOFF Channel A LOS Detector Off Set high to power down channel A input signal detector 4 OCOFF Channel A Offset Cancellation Off Disables channel A offset cancellation circuit 3 Reserved 2 SQUELCH Channel A Squelch Mode High activates channel A internal output squelch function 1 POL Channel A Polarity Switch Set to high to change polarity of channel A output signal 0 DISABLE Channel A Output Disable Set to high to disable channel A output data and keep common mode level 7 BW3 Channel A Bandwidth Select 3 (MSB) 0000 -> highest bandwidth 1111 -> lowest bandwidth 6 BW2 Channel A Bandwidth Select 2 5 BW1 Channel A Bandwidth Select 1 4 BW0 Channel A Bandwidth Select 0 (LSB) 3 EQ3 Channel A EQ Filter Stage 3 Control (MSB) Set to high to switch off channel A EQ filter 3 2 EQ2 Channel A EQ Filter Stage 2 Control Set to high to switch off channel A EQ filter 2 1 EQ1 Channel A EQ Filter Stage 1 Control Set to high to switch off channel A EQ filter 1 0 EQ0 Channel A EQ Filter Stage 0 Control (LSB) Set to high to switch off channel A EQ filter 0 00000000 Submit Documentation Feedback 00000000 00000000 Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 Table 20. Register Functionality (continued) REGISTER BIT(s) 4 7 DEEM3 Channel A Output De-emphasis 3 (MSB) 6 DEEM2 Channel A Output De-emphasis 2 5 DEEM1 Channel A Output De-emphasis 1 4 DEEM0 Channel A Output De-emphasis 0 (LSB) 3 AMP3 Channel A Output Amplitude 3 (MSB) 2 AMP2 Channel A Output Amplitude 1 AMP1 Channel A Output Amplitude 1 0 AMP0 Channel A Output Amplitude 0 (LSB) 7 FAST Channel A Fast Signal Detection Mode Set to high to select fast signal detection mode on channel A 6 LOSLVL6 Channel A LOS Threshold Level 6 (MSB) 0000000 -> Minimum LOS assert level 1001100 -> Maximum LOS assert level Settings out of the above range are not supported 5 LOSLVL5 Channel A LOS Threshold Level 5 4 LOSLVL4 Channel A LOS Threshold Level 4 3 LOSLVL3 Channel A LOS Threshold Level 3 2 LOSLVL2 Channel A LOS Threshold Level 2 1 LOSLVL1 Channel A LOS Threshold Level 1 0 LOSLVL0 Channel A LOS Threshold Level 0 (LSB) 7 INOFF Channel B Input Off Set high to power down channel B input stages 6 OUTOFF Channel B Output Off Set high to power down channel B output driver and buffer 5 LOSOFF Channel B LOS Detector Off Set high to power down channel B input signal detector 4 OCOFF Channel B Offset Cancellation Off Disables channel B offset cancellation circuit 3 Reserved 2 SQUELCH Channel B Squelch Mode High activates channel B internal output squelch function 1 POL Channel B Polarity Switch Set to high to change polarity of channel B output signal 0 DISABLE Channel B Output Disable Set to high to disable channel B output data and keep common mode level 5 6 NAME DESCRIPTION FUNCTION 0000 -> no peaking 1111 -> highest peaking DEFAULT 00000000 0000 -> 225mVp-p 1111-> 1200mVp-p approximately 60mVp-p per step 00000000 00000000 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E 15 TLK1102E SLLS958 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com Table 20. Register Functionality (continued) REGISTER BIT(s) 7 7 BW3 Channel B Bandwidth Select 3 (MSB) 6 BW2 Channel B Bandwidth Select 2 5 BW1 Channel B Bandwidth Select 1 4 BW0 Channel B Bandwidth Select 0 (LSB) 3 EQ3 Channel B EQ Filter Stage 3 Control (MSB) Set to high to switch off channel B EQ filter 3 2 EQ2 Channel B EQ Filter Stage 2 Control Set to high to switch off channel B EQ filter 2 1 EQ1 Channel B EQ Filter Stage 1 Control Set to high to switch off channel B EQ filter 1 0 EQ0 Channel B EQ Filter Stage 0 Control (LSB) Set to high to switch off channel B EQ filter 0 7 DEEM3 Channel B Output De-emphasis 3 (MSB) 0000 -> no peaking 1111 -> highest peaking 6 DEEM2 Channel B Output De-emphasis 2 5 DEEM1 Channel B Output De-emphasis 1 4 DEEM0 Channel B Output De-emphasis 0 (LSB) 3 AMP3 Channel B Output Amplitude 3 (MSB) 2 AMP2 Channel B Output Amplitude 1 AMP1 Channel B Output Amplitude 1 0 AMP0 Channel B Output Amplitude 0 (LSB) 7 FAST Channel B Fast Signal Detection Mode Set to high to select fast signal detection mode on channel B 6 LOSLVL6 Channel B LOS Threshold Level 6 (MSB) 0000000 = Minimum LOS assert level 1001100 = Maximum LOS assert level Settings outside the above range are not supported 5 LOSLVL5 Channel B LOS Threshold Level 5 4 LOSLVL4 Channel B LOS Threshold Level 4 3 LOSLVL3 Channel B LOS Threshold Level 3 2 LOSLVL2 Channel B LOS Threshold Level 2 1 LOSLVL1 Channel B LOS Threshold Level 1 0 LOSLVL0 Channel B LOS Threshold Level 0 (LSB) 8 9 16 NAME DESCRIPTION FUNCTION 0000 -> highest bandwidth 1111 -> lowest bandwidth DEFAULT 00000000 00000000 0000 -> 225mVp-p 1111-> 1200mVp-p approximately 60mVp-p per step Submit Documentation Feedback 00000000 Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 Table 20. Register Functionality (continued) REGISTER BIT(s) 10 7 Reserved 6 Reserved 5 Reserved 4 Reserved 3 Reserved 2 Reserved 1 Reserved 0 Reserved 7 Reserved 6 Reserved 5 Reserved 4 Reserved 3 Reserved 2 Reserved 1 Reserved 0 Reserved 7 Reserved 6 Reserved 5 Reserved 4 Reserved 3 Reserved 2 Reserved 1 Reserved 0 Reserved 7 Reserved 6 Reserved 5 Reserved 4 Reserved 3 Reserved 2 Reserved 1 Reserved 0 Reserved 7 Reserved 6 Reserved 5 Reserved 4 Reserved 3 Reserved 2 Reserved 1 LOS_CHB LOS Channel B Indicates LOS at input channel B 0 LOS_CHA LOS Channel A Indicates LOS at input channel A 11 12 13 14 NAME DESCRIPTION FUNCTION DEFAULT 00000000 00000000 00000000 00000000 00000000 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E 17 TLK1102E SLLS958 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com Table 20. Register Functionality (continued) REGISTER BIT(s) 15 7 Reserved 6 Reserved 5 Reserved 4 Reserved 3 Reserved 2 Reserved 1 Reserved 0 Reserved 18 NAME DESCRIPTION FUNCTION DEFAULT 00000000 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 TYPICAL CHARACTERISTICS Typical operating condition is at VCC = 3.3V and TA = 25°C, VIN = 400mVp-p (signal generator output), output swing = 600mVp-p setting, no interconnect line at the output, and with default device settings (unless otherwise noted). Optimum input equalization level and output de-emphasis settings were used for the cable and backplane measurements. Differential S-parameter characteristics of Spectra-Strip® SKEWCLEAR® EXD twinaxial cables and a 40-inch N4000-13 SI™ backplane link with Amphenol XCede® backplane connectors used for the measurements captured in this document are as shown in Figure 5. 0 Differential S-parameter Magnitude - dB -10 -20 -30 -40 -50 -60 Insertion Loss - 15m 24AWG Cable -70 Insertion Loss - 10m 28AWG Cable Insertion Loss - 40in PCB Link Return Loss - 15m 24AWG Cable Return Loss - 10m 28AWG Cable -80 -90 0 Return Loss - 40in PCB Link 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 f - Frequency - GHz Figure 5. Typical Differential S-Parameter Characteristics of Twinaxial Cable and PCB Interconnect Lines Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E 19 TLK1102E SLLS958 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) DIFFERENTIAL EQUALIZER INPUT SIGNAL (TOP) AND OUTPUT SIGNAL (BOTTOM) AT 12Gbps USING A K28.5 PATTERN Input Voltage 50 mV/div Input Interconnect: 15 meters 24AWG Twinaxial Cable Output Voltage 200 mV/div Output Voltage 200 mV/div Input Voltage 50 mV/div Input Interconnect: 15 meters 24AWG Twinaxial Cable Input Interconnect: 10 meters 28AWG Twinaxial Cable Input Interconnect: 10 meters 28AWG Twinaxial Cable Output Voltage 200 mV/div Output Voltage 200 mV/div Input Voltage 50 mV/div t – Time – 500 ps/div Input Voltage 50 mV/div t – Time – 40 ps/div t – Time – 500 ps/div Input Interconnect: 40 inches Backplane Link Input Interconnect: 40 inches Backplane Link Output Voltage 200 mV/div Output Voltage 200 mV/div Input Voltage 50 mV/div Input Voltage 50 mV/div t – Time – 40 ps/div t – Time – 40 ps/div t – Time – 500 ps/div Figure 6. Equalizer Input and Output Signals with Different Interconnect Lines at 12Gbps 20 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 TYPICAL CHARACTERISTICS (continued) DIFFERENTIAL EQUALIZER INPUT SIGNAL (TOP) AND OUTPUT SIGNAL (BOTTOM) AT 11.3Gbps USING A K28.5 PATTERN Input Voltage 50 mV/div Input Interconnect: 15 meters 24AWG Twinaxial Cable Output Voltage 200 mV/div Output Voltage 200 mV/div Input Voltage 50 mV/div Input Interconnect: 15 meters 24AWG Twinaxial Cable Input Interconnect: 10 meters 28AWG Twinaxial Cable Input Interconnect: 10 meters 28AWG Twinaxial Cable Output Voltage 200 mV/div Output Voltage 200 mV/div Input Voltage 50 mV/div t – Time – 500 ps/div Input Voltage 50 mV/div t – Time – 40 ps/div t – Time – 500 ps/div Input Interconnect: 40 inches Backplane Link Input Interconnect: 40 inches Backplane Link Output Voltage 200 mV/div Output Voltage 200 mV/div Input Voltage 50 mV/div Input Voltage 50 mV/div t – Time – 40 ps/div t – Time – 40 ps/div t – Time – 500 ps/div Figure 7. Equalizer Input and Output Signals with Different Interconnect Lines at 11.3Gbps Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E 21 TLK1102E SLLS958 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) DIFFERENTIAL EQUALIZER INPUT SIGNAL (TOP) AND OUTPUT SIGNAL (BOTTOM) AT 10.3125Gbps USING A PRBS 231-1 PATTERN Output Voltage 200 mV/div Input Voltage 50 mV/div Input Interconnect: 15 meters 24AWG Twinaxial Cable t – Time – 40 ps/div Output Voltage 200 mV/div Input Voltage 50 mV/div Input Interconnect: 10 meters 28AWG Twinaxial Cable t – Time – 40 ps/div Output Voltage 200 mV/div Input Voltage 50 mV/div Input Interconnect: 40 inches Backplane Link t – Time – 40 ps/div Figure 8. Equalizer Input and Output Signals with Different Interconnect Lines at 10.3125Gbps. 22 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 TYPICAL CHARACTERISTICS (continued) DIFFERENTIAL EQUALIZER INPUT SIGNAL (TOP) AND OUTPUT SIGNAL (BOTTOM) AT 8.5Gbps USING A K28.5 PATTERN Input Voltage 50 mV/div Input Interconnect: 15 meters 24AWG Twinaxial Cable Output Voltage 200 mV/div Output Voltage 200 mV/div Input Voltage 50 mV/div Input Interconnect: 15 meters 24AWG Twinaxial Cable Input Interconnect: 10 meters 28AWG Twinaxial Cable Input Interconnect: 10 meters 28AWG Twinaxial Cable Output Voltage 200 mV/div Output Voltage 200 mV/div Input Voltage 50 mV/div t – Time – 500 ps/div Input Voltage 50 mV/div t – Time – 40 ps/div t – Time – 500 ps/div Input Interconnect: 40 inches Backplane Link Input Interconnect: 40 inches Backplane Link Output Voltage 200 mV/div Output Voltage 200 mV/div Input Voltage 50 mV/div Input Voltage 50 mV/div t – Time – 40 ps/div t – Time – 40 ps/div t – Time – 500 ps/div Figure 9. Equalizer Input and Output Signals with Different Interconnect Lines at 8.5Gbps. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E 23 TLK1102E SLLS958 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) RANDOM JITTER vs INPUT VOLTAGE (11.3Gbps, K28.5 Pattern, OC = OFF) RESIDUAL DETERMINISTIC JITTER vs INPUT VOLTAGE (11.3Gbps, K28.5 Pattern, OC = OFF) 18 2.0 DJ − Residual Deterministic Jitter − ps RJ − Random Jitter − psRMS 2.4 15m 24AWG Twinaxial Cable 1.6 10m 28AWG Twinaxial Cable 1.2 40-Inch Backplane Link 0.8 0.4 No Interconnect 15m 24AWG Twinaxial Cable 14 12 10 8 6 4 10m 28AWG Twinaxial Cable 2 0.0 40-Inch Backplane Link 0 0 300 600 900 1200 1500 1800 VIN − Input Voltage − mVpp 0 300 600 900 1200 1500 1800 VIN − Input Voltage − mVpp G001 G002 Figure 10. Figure 11. DIFFERENTIAL INPUT RETURN LOSS vs FREQUENCY DIFFERENTIAL OUTPUT RETURN LOSS vs FREQUENCY 0 0 −5 −5 −10 −10 Differential S22 − dB Differential S11 − dB No Interconnect 16 −15 −20 −25 −30 −35 −15 −20 −25 −30 −35 −40 −40 −45 −45 −50 −50 −55 0 2 4 6 8 10 12 14 16 f − Frequency − GHz 0 2 4 6 8 10 12 14 16 f − Frequency − GHz G003 G004 Figure 12. Figure 13. REGISTER 5/9 SETTING/LOSL PIN VOLTAGE vs LOS THRESHOLD VOLTAGE REGISTER 5/9 SETTING/LOSL PIN VOLTAGE vs LOS HYSTERESIS 80 0.7 80 0.7 0.6 70 0.6 0.5 50 0.4 40 Assert (2-Wire Serial I/F Mode) Deassert (2-Wire Serial I/F Mode) 0.3 30 0.2 20 0.1 10 60 2-Wire Serial I/F Mode 0.5 50 0.4 40 0.3 30 0.2 20 Pin Mode LOSL Pin Voltage − V 60 Register 5/9 Setting − dec Register 5/9 Setting − dec 70 LOSL Pin Voltage − V Assert (Pin Mode) 0.1 10 Deassert (Pin Mode) 0 0 50 100 150 200 250 VTH − LOS Threshold Voltage − mVpp 0.0 300 0 3.1 3.2 G005 Figure 14. 24 3.3 3.4 3.5 3.6 3.7 3.8 LOS Hysteresis − dB 3.9 4.0 0.0 4.1 G006 Figure 15. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E TLK1102E www.ti.com ................................................................................................................................................................................................... SLLS958 – MARCH 2009 TYPICAL CHARACTERISTICS (continued) LOS THRESHOLD VOLTAGE/LOS HYSTERESIS vs DATA RATE (V(LOSL)=700mV) 7.5 Deassert 200 6.5 Assert 150 5.5 100 4.5 Hysteresis 50 3.5 0 0 2 4 6 8 Data Rate − GHz 10 12 7.0 160 6.5 Deassert 140 6.0 120 5.5 100 5.0 Assert 80 4.5 60 4.0 Hysteresis 40 3.5 20 3.0 0 2.5 14 LOS Hysteresis − dB 250 VTH − LOS Threshold Voltage − mVpp 180 8.5 LOS Hysteresis − dB VTH − LOS Threshold Voltage − mVpp 300 LOS THRESHOLD VOLTAGE/LOS HYSTERESIS vs DATA RATE (V(LOSL)=OPEN) 0 2 G007 Figure 16. 4 6 8 10 12 2.5 14 Data Rate − GHz G008 Figure 17. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLK1102E 25 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TLK1102ERGER ACTIVE VQFN RGE 24 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 100 TLK 1102E TLK1102ERGET ACTIVE VQFN RGE 24 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 100 TLK 1102E (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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TLK1102ERGET
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