0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
TPA3131D2EVM

TPA3131D2EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    EVAL BOARD FOR TPA3131D2

  • 数据手册
  • 价格&库存
TPA3131D2EVM 数据手册
User's Guide SLOU374 – July 2013 TPA3131D2EVM Audio Amplifier Evaluation Module This evaluation module allows users to evaluate TI's TPA3131D2 audio amplifier. This user's guide contains an operations description, schematic, printed-circuit board (PCB) layout, and the bill of materials (BOM). 1 2 3 Contents Introduction .................................................................................................................. Operation ..................................................................................................................... 2.1 Quick-Start List for Stand-Alone Operation ..................................................................... Schematic, Layout, and Bill of Materials ................................................................................. 3.1 TPA3131D2EVM Schematic ...................................................................................... 3.2 TPA3131D2EVM Printed-Circuit Board Layers ................................................................ 3.3 TPA3131D2EVM Bill of Materials ................................................................................ 2 3 3 4 4 5 6 List of Figures 1 TPA3131D2EVM Audio Power Amplifier – Top View .................................................................. 2 2 TPA3131D2EVM Audio Power Amplifier – Bottom View .............................................................. 2 3 TPA3131D2EVM Schematic............................................................................................... 4 4 TPA3131D2EVM – Top-Side Layout ..................................................................................... 5 5 TPA3131D2EVM – Bottom-Side Layout ................................................................................. 5 List of Tables 1 Power Supply Requirements .............................................................................................. 3 2 TPA3131D2EVM Jumpers ................................................................................................. 3 3 TPA3131D2EVM Bill of Materials ......................................................................................... 6 SLOU374 – July 2013 Submit Documentation Feedback TPA3131D2EVM Audio Amplifier Evaluation Module Copyright © 2013, Texas Instruments Incorporated 1 Introduction 1 www.ti.com Introduction The TPA3131D2EVM (EVM) customer evaluation module, Figure 1 and Figure 2, demonstrates the TPA3131D2 integrated circuit (IC) from Texas Instruments. Figure 1. TPA3131D2EVM Audio Power Amplifier – Top View Figure 2. TPA3131D2EVM Audio Power Amplifier – Bottom View 2 TPA3131D2EVM Audio Amplifier Evaluation Module Copyright © 2013, Texas Instruments Incorporated SLOU374 – July 2013 Submit Documentation Feedback Operation www.ti.com 2 Operation 2.1 Quick-Start List for Stand-Alone Operation Section 2.1.1 and Section 2.1.2 provide instructions for using the TPA3131D2EVM in stand-alone operation or when connecting it into existing circuits or equipment. Connections to the EVM power supply and output connectors can be made by inserting stripped wire or using banana jacks. The input connectors are RCA phono jacks. 2.1.1 Power Supply A single power supply is required to power the EVM. Because most of the pins are PVCC compliant, the PVCC supply can also be used to power the analog supply (AVcc) and to pull up the logic pins for shutdown (SD) control, and gain (GAIN). PLIMIT can be powered by an external supply connected to the PLIMIT pin. Do not power the PLIMIT pin through the PLIMIT network when the PVCC supply is turned off. This can damage the IC. Table 1. Power Supply Requirements Description Voltage Range Current Requirements Wire Size PVCC 4.5 V to 26 V 3A 24 AWG 1. Ensure that the external regulated power supply is turned OFF. 2. Connect the external regulated power supply, adjusted from 4.5 V to 26 V, to the PVCC and GND banana jacks on the EVM taking care to observe marked polarity. 2.1.2 EVM Preparations Inputs and Outputs 1. For a BTL configuration, remove jumpers from JP5 and JP6 and connect loads across the outputs (LEFT+ and LEFT–) and (RIGHT+ and RIGHT–). For PBTL configuration, insert jumpers on JP5 and JP6 and connect a single load from one of the left speaker jacks to one of the right speaker jacks. 2. Connect audio inputs, either differential or single-ended, to the LIN and RIN RCA phono plugs for BTL operation. For PBTL operation, connect a single input, differential or single-ended, to the RIN RCA phono plug. Table 2. TPA3131D2EVM Jumpers Jumper Function Options Notes Fault to SD short Auto SD = insert, No SD= open When inserted, fault pulls down SD Gvdd to Plimit short Insert to defeat, remove to enable See datasheet (SLOS841) JP5 BTL or PBTL Insert for PBTL, remove for BTL JP5 and JP6 should match JP6 BTL or PBTL Insert for PBTL, remove for BTL JP5 and JP6 should match AM0 AM1 AM2 Oscillator frequency AM2=0, AM2=0, AM2=0, AM2=0, AM2=1, AM2=1, AM2=1, AM2=1, 400 kHz 500 kHz 600 kHz 1000 kHz 1200 kHz Reserved Reserved Reserved JP1 RCA Gnd to Board GND JP2 RCA Gnd to Board GND JP3 JP4 AM1=0, AM1=0, AM1=1, AM1=1, AM1=0, AM1=0, AM1=1, AM1=1, AM0=0 AM0=1 AM0=0 AM0=1 AM0=0 AM0=1 AM0=0 AM0=1 Power Up 1. Verify correct power supply voltage and polarity, and turn the external power supply ON. The EVM begins to operate. 2. Adjust the audio source for the correct volume. SLOU374 – July 2013 Submit Documentation Feedback TPA3131D2EVM Audio Amplifier Evaluation Module Copyright © 2013, Texas Instruments Incorporated 3 Schematic, Layout, and Bill of Materials www.ti.com 3 Schematic, Layout, and Bill of Materials 3.1 TPA3131D2EVM Schematic Figure 3 illustrates the schematic for this EVM. TPA3131D2RHB/TPA3132D2RHB/TPA3133D2RHB EVALUATION BOARD (RevA) STUFF OPTIONS PVCC POWER SUPPLY PVCC Red PVCC GND GND PVCC SD Orange 100K/5% 0603 Shield 1 C1 RIN+ 3 RIN- Orange C3 GVDD TBD 0603 1 LIN- 3 Shield LIN 2 GND 1.0ufd/16V 0603 X7R RCA (Black) ANALOG INPUTS 100.0K 0805 1/8W GND GAIN/SLV 20.0K 0805 1/8W 32 GND GND PVCC 29 28 27 26 25 24 23 U1 5 6 R22 21 QFN32-RHB 18 7 20 11 12 13 14 15 GND L2 GND GND Black GND C15 0.22ufd/25V 0603 X5R 10/5% 0805 1/4W 2 C23 GND AM AVOIDANCE C17 0.22ufd/25V 0603 X5R 330pfd/50V 0603 COG GND PVCC C19 1000pfd/50V 0402 COG 0.1ufd/50V 0603 X7R GND R10 100K/5% 0603 100K/5% 0603 100K/5% 0603 AM1 AM0 AM0 GND + GND 10/5% 0805 1/4W L4 1 GND LEFTBlack JUMPER FOR PBTL MODE Orange LGND Black GND GND 2 LEFT+ 10uH/5.8A D128C LEFT+ C24 R18 3.3/5% 0603 0.68ufd/50V 1206 X7R Red Orange L+ C28 GND 220ufd/35V WT GND TPA3131D2RHB 0.01ufd/100V 0805 X7R TRIPLE FOOTPRINT PADS D128C - 10uH DG6045C - 2.2uH FB1812 GND STUFF OPTION QFN32-RHB PowerPAD R20 SYNC Orange C30 47K/5% 0603 GND MOUNTING HARDWARE 47pfd/50V 0603 COG GND GND GND GND GND M3x25 M3x25 M3x25 M3x25 STANDOFFS TI C27 0.01ufd/100V 0805 X7R R14 C18 U1 AM2 AM1 3.3/5% 0603 GND PVCC C20 R- (PBTL-) R17 0.68ufd/50V 1206 X7R OUTPL C16 Orange C26 LEFT- OUTNL MMBT2222A E R9 3.3/5% 0603 GND 10uH/5.8A D128C R13 330pfd/50V 0603 COG Black R16 0.01ufd/100V 0805 X7R 1 C14 GND Black GND RIGHT- C22 GND L3 16 R+ RIGHT- GND Black GND GND Black JUMPER FOR PBTL MODE Orange GND 2 0.68ufd/50V 1206 X7R MUTE R8 C25 0.01ufd/100V 0805 X7R 17 10 3.3/5% 0603 RIGHT+ Red R15 0.68ufd/50V 1206 X7R GND 10/5% 0805 1/4W SOT23-DBV3 40V,1A AM2 C21 19 8 100K/5% 0603 330pfd/50V 0603 COG (PBTL+) RIGHT+ 10uH/5.8A D128C Q1 GND 2 10uH/5.8A D128C 1 C B 1 GND R12 MUTE 100K/5% 0603 L1 10/5% 0805 1/4W 22 TPA3131D2RHB TPA3132D2RHB TPA3133D2RHB 9 R21 30 2 4 Black INPL JP6 31 C13 0.22ufd/25V 0603 X5R 1 3 GND INNL GND 330pfd/50V 0603 COG R11 OUTNR 1.0ufd/16V 0603 X7R R5 GND JP5 0.22ufd/25V 0603 X5R C12 C6 C4 LIN+ C11 OUTPR GND TBD 0603 R6 1.0ufd/16V 0603 X7R GND C10 1.0ufd/16V 0603 X7R R30 R3 ANALOG OUTPUTS 220ufd/35V WT GND C5 JP4 IN = PBTL OUT = BTL GND 0.1ufd/50V 0603 X7R PLIMIT PLIMIT 1.0ufd/16V 0603 X7R JP2 C8 1000pfd/50V 0402 COG GND C7 + C9 INNR C2 JP1 Orange INPR 1.0ufd/16V 0603 X7R RCA (Red) PVCC JP3 FAULT 2 L1-L4 10uH DS104C2 10uH D128C 10uH D128C R30 75K 36K 0.0 S1 GND R1 RIN 100K/5% 0603 Black R3 27K 56K DNP BOARD TPA3131D2 TPA3132D2 TPA3133D2 R2 M3 M3 M3 M3 WASHERS M3x8 M3x8 M3x8 M3x8 SCREWS DATE MAY 30, 2013 FILENAME TPA3131-32-33D2EVM_RevA.SBK PAGE INFO: TPA3131/3132/3133D2RHB EVALUATION BOARD DESIGN LEAD DAVID K. WILSON SCH REV A PCB REV A SHEET 1 OF 3 DRAWN BY LDN Figure 3. TPA3131D2EVM Schematic 4 TPA3131D2EVM Audio Amplifier Evaluation Module SLOU374 – July 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Schematic, Layout, and Bill of Materials www.ti.com 3.2 TPA3131D2EVM Printed-Circuit Board Layers Figure 4 and Figure 5 illustrate the top- and bottom-side PCB layouts for the EVM. Figure 4. TPA3131D2EVM – Top-Side Layout Figure 5. TPA3131D2EVM – Bottom-Side Layout SLOU374 – July 2013 Submit Documentation Feedback TPA3131D2EVM Audio Amplifier Evaluation Module Copyright © 2013, Texas Instruments Incorporated 5 Schematic, Layout, and Bill of Materials 3.3 www.ti.com TPA3131D2EVM Bill of Materials Table 3 is the TPA3131D2EVM BOM. Table 3. TPA3131D2EVM Bill of Materials Item 6 MANU PART NUM MANU REF Designators Description 1 TPA3131D2RHB TEXAS INSTRUMENTS Qty 1 U1 100 W FILTER-FREE CLASS D STEREO AMP AM AVOIDANCE QFN32-RHB ROHS 2 MMBT2222A-7-F DIODES INC. 1 Q1 TRANSISTOR NPN GENERAL PURPOSE 40V 1A SOT23 DBV3 ROHS 3 C1608X7R1C105K TDK 6 C1, C2, C3, C4, C5, C6 CAP SMD0603 CERM 1.0UFD 16V 10% X7R ROHS 4 UWT1V221MNL1GS NICHICON 2 C7, C18 CAP SMD ELECT 220ufd 35V 20% WT ROHS 5 GRM188R71H104KA93D MURATA 2 C8, C19 CAP SMD0603 CERM 0.1UFD 50V 10% X7R ROHS 6 GRM1555C1H102JA01D MURATA 2 C9, C20 CAP SMD0402 CERM 1000pfd 5% 50V COG ROHS 7 06033D224KAT2A AVX 4 C10, C12, C14, C16 CAP SMD0603 CERM 0.22UFD 25V 10% X5R ROHS 8 GRM1885C1H331JA01D MURATA 4 C11, C13, C15, C17 CAP SMD0603 CERM 330PFD 50V 5% COG ROHS 9 C1206C684K5RACTU KEMET 4 C21, C22, C23, C24 CAP SMD1206 CERM 0.68UFD 50V 10% X7R ROHS 10 GRM21BR72A103KA01L MURATA 4 C25, C26, C27, C28 CAP SMD0805 CERM 0.01UFD 100V 10% X7R ROHS 11 GRM1885C1H470JA01D MURATA 1 C30 CAP SMD0603 CERM 47PFD 50V 5% COG ROHS 12 RMCF0603JT100K STACKPOLE ELECTRONICS 7 R1, R2, R8, R9, R10, R21, R22 RESISTOR SMD0603 100K OHMS 5% 1/10W ROHS 13 ERJ-3EKF2702V PANASONIC 1 R3 RESISTOR SMD0603 27.0K 1% THICK FILM 1/10W ROHS 14 MCR10EZHF1003 ROHM 1 R5 RESISTOR SMD0805 100.0 KOHMs 1% 1/8W ROHS 15 MCR10EZHF2002 ROHM 1 R6 RESISTOR SMD0805 20.0 KOHMs 1% 1/8W ROHS 16 ESR10EZPJ100 ROHM 4 R11, R12, R13, R14 RESISTOR SMD0805 10 OHM 5% 1/4W ROHS 17 ERJ-3GEYJ3R3V PANASONIC 4 R15, R16, R17, R18 RESISTOR SMD0603 3.3 OHMS 5% 1/10W ROHS 18 ERJ-3GEYJ473V PANASONIC 1 R20 RESISTOR SMD0603 47K OHMS 5% 1/10W ROHS 19 RMCF0603FT75K0 STACKPOLE ELECTRONICS 1 R30 RESISTOR SMD0603 75.0K OHMS 1% 1/10W ROHS 20 B952AS-100M TOKO 4 L1, L2, L3, L4 INDUCTOR SMT 10uH 3.6A 44 mOHMS 20% DS104C2 ROHS 21 PBC02SAAN SULLINS 9 AM0, AM1, AM2, JP1, JP2, JP3, JP4, JP5, JP6 HEADER THRU MALE 2 PIN 100LS GOLD ROHS 22 PJRAN1X1U013 SWITCHCRAFT 1 RIN JACK, RCA 3-PIN PCB-RA RED ROHS 23 PJRAN1X1U01X SWITCHCRAFT 1 LIN JACK, RCA 3-PIN PCB-RA BLACK ROHS 24 5001 KEYSTONE ELECTRONICS 6 G1, G2, G3, G4, G5, G6 PC TESTPOINT, BLACK, ROHS 25 5003 KEYSTONE ELECTRONICS 8 L+, L-, R+, R-, SD, SYNC, FAULT, PLIMIT PC TESTPOINT, ORANGE, ROHS 26 TL1015AF160QG E-SWITCH 2 S1, MUTE SWITCH, MOM, 160G SMT 4X3MM ROHS 27 7006 KEYSTONE ELECTRONICS 3 PVCC, LEFT+, RIGHT+ BINDING POST, RED, 15A ECONO ROHS 28 7007 KEYSTONE ELECTRONICS 3 GND, LEFT-, RIGHT- BINDING POST, BLACK, 15A ECONO ROHS TPA3131D2EVM Audio Amplifier Evaluation Module SLOU374 – July 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Schematic, Layout, and Bill of Materials www.ti.com Table 3. TPA3131D2EVM Bill of Materials (continued) Item MANU PART NUM MANU REF Designators Description 29 95947A018 MCMASTER-CARR Qty 4 STANDOFFS STANDOFF M3x25mm 4.5mm DIA HEX ALUM F-F ROHS 30 92148A150 MCMASTER-CARR 4 STANDOFF WASHERS WASHER SPLIT-LOCK M3 6.2mm OD 0.7mm THICK STAINLESS STEEL ROHS 31 92000A118 MCMASTER-CARR 4 STANDOFF SCREWS SCREW M3x8 PHILIPS PANHEAD STAINLESS STEEL ROHS 32 969102-0000-DA 3M 9 AM0, AM1, AM2, JP1, JP2, JP3, JP4, JP5, JP6 SHUNT BLACK AU FLASH 0.100LS OPEN TOP ROHS TOTAL 109 SPECIAL NOTES TO THIS BILL OF MATERIALS SN1 These assemblies are ESD sensitive, ESD precautions shall be observed. SN2 These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable. SN3 These assemblies must comply with workmanship standards IPC-A-610 Class 2. SN4 Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components. SLOU374 – July 2013 Submit Documentation Feedback TPA3131D2EVM Audio Amplifier Evaluation Module Copyright © 2013, Texas Instruments Incorporated 7 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated
TPA3131D2EVM 价格&库存

很抱歉,暂时无法提供与“TPA3131D2EVM”相匹配的价格&库存,您可以联系我们找货

免费人工找货