TMP300B-Q1
SBOS586 – DECEMBER 2011
www.ti.com
1.8V, Resistor-Programmable
TEMPERATURE SWITCH and
ANALOG OUT TEMPERATURE SENSOR in SC70
Check for Samples: TMP300B-Q1
FEATURES
DESCRIPTION
•
•
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•
•
•
•
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The
TMP300B-Q1
is
a
low-power,
resistor-programmable, digital output temperature
switch. It allows a threshold point to be set by adding
an external resistor. Two levels of hysteresis are
available. The TMP300B-Q1 has a VTEMP analog
output that can be used as a testing point or in
temperature-compensation loops.
1
2
ACCURACY: ±1°C (typical at +25°C)
PROGRAMMABLE TRIP POINT
PROGRAMMABLE HYSTERESIS: 5°C/10°C
OPEN-DRAIN OUTPUTS
LOW-POWER: 110μA (max)
WIDE VOLTAGE RANGE: +1.8V to +18V
OPERATION: –40°C to +150°C
ANALOG OUT: 10mV/°C
SC70-6 PACKAGE
With a supply voltage as low as 1.8V and low current
consumption, the TMP300B-Q1 is ideal for
power-sensitive systems.
Available in two micropackages that have proven
thermal characteristics, this part gives a complete and
simple solution for users who need simple and
reliable thermal management.
APPLICATIONS
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QUALIFIED FOR for AUTOMOTIVE
APPLICATIONS
POWER-SUPPLY SYSTEMS
DC-DC MODULES
THERMAL MONITORING
ELECTRONIC PROTECTION SYSTEMS
V+
3mA
TMP300B-Q1
TSET
1
6
V+
GND
2
5
VTEMP
OUT
3
4
HYSTSET
Proportional
to TA
RPULL-UP
VTEMP
OUT
TSET
RSET
210kW
(1)
SC70-6
TMP300
HYSTSET
NOTE: (1) Thinfilm resistor with approximately 10% accuracy;
however, this accuracy error is trimmed out at the factory.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TMP300B-Q1
SBOS586 – DECEMBER 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
(1)
ORDERABLE P/N
TA
PACKAGE
TOP SIDE SYMBOL
TMP300BQDCKRQ1 or
TMP300B-Q1
-40°C to 125°C
SC70 - DCK | Reel of 3000
SBG
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
Supply Voltage
V+
Signal Input Terminals, Voltage (2)
Signal Input Terminals, Current
(2)
Output Short-Circuit (3)
VALUE
UNIT
+18
V
–0.5 to (V+) + 0.5
V
±10
mA
ISC
Open-Drain Output
Continuous
(V+) + 0.5
V
Operating Temperature
TA
–40 to +150
°C
Storage Temperature
TA
–55 to +150
°C
Junction Temperature
TJ
+150
°C
Human Body Model (HBM)
4000
V
Charged Device Model (CDM)
1000
V
Machine Model (MM)
200
V
ESD Rating
(1)
(2)
(3)
2
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less.
Short-circuit to ground.
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Product Folder Link(s): TMP300B-Q1
TMP300B-Q1
SBOS586 – DECEMBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
At VS = 3.3V and TA = –40°C to +125°C, unless otherwise noted.
TMP300B-Q1
PARAMETER
TEST CONDITIONS
MIN
VS = 2.35V to 18V
TYP
MAX
UNIT
–40
+125
°C
–40
100 ×
(VS – 0.95)
°C
TEMPERATURE MEASUREMENT
Measurement Range
VS = 1.8V to 2.35V
TRIP POINT
Total Accuracy
TA = –40°C to +125°C
±2
RSET Equation
TC is in °C
RSET = 10 (50 + TC)/3
±6
°C
kΩ
HYSTERESIS SET INPUT
(1)
LOW Threshold
HIGH Threshold
0.4
(1)
V
VS – 0.4
Threshold Hysteresis
V
HYSTSET = GND
5
°C
HYSTSET = VS
10
°C
DIGITAL OUTPUT
Logic Family
CMOS
Open-Drain Leakage Current
(1)
OUT = VS
10
μA
VS = 1.8V to 18V, ISINK = 5mA
0.3
V
Logic Levels
VOL
ANALOG OUTPUT
Accuracy
±2
Temperature Sensitivity
10
Output Voltage
(1)
TA = +25°C
720
VTEMP Pin Output Resistance
750
±5
°C
mV/°C
780
mV
210
kΩ
POWER SUPPLY
Quiescent Current (2)
IQ
VS = 1.8V to 18V,
TA = –40°C to +125°C
110
μA
–40
+125
°C
VS = 1.8V to 2.35V
–40
100 ×
(VS – 0.95)
°C
VS = 2.35V to 18V
–40
+150
°C
–50
100 ×
(VS – 0.95)
°C
TEMPERATURE RANGE
VS = 2.35V to 18V
Specified Range
TA
Operating Range
TA
Thermal Resistance
θJA
(1)
(2)
VS = 1.8V to 2.35V
SC70
250
°C/W
SOT23-6
180
°C/W
Specified by design. Not production tested.
See Figure 1 for typical quiescent current.
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TMP300B-Q1
3
TMP300B-Q1
SBOS586 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS
At VS = 5V, unless otherwise noted.
QUIESCENT CURRENT OVER TEMPERATURE AND
SUPPLY
RSET SHIFT DUE TO RSET TOLERANCE
2.0
95
TERROR + 1%
1.5
85
1.0
75
Error (°C)
IQ (mA)
VS = 18V
VS = 3.3V
65
VS = 1.8V
0.5
TERROR + 0.1%
0
TERROR - 0.1%
-0.5
-1.0
55
-1.5
45
-40 -25
0
25
50
75
100
TERROR - 1%
-2.0
-40 -25
125
25
0
Figure 1.
4.0
600
3.0
125
100
125
2.0
Error (°C)
RSET (kW)
100
TYPICAL TRIP ERROR
700
500
400
300
200
1.0
0
-1.0
-2.0
100
-3.0
0
-40 -25
0
25
50
75
100
-4.0
-40 -25
125
0
Temperature (°C)
50
75
Figure 4.
TYPICAL ANALOG OUTPUT ERROR
ANALOG PSR OVER TEMPERATURE
0.10
3.0
2.5
0.08
2.0
1.5
0.06
0.04
Error (°C/V)
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-40 -25
25
Temperature (°C)
Figure 3.
Error (°C)
75
Figure 2.
RSET vs TEMPERATURE
TMAX is +85°C for VS = 1.8V to 3.3V
0.02
0
3.3V to 18V
-0.02
-0.04
-0.06
-0.08
0
25
50
75
100
125
-0.10
-40 -25
Temperature (°C)
0
25
50
75
100
125
Temperature (°C)
Figure 5.
4
50
Temperature (°C)
Temperature (°C)
Figure 6.
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TMP300B-Q1
TMP300B-Q1
SBOS586 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At VS = 5V, unless otherwise noted.
TRIP PSR OVER TEMPERATURE
0.10
0.08
0.06
Error (°C/V)
0.04
0.02
3.3V to 18V
0
-0.02
-0.04
-0.06
TMAX is +85°C for VS = 1.8V to 3.3V
-0.08
-0.10
-40 -25
0
25
50
75
100
125
Temperature (°C)
Figure 7.
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TMP300B-Q1
5
TMP300B-Q1
SBOS586 – DECEMBER 2011
www.ti.com
APPLICATIONS INFORMATION
To set the TMP300B-Q1 to trip at a preset value,
calculate the RSET resistor value according to
Equation 1 or Equation 2:
(TSET ´ 0.01 + 0.5)
RSET =
-6
3e
(1)
The TMP300B-Q1 is a thermal sensor designed for
over-temperature protection circuits in electronic
systems. The TMP300B-Q1 uses a set resistor to
program the trip temperature of the digital output. An
additional high-impedance (210kΩ) analog voltage
output provides the temperature reading.
Where TSET is in °C; or
10(50 + TSET)
RSET in kW =
3
CALCULATING RSET
The set resistor (RSET) provides a threshold voltage
for the comparator input. The TMP300B-Q1 trips
when the VTEMP pin exceeds the TSET voltage. The
value of the set resistor is determined by the analog
output function and the 3μA internal bias current.
(2)
Where TSET is in °C.
USING VTEMP TO TRIP THE DIGITAL OUTPUT
The analog voltage output can also serve as a
voltage input that forces a trip of the digital output to
simulate a thermal event. This simulation facilitates
easy system design and test of thermal safety
circuits, as shown in Figure 8.
V+
3 mA
Voltage source
to test trip point.
Proportional
to TA
VTEMP
OUT
Open-Drain Control
TSET
RINT
210kW
RSET
TMP300
HYSTSET
Figure 8. Applying Voltage to Trip Digital Output
6
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Product Folder Link(s): TMP300B-Q1
TMP300B-Q1
SBOS586 – DECEMBER 2011
www.ti.com
ANALOG TEMPERATURE OUTPUT
USING A DAC TO SET THE TRIP POINT
The analog out or VTEMP pin is high-impedance
(210kΩ). Avoid loading this pin to prevent degrading
the analog out value or trip point. Buffer the output of
this pin when using it for direct thermal measurement.
Figure 9 shows buffering of the analog output signal.
The trip point is easily converted by changing the
digital-to-analog converter (DAC) code. This
technique can be useful for control loops where a
large thermal mass is being brought up to the set
temperature and the OUT pin is used to control the
heating element. The analog output can be monitored
in a control algorithm that adjusts the set temperature
to prevent overshoot. Trip set voltage error versus
temperature is shown in Figure 10, which shows error
in °C of the comparator input over temperature. An
alternative method of setting the trip point by using a
DAC is shown in Figure 11.
Analog Out
OPA335
V+
1.00
Proportional
to TA
0.75
VTEMP
Trip Set Voltage Error (°C)
3mA
OUT
TSET
210kW
TMP300
0.50
0.25
0
-0.25
-0.50
-0.75
HYSTSET
-1.00
-50
-25
Figure 9. Buffering the Analog Output Signal
0
25
50
75
100
125
Temperature (°C)
Figure 10. Trip Set Voltage Error vs Temperature
V+
3 mA
Voltage source
to test trip point.
Proportional
to TA
VTEMP
OUT
Open-Drain Control
TSET
210kW
DAC8560
TMP300
HYSTSET
Figure 11. DAC Generates the Voltage-Driving TSET Pin
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TMP300B-Q1
7
TMP300B-Q1
SBOS586 – DECEMBER 2011
www.ti.com
HYSTERESIS
The hysteresis pin has two settings. Grounding
HYSTSET results in 5°C of hysteresis. Connecting it to
VS results in 10°C of hysteresis. Hysteresis error
variation over temperature is shown in Figure 12 and
Figure 13.
Bypass capacitors should be used on the supplies as
well as on the RSET and analog out (VTEMP) pins when
in noisy environments, as shown in Figure 14. These
capacitors reduce premature triggering of the
comparator.
5
4
4
3
3
2
Error (°C)
2
Error (°C)
5
Maximum
1
0
-1
-2
Average
Maximum
1
0
-1
Average
-2
Minimum
-3
-3
-4
-4
-5
-50
-5
-50
Minimum
-25
0
25
50
75
100
-25
0
25
50
75
100
125
Temperature (°C)
125
Temperature (°C)
Figure 13. 10°C Hysteresis Error vs Temperature
Figure 12. 5°C Hysteresis Error vs Temperature
V+
3mA
Proportional
to TA
VTEMP
OUT
Open-Drain Control
TSET
CBYPASS
CBYPASS
210kW
RSET
TMP300
HYSTSET
Figure 14. Bypass Capacitors Prevent Early Comparator Toggling Due to Circuit Board Noise
8
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TMP300B-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TMP300BQDCKRQ1
ACTIVE
SC70
DCK
6
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
SBG
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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