TLV4112TDA2

TLV4112-DIE www.ti.com SGLS411 – NOVEMBER 2012 HIGH-OUTPUT-DRIVE OPERATIONAL AMPLIFIER WITH SHUTDOWN FEATURES 1 • • • High Output Drive Rail-To-Rail Output Universal Operational Amplifier EVM DESCRIPTION The TLV4112 single-supply operational amplifier provides output currents in excess of 300 mA at 5 V. This enables standard pin-out amplifiers to be used as high current buffers or in coil driver applications. The TLV4112 offers the exceptional thermal impedance required for amplifiers delivering high current levels. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE TLV4112 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY TLV4112TDA1 400 TLV4112TDA2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TLV4112-DIE SGLS411 – NOVEMBER 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 10.5 mils. Silicon with backgrind Floating AlCuTiw 1540 nm Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated TLV4112-DIE www.ti.com SGLS411 – NOVEMBER 2012 Table 1. Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX 1OUT 1 234.75 121.75 334.75 221.75 1IN- 2 676.5 121.75 776.5 221.75 1IN+ 3 892.25 121.75 992.25 221.75 GND 4 1175.25 141.25 1275.25 241.25 N/C 5 1197.25 279.25 1274.25 356.25 2IN+ 6 1175.25 1048.25 1275.25 1148.25 2IN- 7 891.75 1048.25 991.75 1148.25 2OUT 8 539.5 1048.25 639.5 1148.25 N/C 9 318.25 1063 395.25 1140 VDD 10 121.75 1048.25 221.75 1148.25 N/C 11 121.75 933.25 198.75 1010.25 Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 PACKAGE OPTION ADDENDUM www.ti.com 26-May-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) TLV4112TDA1 ACTIVE 0 400 RoHS & Green Call TI N / A for Pkg Type 0 to 0 TLV4112TDA2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type 0 to 0 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of