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TPIC44L01DBRG4

TPIC44L01DBRG4

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SSOP24

  • 描述:

    BUFFER/INVERTER MOSFET DRIVER

  • 数据手册
  • 价格&库存
TPIC44L01DBRG4 数据手册
             SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 D 4-Channel Serial-In Parallel-In Low-Side D D D D D D Pre-FET Driver Devices Are Cascadable Internal 55-V Inductive Load Clamp and VGS Protection Clamp for External Power FETs Independent Shorted-Load/Short-toBattery Fault Detection on All Drain Terminals Independent OFF-State Open-Load Fault Sense Over-Battery-Voltage Lockout Protection and Fault Reporting Under-Battery Voltage Lockout Protection for the TPIC44L01 and TPIC44L02 D Asynchronous Open-Drain Fault Flag D Device Output Can Be Wire-ORed With Multiple Devices D Fault Status Returned Through Serial D D D D Output Terminal Internal Global Power-On Reset of Device and External RESET Terminal High-Impedance CMOS-Compatible Inputs With Hysteresis TPIC44L01 and TPIC44L03 Disables the Gate Output When a Shorted-Load Fault Occurs TPIC44L02 Transitions the Gate Output to a Low-Duty Cycle PWM Mode When a Shorted-Load Fault Occurs description The TPIC44L01, TPIC44L02, and TPIC44L03 are low-side predrivers that provide serial and parallel input interfaces to control four external FET power switches such as offered in the TI TPIC family of power arrays. These devices are designed primarily for low-frequency switching, inductive load applications such as solenoids and relays. Fault status for each channel is available in a serial-data format. Each driver channel has independent off-state open-load detection and on-state shorted-load/short-to-battery detection. Battery overvoltage and undervoltage detection and shutdown is provided on the TPIC44L01/L02. On the TPIC44L03 driver, only over-battery voltage shutdown is provided. Each channel also provides inductive-voltage-transient protection for the external FET. DB PACKAGE (TOP VIEW) FLT VCOMPEN VCOMP IN0 IN1 IN2 IN3 CS SDO SDI SCLK VCC 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VBAT N/C RESET DRAIN0 GATE0 DRAIN1 GATE1 GATE2 DRAIN2 GATE3 DRAIN3 GND These devices provide control of output channels through a serial input interface or a parallel input interface. A command to enable the output from either interface enables the respective channels gate output to the external FET. The serial interface is recommended when the number of signals between the control device and the predriver must be minimized and the speed of operation is not critical. In applications where the predriver must respond very quickly or asynchronously, the parallel input interface is recommended. For serial operation, the control device must transition CS from high to low to activate the serial input interface. When this occurs, SDO is enabled, fault data is latched into the serial interface, and the fault flag is refreshed. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2001, Texas Instruments Incorporated    ! " #$%! "  &$'(# ! ) !%* )$#!" # ! "&%## !" &% !+% !%"  %, " "!$%!" "! ) ) -  !.* )$#! &#%""/ )%" ! %#%"" (. #($)% !%"!/  (( &  %!%"* POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 description (continued) Data is clocked into the serial registers on low-to-high transitions of SCLK through SDI. Each string of data must consist of at least four bits of data. In applications where multiple devices are cascaded together, the string of data must consist of four bits for each device. A high data bit turns the respective output channel on and a low data bit turns it off. Fault data for the device is clocked out of SDO as serial input data is clocked into the device. Fault data consists of fault flags for shorted-load and open-load flags (bits 0–3) for each of the four output channels. A high bit in the fault data indicates a fault and a low bit indicates that no fault is present for that channel. Fault register bits are set or cleared asynchronously to reflect the current state of the hardware. A fault must be present when CS is transitioned from high to low to be captured and reported in the serial fault data. New faults cannot be captured in the serial register when CS is low. CS must be transitioned high after all of the serial data has been clocked into the device. A low-to-high transition of CS transfers the last four bits of serial data to the output buffer puts SDO in a high-impedance state and clears and reenables the fault register. The TPIC44L01/L02/L03 was designed to allow the serial input interfaces of multiple devices to be cascaded together to simplify the serial interface to the controller. Serial input data flows through the device and is transferred out SDO following the fault data in cascaded configurations. For parallel operation, data is transferred directly from the parallel input interface IN0-IN3 to the respective GATE(0–3) output asynchronously. SCLK or CS is not required for parallel control. A 1 on the parallel input turns the respective channel on, where a 0 turns it off. Note that either the serial input interface or the parallel input interface can enable a channel. Under parallel operation, fault data must still be collected through the serial data interface. The predrivers monitor the drain voltage for each channel to detect shorted-load or open-load fault conditions in the the on and off states respectively. These devices offer the option of using an internally generated fault-reference voltage or an externally supplied fault-reference voltage through VCOMP for fault detection. The internal fault reference is selected by connecting VCOMPEN to GND and the external reference is selected by connecting VCOMPEN to VCC. The drain voltage is compared to the fault reference when the channel is turned on to detect shorted-load conditions and when the channel is off to detect open-load conditions. When a shorted fault occurs using the TPIC44L01 or the TPIC44L03, the channel is turned off and a fault flag is sent to the control device as well as to the serial fault register bits. If a fault occurs while using the TPIC44L02, the channel transitions into a low-duty cycle, pulse-width-modulated (PWM) signal as long as the fault is present. Shorted-load fault conditions must be present for at least the shorted-load deglitch time, t(STBDG), to be flagged as a fault. A fault flag is sent to the control device as well as the serial fault register bits. More detail on fault detection operation is presented in the device operation section of this data sheet. These devices provide protection from over-battery voltage and under-battery voltage conditions irrespective of the state of the output channels. When the battery voltage is greater than the overvoltage threshold or less than the undervoltage threshold, all channels are disabled and a fault flag is generated. Battery-voltage faults are not reported in the serial fault data. The outputs return to normal operation once the battery-voltage fault has been corrected. When an over-battery/under-battery voltage condition occurs, the device reports the battery fault, but disables fault reporting for open- and shorted-load conditions. Fault reporting for open- and shorted-load conditions are reenabled after the battery fault condition has been corrected. These devices provide inductive transient protection on all channels. The drain voltage is clamped to protect the FET. The clamp voltage is defined by the sum of VCC and turnon voltage of the external FET. The predriver also provides a gate-to-source voltage (VGS) clamp to protect the gate-source terminals of the power FET from exceeding their rated voltages. An external active low RESET is provided to clear all registers and flags in the device. GATE(0–3) outputs are disabled after RESET has been pulled low. These devices provide pulldown resistors on all inputs except CS and RESET. A pullup resistor is used on CS and RESET. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 schematic diagram 4 Fault Logic RST SDI SCLK SDO Serial Register VCC Parallel Register CS 4 RST IN 0 IN 1 IN 2 IN 3 FLT PREZ GND D Q RST DRAIN 0 DRAIN 1 DRAIN 2 DRAIN 3 4 STB and Open-Load Fault Protection VCOMPEN OSC S BIAS 2 B VCOMP A Gate Drive Block VBAT Vbg OVLO† UVLO GATE 0 GATE 1 GATE 2 GATE 3 VCC RST RESET † OVLO not on TPIC44L03 RST POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 Terminal Functions DESCRIPTION TERMINAL NAME NO. I/O CS 8 I Chip select. A high-to-low transition on CS enables SDO, latches fault data into the serial interface, and refreshes FLT. When CS is high, the fault registers can change fault status. On the falling edge of CS, fault data is latched into the serial output register and transferred using SDO and SCLK. On a low-to-high transition of CS, serial data is latched in to the output control register. DRAIN0 21 I DRAIN1 19 FET drain inputs. DRAIN0 through g DRAIN3 are used for both open-load and short-circuit fault detection at the drain of the external FETs. They are also used for inductive transient protection. DRAIN2 16 DRAIN3 14 FLT 1 I Fault flag. FLT is a logic level open-drain output that provides a real-time fault flag for shorted-load/ open-load/over-battery voltage/under-battery voltage faults. The device can be ORed with FLT terminals on other devices for interrupt handling. FLT requires an external pullup resistor. GATE0 20 O GATE1 18 Gate drive output. GATE0 through g GATE3 outputs are derived from the VBAT supply y voltage. g Internal clamps prevent voltages on these nodes from exceeding the VGS rating on most FETs. GATE2 17 GATE3 15 GND 13 I Ground and substrate IN0 4 I IN1 5 Parallel g gate driver. IN0 through g IN3 are real-time controls for the g gate predrive circuitry. y They y are CMOS compatible with hysteresis. IN2 6 IN3 7 RESET 22 I Reset. A high-to-low transition of RESET clears all registers and flags. Gate outputs turn off and the FLT flag is cleared. SCLK 11 I Serial clock. SCLK clocks the shift register. Serial data is clocked into SDI and serial fault data is clocked out of SDO on the falling edge of the serial clock. SDI 10 I Serial data input. Output control data is clocked into the serial register through SDI. A 1 on SDI commands a particular gate output on and a 0 turns it off. SDO 9 O Serial data output. SDO is a 3-state output that transfers fault data to the controlling device. It also passes serial input data to the next stage for cascaded operation. SDO is taken to a high-impedance state when CS is in a high state. VBAT VCC 24 I Battery supply voltage 12 I Logic supply voltage VCOMPEN 2 I Fault reference voltage select. VCOMPEN selects the internally generated fault reference voltage (0) or an external fault reference (1) to be used in the shorted- and open-load fault detection circuitry. VCOMP 3 I Fault reference voltage. VCOMP provides an external fault reference voltage for the shorted-load and open-load fault detection circuitry. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 7 V Battery supply voltage range, VBAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 60 V Input voltage range,VI (at any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 7 V Output voltage range, VO (SDO and FLT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 7 V Drain-to-source voltage, VDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 60 V Output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 15 V Operating case temperature range, TC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 125°C Thermal resistance, junction to ambient, RθJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135°C/W Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values are with respect to GND. recommended operating conditions Logic supply voltage, VCC Battery supply voltage, VBAT MIN NOM MAX 4.5 5 5.5 V 24 V VCC 0.15 VCC V 8 High-level input voltage, VIH 0.85 VCC Low-level input voltage, VIL 0 UNIT V Setup time, SDI high before SCLK rising edge, tsu (see Figure 5) 10 ns Hold time, SDI high after SCLK rising edge, th (see Figure 5) 10 ns Case temperature, TC –40 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 125 °C 5              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER IBAT ICC TEST CONDITIONS Supply current, VBAT All outputs off, Supply current, VCC All outputs off, V(turnon) Turnon voltage, logic operational, VCC VBAT = 5.5 V, Check output functionality V(ovsd) Vhys(ov) Over-battery-voltage shutdown V(uvsd) Over-battery-voltage reset hysteresis VBAT = 12 V VBAT = 5.5 V Gate disabled, disabled See Figure Fig re 16 disabled Gate disabled, Fig re 17 See Figure Under-battery-voltage shutdown, (TPIC44L01/L02 only) MIN TYP MAX UNIT 300 500 700 µA 1 2.6 4.2 mA 2.6 3.5 4.4 V 32 34 36 V 0.5 1 1.5 V 4.1 4.8 5.4 V 100 200 300 mV 7 13.5 V 5 7 V Vhys(uv) Under-battery-voltage reset hysteresis, (TPIC44L01/L02 only) VG Gate drive dri e voltage oltage 8 V < VBAT < 24 V, 5.5 V < VBAT < 8 V, IO(H) Maximum current output for drive terminals, pullup VO = GND 0.5 1.2 2.5 mA IO(L) Maximum current output for drive terminals, pulldown VO = 7 V 0.5 1.2 2.5 mA V(stb) Short-to-battery/shorted-load/open-load detection voltage VCOMPEN = L 1.1 1.25 1.4 V 40 100 150 mV VCOMPEN = L 1.1 1.25 1.4 V 40 100 150 mV 30 60 80 µA Vhys(stb) VD(open) Short-to-battery hysteresis Vhys(open) II(open) Open-load hysteresis II(PU) II(PD) Input pullup current (CS) Input pulldown current VCC = 5 V, VCC = 5 V, Vhys Input voltage hysteresis VCC = 5 V VO(SH) VO(SL) High-level serial output voltage IO = 1 mA IO = 1 mA IOZ(SD) VO(CFLT) 3-state current serial-data output Open-load off-state detection voltage threshold IO = 100 µA IO = 100 µA Open-load off-state detection current Low-level serial output voltage Fault-interrupt output voltage VIN = 0 V VIN = 5 V µA 10 µA 10 0.6 0.85 1.1 0.1 0.4 V 1 10 µA 0.1 0.5 V 0.8 VCC VCC = 0 V to 5.5 V IO = 1 mA -10 V V VI(COMP) Fault-external reference voltage, (TPIC44L01/L02 only) VCOMPEN = H 0.25 3 V VI(COMP) Fault-external reference voltage, (TPIC44L03 only) VCOMPEN = H 1 3 V VC Output clamp voltage, (TPIC44L01/L02 only) dc < 1%, tw = 100 µs 47 55 63 V VC Output clamp voltage, (TPIC44L03 only) dc < 1%, tw = 100 µs 47 53.5 60 V 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 switching characteristics, VCC = 5 V, Vbat = 12 V, TC = 25°C PARAMETER TEST CONDITIONS t(STBFM) Short-to-battery/shorted-load/open-load fault mask time See Figures 14 and 15 t(STBDG) Short-to-battery/shorted-load deglitch time See Figure 14 tPLH Propagation turnon delay time, CS or IN0-IN3 to GATE0–GATE3 C(gate) = 400 pF, tPHL Propagation turnoff delay time, CS or IN0-IN3 to GATE0–GATE3 tr(1) MIN TYP MAX UNIT 60 µs 8 µs See Figure 1 4 µs C(gate) = 400 pF, See Figure 2 3.5 µs Rise time GATE0–GATE3 C(gate) = 400 pF, See Figure 3 3.5 µs tf(1) Fall time, GATE0–GATE3 C(gate) = 400 pF, See Figure 4 3 f(SCLK) trf(SB) Serial clock frequency Refresh time, short-to-battery TPIC46L01 only, See Figure 14 10 ms tw Refresh pulse width, short-to-battery TPIC46L01 only, See Figure 14 68 µs tsu(1) Setup time, CS↓ to ↑SCLK See Figure 5 10 ns tpd(1) Propagation delay time, CS↓ to SDO valid RL = 10 kΩ, See Figure 6 40 ns tpd(2) Propagation delay time, SCLK↓ to SDO valid See Figure 6 20 ns tpd(3) Propagation delay time, CS↑ to SDO 3-state RL = 10 kΩ, See Figure 7 CL = 50 pF, 2 µs tr2 Rise time, SDO 3-state to SDO valid RL = 10 kΩ to GND, CL = 200 pF, Over-battery fault, See Figure 8 30 ns tf(2) Fall time, SDO 3-state to SDO valid RL = 10 kΩ to VCC, CL = 200 pF, No faults, See Figure 9 20 ns tr(3) Rise time, FLT RL = 10 kΩ, See Figure 10 CL = 50 pF, 1.2 µs tf(3) Fall time, FLT RL = 10 kΩ, See Figure 11 CL = 50 pF, 15 ns µs 10 CL = 200 pF, MHz 50% IN0–IN3 or CS or IN0–IN3 CS 50% 50% tPLH tPHL 90% GATE0–GATE3 GATE0–GATE3 Figure 1 10% Figure 2 tr(1) 90% GATE0–GATE3 tf(1) GATE0–GATE3 10% 90% 10% Figure 3 Figure 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 SCLK SCLK tsu(1) CS CS th tpd(1) tsu SDO SDI tpd(2) 3-State Figure 5 Figure 6 50% CS SDO 90% 3-STATE 10% tpd(3) SDO tr(2) 3-State Figure 7 Figure 8 tf(2) SDO 3-STATE tr(3) 90% 10% Figure 9 Figure 10 tf(3) 90% FLT 10% Figure 11 8 90% FLT 10% POST OFFICE BOX 655303 • DALLAS, TEXAS 75265              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 PRINCIPLES OF OPERATION serial data operation The TPIC44L01, TPIC44L02, and TPIC44L03 offer serial input interface to the microcontroller to transfer control data to the predriver and fault data back to the controller. The serial input interface consists of: D D D D SCLK – Serial clock CS – Chip select SDI – Serial data input SDO – Serial data output Serial data is shifted into the least significant bit (LSB) of the SDI shift register on the rising edge of the first SCLK after CS has transitioned from 1 to 0. Four clock cycles are required to shift the first bit from the LSB to the most significant bit (MSB) of the shift register. Four clock cycles must occur before CS transitions high for proper control of the outputs. Less than four clock cycles result in fault data being latched into the output control buffer. Eight bits of data can be shifted into the device, but the first 4 bits shifted out are always the fault data and the last 4 bits shifted in are always the output control data. A low-to-high transition on CS latches the contents of the serial shift register into the output control register. A logic 0 input to SDI turns the corresponding parallel output off and a logic 1 input turns the output on (see Figure 12). 1 2 3 4 SCLK CS SDI New Data GATE3 ON GATE2 ON GATE1 OFF GATE0 OFF Output Control Register Data SDO Present Output Data 3-State FLT3 FLT2 FLT1 New Data FLT0 IN3 3-State (a) 4-Bit Serial Word Example Figure 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 PRINCIPLES OF OPERATION 1 2 3 4 5 6 7 8 SCLK CS SDI Don’t Care New Data GATE3 ON GATE2 ON GATE1 OFF GATE0 OFF Output Control Register Data SDO 3-State Present Output Data FLT3 FLT2 FLT1 FLT0 NA NA New Data NA NA IN3 3-State (b) 8-Bit Serial Word Example (Single Predriver) 1 2 3 4 5 6 7 8 SCLK CS SDI IN 7 IN 6 IN 5 IN 4 IN 3 IN 2 IN 1 IN 0 NA FLT5 FLT4 FLT3 FLT2 FLT1 FLT0 IN7 New Data GATE7–GATE4 (2nd stage) GATE3–GATE0 (1st stage) SDO 3-State FLT7 FLT6 (c) 8-Bit Serial Word Example (Cascade: Two Predrivers) Figure 12 (continued) 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3-State              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 PRINCIPLES OF OPERATION serial data operation (continued) Data is shifted out of SDO on the falling edge of SCLK. The MSB of fault data is available after CS is transitioned low. The remaining 3 bits of fault data are shifted out in the following three clock cycles. Fault data is latched into the serial register when CS is transitioned low. A fault must be present on the high to low transition of CS to be captured by the device. The CS input must be transitioned to a high state after the last bit of serial data has been clocked into the device. The rising edge of CS inhibits SDI, puts SDO into a high-impedance state, latches the 4 bits of serial data into the output control register, and clears and reenable the serial fault registers (see Figure 13). When a shorted-load condition occurs with the TPIC44L01 or TPIC44L03, then the controller must disable and reenable the channel to clear the fault register and FLT. The TPIC44L02 automatically retries the output and the fault clears after the fault condition has been corrected. 1 2 3 4 SCLK CS SDO 3-State FLT3 FLT2 FLT1 FLT0 IN3 3-State Figure 13 parallel input data operation In addition to the serial interface, the TPIC44L01, TPIC44L02, and TPIC44L03 also provides a parallel interface to the microcontroller. The output turns on when either the parallel or the serial interface commands it to turn on. The parallel data terminals are real-time control inputs for the output drivers. SCLK and CS are not required to transfer parallel input data to the output buffer. Fault data must be read over the serial data bus as described in the serial data operation section of this data sheet. The parallel input must be transitioned low and then high to clear and reenable a gate output after it has been disabled due to a shorted-load fault condition. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 PRINCIPLES OF OPERATION chipset performance under fault conditions The TPIC44L01, TPIC44L02, TPIC44L03, and power FET arrays are designed for normal operation over a battery-voltage range of 8 V to 24 V with load-fault detection from 4.8 V to 34 V. The TPIC44L01, TPIC44L02, and TPIC44L03 offer onboard fault detection to handle a variety of faults that may occur within a system. The circuits primary function is to prevent damage to the load and the power FETs in the event that a fault occurs. Note that unused DRAIN0-DRAIN3 inputs must be connected to VBAT through a pullup resistor to prevent false reporting of open-load fault conditions. The circuitry detects the fault, shuts off the output to the FET, and reports the fault to the microcontroller. The primary faults under consideration are: 1. 2. 3. 4. Shorted load Open load Over-battery voltage shutdown Under-battery voltage shutdown (TPIC44L01 and TPIC44L02 only) NOTE: An undervoltage fault may be detected when VCC and VBAT are applied to the device. The controller should initialize the fault register after power up to clear any false fault reports. shorted-load fault condition The TPIC44L01, TPIC44L02, and TPIC44L03 monitor the drain voltage of each channel to detect shorted-load conditions. The onboard deglitch timer starts running when the gate output to the power FET transitions from the off state to the on state. The timer provides a 60-µs deglitch time, t(STBFM), to allow the drain voltage to stabilize after the power FET has been turned on. The deglitch time is only enabled for the first 60 µs after the FET has been turned on. After the deglitch delay time, the drain voltage is checked to verify that it is less than the fault reference voltage. When it is greater than the reference voltage for at least the short-to-battery deglitch time, t(STBDG), FLT flags the microcontroller that a fault condition exists and the gate output is automatically shut off (TPIC44L01 and TPIC44L03) until the error condition has been corrected. An overheating condition on the FET occurs when the controller continually tries to reenable the output under shorted-load fault conditions. When a shorted-load fault is detected using the TPIC44L02, the gate output is transitioned into a low-duty cycle, PWM signal to to protect the FET from overheating. The PWM rate is defined as t(SB) and the pulse width is defined as tw. The gate output remains in this state until the fault has been corrected or until the controller disables the gate output. The microcontroller can read the serial port on the predriver to isolate which channel reported the fault condition. Fault bits 0-3 distinguish faults for each of the output channels. When a shorted-load condition occurs with the TPIC44L01 or TPIC44L03, the controller must disable and reenable the channel to clear the fault register and FLT. The TPIC44L02 automatically retries the output and the fault clears after the fault condition has been corrected. Figure 14 illustrates operation after a gate output has been turned on. The gate to the power FET is turned on and the deglitch timer starts running. Under normal operation T1 turns on and the drain operates below the reference point set at U1. The output of U1 is low and a fault condition is not flagged. 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 PRINCIPLES OF OPERATION External TPIC44L01/L02 VBAT Load T1 + _ 1.25 V Input From TPIC44L01/L02 N-Channel U1 FLT Deglitch SHORTED-LOAD TPIC44L01 and TPIC44L03 NORMAL Input Input GATE0– GATE3 GATE0– GATE3 Glitches Glitches DRAIN0– DRAIN3 DRAIN0– DRAIN3 t(STBFM) FLT FLT t(STBDG) t(STBFM) SHORTED-LOAD TPIC44L02 Input GATE0– GATE3 Glitches t(SB) tw DRAIN0– DRAIN3 GATE0– GATE3 FLT t(STBDG) t(STBFM) Figure 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 PRINCIPLES OF OPERATION open load The TPIC44L01, TPIC44L02, and TPIC44L03 monitor the drain of each power FET for open circuit conditions that may exist. The 60-µA current source is provided to monitor open load fault conditions. Open-load faults are only detected when the power FET is turned off. When load impedance is open or substantially high, the 60-µA current source has adequate drive to pull the drain of T1 below the fault reference threshold on the detection circuit. Unused DRAIN0–DRAIN3 inputs must be connected to VBAT through a pullup resistor to prevent false reporting of open-load fault conditions. The onboard deglitch timer starts running when the TPIC44L01, TPIC44L02, and TPIC44L03 gate output to the power FET transitions to the off state. The timer provides a 60-µs deglitch time, t(STBFM) to allow the drain voltage to stabilize after the power FET has been turned off. The deglitch time is only enabled for the first 60 µs after the FET has been turned off. After the deglitch delay time, the drain is checked to verify that it is greater than the fault reference voltage. When it is less than the reference voltage, a fault is flagged to the microcontroller through FLT that an open-load fault condition exists. The microcontroller can then read the serial port on the TPIC44L01, TPIC44L02, and TPIC44L03 to isolate which channel reported the fault condition. Fault bits 0–3 distinguish faults for each of the output channels. Figure 15 illustrates the operation of the open-load detection circuit. This feature provides useful information to the microcontroller to isolate system failures and warn the operator that a problem exists. Examples of such applications would be a warning that a light bulb filament may be open, solenoid coils may be open, etc. External TPIC44L01/L02/L03 VBAT Load U1 60 µA T1 Input From TPIC44L01/L02/L03 1.25 V N-Channel GATE0– GATE3 OPEN-LOAD Input NORMAL GATE0– GATE3 Glitches DRAIN0– DRAIN3 FLT FLT Deglitch NORMAL Input + _ DRAIN0– DRAIN3 FLT t(STBFM) t(STBFM) Figure 15 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 PRINCIPLES OF OPERATION over-battery-voltage shutdown The TPIC44L01,TPIC44L02, and TPIC44L03 monitor the battery voltage to prevent the power FETs turning on in the event that the battery voltage is too high. This condition may occur due to voltage transients resulting from a loose battery connection. The TPIC44L01, TPIC44L02, and TPIC44L03 turns the power FET off when the battery voltage is above 34 V to prevent possible damage to the load and the FET. GATE(0–3) output goes back to normal operation after the overvoltage condition has been corrected. An over-battery voltage fault is flagged to the controller through FLT. The over-battery voltage fault is not reported in the serial fault word. When an overvoltage condition occurs, the device reports the battery fault, but disables fault reporting for open and shorted-load conditions. Fault reporting for open and shorted-load conditions are reenabled after the battery fault condition has been corrected. When the fault condition is removed before the CS signal transitions low, the fault condition is not captured in the serial fault register. The fault flag resets on a high-to-low transition of CS provided no other faults are present in the device. Figure 16 illustrates the operation of the over-battery voltage detection circuit. VBAT 34 V VBAT + _ U1 Output Disable 34 V 12 V 33 V GATE0–GATE3 Figure 16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 15              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 PRINCIPLES OF OPERATION under-battery-voltage shutdown (TPIC44L01 and TPIC44L02 only) The TPIC44L01 and TPIC44L02 monitor the battery voltage to prevent the power FETs from being turned on in the event that the battery voltage is too low. When the battery voltage is below 4.8 V, then GATE0–GATE3 may not provide sufficient gate voltage to the power FETs to minimize the on-resistance that could result in a thermal stress on the FET. The output goes back to normal operation after the undervoltage condition has been corrected. An under-battery voltage fault is flagged to the controller through FLT. The under-battery voltage fault is not reported in the serial fault word. When an under-battery voltage condition occurs, the device reports the battery fault but disables fault reporting for open- and shorted-load conditions. When the fault condition is removed before the CS signal transitions low, the fault condition is not captured in the serial fault register. The fault flag resets on a high-to-low transition of CS provided no other faults are present in the device. Figure 17 illustrates the operation of the under-battery voltage detection circuit. VBAT _ 4.8 V U1 Output Disable + 12 V VBAT 5V 4.8 V GATE0–GATE3 Figure 17 16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 PRINCIPLES OF OPERATION inductive voltage transients A typical application for the predriver/power FET circuit is to switch inductive loads. When an inductive load is switched off, a large voltage spike can occur. These spikes can exceed the maximum VDS rating for the external FET and damage the device when the proper protection is not in place. The FET can be protected from these transients through a variety of methods using external components. The TPIC44L01, TPIC44L02, and TPIC44L03 offer that protection in the form of a Zener diode stack connected between the DRAIN input and GATE output (see Figure 18). Zener diode Z1 turns the FET on to dissipate the transient energy. GATE diode Z2 is provided to prevent the gate voltage from exceeding 13 V during normal operation and transient protection. TPIC44L01/L02/L03 External DRAIN Z1 LOAD VBAT 55 V T1 GATE Z2 Power FET 13 V Figure 18 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 17              SLIS062B – NOVEMBER 1996 – REVISED AUGUST 2001 PRINCIPLES OF OPERATION external fault reference input The TPIC44L01, TPIC44L02, and TPIC44L03 compare each channel drain voltage to a fault reference to detect shorted-load and open-load conditions. The user has the option of using the internally generated 1.25-V fault reference or providing an external reference voltage through VCOMP. The internal reference is selected by connecting VCOMPEN to GND and VCOMP is selected by connecting VCOMPEN to VCC (see Figure 19). Proper layout techniques should be used in the grounding network for the VCOMP circuit on the TPIC44L01, TPIC44L02, and TPIC44L03. The ground for the predriver and VCOMP network should be connected to a Kelvin ground if available; otherwise, they should make single-point contact back to the power ground of the FET array. Improper grounding techniques can result in inaccuracies in detecting faults. External TPIC44L01/L02/L03 DRAIN3 + _ DRAIN0 + _ U1 1.25 V VCOMP A M U X VCOMPEN Deglitch VCOMPEN 1.25 V VCOMP 0 1 Figure 19 18 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 FLT PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPIC44L01DBR ACTIVE SSOP DB 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 TPIC44L01 TPIC44L02DB ACTIVE SSOP DB 24 60 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 TPIC44L02 TPIC44L02DBG4 ACTIVE SSOP DB 24 60 RoHS & Green NIPDAU Level-1-260C-UNLIM TPIC44L02 TPIC44L02DBR ACTIVE SSOP DB 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM TPIC44L02 TPIC44L02DBRG4 ACTIVE SSOP DB 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM (IC44L02, TPIC44L0 2) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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