TPS24742EVM-667

User's Guide SLVUAH8 – July 2015 TPS24742EVM-667 Evaluation Module This user’s guide describes the TPS24742 evaluation module (TPS24742EVM-667). The TPS24742EVM667 (EVM) contains evaluation and reference circuitry for the TPS24742. The TPS24742 device is an easy-to-use, 2.5 to 18 V, hot-swap and ORing power management device that safely drives external Nchannel MOSFETs. 1 2 3 4 5 6 7 Contents Introduction ................................................................................................................... 2 1.1 Features .............................................................................................................. 2 1.2 Applications .......................................................................................................... 2 1.3 Electrical Specifications ............................................................................................ 3 Description .................................................................................................................... 3 2.1 Jumpers .............................................................................................................. 3 Schematic ..................................................................................................................... 4 TPS24742 Hot-Swap and OR Performance ............................................................................. 6 Priority Muxing ............................................................................................................... 7 EVM Assembly Drawing and PCB Layout ................................................................................ 8 6.1 PCB Drawings ....................................................................................................... 8 Bill of Material ............................................................................................................... 13 List of Figures 1 Block Diagram for Priority Muxing ......................................................................................... 3 2 TPS24742EVM-667 High Level Schematic .............................................................................. 4 3 TPS24742EVM-667 Hotswap then OR Schematic A ................................................................... 4 4 TPS24742EVM-667 Hotswap then OR Schematic B ................................................................... 5 5 Start Up (COUT = 440 µF) .................................................................................................... 6 6 Start Up (COUT = 10440 µF) ................................................................................................. 6 7 Hot Short on VOUT (Zoomed Out)........................................................................................... 6 8 Hot Short on VOUT (Zoomed In) ............................................................................................. 6 9 Under/Overvoltage With VIN Rising ........................................................................................ 6 10 Under/Overvoltage With VIN Falling........................................................................................ 6 11 Start into Short on VOUT ................................................................................................... 6 12 Load Step – 40 A to 60 A ................................................................................................... 6 13 Hot – Short on VIN 14 Gradual Reverse Current ................................................................................................... 7 15 Top Side Component Placement .......................................................................................... 8 16 Top Side Routing ............................................................................................................ 9 17 Midlayer 1 Routing ......................................................................................................... 10 18 Midlayer 2 Routing ......................................................................................................... 11 19 Bottom Layer Routing...................................................................................................... 12 .......................................................................................................... 7 List of Tables 1 TPS24742EVM-667 Electrical and Performance Specifications at 25°C ............................................. 3 2 Jumpers (A and B Circuits) ................................................................................................. 3 SLVUAH8 – July 2015 Submit Documentation Feedback TPS24742EVM-667 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 1 Introduction 3 1 www.ti.com TPS24742EVM-667 BOM ................................................................................................. 13 Introduction The TPS24742EVM-667 evaluation module (EVM) is a fully assembled and tested circuit for evaluating the TPS24742 high performance hot-swap and ORing controller. The EVM contains header connectors for easy connection to external test and application circuitry. 1.1 Features • • • • • • 1.2 Applications • • • • 2 2.5-V to 18-V bus operation (30 V absolute maximum) Programmable FET SOA protection Dual fault timer (Over-current / Inrush) Interchangeable hotswap and ORing Analog current monitor (1% at 25 mV) Programmable protection settings: – Current limit: ±5% at 10 mV – Fast trip: ±10% at 20 mV – Reverse voltage: ±1 mV at –1 mV – 4 mm × 4 mm 24-pin QFN – 40 = Latch, 41 = Retry, 42 = Immediate Latch Off Enterprise storage Power muxing Redundant power supplies Battery back up TPS24742EVM-667 Evaluation Module SLVUAH8 – July 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Introduction www.ti.com 1.3 Electrical Specifications Table 1. TPS24742EVM-667 Electrical and Performance Specifications at 25°C 2 Characteristics TPS24742EVM-667 Current limit 45 A Fast Trip Threshold 65 A Fast Trip Filtering 0.5 µs Power Limit 39 W Rising UV threshold 10 V Rising OV threshold 14 V Reverse Current Threshold 1.5 A Reverse Current Filtering 0.5 µs inrush timer 44 ms fault timer 300 ms Iload vs Vimon 15 mV/A Iload vs Vimonbuff 45 mV/A Description The TPS24742EVM-667 as-is, contains two separate hotswap then OR circuits. The TPS24742EVM-667 is designed to accommodate two hotswap then OR configuration (as shown in Figure 1) mainly to evaluate systems with priority muxing as described in the priority muxing section of the TPS24742 datasheet (SLVSCV6). MAIN Hotswap OR TPS2474x To Load OFF if VMAIN > 11 V AUX Hotswap OR TPS2474x Figure 1. Block Diagram for Priority Muxing 2.1 Jumpers Table 2. Jumpers (A and B Circuits) JUMPER Description J1 Shorting J1 sets the sensing of overvoltage to be on VINA or VINB J2 Shorting J2 sets the pull up voltage of the output flags to VIN or an external bias voltage J3 Shorting J3 sets (+) reverse voltage on the output of the ORing or input of the hotswap J4 Shorting J4 sets the same fault and inrush timers J5 Shorting J3 sets (–) reverse voltage on the input of the ORing or input of the hotswap J6 Shorting J6 disables ORing J7 Shorting J7 disables overvoltage protection SLVUAH8 – July 2015 Submit Documentation Feedback TPS24742EVM-667 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 3 Schematic 3 www.ti.com Schematic Figure 2 through Figure 4 illustrate the EVM schematics. A PWR667A_sch.SchDoc T1 11-13V 40A VINA UV=10V OV=14V VIN GNDIN VINA T2 VOUTA T4 VIN_OV T3 R2 R1 DNP DNP0.005 0.005 GND T5 11-13V 40A VOUTA VOUT GNDOUT GND R4 DNP0.005 R3DNP 0.005 T6 GND GND B PWR667A_sch.SchDoc T7 11-13V 40A VINB UV=10V OV=14V VIN GNDIN VINB 1 2 3 VIN_OV_A VIN_OV_B VINB T8 VOUTB VOUT GNDOUT 11-13V 40A VOUTB VIN_OV J1 Figure 2. TPS24742EVM-667 High Level Schematic Q1_A CSD16415Q5 25 V Q2_A CSD16415 25V VIN TP1_A VINA VOUT TP25_A VOUT R2_A VINA 1,2,3 7,8 5,6, 1,2,3 4 0.0005 7,8 5,6, 4 VIN Q4_A CSD16415 25V TP24_A VSRC 7,8 DNP 5,6, 4 1,2,3 4 1,2,3 7,8 5,6, DNP Q3_A CSD16415 25 V C3_A DNP 1uF 100V R4_A 10.0 C4_A 1!F 100V TP2_A HGATE R6_A 10.0 C1_A 220!F 50V D1_A MBRS330T3G 0.5V C2_A 220!F 50V VIN VPU_FLAG V_bias R3_A 10.0 R7_A 10.0 V_bias TP30_A 3 2 1 J2_A BGATE TP3_A U1_A BGATE OUTH 22 19 R8_A 49.9k R9_A 49.9k 8 TFLT HGATE 18 7 TINR IMONBUFF 13 1 CP PGHS 5 OV FLTb 4 3 ENOR STAT 6 2 RVSNP TP9_A ENHS R10_A 49.9k CP D2_A 5.0SMDJ14A 14V C5_A TP5_A 0.1!F 9 C6_A 0.1!F TP10_A ENOR TP11_A OV TP12_A ENHS TINR TP14_A TFLT TFLT TINR DIS_OV 1 RVSNP 2 SENM 3 1 2 3 TP15_A DIS_OR VOUT VSRC RVSNM VIN J5_A R14_A 15.0 TP13_A RVSNM J3_A R15_A 324 FSTP TP16_A DNP C11_A 0.1uF 16V C7_A 24 0.033!F RVSNM PLIM FSTP IMON 12 SENM GND DAP 10 25 C8_A 1500pF GND R17_A 5.36k R18_A SENM DNP 1k TP17_A SENP R20_A 7.87k TP18_A S1_A HS_OFF C10_A 0.022!F DNP C12_A 0.1uF 16V 17 15 J4_A 2 GND RVSNP J7_A 1 J6_A R21_A C13_A 2.2!F C14_A 0.33!F R24_A 22k R25_A 22k R13_A 100k D4_A Red TP7_A FLTB TP8_A STAT D3_A Green D5_A Blue Q5_A 2N7002 60V 11 IMON TP27_A SET TPS24740 TP19_A SET 90.9 TP6_A PGHS PLIM TP26_A 21 16 R12_A 4.99k R11_A 100k IMON_BUFF TP4_A 1 VDD A C 2 14 23 20 VIN_OV R19_A 2.74k R16_A 143k Q6_A 2N7002 60V GND GND GND TP28_A TP29_A TP20_A IC GND NT1_A NT2_A NT3_A NT4_A GND TP22_A TP21_A GND GNDIN GNDOUT POWER GND Figure 3. TPS24742EVM-667 Hotswap then OR Schematic A 4 TPS24742EVM-667 Evaluation Module SLVUAH8 – July 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Schematic www.ti.com Q1_B CSD16415Q5 25 V Q2_B CSD16415 25V VINA VOUT TP25_B VOUT R2_B VINA 1,2,3 7,8 5,6, 1,2,3 4 0.0005 7,8 5,6, 4 VIN Q4_B CSD16415 25V TP24_B VSRC 7,8 DNP 5,6, 4 1,2,3 4 1,2,3 7,8 5,6, DNP Q3_B CSD16415 25 V VIN TP1_B C3_B DNP 1uF 100V R4_B 10.0 C4_B 1!F 100V TP2_B HGATE R6_B 10.0 C1_B 220!F 50V D1_B MBRS330T3G 0.5V C2_B 220!F 50V VIN VPU_FLAG V_bias R3_B 10.0 R7_B 10.0 V_bias TP30_B 3 2 1 J2_B BGATE TP3_B U1_B R9_B 49.9k R10_B 49.9k CP D2_B 5.0SMDJ14A 14V VDD A C BGATE OUTH 22 19 8 TFLT HGATE 18 7 TINR IMONBUFF 1 CP PGHS 5 OV FLTb 4 STAT 6 C5_B TP5_B 0.1!F 9 C6_B 0.1!F TP10_B ENOR TP11_B OV TP14_B TFLT TINR TFLT TINR DIS_OV 1 RVSNP 2 SENM 3 1 2 3 TP15_B DIS_OR VOUT VSRC RVSNM VIN TP12_B ENHS J5_B R14_B 15.0 TP13_B RVSNM J3_B ENHS R15_B 324 FSTP 1 GND PLIM FSTP IMON 12 SENM GND DAP 10 25 C8_B 1500pF 17 DNP C12_B 0.1uF 16V TP18_B S1_B HS_OFF R21_B C13_B 2.2!F C14_B 0.33!F 90.9 D3_B Green D5_B Blue Q5_B 2N7002 60V 11 IMON TP27_B SET TPS24740 TP19_B SET R25_B 22k PLIM TP26_B RVSNM R18_B SENM DNP 1k TP17_B SENP R20_B 7.87k C10_B 0.022!F TP8_B STAT C7_B 24 0.033!F J4_B R24_B 22k R13_B 100k D4_B Red TP7_B FLTB RVSNP 15 R17_B 5.36k TP6_B PGHS 13 21 J7_B 2 GND DNP C11_B 0.1uF 16V ENOR RVSNP 2 TP9_B 16 TP16_B J6_B 3 R12_B 4.99k R11_B 100k IMON_BUFF TP4_B 1 R8_B 49.9k 14 23 20 2 VIN_OV R19_B 2.74k R16_B 143k Q6_B 2N7002 60V GND GND GND TP28_B TP29_B TP20_B IC GND NT1_B NT2_B NT3_B NT4_B GND TP22_B TP21_B GND GNDIN GNDOUT POWER GND Figure 4. TPS24742EVM-667 Hotswap then OR Schematic B SLVUAH8 – July 2015 Submit Documentation Feedback TPS24742EVM-667 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 5 TPS24742 Hot-Swap and OR Performance 4 6 www.ti.com TPS24742 Hot-Swap and OR Performance Figure 5. Start Up (COUT = 440 µF) Figure 6. Start Up (COUT = 10440 µF) Figure 7. Hot Short on VOUT (Zoomed Out) Figure 8. Hot Short on VOUT (Zoomed In) Figure 9. Under/Overvoltage With VIN Rising Figure 10. Under/Overvoltage With VIN Falling TPS24742EVM-667 Evaluation Module SLVUAH8 – July 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Priority Muxing www.ti.com 5 Figure 11. Start into Short on VOUT Figure 12. Load Step – 40 A to 60 A Figure 13. Hot – Short on VIN Figure 14. Gradual Reverse Current Priority Muxing The TPS24742EVM-667, as is, can be evaluated to test an individual OR then hot-swap circuit (Schematic A or Schematic B). It can also be modified to accommodate priority muxing applications as shown in Figure 1. The results can be found in the Priority Muxing section of the TPS24742 datasheet (SLVSCV6).. SLVUAH8 – July 2015 Submit Documentation Feedback TPS24742EVM-667 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 7 EVM Assembly Drawing and PCB Layout www.ti.com 6 EVM Assembly Drawing and PCB Layout 6.1 PCB Drawings Figure 15 to Figure 19 show component placement and layout of the TPS24742EVM-667. Figure 15. Top Side Component Placement 8 TPS24742EVM-667 Evaluation Module SLVUAH8 – July 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated EVM Assembly Drawing and PCB Layout www.ti.com Figure 16. Top Side Routing SLVUAH8 – July 2015 Submit Documentation Feedback TPS24742EVM-667 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 9 EVM Assembly Drawing and PCB Layout www.ti.com Figure 17. Midlayer 1 Routing 10 TPS24742EVM-667 Evaluation Module SLVUAH8 – July 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated EVM Assembly Drawing and PCB Layout www.ti.com Figure 18. Midlayer 2 Routing SLVUAH8 – July 2015 Submit Documentation Feedback TPS24742EVM-667 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 11 EVM Assembly Drawing and PCB Layout www.ti.com Figure 19. Bottom Layer Routing 12 TPS24742EVM-667 Evaluation Module SLVUAH8 – July 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Bill of Material www.ti.com 7 Bill of Material Table 3. TPS24742EVM-667 BOM Designator Qty Value Description PWR667 Package Reference !PCB1 1 N/A C1_A, C1_B, C2_A, C2_B 4 220uF CAP, AL, 220uF, 50V, +/-20%, 0.3 ohm, SMD SMT Radial G C4_A, C4_B 2 1uF CAP, CERM, 1uF, 100V, +/-10%, X7R, 1206 C5_A, C5_B, C6_A, C6_B 4 0.1uF C7_A, C7_B 2 C8_A, C8_B 2 Part Number Manufacturer Used in BOM report Any EEE-FC1H221P Panasonic 1206 GRM31CR72A105KA01L MuRata CAP, CERM, 0.1uF, 16V, +/-5%, X7R, 0603 0603 0603YC104JAT2A AVX 0.033uF CAP, CERM, 0.033 µF, 16 V, +/10%, X7R, 0603 0603 GRM188R71C333KA01D MuRata 1500pF CAP, CERM, 1500 pF, 100 V, +/5%, X7R, 0603 0603 06031C152JAT2A AVX CAP, CERM, 0.022 µF, 16 V, +/10%, X7R, 0603 0603 C0603C223K4RACTU Kemet C10_A, C10_B 2 0.022uF C13_A, C13_B 2 2.2uF CAP, CERM, 2.2 µF, 35 V, +/- 10%, X5R, 0603 0603 GRM188R6YA225KA12D MuRata 0603 C0603C334K4RACTU Kemet C14_A, C14_B 2 0.33uF CAP, CERM, 0.33 µF, 16 V, +/10%, X7R, 0603 D1_A, D1_B 2 0.5V Diode, Schottky, 30V, 3A, SMC SMC MBRS330T3G ON Semiconductor D2_A, D2_B 2 14V Diode, TVS, Uni, 14V, 5000W, SMC SMC 5.0SMDJ14A Littelfuse D3_A, D3_B 2 Green LT E63C-CADB-35-L-Z OSRAM SML-LX2832IC-TR Lumex LB E63C-U2V2-35-L-Z OSRAM PBC03SAAN Sullins Connector Solutions TSW-102-07-G-S Samtec, Inc. CSD16415Q5 Texas Instruments 2N7002-7-F Diodes Inc. LED, Green, SMD Power TOPLED w/lens D4_A, D4_B 2 Red LED, Red, SMD SMD, 2-Leads, Body 3.2x3mm D5_A, D5_B 2 Blue LED, Blue, SMD Power TOPLED w/lens J1, J2_A, J2_B, J3_A, J3_B, J5_A, J5_B 7 1x3 Header, TH, 100mil, 1x3, Gold plated, 230 mil above insulator PBC03SAAN J4_A, J4_B, J6_A, J6_B, J7_A, J7_B 6 Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator TSW-102-07-G-S Q3_A, Q3_B, Q4_A, Q4_B 4 CSD16 415 MOSFET, N-CH, 25V, 100A, SON 5x6mm SON 5x6mm MOSFET, N-CH, 60V, 0.17A, SOT23 SOT-23 Q5_A, Q5_B, Q6_A, Q6_B 4 60V R2_A, R2_B 2 0.0005 R3_A, R3_B, R4_A, R4_B, R6_A, R6_B, R7_A, R7_B 8 R8_A, R8_B, R9_A, R9_B, R10_A, R10_B R11_A, R11_B, R13_A, R13_B RES, 0.0005, 1%, 3 W, 2512 2512 HCS2512FTL500 Stackpole Electronics Inc 10.0 RES, 10.0 ohm, 1%, 0.1W, 0603 0603 CRCW060310R0FKEA Vishay-Dale 6 49.9k RES, 49.9k ohm, 1%, 0.1W, 0603 0603 CRCW060349K9FKEA Vishay-Dale 4 100k RES, 100k ohm, 1%, 0.1W, 0603 0603 CRCW0603100KFKEA Vishay-Dale R12_A, R12_B 2 4.99k RES, 4.99 k, 1%, 0.1 W, 0603 0603 CRCW06034K99FKEA Vishay-Dale R14_A, R14_B 2 15.0 RES, 15.0, 1%, 0.1 W, 0603 0603 CRCW060315R0FKEA Vishay-Dale R15_A, R15_B 2 324 RES, 324, 1%, 0.1 W, 0603 0603 RC0603FR-07324RL Yageo America R16_A, R16_B 2 143k RES, 143 k, 1%, 0.1 W, 0603 0603 CRCW0603143KFKEA Vishay-Dale R17_A, R17_B 2 5.36k RES, 5.36 k, 1%, 0.1 W, 0603 0603 CRCW06035K36FKEA Vishay-Dale R19_A, R19_B 2 2.74k RES, 2.74 k, 1%, 0.1 W, 0603 0603 CRCW06032K74FKEA Vishay-Dale R20_A, R20_B 2 7.87k RES, 7.87 k, 1%, 0.1 W, 0603 0603 CRCW06037K87FKEA Vishay-Dale R21_A, R21_B 2 90.9 RES, 90.9, 1%, 0.1 W, 0603 0603 CRCW060390R9FKEA Vishay-Dale R24_A, R24_B, R25_A, R25_B 4 22k RES, 22k ohm, 5%, 0.1W, 0603 0603 CRCW060322K0JNEA Vishay-Dale S1_A, S1_B 2 SKRKAEE010 Alps SH-J1, SH-J2, SH-J3, SH-J4, SH-J5, SH-J6, SH-J7, SH-J8, SH-J9, SH-J10, SH-J11, SH-J12, SH-J13 13 1x2 Shunt, 2mm, Gold plated, Black 2SN-BK-G Samtec T1, T2, T3, T4, T5, T6, T7, T8 8 50A Terminal 50A Lug CB35-36-CY Panduit Switch, Push Button, SMD 2.9x2x3.9mm SMD 2mm Shunt, Closed Top CB35-36-CY SLVUAH8 – July 2015 Submit Documentation Feedback TPS24742EVM-667 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 13 Bill of Material www.ti.com Table 3. TPS24742EVM-667 BOM (continued) Designator 14 Qty Value TP1_A, TP1_B, TP2_A, TP2_B, TP3_A, TP3_B, TP4_A, TP4_B, TP5_A, TP5_B, TP6_A, TP6_B, TP7_A, TP7_B, TP8_A, TP8_B, TP9_A, TP9_B, TP10_A, TP10_B, TP11_A, TP11_B, TP12_A, TP12_B, TP13_A, TP13_B, TP14_A, TP14_B, TP15_A, TP15_B, TP16_A, TP16_B, TP17_A, TP17_B, TP18_A, TP18_B, TP19_A, TP19_B, TP20_A, TP20_B, TP21_A, TP21_B, TP22_A, TP22_B, TP24_A, TP24_B, TP25_A, TP25_B, TP26_A, TP26_B, TP27_A, TP27_B, TP28_A, TP28_B, TP29_A, TP29_B, TP30_A, TP30_B Description 58 SMT U1_A, U1_B 2 C3_A, C3_B 0 1uF CAP, CERM, 1uF, 100V, +/-10%, X7R, 1206 C11_A, C11_B, C12_A, C12_B 0 0.1uF Test Point, Miniature, SMT Package Reference Testpoint_Keystone_Miniat ure Part Number Manufacturer 5015 Keystone TPS24740RGE Texas Instruments 1206 GRM31CR72A105KA01L MuRata CAP, CERM, 0.1uF, 16V, +/-5%, X7R, 0603 0603 0603YC104JAT2A AVX Fiducial mark. There is nothing to buy or mount. Fiducial N/A N/A SON 5x6mm 2.5-V to 18-V Positive Voltage HotSwap and Oring Controller, RGE0024B RGE0024B FID1, FID2, FID3 0 Q1_A, Q1_B, Q2_A, Q2_B 0 DNP MOSFET, N-CH, 25V, 100A, SON 5x6mm CSD16415Q5 Texas Instruments R1, R2, R3, R4 0 DNP RES, 0.005 ohm, 1%, 2W, 2512 2512 73M2R005F CTS Resistor R18_A, R18_B 0 DNP RES, 1.00k ohm, 1%, 0.1W, 0603 0603 CRCW06031K00FKEA Vishay-Dale TPS24742EVM-667 Evaluation Module SLVUAH8 – July 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated spacer IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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