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TMP411
SBOS383D – DECEMBER 2006 – REVISED DECEMBER 2016
TMP411 ±1°C Remote and Local Temperature Sensor
With N-Factor and Series Resistance Correction
1 Features
3 Description
•
•
•
•
•
•
•
The TMP411 device is a remote temperature sensor
monitor with a built-in local temperature sensor. The
remote
temperature-sensor,
diode-connected
transistors are typically low-cost, NPN- or PNP-type
transistors or diodes that are an integral part of
microcontrollers, microprocessors, or FPGAs.
1
•
•
•
•
•
•
•
±1°C Remote Diode Sensor
±1°C Local Temperature Sensor
Programmable Non-Ideality Factor
Series Resistance Cancellation
Alert Function
Offset Registers for System Calibration
Pin and Registers Compatible With ADT7461 and
ADM1032
Programmable Resolution: 9 to 12 Bits
Programmable Threshold Limits
Two-Wire and SMBus Serial Interface
Minimum and Maximum Temperature Monitors
Multiple Interface Addresses
ALERT and THERM2 Pin Configuration
Diode Fault Detection
Remote accuracy is ±1°C for multiple device
manufacturers, with no calibration needed. The twowire serial interface accepts SMBus write byte, read
byte, send byte and receive byte commands to
program the alarm thresholds and to read
temperature data.
Features that are included in the TMP411 device are:
series resistance cancellation, programmable nonideality
factor,
programmable
resolution,
programmable threshold limits, user-defined offset
register for maximum accuracy, minimum and
maximum temperature monitors, wide remote
temperature measurement range (up to 150°C), diode
fault detection, and temperature alert function.
2 Applications
•
•
•
•
•
•
•
•
The TMP411 device is available in VSSOP-8 and
SOIC-8 packages.
LCD and DLP and LCOS Projectors
Servers
Industrial Controllers
Central Office Telecom Equipment
Desktop and Notebook Computers
Storage Area Networks (SAN)
Industrial and Medical Equipment
Processor and FPGA Temperature Monitoring
Device Information(1)
PART NUMBER
TMP411
PACKAGE
BODY SIZE (NOM)
VSSOP (8)
3.00 mm × 3.00 mm
SOIC (8)
4.90 mm × 3.91 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Block Diagram
2.7 V to 5.5 V
2.7 V to 5.5 V
Processor or ASIC
8
1
V+
SCL
7
2
D+
Built-In Thermal
Transistor, Diode
TMP411
SDA
6
3
D±
SMBus
Controller
ALERT / THERM2
4
5
THERM
GND
Overtemperature Shutdown
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP411
SBOS383D – DECEMBER 2006 – REVISED DECEMBER 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
4
4
4
4
5
7
Absolute Maximum Ratings .....................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Timing Requirements ...............................................
Typical Characteristics.......................................... 8
Detailed Description ............................................ 10
9.1 Overview ................................................................. 10
9.2 Functional Block Diagram ....................................... 11
9.3 Feature Description................................................. 12
9.4 Device Functional Modes........................................ 15
9.5 Programming........................................................... 15
9.6 Register Map........................................................... 22
10 Application and Implementation........................ 32
10.1 Application Information.......................................... 32
10.2 Typical Application ............................................... 32
11 Power Supply Recommendations ..................... 34
12 Layout................................................................... 35
12.1 Layout Guidelines ................................................. 35
12.2 Layout Example .................................................... 36
13 Device and Documentation Support ................. 37
13.1
13.2
13.3
13.4
13.5
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
37
37
37
37
37
14 Mechanical, Packaging, and Orderable
Information ........................................................... 37
4 Revision History
Changes from Revision C (May 2008) to Revision D
Page
•
Added "Offset Registers for System Calibration" and "Pin and Registers Compatible With ADT7461 and ADM1032"
to Features section ................................................................................................................................................................ 1
•
Kept VSSOP as a package option in Device Information table to match POA and eMSG information................................. 1
•
Changed "MSOP-8" to "VSSOP-8" throughout document .................................................................................................... 1
•
Added package designators to pinout images in Pin Configurations and Functions section ................................................ 3
•
Added ESD Ratings information ............................................................................................................................................ 4
•
Added Recommended Operating Conditions information ..................................................................................................... 4
•
Added Thermal Information ................................................................................................................................................... 4
•
Added package designator information to Thermal Information table header ...................................................................... 4
•
Reformatted Thermal Information table note ......................................................................................................................... 4
•
Changed typical local temperature sensor value from ±0.0625°C to ±0.25°C in Electrical Characteristics table.................. 5
•
Deleted "vs supply" from TERROR_PS test conditions in Electrical Characteristics table ....................................................... 5
•
Deleted Vs = 3.3 V test condition in Temperature error power supply sensitivity vs supply (local and remote)
parameter in Electrical Characteristics table .......................................................................................................................... 5
•
Deleted Temperature Range subsection in Electrical Characteristics table ......................................................................... 6
•
Changed typical power-on-reset threshold value from 16 V to 1.6 V in Electrical Characteristics table .............................. 6
•
Added Functional Block Diagram ........................................................................................................................................ 11
•
Added Timing Diagrams section .......................................................................................................................................... 16
•
Added Power Supply Recommendations information ......................................................................................................... 34
•
Added Receiving Notification of Documentation Updates section ...................................................................................... 37
2
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SBOS383D – DECEMBER 2006 – REVISED DECEMBER 2016
5 Device Comparison Table
PART NUMBER
I2C BINARY ADDRESS
I2C HEX ADDRESS
OFFSET REGISTERS
TMP411A
100 1100b
4Ch
No
TMP411B
100 1101b
4Dh
No
TMP411C
100 1110b
4Eh
No
TMP411E
100 1100b
4Ch
Yes
6 Pin Configuration and Functions
DGK and D Packages
8-Pin VSSOP, SOIC
Top View
V+
1
8
SCL
D+
2
7
SDA
D±
3
6
ALERT/THERM2
THERM
4
5
GND
Not to scale
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
ALERT/
THERM2
6
Digital output
Alert (reconfigurable as second thermal flag), active low, open-drain; requires
pullup resistor to V+
D+
2
Analog input
Positive connection to remote temperature sensor
D–
3
Analog input
Negative connection to remote temperature sensor
GND
5
Ground
SCL
8
Digital input
Serial clock line for SMBus, open-drain; requires pull-up resistor to V+
SDA
7
Bidrectional digital
input-output
Serial data line for SMBus, open-drain; requires pull-up resistor to V+
THERM
4
Digital output
Thermal flag, active low, open-drain; requires pull-up resistor to V+
V+
1
Power supply
Positive supply (2.7 V to 5.5 V)
Ground
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TMP411
SBOS383D – DECEMBER 2006 – REVISED DECEMBER 2016
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7 Specifications
7.1 Absolute Maximum Ratings
MIN
MAX
UNIT
Input voltage
Pins 2, 3, 4 only
–0.5
VS + 0.5
V
Input voltage
Pins 6, 7, 8 only
–0.5
7
V
Input current
10
mA
Power supply, Vs
7
V
127
°C
150
°C
130
°C
Operating temperature range
–55
Junction temperature, TJ(max)
Storage temperature, Tstg
(1)
–60
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±3000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
V+
Supply voltage
2.7
3.3
5.5
UNIT
V
TA
Operating free-air temperature
–40
125
°C
7.4 Thermal Information
TMP411
THERMAL METRIC
(1)
D (SOIC)
DGK (VSSOP)
8 PINS
8 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
112.3
166.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
59.4
58.3
°C/W
RθJB
Junction-to-board thermal resistance
53.0
86.7
°C/W
ψJT
Junction-to-top characterization parameter
13.6
7.5
°C/W
ψJB
Junction-to-board characterization parameter
52.4
85.2
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SBOS383D – DECEMBER 2006 – REVISED DECEMBER 2016
7.5 Electrical Characteristics
at TA = –40°C to +125°C and VS = 2.7 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE ERROR
TA = –40°C to 125°C
TERROR(LOCAL)
TERROR(REMOTE)
TERROR_PS
Local temperature sensor
Remote temperature sensor (1)
Temperature error power supply sensitivity (local and
remote)
–2.5
±1.25
2.5
°C
TA= 15°C to 85°C
VS = 3.3 V
–1
±0.25
1
°C
TA = 15°C to 75°C
TDIODE = –40°C to 150°C
VS = 3.3 V
–1
±0.0625
1
°C
TA = –40°C to 100°C
TDIODE = –40°C to 150°C
VS = 3.3 V
–3
±1
3
°C
TA = –40°C to 125°C
TDIODE = –40°C to 150°C
VS = 3.3 V
–5
±3
5
°C
VS = 2.7 V to 5.5 V
TDIODE = –40°C to 150°C
–0.5
±0.2
0.5
°C/V
One-shot mode
105
115
125
ms
12
Bits
TEMPERATURE MEASUREMENT
Conversion time (per channel)
Resolution
Local temperature sensor
(programmable)
9
Remote temperature sensor
12
Bits
120
µA
Medium high
60
µA
Medium low
12
µA
6
µA
High
Remote sensor source
currents
Series resistance: 3 kΩ maximum
Low
Remote transistor ideality factor
η
Optimized ideality factor
1.008
SMBUS INTERFACE
VIH
Logic input high voltage (SCL, SDA)
VIL
Logic input low voltage (SCL, SDA)
2.1
V
0.8
Hysteresis
500
SMBus output low sink current
6
Logic input current
mA
–1
SMBus input capacitance (SCL, SDA)
1
3
SMBus clock frequency
SMBus timeout
25
V
mV
30
SCL falling edge to SDA valid time
µA
pF
3.4
MHz
35
ms
1
µs
DIGITAL OUTPUTS
VOL
Output low voltage
IOUT = 6 mA
IOH
High-level output leakage current
VOUT = Vs
0.15
0.4
V
0.1
1
µA
ALERT or THERM2 output low sink current
ALERT/THERM2 forced to 0.4 V
6
mA
THERM output low sink current
THERM forced to 0.4 V
6
mA
POWER SUPPLY
VS
Specified voltage range
2.7
0.0625 conversions per second
VS = 3.3 V
Eight conversions per second
VS = 3.3 V
IQ
Quiescent current
Serial bus inactive, shutdown mode
Serial bus active, fS = 40 kHz,
shutdown mode
Serial bus active, fS = 3.4 MHz,
shutdown mode
Undervoltage lockout
(1)
2.3
5.5
V
28
30
µA
400
475
µA
3
10
µA
90
µA
350
µA
2.4
2.6
V
Tested with less than 5-Ω effective series resistance and 100-pF differential input capacitance. TA is the ambient temperature of the
TMP411. TDIODE is the temperature at the remote diode sensor.
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Electrical Characteristics (continued)
at TA = –40°C to +125°C and VS = 2.7 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
POR
6
TEST CONDITIONS
Power-on-reset threshold
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MIN
TYP
MAX
1.6
2.3
UNIT
V
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7.6 Timing Requirements
MIN
f(SCL)
SCL operating frequency
t (BUF)
Bus free time between STOP and START condition
t (HDSTA)
Hold time after repeated START condition. After this
period, the first clock is generated
t (SUSTA)
Repeated START condition setup time
t (SUSTO)
STOP condition setup time
t (HDDAT)
Data hold time
t (SUDAT)
Data setup time
t (LOW)
SCL clock LOW period
t (HIGH)
SCL clock HIGH period
tF
Clock and data fall time
Clock and data rise time
tR
SCLK ≤ 100 kHz
(1)
(2)
NOM
MAX
Fast mode
0.001
0.4
High-speed mode
0.001
3.4
Fast mode
600
High-speed mode
160
Fast mode
100
High-speed mode
100
Fast mode
100
High-speed mode
100
Fast mode
100
High-speed mode
100
Fast mode
0
(1)
High-speed mode
0
(2)
Fast mode
100
High-speed mode
Fast mode
Fast mode
600
High-speed mode
ns
ns
ns
ns
ns
1300
160
ns
ns
60
Fast mode
300
High-speed mode
160
Fast mode
300
High-speed mode
Fast mode
MHz
ns
10
High-speed mode
UNIT
160
1000
ns
ns
High-speed mode
For cases with an SCL fall time of less than 20 ns, or an SDA rise or fall time of less than 20 ns, the hold time must be greater than 20
ns.
For cases with an SCL fall time of less than 10 ns, or an SDA rise or fall time of less than 10 ns, the hold time must be greater than 10
ns.
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8 Typical Characteristics
at TA = 25°C and VS = 5 V (unless otherwise noted)
3.0
VS = 3.3V
TDIODE = +25 °C (temperature at remote diode)
2
30 Typical Units Shown
= 1.008
1
0
í1
í2
í3
í50
2.0
1.0
0
í1.0
í2.0
í3.0
í25
0
25
50
75
100
í50
125
í25
60
50
75
100
125
2.0
Remote Temperature Error ( °C)
Remote Temperature Error ( °C)
25
Figure 2. Local Temperature Error vs TMP411 Ambient
Temperature
Figure 1. Remote Temperature Error vs TMP411 Ambient
Temperature
40
20
R íGND
0
R íVS
í20
í40
1.5
VS = 2.7V
1.0
0.5
0
VS = 5.5V
í0.5
í1.0
í1.5
í2.0
í60
0
5
10
15
20
25
0
30
500
1000
1500
2000
2500
3000
3500
Leakage Resistance (MŸ )
R S ( Ÿ)
Figure 3. Remote Temperature Error vs Leakage Resistance
Figure 4. Remote Temperature Error vs Series Resistance
(Diode-Connected Transistor, 2N3906 PNP)
3
1.5
VS = 2.7V
1.0
0.5
VS = 5.5V
0
í0.5
í1.0
í1.5
í2.0
0
500
1000
1500
2000
2500
3000
3500
Remote Temperature Error ( °C)
2.0
Remote Temperature Error ( °C)
0
Ambient Temperature, TA ( °C)
Ambient Temp erature, TA (°C)
2
1
0
í1
í2
í3
0
RS ( Ÿ )
0.5
1.0
1.5
2.0
2.5
3.0
Capacitance (nF)
Figure 5. Remote Temperature Error vs Series Resistance
(GND Collector-Connected Transistor, 2N3906 PNP)
8
50 Units Shown
VS = 3.3V
Local Temperature Error ( °C)
Remote Temperature Error (°C)
3
Figure 6. Remote Temperature Error vs Differential
Capacitance
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Typical Characteristics (continued)
at TA = 25°C and VS = 5 V (unless otherwise noted)
25
15
10
450
400
350
5
I Q (µA)
Temperature Error ( °C)
500
Local 100mVPP Noise
Remote 100mVPP Noise
Local 250mVPP Noise
Remote 250mVPP Noise
20
0
í5
300
200
í10
150
í15
100
í20
50
5
10
VS = 2.7V
0
0.0625
í25
0
VS = 5.5V
250
15
0.125
Figure 7. Temperature Error vs Power-Supply Noise
Frequency
0.5
1
2
4
8
Figure 8. Quiescent Current vs Conversion Rate
500
8
450
7
400
6
350
5
300
250
IQ (µA)
IQ (µA)
0.25
Conversion Rate (conversions/sec)
Frequency (MHz)
VS = 5.5V
200
4
3
150
2
100
1
50
VS = 3.3V
0
1k
10k
100k
1M
10M
0
2.5
SCL CLock Frequency (Hz)
3.0
3.5
4.0
4.5
5.0
5.5
VS (V)
Figure 9. Shutdown Quiescent Current vs SCL Clock
Frequency
Figure 10. Shutdown Quiescent Current vs Supply Voltage
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9 Detailed Description
9.1 Overview
The TMP411 is a dual-channel digital temperature sensor that combines a local die-temperature measurement
channel in a single VSSOP-8 or SOIC-8 package. The TMP411 is two-wire and SMBus interface-compatible and
is specified over a temperature range of –40°C to +125°C. The TMP411 device contains multiple registers for
holding configuration information, temperature measurement results, temperature comparator maximum and
minimum limits, and status information.
User-programmed high and low temperature limits stored in the TMP411 triggers an overtemperature or
undertemperature alarm (ALERT) on local and remote temperatures. Additional thermal limits can be
programmed into the TMP411 and can trigger another flag (THERM) that initiates a system response to rising
temperatures.
The TMP411 requires only a transistor connected between D+ and D– for proper remote temperature sensing
operation. The SCL and SDA interface pins require pullup resistors as part of the communication bus, while
ALERT and THERM pins are open-drain outputs that require pullup resistors. ALERT and THERM pins can be
shared with other devices for a wired-OR implementation, if desired. TI recommends using a 0.1-µF powersupply bypass capacitor for good local bypassing. Figure 11 shows a typical configuration for the TMP411 .
+5V
0.1µF
Transistoríconnected
configuration (1) :
1
Series Resistance
V+
SCL
RS(2)
2
RS(2)
C DIFF(3)
3
D+
10 kŸ
(typ)
10 kŸ
(typ)
10 kŸ
(typ)
10 kŸ
(typ)
8
TMP411
SDA
7
SMBus
Controller
Dí
ALERT/THERM2
THERM
6
4
Fan Controller
GND
Diodeíconnected configuration (1):
5
RS(2)
RS(2)
CDIFF(3)
Copyright © 2016, Texas Instruments Incorporated
(1)
Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series
resistance cancellation. NPN transistors must be diode-connected. PNP transistors can either be transistor or diodeconnected. TI recommends this layout for the MMBT3906LP and MMBT3904LP devices.
(2)
Rs (optional) must be < 1.5 kΩ in most applications. Selections of Rs depends on specific applications; see the
Filtering section.
(3)
CDIFF (optional) must be < 1000 pF in most applications. Selection of CDIFF depends on specific application; see the
Filtering section and Figure 5.
Figure 11. Basic Connections
10
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9.2 Functional Block Diagram
2.7 V to 5.5 V
2.7 V to 5.5 V
Processor or ASIC
8
1
V+
SCL
7
2
D+
Built-In Thermal
Transistor, Diode
TMP411
SDA
6
3
D±
SMBus
Controller
ALERT / THERM2
4
5
THERM
GND
Overtemperature Shutdown
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9.3 Feature Description
9.3.1 Series Resistance Cancellation
Figure 11 shows series resistance in an application circuit that results from printed circuit board (PCB) trace
resistance and remote line length. The TMP411 automatically cancels the resistance, which prevents a
temperature offset.
The TMP411 device cancels up to 3 kΩ of series line resistance that eliminates the need for additional
characterization and temperature offset correction.
See Figure 4 and Figure 5 for details on the effect of series resistance and power-supply voltage on sensed
remote temperature error.
9.3.2 Differential Input Capacitance
The TMP411 tolerates differential input capacitance of up to 1000 pF with minimal change in temperature error.
The effect of capacitance on sensed remote temperature error is shown in Figure 6.
9.3.3 Temperature Measurement Data
Temperature measurement data is taken over a default range of 0°C to 127°C for local and remote locations.
Measurements from –55°C to +150°C can be made locally and remotely by reconfiguring the TMP411 device for
the extended temperature range. To change the TMP411 configuration from the standard to the extended
temperature range, switch bit 2 (RANGE) of the Configuration Register from low to high.
Temperature data resulting from conversions within the default measurement range are represented in binary
form, as listed in the standard binary column of Table 1. Note that any temperature below 0°C results in a data
value of zero (00h). Likewise, temperatures above 127°C results in a value of 127 (7Fh). The device can be set
to measure over an extended temperature range by changing bit 2 of the Configuration Register from low to high.
The change in measurement range and data format from standard binary to extended binary occurs at the next
temperature conversion. For data captured in the extended temperature range configuration, an offset of 64
(40h) is added to the standard binary value, as listed in the extended binary column in Table 1. This configuration
allows measurement of temperatures below 0°C. It is possible to have binary values in the range of –64°C to
+191°C, but most temperature-sensing diodes measure in the range of –55°C to +150°C. The TMP411 device is
rated only for ambient local temperatures ranging from –40°C to +125°C. Parameters in the Absolute Maximum
Ratings table must be observed.
12
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Feature Description (continued)
Table 1. Temperature Data Format (Local and Temperature High Bytes)
LOCAL AND REMOTE TEMPERATURE REGISTER HIGH BYTE VALUE (1°C RESOLUTION)
TEMP (°C)
STANDARD BINARY
EXTENDED BINARY
BINARY
HEX
BINARY
HEX
–64
0000 0000
00
0000 0000
00
–50
0000 0000
E
0000 1110
0E
–25
0000 0000
00
0010 0111
27
0
0000 0000
00
0100 0000
40
1
0000 0001
01
0100 0001
41
5
0000 0101
05
0100 0101
45
10
0000 1010
0A
0100 1010
4A
25
0001 1001
19
0101 1001
59
50
0011 0010
32
0111 0010
72
75
0100 1011
4B
1000 1011
8b
100
0110 0100
64
1010 0100
A4
125
0111 1101
7D
1011 1101
BD
127
0111 1101
7F
1011 1111
BF
150
0111 1111
7F
1101 0110
D6
175
0111 1111
7F
1110 1111
EF
191
0111 1111
7F
1111 1111
FF
9.3.4 THERM (Pin 4) and ALERTor THERM2 (Pin 6)
The THERM and ALERT or THERM2 pins on the TMP411 device are dedicated to alarm functions. The pins are
open-drain outputs that each require a pullup resistor to V+. These pins can be wire-ORed together with other
alarm pins for system monitoring of multiple sensors. The THERM pin provides a thermal interrupt that cannot be
software disabled. The ALERT pin is an earlier warning interrupt, and can be software disabled or masked. The
ALERT or THERM2 pin can be configured as aTHERM2 pin, which is a second THERM pin (Configuration
Register: AL or TH bit = 1). The default setting configures pin 6 to function as an ALERT pin (AL or TH = 0).
The THERM pin asserts low when the measured local or remote temperature is outside of the temperature range
programmed in the corresponding Local and Remote THERM Limit Register. The THERM temperature limit
range can be programmed with a wider range than that of the limit registers, which allows the ALERTpin to
provide an earlier warning than the THERM pin. The THERM alarm resets automatically when the measured
temperature falls within the THERM temperature limit range minus the hysteresis value stored in the THERM
Hysteresis Register. The permitted hysteresis values are listed in Table 10. The default hysteresis is 10°C. When
the ALERT or THERM2 pin is configured as a second thermal alarm (Configuration Register: bit 7 = 0, bit 5 = 1),
the pin functions the same as the THERM pin, but uses the temperatures stored in the Local and Remote
Temperature High and Low Limit Registers to set the comparison range.
When ALERT or THERM2 (pin 6) is configured as an ALERT pin, (Configuration Register: bit 7 = 0, bit 5 = 0),
the pin asserts low when the measured local or remote temperature violates the range limit set by the
corresponding Local and Remote Temperature High and Low Limit Registers. The alert function configures to
assert only if the range is violated a specified number of consecutive times (either one, two, three or four times).
The consecutive violation limit is set in the Consecutive Alert Register. Required consecutive faults prevent false
alerts that are caused by environmental noise. The ALERT pin asserts low if the remote temperature sensor is
open-circuit. When the MASK function is enabled (Configuration Register: bit 7 = 1), the ALERT pin is disabled
(that is, masked). TheALERT pin resets when the master reads the device address, as long as the condition that
caused the alert no longer persists, and the Status Register is reset.
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9.3.5 Sensor Fault
The TMP411 senses a fault at the D+ input resulting from an incorrect diode connection or an open circuit. The
detection circuitry consists of a voltage comparator that trips when the voltage at D+ exceeds (V+) − 0.6 V
(typical). The comparator output is checked during a conversion. If a fault is detected, the last valid measured
temperature is the temperature measurement result, the OPEN bit (Status Register, bit 2) is set high, and the
ALERT pin asserts low if the alert function is enabled.
The D+ and D− inputs must be connected together to prevent meaningless fault warnings when the TMP411
remote sensor is not in use.
9.3.6 Undervoltage Lockout
The TMP411 senses when the power-supply voltage reaches a minimum voltage level for the ADC converter to
function. The detection circuitry consists of a voltage comparator that enables the ADC converter after the power
supply (V+) exceeds 2.45 V (typical). The comparator output is checked during a conversion. The TMP411 does
not perform a temperature conversion if the power supply is not valid. The last valid measured temperature is the
temperature measurement result.
9.3.7 Filtering
Remote junction temperature sensors are typically implemented in a noisy environment. Noise is often created
by fast digital signals that corrupt measurements. The TMP411 has a built-in 65-kHz filter on the D+ and D−
inputs to minimize the effects of noise. TI recommends placing a bypass capacitor differentially across the sensor
inputs to protect the application against unwanted coupled signals. The value of the capacitor must be between
100 pF and 1 nF. Some applications have better overall accuracy with additional series resistance, however, this
increased accuracy is specific to the setup. When series resistance is added, the value must not be greater than
3 kΩ.
If filtering is needed, TI recommends component values of 100-pF and 50-Ω on each input. Exact values are
specific to the application.
space
NOTE
Whenever changing between standard and extended temperature ranges, be aware that
the temperatures stored in the temperature limit registers are NOT automatically
reformatted to correspond to the new temperature range format. These temperature limit
values must be reprogrammed in the appropriate binary or extended binary format.
Local and remote temperature data uses two bytes for data storage. The high byte stores the temperature with a
resolution of 1°C. The second or low byte stores the decimal fraction value of the temperature and allows a
higher measurement resolution, as listed in Table 2. The measurement resolution for the remote channel is
0.0625°C, and is not adjustable. The measurement resolution for the local channel is adjustable, and can be set
for either 0.5°C, 0.25°C, 0.125°C, or 0.0625°C by setting the RES1 and RES0 bits listed in Table 6.
14
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Table 2. Decimal Fraction Temperature Data Format (Local and Remote Temperature Low Bytes)
REMOTE TEMPERATURE
REGISTER LOW BYTE VALUE
LOCAL TEMPERATURE REGISTER LOW BYTE VALUE
0.0625°C RESOLUTION
0.5°C RESOLUTION
0.25°C RESOLUTION
0.125°C RESOLUTION
0.0625°C RESOLUTION
STANDARD AND
EXTENDED BINARY
HEX
STANDARD AND
EXTENDED BINARY
HEX
STANDARD AND
EXTENDED
BINARY
HEX
STANDARD AND
EXTENDED BINARY
HEX
STANDARD AND
EXTENDED BINARY
HEX
0.0000
0000 0000
00
0000 0000
00
0000 0000
00
0000 0000
00
0000 0000
00
0.0625
0001 0000
10
0000 0000
00
0000 0000
00
0000 0000
00
0001 0000
10
0.1250
0010 0000
20
0000 0000
00
0000 0000
00
0010 0000
20
0010 0000
20
0.1875
0011 0000
30
0000 0000
00
0000 0000
00
0010 0000
20
0011 0000
30
0.2500
0100 0000
40
0000 0000
00
0100 0000
40
0100 0000
40
0100 0000
40
0.3125
0101 0000
50
0000 0000
00
0100 0000
40
0100 0000
40
0101 0000
50
0.3750
0110 0000
60
0000 0000
00
0100 0000
40
0110 0000
60
0110 0000
60
0.4375
0111 0000
70
0000 0000
00
0100 0000
40
0110 0000
60
0111 0000
70
0.5000
1000 0000
80
1000 0000
80
1000 0000
80
1000 0000
80
1000 0000
80
0.5625
1001 0000
90
1000 0000
80
1000 0000
80
1000 0000
80
1001 0000
90
0.6250
1010 0000
A0
1000 0000
80
1000 0000
80
1010 0000
A0
1010 0000
A0
0.6875
1011 0000
B0
1000 0000
80
1000 0000
80
1010 0000
A0
1011 0000
B0
0.7500
1100 0000
C0
1000 0000
80
1100 0000
C0
1100 0000
C0
1100 0000
C0
0.8125
1101 0000
D0
1000 0000
80
1100 0000
C0
1100 0000
C0
1101 0000
D0
0.8750
1110 0000
E0
1000 0000
80
1100 0000
C0
1110 0000
E0
1110 0000
E0
0.9375
1111 0000
F0
1000 0000
80
1100 0000
C0
1110 0000
E0
1111 0000
F0
TEMP
(°C)
9.4 Device Functional Modes
9.4.1 Shutdown Mode (SD)
The TMP411 shutdown mode saves maximum power by shutting down all device circuitry other than the serial
interface, which reduces current consumption to typically less than 3 μA; see Figure 10. Shutdown mode is
enabled when the shutdown bit (SD) of the Configuration Register is high; the device shuts down once the
current conversion is completed. When shutdown is low, the device maintains a continuous conversion state.
9.4.2 One-Shot Conversion
When the TMP411 is in shutdown mode (SD = 1 in the Configuration Register), a single conversion on both
channels starts by writing any value to the One-Shot Start Register (pointer address 0Fh). This write operation
starts one conversion, and the TMP411 device returns to shutdown mode when the conversion is complete. The
value of the data sent in the write command is irrelevant, and is not stored by the TMP411. When the TMP411 is
in shutdown mode, an initial 200 μs is required before a one-shot command is given.
NOTE
When a shutdown command is issued, the TMP411 device completes the current
conversion before shutting down. The wait time only applies to the 200 μs immediately
following shutdown. One-shot commands can be issued without delay thereafter.
9.5 Programming
9.5.1 Serial Interface
The TMP411 operates only as a slave device on either the two-wire bus or the SMBus. Connections to either bus
are made through the SDA and SCL open-drain I/O lines. The SDA and SCL pins feature integrated spike
suppression filters and Schmitt triggers that minimize the effects of input spikes and bus noise. The TMP411
supports the transmission protocol for fast (1 kHz to 400 kHz) and high-speed (1 kHz to 3.4 MHz) modes. All
data bytes are transmitted with the MSB first.
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Programming (continued)
9.5.2 Bus Overview
The TMP411 is SMBus interface-compatible. In SMBus protocol, the device that initiates the transfer is a master,
and the master controls devices known as slaves. The bus must be controlled by a master device that generates
the serial clock (SCL), controls the bus access, and generates the START and STOP conditions.
To address a specific device, a START condition is initiated. START is indicated by pulling the data line (SDA)
from a high to low logic level while the SCL line is high. All slaves on the bus shift are in the slave address byte,
with the last bit indicating if a read or write operation is needed. During the ninth clock pulse, the slave that is
addressed responds to the master by generating an acknowledge bit and pulling the SDA line low.
Data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit. During data
transfer, the SDA line must remain stable while the SCL is high. A change in the SDA while the SCL is high is
interpreted as a control signal.
Once all data transfers, the master generates a STOP condition. STOP is indicated by pulling the SDA line from
low to high, while the SCL line is high.
9.5.3 Timing Diagrams
The TMP411 is two-wire and SMBus-compatible. Figure 12 to Figure 16 describe the various operations on the
TMP411. Parameters for Figure 12 are defined in the Timing Requirements section. Bus definitions are given
below:
Bus Idle: Both SDA and SCL lines remain high.
Start Data Transfer: A change in the state of the SDA line, from high to low (while the SCL line is high) defines
a START condition. A START condition initiates each data transfer.
Stop Data Transfer: A change in the state of the SDA line from low to high (while the SCL line is high) defines a
STOP condition. A STOP or repeated START condition terminates each data transfer.
Data Transfer: The number of data bytes transferred between a START and a STOP condition is not limited and
is determined by the master device. The receiver acknowledges the data transfer.
Acknowledge: Each receiving device (when addressed) is required to generate an acknowledge bit. A device
that acknowledges must pull the SDA line down during the acknowledge clock pulse so the SDA line is stable
and low during the high period of the acknowledge clock pulse. Setup and hold times must be taken into account.
On a master receive, the master signals data transfer termination by generating a not-acknowledge bit
transmitted by the slave.
t(LOW)
tF
tR
t(HDSTA)
SCL
t(HIGH)
t(HDSTA)
t(HDDAT)
t(SUSTO)
t(SUSTA)
t(SUDAT)
SDA
t(BUF)
P
S
S
P
Figure 12. Two-Wire Timing Diagram
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Programming (continued)
1
9
9
1
«
SCL
SDA
0
1
0
1
1
0
(1)
0
Start By
Master
R/W
P7
P6
P5
P4
P3
P2
P1
ACK By
TMP411A
ACK By
TMP411A
Frame 2 Pointer Register Byte
Frame 1 TwoíWire Slave Address Byte
9
1
«
P0
1
9
SCL
(Continued)
SDA
(Continued)
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
ACK By
TMP411A
ACK By
TMP411A
Frame 4 Data Byte 2
Frame 3 Data Byte 1
(1)
Stop By
Master
Slave address 1001100 (TMP411A) shown. Slave address changes for TMP411B and TMP411C. See Ordering
Information table for more details.
Figure 13. Two-Wire Timing Diagram for Write Word Format
1
9
1
9
SCL
1
SDA
0
0
1
1
0
0(1)
P7
R/W
Start By
Master
P6
P5
P4
P3
P2
P1
P0
ACK By
TMP411A
ACK By
TMP411A
Frame 1 Two−Wire Slave Address Byte
Frame 2 Pointer Register Byte
1
9
1
9
SCL
(Continued)
SDA
(Continued)
1
0
0
1
1
0
0(1)
R/W
Start By
Master
D7
D6
ACK By
TMP411A
Frame 3 Two−Wire Slave Address Byte
D5
D4
D3
D2
D1
D0
From
TMP411A
NACK By
Master(2)
Frame 4 Data Byte 1 Read Register
(1)
Slave address 1001100 (TMP411A) shown. Slave address changes for TMP411B and TMP411C. See Ordering
Information table for more details.
(2)
Master must leave the SDA high to terminate a single−byte read operation.
Figure 14. Two-Wire Timing Diagram for Single-Byte Read Format
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Programming (continued)
1
9
1
9
SCL
SDA
0
1
0
1
1
0
0(1)
R/W
Start By
Master
P7
P6
P5
P4
P3
P2
P1
P0
ACK By
TMP411A
ACK By
TMP411A
Frame 2 Pointer Register Byte
Frame 1 Two-Wire Slave Address Byte
1
9
1
9
SCL
(Continued)
SDA
(Continued)
1
0
0
1
1
0
0(1)
R/W
Start By
Master
D7
D6
D5
D4
D3
ACK By
TMP411A
D1
D0
From
TMP411A
ACK By
Master
Frame 4 Data Byte 1 Read Register
Frame 3 Two-Wire Slave Address Byte
1
D2
9
SCL
(Continued)
SDA
(Continued)
D7
D6
D5
D4
D3
D2
D1
D0
From
TMP411A
NACK By
Master(2)
Stop By
Master
Frame 5 Data Byte 2 Read Register
(1)
Slave address 1001100 (TMP411A) is shown. Slave address changes for TMP411B and TMP411C. See Ordering
Information table for more details.
(2)
Master must leave SDA high to terminate a two−byte read operation.
Figure 15. Two-Wire Timing Diagram for Two-Byte Read Format
ALERT
1
9
1
9
SCL
0
SDA
0
0
1
1
Start By
Master
0
(1)
0
R/W
1
0
0
ACK By
TMP411A
Frame 1 SMBus ALERT Response Address Byte
1
1
0
0
From
TMP411A
Status
NACK By
Master
Stop By
Master
Frame 2 Slave Address Byte
NOTE (1): Slave address 1001100 (TMP411A) shown. Slave address changesfor TMP411B and TMP411C. See Ordering Information table for more details.
(1)
Slave address 1001100 (TMP411A) is shown. Slave address changes for TMP411B and TMP411C. See Ordering
Information table for more details.
Figure 16. Timing Diagram for SMBus Alert
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Programming (continued)
THERM Limit and ALERT High Limit
Measured
Temperature
ALERT Low Limit and THERM Limit Hysteresis
THERM
ALERT
SMBus ALERT
Read
Read
Read
Time
Figure 17. SMBus Alert Timing Diagram
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Programming (continued)
9.5.4 Serial Bus Address
To communicate with the TMP411, the master must first address slave devices through a slave address byte.
The slave address byte consists of seven address bits and a direction bit that indicates whether the operation is
read or write. The address of the TMP411A is 4Ch (1001100b). The address of the TMP411B is 4Dh
(1001101b). The address of the TMP411E is 4Ch (1001100b).
9.5.5 Read and Write Operations
To access a particular register on the TMP411, the appropriate value must be written to the Pointer Register.
With the read and write bit low, the value for the Pointer Register is the first byte transferred after the slave
address byte. Every write operation to the TMP411 requires a value for the Pointer Register, as shown in
Figure 13.
When reading from the TMP411, the last value stored in the Pointer Register by a write operation determines
which register is read by a read operation. A new value must be written to the Pointer Register to change the
register pointer for a read operation. This transaction is accomplished by issuing a slave address byte with the
read and write bit low, followed by the Pointer Register byte. No additional data is required. The master then
generates a START condition and sends the slave address byte with the read and write bit high to initiate the
read command. See Figure 14 for details of this sequence. If repeated reads from the same register are desired,
it is not necessary to continually send the Pointer Register bytes, because the TMP411 device retains the Pointer
Register value until the next write operation changes the value. Note that the MSB sends the register bytes first,
followed by the LSB.
9.5.6 Timeout Function
When bit 7 of the Consecutive Alert Register is set high, the TMP411 timeout function is enabled. The TMP411
device resets the serial interface if the SCL or SDA lines are held low for 30 ms (typical) between a START and
STOP condition. If the TMP411 device is holding the bus low, the device releases the bus and waits for a START
condition. To avoid activating the timeout function, it is necessary to maintain a communication speed of at least
1 kHz for the SCL operating frequency. The default state of the timeout function is enabled (bit 7 = high).
9.5.7 High-Speed Mode
For the two-wire bus to operate at frequencies above 400 kHz, the master device must issue a high-speed mode
(Hs-mode) master code (00001XXX) as the first byte after a START condition to switch the bus to high-speed
operation. The TMP411 device does not acknowledge this byte, but switches the input filters on the SDA and
SCL lines, switches the output filter on SDA to operate in Hs-mode, which allows transfers at up to 3.4 MHz.
After the Hs-mode master code is issued, the master transmits a two-wire slave address to initiate a data transfer
operation. The bus operates in high-speed mode until a STOP condition occurs on the bus. The TMP411
switches the input and output filter after receiving the STOP condition.
9.5.8 General Call Reset
The TMP411 device supports reset through the two-wire general call address 00h (0000 0000b). The TMP411
device reads the general call address and responds to the second byte. If the second byte is 06h (0000 0110b),
the TMP411 executes a software reset. The software reset restores the power-on-reset state to all TMP411
registers, aborts any conversion in progress, and clears the ALERT and THERM pins. The TMP411 does not
respond to other values in the second byte.
9.5.9 Software Reset
The TMP411 resets by writing any value to Pointer Register FCh. This restores the power-on-reset state to all of
the TMP411 registers, aborts any conversion in process, and clears the ALERT and THERM pins.
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Programming (continued)
9.5.10 SMBus Alert Function
The TMP411 device supports the SMBus alert function. When pin 6 is configured as an alert output, the ALERT
pin of the TMP411 can connect as an SMBus alert signal. When a master detects an alert condition on the
ALERT line, the master sends an SMBus alert command (00011001) on the bus. If the ALERT pin of the
TMP411 is active, the device acknowledges the SMBus alert command and returns the slave address on the
SDA line. The eighth bit of the slave address byte indicates if the high limit or low limit temperature settings
caused the alert condition. The bit is high if the temperature is greater than or equal to one of the temperature
high limit settings; the bit is low if the temperature is less than one of the temperature low limit settings. See
Figure 16 for details of this sequence.
If multiple devices on the bus respond to the SMBus alert command, arbitration during the slave address portion
of the SMBus alert command determines which device clears the alert status. If the TMP411 wins the arbitration,
the ALERT pin inactivates when the SMBus alert command is complete. If the TMP411 device loses the
arbitration, the ALERT pin remains active.
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9.6 Register Map
Table 3. Register Map Summary
POINTER ADDRESS
(HEX)
READ
00
(1)
(2)
(3)
22
BIT DESCRIPTION
POWER-ONRESET (HEX)
REGISTER DESCRIPTIONS
WRITE
NA
(1)
D7
D6
D5
D4
D3
D2
D1
D0
00
LT11
LT10
LT9
LT8
LT7
LT6
LT5
LT4
Local Temperature (High Byte)
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
Remote Temperature (High
Byte)
01
NA
00
02
NA
XX
BUSY
LHIGH
LLOW
RHIGH
RLOW
OPEN
RTHRM
LTHRM
Status Register
03
09
00
MASK1
SD
AL/TH
0
0
RANGE
0
0
Configuration Register
04
0A
08
0
0
0
0
R3
R2
R1
R0
Conversion Rate Register
05
0B
55
LTH11
LTH10
LTH9
LTH8
LTH7
LTH6
LTH5
LTH4
Local Temperature High Limit
(High Byte)
06
0C
00
LTL11
LTL10
LTL9
LTL8
LTL7
LTL6
LTL5
LTL4
Local Temperature Low Limit
(High Byte)
07
0D
55
RTH11
RTH10
RTH9
RTH8
RTH7
RTH6
RTH5
RTH4
Remote Temperature High Limit
(High Byte)
08
0E
00
RTL11
RTL10
RTL9
RTL8
RTL7
RTL6
RTL5
RTL4
Remote Temperature :Low Limit
(High Byte)
NA
0F
XX
X
X
X
X
X
X
X
X
One-Shot Start
10
NA
00
RT3
RT2
RT1
RT0
0
0
0
0
Remote Temperature (Low Byte)
11
11
00
RTOS11
RTOS10
RTOS9
RTOS8
RTOS7
RTOS6
RTOS5
RTOS4
Remote Temperature Offset
Register (High Byte) (3)
12
12
00
RTOS3
RTOS2
RTOS1
RTOS0
0
0
0
0
Remote Temperature Offset
Register (Low Byte) (3)
13
13
00
RTH3
RTH2
RTH1
RTH0
0
0
0
0
Remote Temperature High Limit
(Low Byte)
14
14
00
RTL3
RTL2
RTL1
RTL0
0
0
0
0
Remote Temperature Low Limit
(Low Byte)
15
NA
00
LT3
LT2
LT1
LT0
0
0
0
0
Local Temperature (Low Byte)
16
16
00
LTH3
LTH2
LTH1
LTH0
0
0
0
0
Local Temperature HIgh Limit
(Low Byte)
17
17
00
LTL3
LTL2
LTL1
LTL0
0
0
0
0
Local Temperature Low Limit
(Low Byte)
18
18
00
NC7
NC6
NC5
NC4
NC3
NC2
NC1
NC0
N-factor correction
19
19
55
RTHL11
RTHL10
RTHL9
RTHL8
RTHL7
RTHL6
RTHL5
RTHL4
Remote THERM Limit
1A
1A
1C
0
0
0
1
1
1
RES1
RES0
Resolution Register
20
20
55
LTHL11
LTHL10
LTHL9
LTHL8
LTHL7
LTHL6
LTHL5
LTHL4
Local THERM Limit
21
21
0A
TH11
TH10
TH9
TH8
TH7
TH6
TH5
TH4
THERM Hysteresis
22
22
81
TO_EN
0
0
0
C2
C1
C0
0
Consecutive Alert Register
30
30
FF
LMT11
LMT10
LMT9
LMT8
LMT7
LMT6
LMT5
LMT4
Local Temperature Minimum
(High Byte)
(2)
NA = not applicable; register is write- or read-only.
X = indeterminable state.
Offset registers 11 and 12 are only available for the TMP411E device.
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Register Map (continued)
Table 3. Register Map Summary (continued)
POINTER ADDRESS
(HEX)
READ
WRITE
31
31
32
BIT DESCRIPTION
POWER-ONRESET (HEX)
REGISTER DESCRIPTIONS
D7
D6
D5
D4
D3
D2
D1
D0
F0
LMT3
LMT2
LMT1
LMT0
0
0
0
0
Local Temperature Minimum
(Low Byte)
32
00
LXT11
LXT10
LXT9
LXT8
LXT7
LXT6
LXT5
LXT4
Local Temperature Maximum
(High Byte)
33
33
00
LXT3
LXT2
LXT1
LXT0
0
0
0
0
Local Temperature Maximum
(Low Byte)
34
34
FF
RMT11
RMT10
RMT9
RMT8
RMT7
RMT6
RMT5
RMT4
Remote Temperature Minimum
(High Byte)
35
35
F0
RTM3
RTM2
RTM1
RTM0
0
0
0
0
Remote Temperature Minimum
(Low Byte)
36
36
00
RXT11
RXT10
RXT9
RXT8
RXT7
RXT6
RXT5
RXT4
Remote Temperature Maximum
(High Byte)
37
37
00
RXT3
RXT2
RXT1
RXT0
0
0
0
0
Remote Temperature Maximum
(Low Byte)
NA
FC
XX
X
X
X
X
X
X
X
Software Reset
FE
NA
55
0
1
0
1
0
1
0
1
Manufacturer ID
FF
NA
12
0
0
0
1
0
0
1
0
Device ID for TMP411A
FF
NA
13
0
0
0
1
0
0
1
1
Device ID for TMP411B
FF
NA
10
0
0
0
1
0
0
0
0
Device ID for TMP411C
FF
NA
12
0
0
0
1
0
0
1
0
Device ID for TMP411E
X
(2)
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9.6.1 Register Information
The TMP411 contains multiple registers for holding configuration information, temperature measurement results,
maximum and minimum temperature comparator limits, and status information. These registers are described in
Figure 18 and Table 3.
9.6.2 Pointer Register
Figure 18 shows the internal register structure of the TMP411 . The 8-bit pointer register addresses a given data
register. The Pointer Register identifies which of the data registers must respond to a read or write command on
the two-wire bus. This register is set with every write command. A write command must be issued to set the
proper value in the pointer register before executing a read command. Table 3 lists the pointer address of the
registers available in the TMP411 . Offset registers 11 and 12 are only available for the TMP411E device . The
power-on-reset (POR) value of the Pointer Register is 00h (0000 0000b).
Pointer Register
Local and Remote Temperature Registers
Status Register
Configuration Register
SDA
Conversion Rate Register
Local and Remote Temperature Limit Registers
One-Shot Start Register
Remote Temperature Offset Registers
I/O
Control
Interface
Local and Remote THERM Limit Registers
THERM Hysteresis Register
Consecutive ALERT Register
N-factor Correction Register
SCL
Digital Filter Register
Manufacturer ID Register
Figure 18. Internal Register Structure
9.6.3 Temperature Registers
The TMP411 has four 8-bit registers that hold temperature measurement results. The local and remote channels
have a high byte register that contains the most significant bits (MSBs) of the temperature analog-to-digital
converter (ADC) result and a low byte register that contains the least significant bits (LSBs) of the temperature
ADC result. The local channel high byte address is 00h; the local channel low byte address is 15h. The remote
channel high byte is at address 01h; the remote channel low byte address is 10h. These registers are read-only
and are updated by the ADC each time a temperature measurement is completed.
The TMP411 contains circuitry to assure that a low byte register read command returns data from the same ADC
conversion as the immediately preceding high byte read command. This assurance remains valid only until
another register is read. For proper operation, the high byte of a temperature register must be read first. The low
byte register must be read in the next read command. The low byte register may be left unread if the LSBs are
not needed. The temperature registers may be read as a 16-bit register using a single two-byte read command
from address 00h for the local channel result, or from address 01h for the remote channel result. The high byte is
read output first, followed by the low byte. Both bytes of this read operation are from the same ADC conversion.
The power-on-reset value of both temperature registers is 00h.
24
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9.6.4 Limit Registers
The TMP411 has 11 registers for setting comparator limits for the local and remote measurement channels.
These registers have read and write capability. The High and Low Limit Registers for both channels span two
registers, as do the temperature registers. The local temperature high limit is set by writing the high byte to
pointer address 0Bh, writing the low byte to pointer address 16h, or by using a single two-byte write command
(high byte first) to pointer address 0Bh. The local temperature high limit is read by the high byte from pointer
address 05h, the low byte from pointer address 16h, or by using a two-byte read command from pointer address
05h. The power-on-reset value of the local temperature high limit is 55h or 00h. The power-on-reset value of the
local temperature high limit is 55h or 00h (85°C in standard temperature mode and 21°C in extended
temperature mode).
Similarly, the local temperature low limit is set by writing the high byte to pointer address 0Ch, writing the low
byte to pointer address 17h, or by using a single two-byte write command to pointer address 0Ch. The local
temperature low limit is read by the high byte from pointer address 06h, the low byte from pointer address 17h,
or by using a two-byte read from pointer address 06h. The power-on-reset value of the local temperature low
limit register is 00h (0°C in standard temperature mode, and −64°C in extended mode).
The remote temperature high limit is set by writing the high byte to pointer address 0Dh, writing the low byte to
pointer address 13h, or by using a two-byte write command to pointer address 0Dh. The remote temperature
high limit is read by the high byte from pointer address 07h, the low byte from pointer address 13h, or by using a
two-byte read command from pointer address 07h. The power-on-reset value of the Remote Temperature High
Limit Register is 55h or 00h (85°C in standard temperature mode, and 21°C in extended temperature mode).
The remote temperature low limit is set by writing the high byte to pointer address 0Eh,writing the low byte to
pointer address 14h, or by using a two-byte write to pointer address 0Eh. The remote temperature low limit is
read by the high byte from pointer address 08h, the low byte from pointer address 14h, or by using a two-byte
read from pointer address 08h. The power-on-reset value of the Remote Temperature Low Limit Register is 00h
(0°C in standard temperature mode, and −64°C in extended mode).
The TMP411 has a THERM limit register for the local and remote channels. These registers are eight bits and
allow for THERM limits to be set to 1°C resolution. The local channel THERM limit is set by writing to pointer
address 20h. The remote channel THERM limit is set by writing to pointer address 19h. The local channel
THERM limit is read from pointer address 20h, and the remote channel THERM limit is read from pointer address
19h. The power-on-reset value of the THERM limit registers is 55h (85°C in standard temperature mode or 21°C
in extended temperature mode). The THERM limit comparators have hysteresis. The hysteresis of the
comparators is set by writing to pointer address 21h. The hysteresis value is obtained by reading from pointer
address 21h. The Hysteresis Register value is an unsigned number that is always positive. The power-on-reset
value of this register is 0Ah (10°C).
When changing between standard and extended temperature ranges, note that the temperatures stored in the
temperature limit registers do not automatically reformat to correspond to the new temperature range format.
These values must be reprogrammed in the appropriate binary or extended binary format.
9.6.5 Status Register
The TMP411 has a Status Register that reports the state of the temperature comparators. Table 4 lists the
Status Register bits. The Status Register is read-only from pointer address 02h.
The BUSY bit reads as 1 if the ADC is making a conversion, and 0 if the ADC is not converting.
The OPEN bit reads as 1 if the remote transistor is detected as OPEN since the last read of the Status Register.
The OPEN status is only detected when the ADC is attempting to convert a remote temperature.
The RTHRM bit reads as 1 if the remote temperature exceeds the remote THERM limit, remains greater than the
remote THERM limit, and less than the value in the shared Hysteresis Register, as shown in Figure 17.
The LTHRM bit reads as 1 if the local temperature exceeds the local THERM limit, remains greater than the local
THERM limit, and less than the value in the shared Hysteresis Register, as shown in Figure 17.
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The LHIGH and RHIGH bit values depend on the state of the AL or TH bit in the Configuration Register. If the AL
or TH bit is 0, the LHIGH bit reads as 1 if the local high limit was exceeded since the last clearing of the Status
Register. The RHIGH bit reads as 1 if the remote high limit was exceeded since the last clearing of the Status
Register. If the AL or TH bit is 1, the remote high limit and the local high limit implement a THERM2 function.
LHIGH reads as 1 if the local temperature has exceeded the local high limit and remains greater than the local
high limit, and less than the value in the Hysteresis Register.
The RHIGH bit reads as 1 if the remote temperature exceeds the remote high limit and remains greater than the
remote high limit, and less than the value in the Hysteresis Register.
The LLOW and RLOW bits are not effected by the AL or TH bit. The LLOW bit reads as 1 if the local low limit
was exceeded since the last clearing of the Status Register. The RLOW bit reads as 1 if the remote low limit was
exceeded since the last clearing of the Status Register.
The values of the LLOW, RLOW, and OPEN (as well as LHIGH and RHIGH when AL or TH is 0) are latched and
are read as 1 until the Status Register is read or a device reset occurs. These bits are cleared by reading the
Status Register, provided that the condition causing the flag to be set no longer exists. The values of BUSY,
LTHRM, and RTHRM (as well as LHIGH and RHIGH when ALERT or THERM2 is 1) are not latched and are not
cleared by reading the Status Register. The values indicate the current state, and are updated appropriately at
the end of the corresponding ADC conversion. Clearing the Status Register bits does not clear the state of the
ALERT pin. An SMBus alert response address command must clear the ALERT pin.
The TMP411 NORs LHIGH, LLOW, RHIGH, RLOW, and OPEN, so a status change for any of these flags from 0
to 1 automatically causes the ALERT pin to go low. (This only applies when the ALERT or THERM2 pin is
configured for ALERT mode).
Table 4. Status Register Format
STATUS REGISTER (READ = 02h, WRITE = NA)
Bit
Number
D7
D6
D5
D4
D3
D2
D1
D0
Bit Name
BUSY
LHIGH
LLOW
RHIGH
RLOW
OPEN
RTHRM
LTHRM
0
0
0
0
0
0
0
POR
Value
(1)
0
(1)
The BUSY bit changes to 1 almost immediately ( 0.25 V at 6 µA, at the highest sensed temperature.
2. Base-emitter voltage < 0.95 V at 120 µA, at the lowest sensed temperature.
3. Base resistance < 100 Ω
4. Tight control of VBE characteristics indicated by small variations in hFE (that is, 50 to 150).
32
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Typical Application (continued)
Based on these criteria, TI recommends using two small-signal transistors, such as the 2N3904 (NPN) or
2N3906 (PNP).
10.2.2 Detailed Design Procedure
The temperature measurement accuracy of the TMP411 depends on the remote or local temperature sensor
being at the same temperature as the monitored system point. If the temperature sensor is not in good thermal
contact with the part of the system being monitored, then there is a delay in the response of the sensor to a
temperature change in the system. For remote temperature sensing applications using a substrate transistor (or
a small, SOT-23 transistor) placed close to the device , this delay is usually not a concern.
The local temperature sensor inside the TMP411 monitors the ambient air around the device. The thermal time
constant for the TMP411 is approximately two seconds. This constant implies that if the ambient air changes
quickly by 100°C, the TMP411 takes approximately 10 seconds (that is, five thermal time constants) to settle
within 1°C of the final value. In most applications, the TMP411 package is in electrical (and thermal contact) with
the printed circuit board (PCB), and subjected to forced airflow. The accuracy of the temperature measurement
directly depends on how accurately the PCB and forced airflow temperatures represent the temperature
measured by the device. Additionally, the internal power dissipation of the TMP411 can cause the temperature to
rise above the ambient or PCB temperature. The internal power dissipated is a result of exciting the remote
temperature sensor is negligible because of the small currents used.
For a 3.3-V supply and maximum conversion rate of eight conversions per second, the TMP411 dissipates 1.32
mW (PD IQ = 3.3 V × 400 µA). If the ALERT/THERM2 and THERM pins are each sinking 1 mA, an additional
power of 0.8 mW is dissipated (PD OUT = 1 mA × 0.4 V + 1 mA × 0.4 V = 0.8 mW). Total power dissipation
equals 2.12 mW (PD IQ + PD OUT) and (with a θJA value of 150°C/W) causes the junction temperature to rise
approximately 0.318°C above the ambient.
10.2.3 Application Curves
2
3.0
VS = 3.3V
TDIODE = +25 °C (temperature at remote diode)
30 Typical Units Shown
= 1.008
1
0
í1
í2
í3
í50
í25
0
25
50
75
50 Units Shown
VS = 3.3V
Local Temperature Error ( °C)
Remote Temperature Error (°C)
3
100
125
2.0
1.0
0
í1.0
í2.0
í3.0
í50
Ambient Temp erature, TA (°C)
í25
0
25
50
75
100
125
Ambient Temperature, TA ( °C)
Figure 19. Remote Temperature Error vs TMP411 Ambient
Temperature
Figure 20. Local Temperature Error vs TMP411 Ambient
Temperature
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11 Power Supply Recommendations
The TMP411 operates with a power supply range of 2.7 V to 5.5 V. The device is optimized for operation at a
3.3-V supply, but measures temperature accurately in the full supply range. TI recommends using a power
supply bypass capacitor. Place the capacitor as close as possible to the supply and ground pins of the device.
0.1 µF is a typical value for the supply bypass capacitor. Applications with noisy or high-impedance power
supplies may require additional decoupling capacitors to reject power-supply noise.
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12 Layout
12.1 Layout Guidelines
Remote temperature sensing on the TMP411 measures small voltages using low currents, and therefore noise at
the device inputs must be minimized. Most applications using the TMP411 have high digital content with several
clocks and logic-level transitions that create a noisy environment. The layout must adhere to the following
guidelines:
• Place the TMP411 as close to the remote junction sensor as possible.
• Route the D+ and D– traces next to each other and shield the traces from adjacent signals using ground
guard traces, as shown in Figure 21. If a multilayer PCB is used, bury these traces between ground or VDD
planes to shield them from extrinsic noise sources. TI recommends using 5-mm (0.127 mm) PCB traces.
• Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are
used, make the same number and approximate location of copper-to-solder connections in the D+ and D–
connections to cancel any thermocouple effects.
• Use a 0.1–µF local bypass capacitor directly between the V+ and GND pins of the TMP411, as shown in
Figure 22. Minimize filter capacitance between D+ and D– to 1000 pF or less for optimum measurement
performance. This capacitance includes any cable capacitance between the remote temperature sensor and
the TMP411 .
• If the connection between the remote temperature sensor and the TMP411 is less than eight inches (20 cm),
use a twisted-wire pair connection. If the connection measures more than eight inches (20 cm), use a twisted,
shielded pair with the shield grounded as close to the TMP411 as possible. Leave the remote sensor
connection end of the shield wire open to avoid grounded loops and 60-Hz pickup.
GND
D+
Ground or V+ layer
on bottom and/or
top, if possible.
Dí
GND
Figure 21. Example Signal Traces
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Layout Guidelines (continued)
0.1µF Capacitor
V+
GND
PCB Via
1
8
2
7
3
6
4
5
PCB Via
TMP411
Figure 22. Suggested Bypass Capacitor Placement
12.2 Layout Example
VIA to Power or Ground Plane
VIA to Internal Layer
Pullup Resistors
Supply Voltage
Supply Bypass
Capacitor
RS
1
V+
SC L
8
2
D+
SDA
7
3
D-
C DIFF
RS
4
THERM
ALERT/
THERM2
GND
6
Thermal
Shutdown
5
Serial Bus Traces
Figure 23. TMP411 Device Layout
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13 Device and Documentation Support
13.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
13.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.3 Trademarks
E2E is a trademark of Texas Instruments.
DLP is a trademark of others.
All other trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
13.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TMP411AD
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
T411A
TMP411ADG4
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
T411A
TMP411ADGKR
ACTIVE
VSSOP
DGK
8
2500
RoHS & Green NIPDAU | NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
411A
TMP411ADGKRG4
ACTIVE
VSSOP
DGK
8
2500
RoHS & Green
Level-2-260C-1 YEAR
-40 to 125
411A
TMP411ADGKT
ACTIVE
VSSOP
DGK
8
250
RoHS & Green NIPDAU | NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
411A
TMP411ADR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
T411A
TMP411BD
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
T411B
TMP411BDGKR
ACTIVE
VSSOP
DGK
8
2500
RoHS & Green NIPDAU | NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
411B
TMP411BDGKT
ACTIVE
VSSOP
DGK
8
250
RoHS & Green NIPDAU | NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
411B
TMP411BDR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
T411B
TMP411CD
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
T411C
TMP411CDGKR
ACTIVE
VSSOP
DGK
8
2500
RoHS & Green
NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
411C
TMP411CDGKT
ACTIVE
VSSOP
DGK
8
250
RoHS & Green NIPDAU | NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
411C
TMP411CDR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
T411C
TMP411EDGKR
ACTIVE
VSSOP
DGK
8
2500
RoHS & Green
NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
411E
TMP411EDGKT
ACTIVE
VSSOP
DGK
8
250
RoHS & Green
NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
411E
(1)
NIPDAU
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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10-Dec-2020
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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