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TMDS181RGZEVM

TMDS181RGZEVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    EVALUATION MODULE

  • 数据手册
  • 价格&库存
TMDS181RGZEVM 数据手册
User's Guide SLLU228A – October 2015 – Revised December 2015 TMDS181RGZ Evaluation Module This document describes how to use and configure the TMDS181RGZEVM (EVM) and provides recommendations for system hardware implementation. These recommendations are only guidelines and it is the designer’s responsibility to consider all system characteristics and requirements. Engineers should refer to the datasheet (SLASE75A) for technical details such as device operation, terminal description, and so forth. 1 2 3 4 5 6 7 8 Contents Overview ...................................................................................................................... 2 1.1 What is the TMDS181? ............................................................................................ 2 1.2 What is the TMDS181 EVM?...................................................................................... 2 1.3 What is Included in the TMDS181 EVM? ........................................................................ 2 1.4 What Does This EVM Look Like? ................................................................................ 3 Hardware Description ....................................................................................................... 4 2.1 Video Connectors for TMDS181 Ports ........................................................................... 4 2.2 Local I2C Access .................................................................................................... 4 2.3 Enable/Reset ........................................................................................................ 5 2.4 Power ................................................................................................................. 5 2.5 Jumper Configuration .............................................................................................. 6 2.6 Component Population Configuration ............................................................................ 6 Quick Start Guide ............................................................................................................ 7 3.1 USB Interface via TUSB3410 .................................................................................... 8 References .................................................................................................................. 12 EVM Bill of Materials ....................................................................................................... 13 EVM Schematics ........................................................................................................... 16 EVM Layout ................................................................................................................. 23 Total Phase Aardvark I2C Host Adapter Scripts ........................................................................ 24 List of Figures 1 TMDS181RGZEVM.......................................................................................................... 3 2 TMDS181RGZEVM Block Diagram ....................................................................................... 4 3 Eye Scan Opening Tab – Device Not Connected ....................................................................... 8 4 Register Status/Control Tab ................................................................................................ 9 5 TMDS181 HDMI 1.4B Operation ......................................................................................... 10 6 TMDS181 HDMI 2.0 Operation ........................................................................................... 10 7 Sample Eyescan at HDMI1.4B ........................................................................................... 11 8 Sample Eyescan at HDMI2.0 Raw ....................................................................................... 11 9 Sample Eyescan at HDMI2.0 Interpreted ............................................................................... 12 10 HDMI Input .................................................................................................................. 16 11 EVM Pin ..................................................................................................................... 17 12 HDMI TX Connector 13 Select Options .............................................................................................................. 19 14 RESET ....................................................................................................................... 20 15 Regulators ................................................................................................................... 21 ....................................................................................................... 18 HDMI is a registered trademark of HDMI Licensing, LLC.. Aardvark is a trademark of Total Phase, Inc.. SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TMDS181RGZ Evaluation Module 1 Overview www.ti.com 16 TUSB3410................................................................................................................... 22 17 Layer 1 (Top) 18 Layer 2 (GND) .............................................................................................................. 23 19 Layer 3 (Power) ............................................................................................................... 23 22 ............................................................................................................ Layer 4 (Power) ............................................................................................................ Layer 5 (GND) .............................................................................................................. Layer 6 (Bottom)............................................................................................................ 1 Aardvark I C (J5) Pin-out ................................................................................................... 4 2 TMDS181 Target I2C Address 3 SW1 DIP Switch Setting .................................................................................................... 6 4 EVM Bill of Materials ....................................................................................................... 13 20 21 23 23 23 23 List of Tables 2 1 Overview 1.1 What is the TMDS181? ............................................................................................. 5 The TMDS181 is a digital video interface (DVI) or high-definition multimedia interface (HDMI®) retimer and redriver. The TMDS181 supports four TMDS channels, audio return channel (SPDIF_IN/ARC_OUT), and digital display control (DDC) interfaces. The TMDS181 supports signaling rates up to 6Gbps to allow for the highest resolutions of 4k2k60p 24 bits per pixel and up to WUXGA 16-bit color depth or 1080p with higher refresh rates. The TMDS181 can be configured to support the HDMI2.0 standard. The TMDS181 automatically configures itself as a redriver at low data rate (< 1.0Gbps) or as a retimer above this data rate by default, or it can be set to redriver only or retimer only modes using I2C. 1.2 What is the TMDS181 EVM? The TMDS181 EVM is a PCB created to help customers evaluate the TMDS181 device for video applications with HDMI interfaces. This EVM can also be used as a hardware reference design for implementation of the TMDS181 in the RGZ package. PCB design/layout files can be provided upon request to provide PCB design illustrations of the routing/placement rules with a TMDS181 component. Please note that the EVM design supports the TMDS181 debug capabilities, so it contains components that would not be needed by a typical TMDS181 end-application. A separate reference design is available for customers. 1.3 What is Included in the TMDS181 EVM? The EVM contains the following major components: • TMDS181RGZ • Standard HDMI source connector (receptacle) • Standard HDMI sink connector (receptacle) • DC power regulators • I2C programming interface for external I2C host connection • USB interface (utility available to access registers) 2 TMDS181RGZ Evaluation Module SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Overview www.ti.com 1.4 What Does This EVM Look Like? Figure 1 illustrates the TMDS181RGZEVM. Figure 1. TMDS181RGZEVM SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TMDS181RGZ Evaluation Module 3 Hardware Description 2 www.ti.com Hardware Description Figure 2 contains the EVM block diagram. USB2 Connector 5-V Dongle 5-V to 3.3-V LDO Aardvark Connector TUSB3410 3.3-V to 1.2-V LDO SCL_CTL SDA_CTL TMDS_D2P/N IN1P/N TMDS_D1P/N TMDS181 (48-Pin QFN) IN2P/N TMDS_D0P/N IN3P/N TMDS_CLKP/N AUXP/N DDC_SCL/SDA HDMI Connector HDMI Connector Bottom IN0P/N DDC - Snoop Only for TMDS181 Figure 2. TMDS181RGZEVM Block Diagram 2.1 Video Connectors for TMDS181 Ports The EVM has two HDMI connections for video. P1 and P2 are standard HDMI connectors (Molex 471510001). 2.2 Local I2C Access Access to TMDS181’s local I2C signals is provided via the J5 input connector. Note that I2C signal levels should be at 3.3 V when the I2C interface is accessed through the connector. A standalone external I2C host can be connected via J5 for debug and control purposes. An example of an external I2C Host controller is the Total Phase Aardvark I2C/SPI host adapter (Total Phase Part#: TP240141). Sample scripts for this I2C host controller are provided by request. Table 1. Aardvark I2C (J5) Pin-out 4 J5 pin # Description J5 pin # Description 1 SCL_CTL 2 GND 3 SDA_CTL 4 NC 5 NC 6 NC 7 NC 8 NC 9 NC 10 GND TMDS181RGZ Evaluation Module SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Hardware Description www.ti.com 2 Table 2. TMDS181 Target I C Address TMDS181 I2C Target Address Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 A6 A5 A4 A3 A2 A1 A0 1 0 1 1 1 1 0 Bit 0 (W/R) 0/1 7 Bit Address = 5Eh NOTE: The target I2C address for TMDS181 can be modified with the EVM jumper settings. 2.3 Enable/Reset There are three device enable/reset options to use with the EVM. (A) Supervisor Circuitry Option This is the default configuration on the TMDS181 EVM. The enable (EN) signal is held low until the power good (PG) from the 3.3-V voltage regulator reaches a stable high voltage level, then it is released high. (B) RC Timing Option C26 external capacitor and internal resistor are used to control the EN ramp time after the device is powered on. C26 is a do not install (DNI) option by default. C26 needs to be installed and R77 needs to be uninstalled to enable this option. (C) External Control Option A push button (SW1) is provided for manual control of the TMDS181’s EN/OE input. 2.4 Power A DC power jack (J9) to accept a 5-V wall power adapter is provided on the EVM. The DC power jack (CUI Inc. PJ-202AH) has an inner diameter of 2.1 mm and an outer diameter of 5.5 mm. The tip of the +5V power supply must be positive. A +5-V power supply of at least 1.5 A that meets the above requirements can be used to power the TMDS181RGZEVM. Power is provided to the EVM when SW2 is set to position 1. NOTE: Care should be taken not to plug in any power source higher than the configuredvoltage V) voltage (5 V). Alternately, it is possible to power the EVM by connecting a micro-USB cable to a host and setting SW2 to position 3. Please note that to prevent any back driving of 5 V in the system, TMDS181RGZEVMs have been configured to receive 5 V from the HDMI source connection to drive the Board_5V. This has been done by removing U6 and installing R104 on the EVMs. SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TMDS181RGZ Evaluation Module 5 Hardware Description 2.5 www.ti.com Jumper Configuration Jumpers are provided to operate the device/EVM in different configurations. Table 3. SW1 DIP Switch Setting DIP SW No J1 Signal Name Description Default Config HPD_SRC JP 1-2 for not used JP 2-3 JP 2-3 for TMDS181 Allows for 3.3-V to 5-V transition of HPD_SRC signal JP 1-2 for I2C ENABLE NC J3 I2_EN_PIN J4 SCL JP 2-3 for pin strap J6 SDA JP 1-2 for USB IF TO I2C JP 1-2 JP 2-3 for EXT IF TO I2C USB I2C Interface JP 1-2 for USB IF TO I2C JP 1-2 2 J7 A1 JP 2-3 for EXT IF TO I C USB I2C Interface JP 1-2 for: NC • I2C Addr bit A1 = 1, when I2C_EN = H JP 2-3 for: • I2C Addr bit A1 = 0, when I2C_EN = H NC for weak internal pulldown (Normal mode) J8 VSADJ JP 1-2 for 6.8 kΩ JP 1-2 JP 2-3 for adjustable resistance J11 SIG_EN JP 1-2 for Signal Detect Enabled NC JP 2-3 for Signal Detect Disabled NC for internal pulldown (Signal Detect Disabled) J12 EQ_SEL_A0 JP 1-2 for: NC • I2C Addr bit A0 = 1, when I2C_EN = H • Fixed EQ at 14 dB @ 3G, when I2C_EN = L JP 2-3 for: • I2C Addr bit A0 = 0, when I2C_EN = H • Fixed EQ at 7.5 dB @ 3G, when I2C_EN = L NC for Adaptive EQ J14 TX_TERM_CTL JP 1-2 for no transmit term NC JP 2-3 for transmit term in 75–150 Ω NC for auto select of term J15 PRE_SEL JP 1-2 for not used NC JP 2-3 for –2.5 dB de-emphasis NC for 0 dB J17 SWAP_POL JP 1-2 for RX Polarity Swap (Retimer Mode Only) NC JP 2-3 for RX Lane Swap NC for normal 2.6 2.6.1 Component Population Configuration HPD Snoop Option To accommodate systems that do not properly resend DDC commands after HPD goes low, TI has implemented an HPD snoop mode on the TMDS181RGZEVM. This mode allows the HPD line to be routed around the TMDS181, but remain connected to the TMDS181 on the sink side to allow the TMDS181 to snoop its state. This snoop mode is disabled, by default, on the TMDS181RGZEVMs. • Pop R131, no pop R129, R130 for HPD on • No pop R131, pop R129, R130 for HPD snoop only 6 TMDS181RGZ Evaluation Module SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Quick Start Guide www.ti.com 2.6.2 DDC Snoop Option To accommodate systems that do not properly support clock stretching on the DDC lines, TI has implemented a snoop mode on the TMDS181RGZEVM. This mode allows the DDC lines to be routed around the TMDS181, but remain connected to the TMDS181 on the sink side to allow the TMDS181 to snoop the DDC traffic. This snoop mode is enabled on the TMDS181RGZEVMs, by default. • Pop R16, R17, R24, R25. No pop R123, R124, R125, R126 - TMDS181, DDC on • No pop R16, R17, R24, R25. Pop R123, R124, R125, R126 - TMDS181, DDC snoop only 3 Quick Start Guide Use the following steps as a quick-start guide: 1. Apply 5-V power to the EVM, turn on SW2. 2. If using external I2C configuration instead of pin straps, configure the TMDS181 at this step. 3. Plug in an HDMI source using a standard HDMI cable into P1 (Standard HDMI connector). LED D2 should light up. 4. Plug in an HDMI video sink device into P2 (Standard HDMI connector) using a standard HDMI cable. 5. Video output on HDMI sink should be observed. SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TMDS181RGZ Evaluation Module 7 Quick Start Guide 3.1 www.ti.com USB Interface via TUSB3410 Access to the USB interface is provided through the TUSB3410 using a USB TI Utility called Eye Scan. To use the utility: • Install the Eye Scan software from Texas Instruments • Set J6 to SDA – SDA_USB • Set J4 to SCL – SCL_USB • Connect the USB micro cable from J13 to the USB host and power on the EVM prior to installing the HDMI cables. This is required since the HDMI_5V can back drive the 3.3 V on the EVM and cause the USB interface chip not to enumerate correctly on the EVM. • Start the Eye Scan software Figure 3. Eye Scan Opening Tab – Device Not Connected Confirm that the SN65DP149/159/TMDS171/181 interface is present and selected. If it is not, check the USB connection and confirm that the driver is loaded in Device Manager. 8 TMDS181RGZ Evaluation Module SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Quick Start Guide www.ti.com Figure 4. Register Status/Control Tab Select the Register Status/Control tab and hit Refresh. TMDS181 should appear in the Device ID field. Various registers can be accessed by selecting the tabs. The Script Mode tab can also be used to both read and write registers The HDMI Control Tab can be used to determine if the TMDS181 is running at HDMI 1.4B speeds or HDMI 2.0 speeds: SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TMDS181RGZ Evaluation Module 9 Quick Start Guide www.ti.com Figure 5. TMDS181 HDMI 1.4B Operation Figure 6. TMDS181 HDMI 2.0 Operation The Eyescan tab can be used to generate an eye of the signal at the TMDS181 receiver. No eye is generated for the clock lane. 10 TMDS181RGZ Evaluation Module SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Quick Start Guide www.ti.com Figure 7. Sample Eyescan at HDMI1.4B Please note that at HDMI 2.0 speeds there is a bug that causes invalid eyescan results. Results that look like this: Figure 8. Sample Eyescan at HDMI2.0 Raw Should be interpreted as this: SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TMDS181RGZ Evaluation Module 11 References www.ti.com Figure 9. Sample Eyescan at HDMI2.0 Interpreted 4 References 1. 2. 3. 4. 12 TMDS181 Product Preview Aardvark™ Adapter User Manual High-Definition Multimedia Interface Specification Version 1.4b. High-Definition Multimedia Interface Specification Version 2.0. TMDS181RGZ Evaluation Module SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated EVM Bill of Materials www.ti.com 5 EVM Bill of Materials Table 4 lists the EVM BOM. Table 4. EVM Bill of Materials Item Qty Reference Part PCB Footprint Manufacturer Part Number Pkg Click to Order Description 1 5 C4,C5,C6,C7,C52 1 uF 603 Taiyo Yuden LMK107B7105KA-T 603 587-1242-1-ND CAP CER 1UF 10V 10% X7R 0603 2 12 C9,C10,C17,C18,C19,C2 1,C23,C29,C40,C46,C59, C60 0.1uF 402 Yageo CC0402KRX5R6BB104 402 311-1336-1-ND CAP CERAMIC .1UF 10V X5R 0402 3 5 C8,C20,C35,C36,C57 10uF 805 TDK C2012X5R1A106K125AB 805 445-7660-1-ND CAP CER 10UF 10V 10% X5R 0805 4 1 C31 10uF 805 TDK C2012X5R1C106K085A C 805 445-7644-1-ND CAP CER 10UF 16V 10% X5R 0805 5 5 C22,C37,C41,C42,C47 0.01uF 402 Murata GRM155R71H103KA88D 402 490-4516-1-ND CAP CER 10000PF 50V 10% X7R 0402 6 0 C26 - DNI DNI_200nF 402 Taiyo Yuden LMK105BJ224KV-F 402 587-1228-2-ND CAP CER 0.22UF 10V 10% X5R 0402 7 1 C27 18pF 402 AVX 04025A180JAT2A 402 478-1073-1-ND CAP CERM 18PF 5% 50V NP0 0402 8 1 C28 220pF 402 Taiyo Yuden UMK105B7221KV-F 402 587-1218-1-ND CAP CER 220PF 50V 10% X7R 0402 9 1 C30 220uF 7343 Kemet T495X337K010ATE060 7343 399-10429-1-ND CAP TANT 220UF 16V 10% 2917 10 1 C34 3.3 nF 402 Samsung CL05B332KB5NNNC 402 1276-1552-1-ND CAP CER 3300PF 50V 10% X7R 0402 11 1 C32 22uF 805 Murata GRM21BR60J226ME39L 805 490-1719-2-ND CAP CER 22UF 6.3V 20% X5R 0805 12 2 C39,C58 2.2uF 805 Taiyo Yuden EMK212BJ225KG-T 805 587-1293-2-ND CAP CER 2.2UF 16V 10% X5R 0805 13 0 R35,R87,R92,R93,R120, C38, R129, R130, R24,R25,R16,R17 - DNI DNI 402 / 201 14 2 C45,C49 22pF 402 Murata GRM1555C1H220JA01D 402 490-5868-1-ND CAP CER 22PF 50V 5% NP0 0402 15 2 C50,C51 33pF 402 Murata GRM1555C1H330JA01D 402 490-5936-2-ND CAP CER 33PF 50V 5% NP0 0402 16 1 D1 Zener 6V SOT23 Diodes Inc. MMBZ5233B-FDICT-ND SOT23 MMBZ5233B-FDICT-ND DIODE ZENER 6V 350MW SOT23-3 17 1 D2 LED Green 0805 805 Lite On LTST-C171GKT 805 160-1423-1-ND LED GREEN CLEAR THIN 0805 SMD 18 1 JP1 JUMPER HDR_THVT_1x2_100 3M 961102-6404-AR HDR2X1 3M9447-ND CONN HEADER VERT SGL 2POS GOLD 19 11 J1,J3,J4,J6,J7,J8,J11,J12 ,J14,J15,J17 HDR3X1 M .1 HDR_THVT_1x3_100 3M 961103-6404-AR HDR3X1 3M9448-ND CONN HEADER VERT SGL 3POS GOLD 20 1 J5 Header 5x2 0.1" thru-hole con_thvt_shrd_2x5_100_ m 3M N2510-6002-RB con_thvt_shrd_2x5_10 0_m MHC10K-ND CONN HEADER 10 POS STRGHT GOLD 21 1 J9 2.1mm x 5.5mm PJ-202AH CUI Inc. PJ-202AH (PJ-002AH) 2.1mm x 5.5mm CP-202AH-ND CONN PWR JACK 2.1X5.5MM HIGH CUR 22 1 J13 USB Micro B USB Micro B FCI 10103592-0001LF USB MICRO 609-4048-2-ND CONN RCPT REV MICRO USB B R/A 23 17 LP1,LP2,LP3,LP4,LP5,LP 6,LP7,LP8,LP9,LP10,LP1 1,LP12,LP13,LP14,LP15, LP16,LP17 LP TESTLOOP Keystone Electronics 5006 THRU 36-5006-ND TEST POINT PC COMPACT .063"D BLK 24 1 L1 2.2 uH 1008 TDK VLS252010ET-2R2M 1008 445-6629-1-ND INDUCTOR POWER 2.2UH 1.3A SMD 25 1 L2 1 uH 1008 TDK NLCV25T-1R0M-EFR 1008 445-17086-1-ND INDUCTOR POWER 1.0UH 1008 26 1 P1 HDMI_IN CON_HDMI_RT_19_0p5 0mm Molex 471510001 CON_HDMI_RT_19_0 p50mm WM19086CT-ND CONN RCPT 19POS HDMI RT ANG SMD 27 1 P2 HDMI_OUT CON_HDMI_RT_19_0p5 0mm Molex 471510001 CON_HDMI_RT_19_0 p50mm WM19086CT-ND CONN RCPT 19POS HDMI RT ANG SMD 28 2 Q1,Q2 FDV301N_NFET_8V SOT23 Fairchild Semiconductor FD301N SOT23 FDV301NCT-ND MOSFET N-CH 25V 220MA SOT-23 29 1 R5 100 402 Yageo RC0402FR-07100RL 402 311-100LRCT-ND RES SMD 100 OHM 5% 1/16W 0402 SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback TMDS181RGZ Evaluation Module Copyright © 2015, Texas Instruments Incorporated 13 EVM Bill of Materials www.ti.com Table 4. EVM Bill of Materials (continued) Item Qty Reference Part PCB Footprint Manufacturer Part Number Pkg Click to Order Description 30 6 R10,R11,R99,R100,R101 ,R121 1K 402 Yageo RC0402JR-071KL 402 311-1.0KJRCT-ND RES SMD 1K OHM 5% 1/16W 0402 31 2 R12,R81 100K 402 Yageo RC0402JR-07100KL 402 311-100KJRCT-ND RES SMD 100K OHM 5% 1/16W 0402 32 1 R13 10 402 Yageo RC0402JR-0710RL 402 311-10JRCT-ND RES SMD 10 OHM 5% 1/16W 0402 33 5 R34,R123,R124,R125,R1 26 0 201 Panasonic ERJ-1GN0R00C 201 P15979CT-ND RES SMD 0.0 OHM JUMPER 1/20W 34 2 R58,R59 2K 402 Yageo RC0402JR-072KL 402 311-2.0KJRTR-ND RES SMD 2K OHM 5% 1/16W 0402 35 8 R77,R80,R83,R84,R89,R 104,R122,R131 0 402 Panasonic ERJ-2GE0R00X 402 P0.0JTR-ND RES SMD 0.0 OHM JUMPER 1/10W 36 1 R127 500K 402 Yageo RC0402FR-07499KL 402 311-499KLRTR-ND RES SMD 499K OHM 1% 1/16W 0402 37 1 R36 75 402 Yageo RC0402JR-0775RL 402 311-75JRTR-ND RES SMD 75 OHM 5% 1/16W 0402 38 14 R57,R60,R61,R62,R63,R 64,R66,R68,R69,R70,R7 1,R72,R73,R74 65K 402 Yageo RC0402FR-0764K9L 402 311-64.9KLRTR-ND RES SMD 64.9K OHM 1% 1/16W 0402 39 1 R75 7.06K (6.98K OK) 402 Vishay Dale CRCW04026K98FKED 402 541-6.98KLTR-ND RES SMD 6.98K OHM 1% 1/16W 0402 40 1 R76 PTV09 10K POT THRUHOLE BOURNS PTV09A-4015F-B103 THRUHOLE PTV09A-4015F-B103-ND POT 10K OHM 9MM SQ .05W CARB 41 3 R78,R98,R102 10K 402 Yageo RC0402JR-0710KL 402 311-10KJRTR-ND RES SMD 10K OHM 5% 1/16W 0402 42 2 R79,R88 4.7K 402 Yageo RC0402JR-074K7L 402 311-4.7KJRTR-ND RES SMD 4.7K OHM 5% 1/16W 0402 43 1 R82 500 402 Vishay Dale CRCW0402499RDHEDP 402 541-499AVTR-ND RES SMD 499 OHM 0.5% 1/16W 0402 44 1 R85 750K 402 Vishay Dale CRCW0402750KJNED 402 541-750KJTR-ND RES SMD 750K OHM 5% 1/16W 0402 45 1 R86 240K 402 Vishay Dale CRCW0402240KJNED 402 541-240KJTR-ND RES SMD 240K OHM 5% 1/16W 0402 46 1 R90 2.21K 402 Yageo RC0402FR-072K21L 402 311-2.21KLRTR-ND RES SMD 2.21K OHM 1% 1/16W 0402 47 1 R91 4.42K 402 Stackpole RMCF0402FT4K42 402 RMCF0402FT4K42TR-ND RES SMD 4.42K OHM 1% 1/16W 0402 48 1 R94 1.5K 402 Yageo RC0402JR-071K5L 402 311-1.5KJRTR-ND RES SMD 1.5K OHM 5% 1/16W 0402 49 2 R95,R96 33 201 Yageo RC0201JR-0733RL 201 311-33NTR-ND RES SMD 33 OHM 5% 1/20W 0201 50 1 R103 15K 402 Yageo RC0402JR-0715KL 402 311-15KJRTR-ND RES SMD 15K OHM 5% 1/16W 0402 51 3 R45,R46,R115 47K 402 Rohm MCR01MRTJ473 402 RHM47KCETR-ND RES SMD 47K OHM 5% 1/16W 0402 52 1 SW1 PB_SWITCH SW_MOM_2NO OMRON B3SN-3012P SW_MOM_2NO SW261CT-ND SWITCH TACTILE SPST-NO 0.05A 24V 53 1 SW2 3POS_SPDT THRUHOLE_3POS NKK Switches MS13ANW03 THRUHOLE_3POS 360-2386-ND SW SLIDE SPDT 6A SILVER STR 125V 54 1 U1 TMDS181RGZ 48_RGZ TI 55 1 U3 TPS3808G30DBVT 6DBV TI TPS3808G30DBVT 6DBV 296-26944-1-ND IC VOLT SUPERVISOR 3.0V SOT23-6 56 1 U4 TPS62150A RGT16 TI TPS62150ARGTT RGT16 296-36472-1-ND IC REG BUCK SYNC ADJ 1A 16QFN 57 0 U6 - DNI TPS61240 - DNI 6DRV TI TPS61240DRVT 6DRV 296-24519-1-ND IC REG BOOST SYNC 5V 0.45A 6SON 58 1 U5 TPS74201RGWT RGW20 TI TPS74201RGWT RGW20 296-19891-1-ND IC REG LDO ADJ 1.5A 20VQFN 59 1 U7 TUSB3410 LQFP32 TI TUSB3410VF LQFP-32 296-12699-ND IC CONV SERIAL-TO-USB 32-LQFP 60 1 U8 24LC256 8SOIC ON Semiconductor CAT24C256W 8SOIC CAT24C256WI-GT3OSCTND IC EEPROM 256KBIT 400KHZ 8SOIC 61 1 Y1 12 MHz Crystal ECX-32 ECS Inc. ECS-120-20-33-TR 4-SMD XC1808CT-ND CRYSTAL 12MHZ 20PF SMD 62 1 U16 TPD2E001 drl_5pin TI TPD2E001 drl_5pin 296-21883-2-ND TVS DIODE 5.5VWM 100VC SOT5 63 4 EVM Assembly 0.75" Standoff 4-40 - F/F Keystone Electronics 2029 OD 0.187" 36-2029-ND ROUND STANDOFF 4-40 ALUM 3/4" 64 4 EVM Assembly 0.25"- Stainless Steel Screws 4-40 Phillips Panhead Building Fasteners PMSSS 440 0025 PH OD 0.187" H703-ND MACHINE SCREW PAN PHILLIPS 4-40 14 48_RGZ TMDS181RGZ Evaluation Module SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated EVM Bill of Materials www.ti.com Table 4. EVM Bill of Materials (continued) Item Qty Reference Part PCB Footprint Manufacturer Part Number Pkg Click to Order Description 65 4 Shunts Shunt SHUNT 3M 969102-0000-DA SHUNT 3M9580-ND SHUNT JUMPER .1" BLACK GOLD 66 1 PCB TMDS181RGZEVM SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback TMDS181RGZ Evaluation Module Copyright © 2015, Texas Instruments Incorporated 15 EVM Schematics 6 www.ti.com EVM Schematics Figure 10 to Figure 16 illustrate the EVM schematics. BOARD_5V HDMI RX 20 21 Case1 Case2 P1 HDMI_IN HDMI_IN IN_D2P PAGE2,3 IN_D2N IN_D1P PAGE2,3 PAGE2,3 IN_D1N IN_D0P PAGE2,3 PAGE2,3 IN_D0N IN_CLKP PAGE2,3 PAGE2,3 R16 47K 0402 5% HDR3X1 M .1 HPD_SRC R17 47K 0402 PAGE4 HPD_SRC_CONN 5% 3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 R10 1K 0402 HPD_SRC 1 HPD_SRC_HDMI_RX_CONN 2 3 HPD_SRC_CONN 1 3 2 1 2 FDV301N_NFET_8V FDV301N_NFET_8V HDMI_IN_5V HPD_SRC_HDMI_RX_CONN LP15 LP16 LP17 IN_CLKN PAGE2,3 HDMI_CEC_SNK PAGE4 HDMI_CEC_SRC ARC_OUT HDMI_SCL_SRC_IN HDMI_SDA_SRC_IN R24 R25 R104 0 0 SCL_SRC SDA_SRC R126 0 R124 R123 0 0 Pop R104 if U6 is no pop No pop R104 if U6 is pop LP1 ARC_OUT_2 R125 0 Pop R16, R17, R24, R25. No pop R123, R124, R125, R126 - TMDS181, DDC on No pop R16, R17, R24, R25. Pop R123, R124, R125, R126 - TMDS181, DDC snoop only PAGE2,3 PAGE2,3 LP2 ARC_OUT_2 SPDIF_IN_2 SPDIF_IN_2 LP3 ARC_OUT PAGE2,3 PAGE2,3 0 HDMI_SCL_SRC HDMI_SDA_SRC PAGE3 PAGE3 R12 100K 0402 Q1 3 Q2 D1 Zener 6V HPD_SRC R11 1K 0402 R13 10 0402 2 J1 1 Case3 Case4 22 23 BOARD_5V 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 R5 100 0402 JP 1-2 NOT USED JP 2-3 for TMDS181 C4 C5 1 uF 1 uF C6 R127 500K 0402 C7 1 uF R34 LP4 0 SPDIF_IN 1 uF ARC_OUT PAGE3 PAGE4 SPDIF_IN R35 DNI 0402 5% R36 75 0402 5% Figure 10. HDMI Input 16 TMDS181RGZ Evaluation Module SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated EVM Schematics www.ti.com VDD_1P1V PAGE6 VCC_3P3V OE PAGE2 ARC_OUT_2 PAGE2 SPDIF_IN_2 PAGE2 SCL_SRC PAGE2 SDA_SRC SDA_SNK PAGE4 HDMI_SDA_SRC PAGE2,3 SCL_SNK PAGE4 HDMI_SCL_SRC PAGE2,3 VCC_3P3V IN_CLKP PAGE2 IN_CLKN 11 37 38 I2C_EN/PIN TEST/A1 IN_CLKP OUT_CLKP IN_CLKN 13 0.1uF VDD4 SCL_SNK SDA_SNK NC 39 40 41 42 OE VCC2 GND4 43 44 45 ARC_OUT 46 SCL_SRC SPDIF_IN 47 48 OUT_D0N VCC1 12 C10 0.1uF OUT_CLKN 36 TX_TERM_CTL PAGE5 35 34 33 32 31 OUT_D2P PAGE4 OUT_D2N PAGE4 HPD_SNK PAGE4 OUT_D1P PAGE4 OUT_D1N PAGE4 OUT_D0P PAGE4 OUT_D0N PAGE4 TEST_A1 PAGE5 Note for TMDS1x1 products Board 1.1V is set to 1.2V VDD_1P1V 30 29 28 27 26 25 OUT_CLKP PAGE4 OUT_CLKN PAGE4 C17 C18 C19 0.1uF 0.1uF 0.1uF PAGE2 SCL_CTL PAGE5 SDA_CTL PAGE5 SIG_EN PAGE5 PRE_SEL PAGE5 EQ_SEL_A0 C21 C22 C23 0.1uF 0.01uF 0.1uF R130 1K 0402 5% TMDS181RGZ 48 PIN RGZ, HSIO PAGE5 C20 10uF BOARD_5V VDD3 PAGE2 C9 24 I2C_EN_PIN OUT_D0P IN_D0N VDD2 PAGE5 10 IN_D0P 23 9 VSADJ 8 GND3 EQ_SEL/A0 IN_D0N GND1 22 IN_D0P PAGE2 OUT_D1N PRE_SEL PAGE2 IN_D1N 21 7 OUT_D1P GND2 6 IN_D1P 20 IN_D1N HPD_SNK NC PAGE2 5 HPD_SRC 19 IN_D1P 0 18 PAGE2 R131 OUT_D2N SIG_EN HPD_SRC IN_D2N SDA_CTL PAGE2 4 OUT_D2P 17 IN_D2N TX_TERM_CTL IN_D2P 16 3 SWAP/POL SCL_CTL 2 VDD1 PAGE2 1 15 IN_D2P 14 SWAP/POL PAGE2 SDA_SRC PAD PAGE5 VDD5 U1 49 C8 10uF HPD_SRC_CONN R129 0 HPD_SNK PAGE4 Pop R131, no pop R129, R130 for HPD on No pop R131, pop R129, R130 for HPD snoop only VSADJ PAGE5 Figure 11. EVM Pin SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback TMDS181RGZ Evaluation Module Copyright © 2015, Texas Instruments Incorporated 17 EVM Schematics www.ti.com HDMI TX 20 21 Case1 Case2 Case3 Case4 22 23 P2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 OUT_D2P PAGE3 OUT_D2N OUT_D1P PAGE3 PAGE3 OUT_D1N OUT_D0P PAGE3 PAGE3 OUT_D0N PAGE3 OUT_CLKP PAGE3 OUT_CLKN PAGE3 HDMI_CEC_SNK PAGE2 SPDIF_IN PAGE2 LP14 LP10 LP11 LP12 BOARD_5V BOARD_5V LP13 R45 47K 0402 5% HDMI_OUT HDMI OUT R46 47K 0402 5% SCL_SNK SDA_SNK PAGE3 PAGE3 HPD_SNK PAGE3 Pop 2K resistors on R45, R46 for TMDS181, DDC on Pop 47K resistors on R45, R46 for TMDS181, DDC snoop only Figure 12. HDMI TX Connector 18 TMDS181RGZ Evaluation Module SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated EVM Schematics www.ti.com VCC_3P3V VCC_3P3V J3 1 2 3 HI I2C_EN_PIN LO I2C_EN_HI Three place switches - hi, lo, no connect Sampled at POR R57 65K 0402 5% I2C_EN_LO I2C_EN_PIN R59 2K 0402 5% J17 R60 65K 0402 5% HDR3X1 M .1 R58 2K 0402 5% PAGE3 J4 PAGE3 1 2 3 SCL_USB SCL SCL_AAR SCL_CTL SCL_CTL_USB PAGE3 SDA_USB SDA SDA_AAR SDA_CTL 1 2 3 J5 SDA_CTL_USB HDR3X1 M .1 1 2 3 HI PRE_SEL LO PRE_SEL_HI R63 65K 0402 5% PRE_SEL_LO HDR3X1 M .1 PAGE8 SWAP_POL_HI 2 4 6 8 10 R66 65K 0402 5% J7 HI TEST/A1 LO 1 2 3 TEST_A1 HDR3X1 M .1 VCC_3P3V 1 2 3 EQ_SEL_HI HDR3X1 M .1 J11 EQ_SEL_A0 PAGE3 HI SIG_EN LO 1 2 3 SIG_EN_HI VCC_3P3V R71 65K 0402 5% SIG_EN_LO HDR3X1 M .1 R70 65K 0402 5% J14 SIG_EN R73 65K 0402 5% PAGE3 1 2 3 HI TX_TERM_CTL LO PAGE3 R69 65K 0402 5% R72 65K 0402 TX_TERM_CTL_HI 5% TX_TERM_CTL_LO HDR3X1 M .1 TX_TERM_CTL PAGE3 R74 65K 0402 5% R75 7K 0402 1% J8 DEFAULT VSADJ POT R68 65K 0402 5% EQ_SEL_LO R62 65K 0402 5% PAGE3 VCC_3P3V HI EQ_SEL_A0 LO PAGE3 VCC_3P3V R64 65K 0402 5% J12 SWAP/POL Header 5x2 0.1" thru-hole AARDVARK I2C AARDVARK CONNECTOR PRE_SEL R61 65K 0402 5% SWAP_POL_LO HDR3X1 M .1 1 3 5 7 9 J6 VCC_3P3V 1 2 3 HI SWAP/POL LO PAGE8 HDR3X1 M .1 J15 VCC_3P3V 1 2 3 VSADJ PAGE3 R76 - DNI HDR3X1 M .1 R115 47K - DNI 0402 5% PTV09 10K POT Figure 13. Select Options SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback TMDS181RGZ Evaluation Module Copyright © 2015, Texas Instruments Incorporated 19 EVM Schematics www.ti.com VCC_3P3V R77 0 OE PAGE3 C26 DNI_200nF BOARD_3P3V 1 2 R78 10K 0402 5% R79 4.7K 0402 5% SW1 PB_SWITCH N.O. BOARD RESET VCC_3P3V U3 PB_MANUAL_RESET 4 3 1 2 3 RESET# GND MR# VDD SENSE CT 6 5 4 TPS3808 C27 18pF PAGE7 REG_PG Pop C26 and depop R77 if not using the Reset SW. R80 TPS3808_CT C28 C29 220pF 0.1uF 0 Figure 14. RESET 20 TMDS181RGZ Evaluation Module SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated EVM Schematics www.ti.com USB_5V BOARD_3P3V +1V8 BOARD_3P3V R92 DNI R93 DNI U16 J13 9 IO2 BOARD_3P3V 6 1 2 3 4 5 7 S3 S1 VBUS DM S5 DP ID GND S4 S2 22pF C49 R94 1.5K 5 R95 R96 PUR 7 6 33 33 22pF C45 33pF DM0 DP0 X2 26 DTR RTS SOUT/IR_SOUT SIN/IR_SIN X1/CLKI RI/CP DCD DSR CTS 4 3 X1 27 BOARD_3P3V 33pF R122 A0 Vcc A1 WP A2 SCL Vss SDA C46 0.1uF R98 10K 0402 5% C47 0.01uF X2 2 1 2 3 4 24 23 +1V8 1 USB Micro B C59 0.1uF U8 TEST1 TEST0 C50 Y1 C42 0.01uF 8 7 6 5 R99 1K 0402 5% R100 1K 0402 5% 2 JP1 24LC256 R121 1K 0402 5% C51 12 MHz 11 10 0 SCL SDA 32 PAGE5 SCL_CTL_USB PAGE5 SDA_CTL_USB P3_4 WAKEUP 1 12 R102 10K 0402 5% VREGEN 2 SUSP BOARD_3P3V 9 R103 15K 0402 5% 22 P3_3 29 1K CLKOUT P3_1 30 R101 BOARD_3P3V P3_0 31 1 21 20 19 17 16 15 14 13 GND1 GND2 GND3 10 4 TPD2E001 C41 0.01uF RESET TUSB3410 8 18 28 8 NC IO1 2 3 C60 0.1uF VCC GND 5 1 C40 0.1uF VDD1V8 VCC1 VCC2 U7 4 3 25 C39 2.2uF RSTIn C52 1 uF Figure 15. Regulators SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback TMDS181RGZ Evaluation Module Copyright © 2015, Texas Instruments Incorporated 21 EVM Schematics www.ti.com WALL - OFF - USB 5V SW2 3POS - SPDT 3.3V BUCK REGULATOR - 4V to 17V input BOARD_3P3V 1 2 3 USB_5V VCC_3P3V LP5 J9 BOARD_IN 2 3 1 L1 U4 S T 13 12 11 10 2.1mm x 5.5mm C30 330uF C31 10uF 9 PG FB SS/TR 17 C34 3.3 nF SW1 SW2 SW3 EN PVIN2 PVIN1 AVIN PAD + VOS PGND2 PGND1 AGND 14 16 15 6 PWRIN_SW FSW DEF 1 2 3 3.3V R84 0 2.2 uH 4 R81 100K 0402 5 7 R85 750K 0402 1% REG_PG PAGE6 C32 22uF FB_3PT3V 8 TPS62150A R83 0 0402 R120 DNI R86 240K 0402 1% 0402 BOARD_3P3V BOARD_5V 5.0V BOOST U6 5 BOARD_3P3V BOARD_3P3V 4 1.2V LDO REGULATOR U5 5 6 7 8 R88 4.7K 0402 5% EN1P2 10 11 IN1 IN2 IN3 IN4 BIAS EN C37 0.01uF SS1P2 15 PG OUT1 OUT2 OUT3 OUT4 SS FB NC1 NC2 NC3 NC4 NC5 NC6 GND PAD C35 10uF 1 uH 2 3 4 13 14 17 12 21 TPS74201RGWT C38 DNI 9 REG_PG GND L EN BOARD_1P1V VOUT 7 R87 DNI 0402 5% VIN PAD 6 L2 FB 1 2 3 R82 500 0402 5% TPS61240 - DNI VDD_1P1V LP6 1 20 19 18 C58 2.2uF C57 10uF D2 LED Green 0805 5V PWR 1.1V R89 16 FB_1PT2V R90 2.21K 0402 1% 0 LP7 C36 10uF R91 4.42K 0402 1% LP8 LP9 GND GND Note for TMDS1x1 products Board 1.1V is set to 1.2V Figure 16. TUSB3410 22 TMDS181RGZ Evaluation Module SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated EVM Layout www.ti.com 7 EVM Layout Figure 17 through Figure 22 contain illustrations of the EVM PCB layout. Figure 17. Layer 1 (Top) Figure 18. Layer 2 (GND) Figure 19. Layer 3 (Power) Figure 20. Layer 4 (Power) SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TMDS181RGZ Evaluation Module 23 Total Phase Aardvark I2C Host Adapter Scripts www.ti.com Figure 21. Layer 5 (GND) 8 Figure 22. Layer 6 (Bottom) Total Phase Aardvark I2C Host Adapter Scripts Please request the latest scripts from your TI representative. Revision History Changes from Original (October 2015) to A Revision .................................................................................................... Page • • • • • • • • • • Changed device EVM name to TMDS181RGZEVM throughout the document. ................................................. Removed references to DP159 in the What is the TMDS181 EVM? section. .................................................... Changed board image in Figure 1....................................................................................................... Removed reference to DisplayPort in the Video Connectors for TMDS181 Ports section. ..................................... Removed reference to exceeding USB compliance requirements for power consumption in the paragraph following the NOTE........................................................................................................................................ Changed SW1 DIP Switch Setting table. .............................................................................................. Removed paragraph and table in the Component Population Configuration section. ........................................... Updated for Component Population Configuration Rev B. .......................................................................... Moved USB Interface via TUSB3410 section. ......................................................................................... Expanded Quick Start Guide section. .................................................................................................. 1 2 3 4 5 6 6 6 7 7 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 24 Revision History SLLU228A – October 2015 – Revised December 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. 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SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. 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User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated spacer IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated
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TMDS181RGZEVM
    •  国内价格
    • 1+3255.71400

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